JPWO2022039235A1 - - Google Patents
Info
- Publication number
- JPWO2022039235A1 JPWO2022039235A1 JP2022544002A JP2022544002A JPWO2022039235A1 JP WO2022039235 A1 JPWO2022039235 A1 JP WO2022039235A1 JP 2022544002 A JP2022544002 A JP 2022544002A JP 2022544002 A JP2022544002 A JP 2022544002A JP WO2022039235 A1 JPWO2022039235 A1 JP WO2022039235A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/285—Ammonium nitrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020139474 | 2020-08-20 | ||
| JP2020139474 | 2020-08-20 | ||
| PCT/JP2021/030446 WO2022039235A1 (ja) | 2020-08-20 | 2021-08-19 | 中空部を有する窒化ホウ素粒子を含有するシート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022039235A1 true JPWO2022039235A1 (https=) | 2022-02-24 |
| JP7158634B2 JP7158634B2 (ja) | 2022-10-21 |
| JPWO2022039235A5 JPWO2022039235A5 (https=) | 2022-11-16 |
Family
ID=80323561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022544002A Active JP7158634B2 (ja) | 2020-08-20 | 2021-08-19 | 中空部を有する窒化ホウ素粒子を含有するシート |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12570836B2 (https=) |
| JP (1) | JP7158634B2 (https=) |
| KR (1) | KR102854947B1 (https=) |
| CN (1) | CN115697899A (https=) |
| WO (1) | WO2022039235A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014003193A1 (ja) * | 2012-06-27 | 2014-01-03 | 水島合金鉄株式会社 | 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料 |
| JP2016076586A (ja) * | 2014-10-06 | 2016-05-12 | 住友ベークライト株式会社 | 造粒粉、放熱用樹脂組成物、放熱シート、半導体装置、および放熱部材 |
| CN108545708A (zh) * | 2018-03-14 | 2018-09-18 | 中国人民解放军火箭军工程大学 | 一种珊瑚状六方氮化硼微纳米管片复合结构的制备方法 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| WO2020031883A1 (ja) * | 2018-08-09 | 2020-02-13 | 日立金属株式会社 | 窒化ホウ素ナノチューブ材料、窒化ホウ素ナノチューブ複合材料、及び窒化ホウ素ナノチューブ材料の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102574684B (zh) | 2009-10-09 | 2015-04-29 | 水岛合金铁株式会社 | 六方氮化硼粉末及其制备方法 |
| CN106255721A (zh) * | 2014-04-30 | 2016-12-21 | 罗杰斯公司 | 导热复合材料及其制造方法以及包含所述复合材料的制品 |
-
2021
- 2021-08-19 JP JP2022544002A patent/JP7158634B2/ja active Active
- 2021-08-19 CN CN202180038782.6A patent/CN115697899A/zh active Pending
- 2021-08-19 US US18/041,851 patent/US12570836B2/en active Active
- 2021-08-19 KR KR1020237005820A patent/KR102854947B1/ko active Active
- 2021-08-19 WO PCT/JP2021/030446 patent/WO2022039235A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014003193A1 (ja) * | 2012-06-27 | 2014-01-03 | 水島合金鉄株式会社 | 凹部付きｂｎ球状焼結粒子およびその製造方法ならびに高分子材料 |
| JP2016076586A (ja) * | 2014-10-06 | 2016-05-12 | 住友ベークライト株式会社 | 造粒粉、放熱用樹脂組成物、放熱シート、半導体装置、および放熱部材 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| CN108545708A (zh) * | 2018-03-14 | 2018-09-18 | 中国人民解放军火箭军工程大学 | 一种珊瑚状六方氮化硼微纳米管片复合结构的制备方法 |
| WO2020031883A1 (ja) * | 2018-08-09 | 2020-02-13 | 日立金属株式会社 | 窒化ホウ素ナノチューブ材料、窒化ホウ素ナノチューブ複合材料、及び窒化ホウ素ナノチューブ材料の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7158634B2 (ja) | 2022-10-21 |
| US12570836B2 (en) | 2026-03-10 |
| KR20230052897A (ko) | 2023-04-20 |
| KR102854947B1 (ko) | 2025-09-03 |
| CN115697899A (zh) | 2023-02-03 |
| WO2022039235A1 (ja) | 2022-02-24 |
| US20240010817A1 (en) | 2024-01-11 |
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