CN210243693U - Dual-mode inspection jig for substrate and inspection apparatus for substrate - Google Patents

Abstract

A dual-mode inspection jig for a substrate and an inspection apparatus for a substrate, which can complete electrical inspection by one process when performing electrical inspection of a circuit substrate including a contact inspection point and a non-contact inspection point. The dual-mode inspection jig for a substrate is mounted on an inspection apparatus for a substrate for electrically inspecting a wiring of a circuit substrate on which a plurality of wirings are formed, and includes: a clamp head; and an electrode mounting portion detachably connected to the jig head portion, provided on the opposite side of the jig head portion from the circuit board, and mounting an electrode, the jig head portion having a contact jig head portion and a non-contact jig head portion.

Description

Dual-mode inspection jig for substrate and inspection apparatus for substrate

Technical Field

The present invention relates to a dual mode inspection jig for a substrate and an inspection apparatus for a substrate including the same, and more particularly, to a dual mode inspection jig for a substrate which performs electrical inspection of a wiring including a contact check point and a non-contact check point of a circuit board formed with a plurality of wirings, and an inspection apparatus for a substrate including the same.

Background

In the related art, a contact type inspection jig is known, which inspects whether or not a wiring where a check point is located is broken, short-circuited, or an electronic component connected to the wiring is normal, generally by directly contacting the check point of an inspection object (for example, a circuit board) with a probe.

In addition, there is also a non-contact inspection jig having an inductive element, in which, when a check point on a circuit board to be inspected is not directly exposed to the outside and is covered with a plating layer or the like, a voltage between the inductive element and the check point is inspected to determine whether or not a wiring where the check point is located is short-circuited or broken. The non-contact inspection jig generally includes: a plate-shaped portion which is grounded; a voltage applying unit that applies a transient voltage to the inspection object; and an inspection member that is provided on the plate-like portion and that can inspect an inspection site on the inspection target with a space therebetween.

However, conventionally, when a contact inspection point that can be directly touched for electrical inspection and a non-contact inspection point that cannot be directly touched for electrical inspection are simultaneously present on one inspection object (one circuit board), it is generally necessary to inspect the circuit board by a contact inspection jig and inspect the circuit board by a non-contact inspection jig. Thus, the electrical inspection of the circuit board needs two inspection processes, which is complicated.

SUMMERY OF THE UTILITY MODEL

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a dual-mode inspection jig for a substrate and an inspection apparatus for a substrate, which can complete electrical inspection through one process when performing electrical inspection on a circuit board including a contact inspection point and a non-contact inspection point.

In order to achieve the above object, a first aspect of the present invention provides a dual-mode inspection jig for a substrate, which is mounted on an inspection apparatus for a substrate for electrically inspecting wiring lines of a circuit substrate on which a plurality of wiring lines are formed, the inspection jig comprising: a clamp head; and an electrode mounting part detachably connected to the jig head part, provided on the opposite side of the jig head part from the circuit board, and mounted with an electrode, wherein the jig head part has a contact jig head part and a non-contact jig head part.

According to the above configuration, by forming the jig head to have the contact jig head and the noncontact jig head, it is possible to perform electrical inspection simultaneously for a check point on the circuit substrate where contact inspection is possible (i.e., a contact check point) and a check point where contact inspection is not possible (i.e., a noncontact check point). Thus, the circuit board can be electrically inspected by one process, the inspection process can be simplified, and the inspection efficiency can be improved.

The present invention provides a dual mode inspection jig for a substrate according to a second aspect of the present invention, wherein the dual mode inspection jig for a substrate according to the first aspect of the present invention is provided with a jig head portion, a contact jig head portion and a non-contact jig head portion, which are formed integrally.

According to the structure, the contact type clamp head and the non-contact type clamp head are formed in the clamp head, so that the contact type clamp head and the non-contact type clamp head can be designed, adjusted and maintained respectively, the freedom degree of design and adjustment is improved, and the maintenance cost is reduced.

The present invention provides a dual mode inspection jig for a substrate according to a third aspect of the present invention, wherein the non-contact jig head is formed integrally with the contact jig head in such a manner as to be embedded in the jig head.

According to the above configuration, the non-contact jig head is formed integrally with the contact jig head in the jig head so as to be fitted into the contact jig head, and the jig head is integrated, whereby the positional accuracy between the non-contact jig head and the contact jig head can be improved, and the inspection accuracy can be improved.

The present invention provides a dual mode inspection jig for a substrate according to a fourth aspect of the present invention, wherein the non-contact type jig head is provided with an inductive element, and the inductive element is inspected in a non-contact manner with a voltage between inspection points of the circuit substrate.

