JP7209904B2 - 複合材料、放熱材及び放熱材の製造方法 - Google Patents
複合材料、放熱材及び放熱材の製造方法 Download PDFInfo
- Publication number
- JP7209904B2 JP7209904B2 JP2022543999A JP2022543999A JP7209904B2 JP 7209904 B2 JP7209904 B2 JP 7209904B2 JP 2022543999 A JP2022543999 A JP 2022543999A JP 2022543999 A JP2022543999 A JP 2022543999A JP 7209904 B2 JP7209904 B2 JP 7209904B2
- Authority
- JP
- Japan
- Prior art keywords
- boron nitride
- nitride particles
- heat dissipating
- less
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Combustion & Propulsion (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
を含む窒素雰囲気となっている。窒素雰囲気中の窒素ガスの含有量は、好ましくは95体積%以上であり、より好ましくは99.9体積%以上であり、実質的に100体積%であってよい。窒素雰囲気中に、窒素ガスに加えて、アンモニアガス等が含まれてもよい。
形態において、第二のシート及び第三のシートは、第一のシートに直接積層されていてよく、接着剤等を介して積層されていてもよい。
窒化ホウ素粒子を、窒化ホウ素(デンカ社製「GP」)に変更した以外は参考例1と同様にして放熱材を作製した。
窒化ホウ素粒子を用いない以外は参考例1と同様にして、放熱材を作製した。
実施例3及び参考例1~3の放熱材の誘電特性を評価するために、インピーダンスアナライザ(IWATSU PSM3750+IAI2)を用いて、周波数10-1~107Hzの範囲で放熱材の静電容量(C)を測定した。この測定において、印加電圧は10V、評価温度は室温25℃とした。また、放熱材の一方の面には、金スパッタを施して全面に電極を設け、他方の面には、金スパッタを施して直径15mmの円形の電極を設けた。放熱材の誘電特性は、周波数1kHzにおける放熱材の比誘電率εの比較で評価した。なお、放熱材の比誘電率εは、下記の関係式から算出した。
C=ε×ε0×S/d(C:放熱材の静電容量、S:円形の電極の面積、d:放熱材の厚み、ε0:真空の誘電率)
実施例3:4.58
参考例1:5.10
参考例2:4.83
参考例3:4.50
この結果から、実施例3の放熱材において、誘電特性が低下することはなく、一定水準以上の誘電特性が示されることが確認された。
Claims (5)
- 無機基材と、
前記無機基材の一面上に配置された複数の窒化ホウ素粒子と、を備え、
前記無機基材が、炭素及び窒化ホウ素からなる群より選ばれる一種を含み、
前記複数の窒化ホウ素粒子が前記無機基材を起点として延伸している、複合材料。 - 前記複数の窒化ホウ素粒子の延伸方向における平均長さが50μm以上である、請求項1に記載の複合材料。
- 請求項1又は2に記載の複合材料の前記複数の窒化ホウ素粒子間に樹脂を充填する工程を備える、放熱材の製造方法。
- 前記工程の後に、前記無機基材を除去する工程を更に備える、請求項3に記載の放熱材の製造方法。
- 複数の窒化ホウ素粒子と、樹脂と、を含有するシート状の放熱材であって、
前記複数の窒化ホウ素粒子が、前記放熱材の一面を起点として、前記一面に対向する他面に向けて延伸しており、
前記複数の窒化ホウ素粒子の延伸方向における平均長さが50μm以上であり、
前記複数の窒化ホウ素粒子の平均アスペクト比が12.0以下である、放熱材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023001850A JP2023054801A (ja) | 2020-08-20 | 2023-01-10 | 複合材料、放熱材及び放熱材の製造方法 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020139475 | 2020-08-20 | ||
JP2020139475 | 2020-08-20 | ||
JP2021008753 | 2021-01-22 | ||
JP2021008753 | 2021-01-22 | ||
PCT/JP2021/030442 WO2022039232A1 (ja) | 2020-08-20 | 2021-08-19 | 複合材料、放熱材及び放熱材の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023001850A Division JP2023054801A (ja) | 2020-08-20 | 2023-01-10 | 複合材料、放熱材及び放熱材の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022039232A1 JPWO2022039232A1 (ja) | 2022-02-24 |
JPWO2022039232A5 JPWO2022039232A5 (ja) | 2022-10-24 |
JP7209904B2 true JP7209904B2 (ja) | 2023-01-20 |
Family
ID=80323548
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022543999A Active JP7209904B2 (ja) | 2020-08-20 | 2021-08-19 | 複合材料、放熱材及び放熱材の製造方法 |
JP2023001850A Pending JP2023054801A (ja) | 2020-08-20 | 2023-01-10 | 複合材料、放熱材及び放熱材の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023001850A Pending JP2023054801A (ja) | 2020-08-20 | 2023-01-10 | 複合材料、放熱材及び放熱材の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP7209904B2 (ja) |
