JP7158634B2 - 中空部を有する窒化ホウ素粒子を含有するシート - Google Patents

中空部を有する窒化ホウ素粒子を含有するシート Download PDF

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Publication number
JP7158634B2
JP7158634B2 JP2022544002A JP2022544002A JP7158634B2 JP 7158634 B2 JP7158634 B2 JP 7158634B2 JP 2022544002 A JP2022544002 A JP 2022544002A JP 2022544002 A JP2022544002 A JP 2022544002A JP 7158634 B2 JP7158634 B2 JP 7158634B2
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boron nitride
nitride particles
sheet
resin
particles
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Japanese (ja)
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JPWO2022039235A1 (https=
JPWO2022039235A5 (https=
Inventor
祐輔 佐々木
建治 宮田
道治 中嶋
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/285—Ammonium nitrates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022544002A 2020-08-20 2021-08-19 中空部を有する窒化ホウ素粒子を含有するシート Active JP7158634B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020139474 2020-08-20
JP2020139474 2020-08-20
PCT/JP2021/030446 WO2022039235A1 (ja) 2020-08-20 2021-08-19 中空部を有する窒化ホウ素粒子を含有するシート

Publications (3)

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JPWO2022039235A1 JPWO2022039235A1 (https=) 2022-02-24
JP7158634B2 true JP7158634B2 (ja) 2022-10-21
JPWO2022039235A5 JPWO2022039235A5 (https=) 2022-11-16

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JP2022544002A Active JP7158634B2 (ja) 2020-08-20 2021-08-19 中空部を有する窒化ホウ素粒子を含有するシート

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US (1) US12570836B2 (https=)
JP (1) JP7158634B2 (https=)
KR (1) KR102854947B1 (https=)
CN (1) CN115697899A (https=)
WO (1) WO2022039235A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003193A1 (ja) 2012-06-27 2014-01-03 水島合金鉄株式会社 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料
CN108545708A (zh) 2018-03-14 2018-09-18 中国人民解放军火箭军工程大学 一种珊瑚状六方氮化硼微纳米管片复合结构的制备方法
WO2019073690A1 (ja) 2017-10-13 2019-04-18 デンカ株式会社 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材
WO2020031883A1 (ja) 2018-08-09 2020-02-13 日立金属株式会社 窒化ホウ素ナノチューブ材料、窒化ホウ素ナノチューブ複合材料、及び窒化ホウ素ナノチューブ材料の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
CN106255721A (zh) * 2014-04-30 2016-12-21 罗杰斯公司 导热复合材料及其制造方法以及包含所述复合材料的制品
JP6565157B2 (ja) * 2014-10-06 2019-08-28 住友ベークライト株式会社 造粒粉、放熱用樹脂組成物、放熱シート、半導体装置、および放熱部材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014003193A1 (ja) 2012-06-27 2014-01-03 水島合金鉄株式会社 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料
WO2019073690A1 (ja) 2017-10-13 2019-04-18 デンカ株式会社 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材
CN108545708A (zh) 2018-03-14 2018-09-18 中国人民解放军火箭军工程大学 一种珊瑚状六方氮化硼微纳米管片复合结构的制备方法
WO2020031883A1 (ja) 2018-08-09 2020-02-13 日立金属株式会社 窒化ホウ素ナノチューブ材料、窒化ホウ素ナノチューブ複合材料、及び窒化ホウ素ナノチューブ材料の製造方法

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JPWO2022039235A1 (https=) 2022-02-24
US12570836B2 (en) 2026-03-10
KR20230052897A (ko) 2023-04-20
KR102854947B1 (ko) 2025-09-03
CN115697899A (zh) 2023-02-03
WO2022039235A1 (ja) 2022-02-24
US20240010817A1 (en) 2024-01-11

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