According to the above configuration, the inductive element is provided at the head of the non-contact jig, and the voltage between the inductive element and the inspection point of the circuit board is inspected in a non-contact manner, so that the electrical inspection of the non-contact inspection point of the circuit board is realized, the inspection process can be simplified, and the inspection efficiency can be improved.

The utility model discloses a dual mode inspection anchor clamps for base plate of fifth aspect is in the utility model discloses a on the basis of the dual mode inspection anchor clamps for base plate of fourth aspect, contact anchor clamps head includes: an inspection-side support body having an inspection-side through hole; an electrode side support body which is arranged at a distance from the inspection side support body and has an electrode side through hole; a connecting member that connects the inspection side support and the electrode side support together; and a probe pin that penetrates the inspection side through hole and the electrode side through hole, has a tip protruding from the inspection side through hole toward the circuit board and contactable with the circuit board, and has a rear end protruding from the electrode side through hole toward the electrode mounting portion and contactable with the electrode, the tip of the probe pin protruding toward the circuit board than the noncontact jig head.

According to the above configuration, the tip of the probe pin that can be retracted into the inspection-side through hole of the inspection-side support body is projected toward the circuit board beyond the non-contact jig head, and thus the tip of the probe pin and the non-contact jig head can be ensured to simultaneously contact the circuit board, and thus the contact inspection and the non-contact inspection can be simultaneously performed, and the inspection accuracy can be improved.

The present invention provides a dual mode inspection jig for a substrate according to a sixth aspect of the present invention, wherein the probe is not in contact with the circuit board, and the front end of the probe is located at a position where the protruding amount of the inspection side through hole is 200um at the maximum.

According to the above configuration, the distance by which the tip of the probe protrudes from the inspection-side through hole to the circuit board is 200 μm at most, and thus the contact inspection jig can be kept in contact with the circuit board within a reasonable range in which the probe retracts, thereby improving the inspection accuracy of the contact inspection.

The present invention provides a dual mode inspection jig for a substrate according to a seventh aspect of the present invention, wherein the non-contact jig head has a protruding amount △ d of 0 or more and 30um or less, which is the protruding amount of the upper surface of the sensing element facing the circuit board, on the basis of the dual mode inspection jig for a substrate according to the sixth aspect of the present invention, the protruding amount △ d is equal to or less than 0 and equal to or less than △ d.

According to the above configuration, the protrusion amount △ d of the sensing element of the non-contact jig head portion from the inspection side support body of the contact jig head portion toward the circuit board satisfies 0 ≤ △ d ≤ 30um, so that the non-contact inspection jig can be held in contact with the circuit board within a preferable range of probe retraction to perform electrical inspection simultaneously with the contact inspection point and the non-contact inspection point, thereby reducing inspection processes and improving inspection efficiency.

The present invention provides the eighth dual mode inspection jig for a substrate according to the seventh aspect of the present invention, wherein the non-contact jig head further has a spacer for adjusting the height of the induction element.

According to the above configuration, since the noncontact jig head further includes the spacer for adjusting the height of the inductive element, the height difference between the tip of the probe and the inductive element can be adjusted, and the height difference between the tip of the probe and the inductive element can be kept within a predetermined range at all times, so that the inspection accuracy of the jig head on the circuit board can be ensured at all times.

The utility model discloses a dual mode inspection anchor clamps for base plate of ninth aspect is in the utility model discloses a on the basis of the dual mode inspection anchor clamps for base plate of fourth aspect, the inductive element of non-contact anchor clamps head is the TRL sensor, non-contact anchor clamps head still includes voltage application portion, voltage application portion is right transient voltage is applyed to circuit substrate.

According to the above configuration, the non-contact jig head is a TRL sensor as an inductive element, and the non-contact jig head further includes a voltage applying unit, and the voltage applying unit is caused to apply a transient voltage to the circuit board, whereby power can be supplied to the circuit board to electrically inspect the circuit board.

The utility model provides an inspection device for base plate for to be formed with the circuit substrate of many wirings the wiring carries out electrical inspection, wherein, include: the dual-mode inspection jig for a substrate described in any one of the first to ninth aspects; a moving mechanism for moving the dual-mode inspection jig for a substrate; a holding mechanism for holding the circuit substrate at an inspection position; a control unit for controlling at least one of the moving mechanism and the holding mechanism; and a display unit for displaying a result of the inspection of the circuit board.

According to the above configuration, the substrate inspection apparatus is configured to include the dual-mode substrate inspection jig according to any one of the first to ninth aspects, the moving mechanism, the holding mechanism, the control unit, and the display unit, thereby enabling electrical inspection of an inspection target with a simple configuration.

Drawings

Fig. 1 is a schematic diagram showing the overall configuration of a substrate inspection apparatus according to embodiment 1.

Fig. 2 is a schematic diagram showing a schematic configuration of a dual-mode inspection jig for a substrate of the inspection apparatus for a substrate according to embodiment 1.

Fig. 3 is a schematic diagram showing a schematic configuration of a dual-mode inspection jig for a substrate of the inspection apparatus for a substrate according to embodiment 2.

Fig. 4 is a schematic view showing the operation principle of the noncontact inspection jig.

(symbol description)

1a substrate inspection device;

10 a dual-mode inspection jig for a substrate;

100 a circuit substrate;

a 110TRL sensor;

11. 11B inspection side support body;

111. 111A, 111B carrier plates;

112. 112B middle plate;

112A support plate;

113. 113B a support plate;

1111. 1121, 1131 inspecting side through holes;

1111B, 1121B, 1131B inspection side through holes;

12a connecting member;

120 amplifier;

13. 13B electrode side support;

130 a judging means;

131. 131B a first electrode side support body;

132. 132B a second electrode side support body;

133. 133B a third electrode side support body;

1311. 1311B first-electrode-side through holes;

1321. 1321B second-electrode-side through-holes;

1331. 1331B third-electrode-side through holes;

14 an electrode mounting portion;

141 a first electrode mounting plate;

1411 first electrode mounting holes;

142 a second electrode mounting plate;

1421 second electrode mounting holes;

143 a third electrode mounting plate;

1431 a third electrode mounting hole;

15 electrodes;

150 a main body portion;

16 probes;

160 a lead portion;

20 a moving mechanism;

30 a holding mechanism;

40 a control unit;

50 a display unit;

ZFA loading surface;

ZFB loading surface;

ZFC loading surface;

and (S) a gasket.

Detailed Description

Hereinafter, a dual-mode inspection jig for a substrate and an inspection apparatus for a substrate according to embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram showing the overall configuration of a substrate inspection apparatus according to embodiment 1. Fig. 2 is a schematic diagram showing a schematic configuration of a dual-mode inspection jig for a substrate of the inspection apparatus for a substrate according to embodiment 1. Fig. 3 is a schematic diagram showing a schematic configuration of a dual-mode inspection jig for a substrate of the inspection apparatus for a substrate according to embodiment 2. Fig. 4 is a schematic view showing the operation principle of the noncontact inspection jig.

Here, in the drawings of the present application, the side of the jig head closer to the inspection substrate 100 is referred to as "inspection side", and the side of the jig head closer to the electrode 15 is referred to as "electrode side". Fig. 2 and 3 are each a cross section of the substrate dual-mode inspection jig of fig. 1 cut by a surface parallel to the paper surface. In the contact jig head, only one of the inspection-side through holes in the inspection-side support 11 and only two of the electrode-side through holes in the probe 16 and the electrode-side support 13 are illustrated in fig. 2 and fig. 3. Here, in the present application, the vertical direction in fig. 1 and the like is referred to as the vertical direction, and the direction perpendicular to the vertical direction in fig. 1 and the like is referred to as the horizontal direction.

In addition, the contact type inspection jig is an inspection jig in which an inspection element (probe) is in direct contact with an inspection point to electrically inspect the wiring of the circuit board, and the non-contact type inspection jig is an inspection jig in which an inspection element (sensor) is not in direct contact with an inspection point to electrically inspect the wiring of the circuit board, and therefore, whether or not the non-contact type inspection jig is in contact with the circuit board to be inspected is not limited, and the jig head of the non-contact type inspection jig may be in contact with the circuit board to be inspected or may be spaced apart from the circuit board to be inspected by a slight gap during electrical inspection, as long as the non-contact type inspection jig (sensor) can sense the voltage of the non-contact type inspection point.

(embodiment mode 1)

(Overall Structure of inspection apparatus for substrate)

As shown in fig. 1, a substrate inspection apparatus 1 according to the present embodiment is used for electrically inspecting wires of a circuit substrate 100 on which a plurality of wires are formed, and includes: a substrate dual-mode inspection jig 10; a moving mechanism 20, the moving mechanism 20 having a device mounting portion, for moving the dual-mode inspection jig for substrate 10; a holding mechanism 30 for holding the circuit substrate 100 at the inspection position by the holding mechanism 30; a control unit 40, the control unit 40 controlling at least one of the moving mechanism 20 and the holding mechanism 30; and a display unit 50, the display unit 50 displaying a result of the inspection of the circuit board 100.

In the present embodiment, as shown in fig. 1, the substrate inspection apparatus 1 includes two dual-mode inspection jigs 10 for substrates, and since the two dual-mode inspection jigs 10 for substrates are vertically symmetrical, the structure of the dual-mode inspection jig 10 for substrates will be described in detail below by taking the lower dual-mode inspection jig 10 for substrates in fig. 1 as an example. However, the present invention is not limited to this, and the upper and lower two substrate dual-mode inspection jigs may have different structures, or only one of the upper and lower two substrate inspection jigs may be the substrate dual-mode inspection jig, or the substrate inspection apparatus may include only one substrate inspection jig, that is, the substrate inspection apparatus may include at least one dual-mode inspection jig.

In the present embodiment, the dual-mode inspection jig for substrates 10 includes: a clamp head having a contact clamp head (left side in fig. 2) and a non-contact clamp head (right side in fig. 2); and an electrode mounting portion 14 detachably connected to the jig head, provided on the opposite side of the jig head from the circuit board 100, and having an electrode 15 mounted thereon. The details will be described below.

In both fig. 2 and 3, the probe 16 is not in contact with the circuit board 100, that is, the circuit board 100 is not electrically inspected.

(Structure of the head of the jig)

As shown in fig. 2, the contact jig head and the noncontact jig head are formed on the upper surface of the electrode mounting portion 14, the contact jig head is located on the left side of the upper surface of the electrode mounting portion 14, and the noncontact jig head is located on the right side of the upper surface of the electrode mounting portion 14.

The contact clamp head includes: an inspection side support 11 having inspection side through-holes 1111, 1121, 1131; an electrode-side support 13 disposed at a distance from the inspection-side support 11 and having a first electrode-side through hole 1311, a second electrode-side through hole 1321, and a third electrode-side through hole 1331; a connecting member 12 for connecting the inspection side support 11 and the electrode side support 13; and a plurality of probes 16 that penetrate through the inspection side through-holes 1111, 1121, 1131 and the first electrode side through-hole 1311, the second electrode side through-hole 1321, the third electrode side through-hole 1331, and protrude from the inspection side support 11 (the inspection side through-hole 1111) toward the circuit board 100 at the tip (the upper end in fig. 2) so as to be able to contact the circuit board 100, and protrude from the electrode side support 13 (the third electrode side through-hole 1331) at the rear end (the lower end in fig. 2) so as to contact the electrode 15.

Specifically, as shown in fig. 2, the inspection side support body 11 includes: a mounting plate 111 having a mounting surface ZFA contactable with the circuit board 100 and an inspection-side through-hole 1111 through which the probe 16 passes; an intermediate plate 112 formed in the same size as the mounting plate 111 and having an inspection-side through-hole 1121 formed at a position corresponding to the inspection-side through-hole 1111; and a support plate 113, the support plate 113 being formed to support the mounting plate 111 and the intermediate plate 112 from below, and having inspection-side through holes 1131 through which the probes 16 are inserted, formed at positions corresponding to the inspection-side through holes 1111 and 1112. Here, the placing plate 111, the intermediate plate 112, and the support plate 113 are formed in a rectangular plate shape having the same size when viewed in the vertical direction, and are fixed together by screws (not shown); the inspection-side through holes 1111, 1121, 1131 are connected to each other from the top to the bottom, in this order, with a substantially right downward inclination. Further, the electrode side supporter 13 includes: a first electrode side support 131 located on the inspection side of the electrode side support 13, supporting the connection member 12, and having a first electrode side through hole 1311 for accommodating the probe 16; a second electrode side support 132, the second electrode side support 132 being positioned on the electrode side of the first electrode side support 131, and having a second electrode side through hole 1321 formed therein for housing the probe 16; and a third electrode side support 133, the third electrode side support 133 being positioned on the electrode side of the electrode side support 13, and having a third electrode side through hole 1331 for housing the probe 16 formed therein. Here, the first electrode side through hole 1311, the second electrode side through hole 1321, and the third electrode side through hole 1331 are connected to each other from the top to the bottom in this order with a substantially right inclination. Fig. 2 schematically shows only the inspection-side through holes 1111, 1121, 1131, the first electrode-side through hole 1311, the second electrode-side through hole 1321, and the third electrode-side through hole 1331, and does not show in detail a structure in which the probe 16 is guided and the wiring can be accurately electrically inspected.

As described above, by forming both the inspection side support and the electrode side support of the contact jig head in a multilayer board structure, the inspection side through holes 1111, 1121, 1131 and the first electrode side through hole 1311, the second electrode side through hole 1321, and the third electrode side through hole 1331 can be easily processed, and the deformation resistance of the entire contact jig head can be enhanced.

In another aspect, a non-contact clamp head includes: a TRL sensor 110 (a sensing element), the TRL sensor 110 electrically checking a voltage between the TRL sensor 110 and a non-contact checking point of the circuit substrate 110 in a non-contact manner; a placement plate 111A, the placement plate 111A having a placement surface ZFB, the TRL sensor 110 being embedded in the placement plate 111A such that an upper surface of the TRL sensor 110 is flush with the placement surface ZFB; and a support plate 112A formed by stacking a plurality of plates, and supporting the mounting plate 111A from below. Here, in the noncontact jig head, the mounting plate 111A and the support plate 112A are formed in rectangular shapes having the same size when viewed in the vertical direction.

In the present embodiment, as shown in fig. 2, the TRL sensor 110 is located at a substantially central portion of the placement plate 111A in the horizontal direction.

Further, in the case where the height of the noncontact jig head with respect to the contact jig head needs to be adjusted, the noncontact jig head may further have a spacer S for adjusting the height of the TRL sensor 110 (sensing element), and the height of the TRL sensor 110 can be adjusted by providing the spacer S between the mounting plate 111A and the support plate 112A so that the TRL sensor 110 is always in a range of a voltage that can detect the noncontact inspection point of the circuit board 100.

Here, although the projecting amount △ d of the placement surface ZFB of the noncontact type jig head (the upper surface of the TRL sensor 110 as the sensing element) toward the circuit board 100 satisfies 0 ≦ △ d ≦ 30um for the placement surface ZFA of the contact type jig head (the inspection side support 11), the placement surface ZFA of the placement plate 111 and the placement surface ZFB of the placement plate 111A are preferably located on the same horizontal plane.

As shown in fig. 2, when the probe 16 is not in contact with the contact inspection point of the circuit board 100, the maximum protrusion amount of the tip of the probe 16 from the placement surface ZFA of the placement plate 111 is 200 um. According to the above configuration, the tip of the probe 16 protrudes toward the circuit board 100 beyond the head of the noncontact jig, and when the probe 16 abuts on the contact inspection point and the circuit board 100 is electrically inspected, the tip of the inclined probe 16 retracts in the direction of the inspection-side through hole 111.

According to the above structure, the following can be avoided: when the tip of the probe 16 is in contact with the contact inspection point of the circuit substrate 100, the height difference between the tip of the probe 16 and (the upper surface of) the TRL sensor 110 is excessively large, and even when the probe 16 is in contact with the circuit substrate 100 and retracts, a large space is still present between the TRL sensor 110 and the circuit substrate 100, and therefore, no coupling capacitance is generated between the TRL sensor 110 and the circuit substrate 100, and electrical inspection of the non-contact inspection point of the circuit substrate 100 is not possible.

(Structure of electrode mounting part)

In the present embodiment, the electrode mounting portion 14 is provided in a size capable of supporting both the contact jig head and the noncontact jig head.

The electrode mounting portion 14 includes: a first electrode mounting plate 141, which supports the electrode side support 13 of the contact jig head and the support plate 112A of the noncontact jig head, and has a first electrode mounting hole 1411 formed therein through which the electrode 15 passes; a second electrode mounting plate 142 which supports the first electrode mounting plate 141 and has a second electrode mounting hole 1421 through which the electrode 15 passes; and a third electrode mounting plate 143, the third electrode mounting plate 143 supporting the first electrode mounting plate 141 and the second electrode mounting plate 142, and having a third electrode mounting hole 1431 through which the electrode 15 passes.

Here, the first electrode mounting plate 141, the second electrode mounting plate 142, and the third electrode mounting plate 143 are formed in rectangular shapes having the same size when viewed in the vertical direction, and are stacked in this order from the top.

In addition, the first electrode mounting hole 1411, the second electrode mounting hole 1421, and the third electrode mounting hole 1431 are disposed to overlap from top to bottom to form a through hole for receiving the electrode 15.

As described above, the electrode mounting portion 14 is configured to include the first electrode mounting plate 141, the second electrode mounting plate 142, and the third electrode mounting plate 143, so that the contact jig head and the noncontact jig head can be firmly supported.

(working principle of non-contact inspection)

As shown in fig. 4, the non-contact jig head further includes a voltage applying unit, and when the circuit substrate 100 is electrically inspected by the jig head of the present embodiment, a transient voltage is first applied to the circuit substrate 100 by a spring probe (voltage applying unit) to bring the circuit substrate 100 into a conductive state, and then the voltage between the non-contact inspection point of the circuit substrate 100 and the TRL sensor 110 is inspected by the TRL sensor 110, amplified by the amplifier 120, and then the peak value of the voltage is compared with a predetermined threshold value by the determining means 130 to determine whether or not the non-contact inspection point of the circuit substrate 100 is in the conductive state.

(Effect of the present embodiment)

According to the dual-mode inspection jig for a substrate and the inspection apparatus for a substrate of the present embodiment, the contact type inspection point and the non-contact type inspection point of the circuit substrate 100 can be electrically inspected at the same time by the jig head including the contact type jig head and the non-contact type jig head. Thus, compared with the case where the circuit board 100 needs to be electrically inspected in two steps, the number of steps for electrical inspection can be reduced, and the efficiency of electrical inspection can be improved.

(embodiment mode 2)

Hereinafter, a dual-mode inspection jig for a substrate and an inspection apparatus for a substrate according to embodiment 2 will be described with reference to fig. 3. In the present embodiment, the difference from embodiment 1 (the structure of the jig head) will be mainly described in detail.

As shown in fig. 3, the dual-mode inspection jig for a substrate includes a contact jig head, a non-contact jig head, and an electrode mounting portion, wherein the non-contact jig head is integrally formed with the contact jig head in such a manner as to be inserted into the contact jig head.

As shown in fig. 3, the contact jig head of the present embodiment includes: an inspection side support 11B having inspection side through- holes 1111B, 1121B, 1131B; an electrode-side support 13B which is disposed at a distance from the inspection-side support 11B and has a first electrode-side through hole 1311B, a second electrode-side through hole 1321B, and a third electrode-side through hole 1331B; a connecting member 12 for connecting the inspection side support 11B and the electrode side support 13B; and a plurality of probes 16 that penetrate through inspection-side through holes 1111B, 1121B, 1131B and first electrode-side through hole 1311B, second electrode-side through hole 1321B, third electrode-side through hole 1331B, and have tips (upper ends in fig. 3) protruding from inspection-side support 11B (inspection-side through hole 1111B) toward circuit board 100 and being capable of contacting circuit board 100, and have rear ends (lower ends in fig. 3) protruding from electrode-side support 13B (third electrode-side through hole 1331B) and contacting electrode 15.

Specifically, as shown in fig. 3, the inspection side support body 11B includes: a mounting plate 111B having a mounting surface ZFC capable of contacting the circuit board 100 and a plurality of (only two in the illustrated example) inspection-side through holes 1111B provided in the outer peripheral portion in the horizontal direction, through which the probes 16 pass, and having a recessed portion and a mounting plate lead wire through hole having one end opening in the recessed portion and the other end opening in the lower surface of the mounting plate 111B formed in the inner peripheral portion in the horizontal direction; a middle plate 112B, which is formed in the same size as the mounting plate 111B, and in which a plurality of (only two in the illustrated example) inspection side through holes 1121B are formed at positions corresponding to the inspection side through holes 1111B, and middle plate lead wire through holes are formed at positions corresponding to the mounting plate lead wire through holes; and a support plate 113B configured to support the mounting plate 111B and the intermediate plate 112B from below, wherein a plurality of (only two in the illustrated example) inspection-side through holes 1131B for housing the probes 16 are formed at positions corresponding to the inspection-side through holes 1111B and 1112B, and support-plate lead through holes are formed at positions corresponding to the mounting-plate lead through holes. Here, the placing plate 111B, the intermediate plate 112B, and the support plate 113B are formed in rectangular shapes having the same size when viewed in the vertical direction; the corresponding inspection-side through holes 1111B, 1121B, 1131B are inclined and communicated from the top to the bottom right in this order; the wire through hole of the loading plate, the wire through hole of the middle plate and the wire through hole of the supporting plate are vertically communicated from top to bottom in sequence. The electrode-side supporter 13B includes: a first electrode side support body 131B which is positioned on the inspection side of the electrode side support body 13B, supports the connection member 12, has a plurality of (only two in the illustrated example) first electrode side through holes 1311B formed in the outer peripheral portion in the horizontal direction for accommodating the probes 16, and has a first electrode side support body side accommodating hole formed in the inner peripheral portion in the horizontal direction; a second electrode side support 132B, the second electrode side support 132B being positioned below the first electrode side support 131B, a plurality of (only two in the illustrated example) second electrode side through holes 1321B through which the probes 16 penetrate being formed at positions corresponding to the first electrode side through holes 1311B, and a second electrode side support side receiving hole being formed in the inner peripheral portion in the horizontal direction; and a third electrode side support body 133B, the third electrode side support body 133B being positioned on the electrode side of the electrode side support body 13B, a plurality of (only two in the illustrated example) third electrode side through holes 1331B for housing the probes 16 being formed at positions corresponding to the second electrode side through holes 1321B, and a third electrode side support body side housing hole being formed in the inner peripheral portion in the horizontal direction. Here, the first electrode side through hole 1311B, the second electrode side through hole 1321B, and the third electrode side through hole 1331B are communicated with each other from top to bottom in order to be inclined substantially rightward and downward, so as to form a through hole for accommodating the electrode side end portion of the probe 16; the first electrode side support side accommodating hole, the second electrode side support side accommodating hole and the third electrode side support side accommodating hole are vertically communicated from top to bottom in sequence. Fig. 3 schematically shows only the inspection-side through holes 1111B, 1121B, 1131B, the first electrode-side through hole 1311B, the second electrode-side through hole 1321B, and the third electrode-side through hole 1331B, and does not show in detail a structure capable of guiding the probe 16 and accurately performing electrical inspection on the wiring.

Further, as shown in fig. 3, the noncontact jig head is formed integrally with the contact jig head so as to be fitted into the horizontal inner peripheral portion of the contact jig head.

Specifically, the noncontact clamp head includes: a TRL sensor 110 that electrically inspects a non-contact inspection point of the circuit board 110 in a non-contact manner and that is fitted into a recessed portion formed in a horizontal inner peripheral portion of an inspection side support body 11B (specifically, a mounting plate 111B) of the contact jig head; a main body 150 fitted into the first electrode side support side receiving hole, the second electrode side support side receiving hole, and the third electrode side support side receiving hole formed in the horizontal direction inner peripheral portion of the electrode side support 13B of the contact jig head portion; and a lead portion 160 that penetrates the main body portion 150 to electrically connect the TRL sensor 100 and the electrode 15, and that penetrates a mounting plate lead through-hole, an intermediate plate lead through-hole, and a support plate lead through-hole formed in the horizontal inner peripheral portion of the inspection side support 11B at the head portion of the contact jig. The upper surface of the body 150 supports the lower surface of the inspection side support 11B, and the lower surface of the body 150 is supported by the electrode mounting portion 14.

As described above, by forming both the inspection side support and the electrode side support of the contact jig head in a multilayer board structure, the inspection side through holes 1111B, 1121B, and 1131B, the first electrode side through hole 1311B, the second electrode side through hole 1321B, and the third electrode side through hole 1331B can be easily processed, and the deformation resistance of the contact jig head as a whole can be enhanced.

The connecting member 12 and the electrode mounting portion 14 have the same configuration as that of embodiment 1, and therefore, a repetitive description thereof will be omitted.

(Effect of the present embodiment)

According to the dual-mode inspection jig for a substrate and the inspection apparatus for a substrate of the present embodiment, the contact type inspection point and the non-contact type inspection point of the circuit substrate 100 can be electrically inspected at the same time by the jig head in which the contact type jig head and the non-contact type jig head (the jig head provided with the TRL sensor) are integrally formed. Thus, compared to a case where the circuit board 100 needs to be electrically inspected in two steps, the circuit board can be electrically inspected with fewer components and a simple configuration, and the number of steps for electrical inspection can be reduced as much as possible, thereby improving the efficiency of electrical inspection as much as possible.

While embodiment 1 and embodiment 2 of the present invention have been described above, the elements of the above-described embodiments may be used in combination to obtain the technical aspects of the present invention, in addition to the technical aspects described in the above-described embodiments, without departing from the spirit of the present invention.

Further, by sharing the electrode mounting portion 14, the noncontact jig head and the contact jig head can be formed in a size as small as possible. Thus, the substrate inspection jig can be miniaturized.

In each of the above embodiments, the inspection-side through holes (3) and the electrode-side through holes (3) for receiving the probes are sequentially inclined and communicated gradually rightward and downward, but the present invention is not limited thereto, and the through holes may be stacked and communicated in other directions.

In the above embodiments, the placement plate, the intermediate plate, and the support plate are all formed in a substantially rectangular shape, but the present invention is not limited to this, and may be formed in any other shape and different sizes.

In the above embodiments, the TRL sensor is provided at the substantially central portion of the mounting plate in the horizontal direction, but the TRL sensor is not limited to this, and may be provided at another portion of the mounting plate.

In embodiment 2, the mounting plate is formed of only one plate, but the present invention is not limited to this, and may be formed of a plurality of plates.

In each of the above embodiments, the electrode mounting portion is formed by laminating the first electrode mounting plate, the second electrode mounting plate, and the third electrode mounting plate, but the present invention is not limited thereto, and other numbers of electrode mounting plates may be laminated.

In the above embodiments, the first electrode mounting plate, the second electrode mounting plate, and the third electrode mounting plate of the electrode mounting portion are the same in size and shape, but the present invention is not limited thereto, and the first electrode mounting plate, the second electrode mounting plate, and the third electrode mounting plate may be different in size and shape.

In each of the above embodiments, the noncontact chuck head further includes a voltage application unit (not shown), but is not limited to this, and the noncontact chuck head may not include a voltage application unit and apply a transient voltage to the circuit substrate 100 using the probe of the contact chuck head as a voltage application unit for noncontact inspection, or the noncontact chuck head positioned on one side in the vertical direction of the circuit substrate may not include a voltage application unit and apply a transient voltage to the circuit substrate 100 using the probe of the contact chuck head positioned on the other side in the vertical direction of the circuit substrate and/or the voltage application unit of the noncontact chuck head.

Claims (10)

1. A dual-mode inspection jig for a substrate, which is mounted on an inspection apparatus for a substrate for electrically inspecting a plurality of wirings formed on a circuit substrate, comprising:

a clamp head; and

an electrode mounting portion detachably connected to the jig head portion, provided on an opposite side of the jig head portion from the circuit board, and mounted with an electrode,

it is characterized in that the preparation method is characterized in that,

the clamp head has a contact clamp head and a non-contact clamp head.

2. The dual-mode inspection jig for a substrate as set forth in claim 1,

in the jig head, the contact jig head is formed with the noncontact jig head portion.

3. The dual-mode inspection jig for a substrate as set forth in claim 1,

in the jig head, the noncontact jig head is formed integrally with the contact jig head in such a manner as to be embedded in the contact jig head.

4. The dual-mode inspection jig for a substrate as set forth in claim 2 or 3,

the non-contact type clamp head is provided with an induction element, and the induction element inspects the voltage between the induction element and the inspection point of the circuit substrate in a non-contact mode.

5. The dual-mode inspection jig for a substrate as set forth in claim 4,

the contact jig head includes:

an inspection-side support body having an inspection-side through hole;

an electrode side support body which is arranged at a distance from the inspection side support body and has an electrode side through hole;

a connecting member that connects the inspection side support and the electrode side support together; and

a probe pin which penetrates the inspection side through hole and the electrode side through hole, has a tip end protruding from the inspection side through hole toward the circuit board and contactable with the circuit board, and has a rear end protruding from the electrode side through hole toward the electrode mounting portion and contactable with the electrode,

the front end of the probe protrudes toward the circuit board than the head of the noncontact jig.

6. The dual-mode inspection jig for a substrate as set forth in claim 5,

when the probe is not in contact with the circuit board, the amount of protrusion of the tip of the probe from the inspection-side through hole to the circuit board is 200um at most.

7. The dual-mode inspection jig for a substrate as set forth in claim 6,

the amount of protrusion △ d of the upper surface of the sensing element of the noncontact jig head toward the circuit board with respect to the inspection side support body of the noncontact jig head satisfies 0 ≦ △ d ≦ 30 um.

8. The dual-mode inspection jig for a substrate as set forth in claim 7,

the non-contact clamp head also has a shim for adjusting the height of the inductive element.

9. The dual-mode inspection jig for a substrate as set forth in claim 4,

the sensing element of the non-contact clamp head is a TRL sensor,

the noncontact chuck head further includes a voltage applying section that applies a transient voltage to the circuit substrate.

10. An inspection apparatus for a substrate for electrically inspecting a plurality of wirings formed on a circuit board, comprising:

the dual-mode inspection jig for a substrate according to any one of claims 1 to 9;

a moving mechanism for moving the dual-mode inspection jig for a substrate;

a holding mechanism for holding the circuit substrate at an inspection position;

a control unit for controlling at least one of the moving mechanism and the holding mechanism; and

and a display unit for displaying a result of the inspection of the circuit board.

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