WO (1) | WO2022039232A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013505194A (ja) | 2009-09-21 | 2013-02-14 | ディーキン ユニバーシティ | 製造方法 |
JP2014003144A (ja) | 2012-06-18 | 2014-01-09 | Fujitsu Ltd | 電子機器の製造方法及び電子機器 |
JP2017094542A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 積層体 |
JP2017094541A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 熱硬化性シート、硬化物シート及び積層体 |
-
2021
- 2021-08-19 WO PCT/JP2021/030442 patent/WO2022039232A1/ja active Application Filing
- 2021-08-19 JP JP2022543999A patent/JP7209904B2/ja active Active
-
2023
- 2023-01-10 JP JP2023001850A patent/JP2023054801A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013505194A (ja) | 2009-09-21 | 2013-02-14 | ディーキン ユニバーシティ | 製造方法 |
JP2014003144A (ja) | 2012-06-18 | 2014-01-09 | Fujitsu Ltd | 電子機器の製造方法及び電子機器 |
JP2017094542A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 積層体 |
JP2017094541A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 熱硬化性シート、硬化物シート及び積層体 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022039232A1 (ja) | 2022-02-24 |
WO2022039232A1 (ja) | 2022-02-24 |
JP2023054801A (ja) | 2023-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI700243B (zh) | 六方晶氮化硼粉末及其製造方法以及使用其之組成物及散熱材 | |
US7550529B2 (en) | Expanded graphite and products produced therefrom | |
US11339055B2 (en) | Graphite/graphene composite material, heat collector, a heat conductor, a heat dissipator, a heat-dissipation system, and a method of producing the graphite/graphene composite material | |
Wang et al. | On the influence of carbide coating on the thermal conductivity and flexural strength of X (X= SiC, TiC) coated graphite/Al composites | |
JP7209904B2 (ja) | 複合材料、放熱材及び放熱材の製造方法 | |
JP2023083333A (ja) | 窒化ホウ素粒子、窒化ホウ素粉末、樹脂組成物、及び樹脂組成物の製造方法 | |
CN113261398A (zh) | 散热片的制备方法 | |
JP7106033B1 (ja) | 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法 | |
Zheng et al. | Improved thermal conductivity and excellent electrical insulation properties of polysiloxane nanocomposite-incorporated functional boron nitride sheets via in situ polymerization | |
CN115398620A (zh) | 导热性片和其制造方法 | |
JP7216872B2 (ja) | 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法 | |
KR20210142640A (ko) | 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재 | |
JP7158634B2 (ja) | 中空部を有する窒化ホウ素粒子を含有するシート | |
TWI838500B (zh) | 塊狀氮化硼粒子、熱傳導樹脂組成物、以及散熱構件 | |
JP7241248B2 (ja) | 窒化ホウ素粒子、樹脂組成物、及び樹脂組成物の製造方法 | |
US20230227709A1 (en) | Flowable hardenable composition, thermally conductive composition, and electronic heat sink assembly including the same | |
US20230295399A1 (en) | Boron nitride particles, method for producing boron nitride particles, resin composition, and method for producing resin composition | |
KR20230156791A (ko) | 질화붕소 분말 및 수지 조성물 | |
Yang et al. | The dielectric property and thermal conductivity properties of epoxy composite filled by P-CdS with patterned surface structure | |
KR20230156793A (ko) | 질화붕소 입자, 그 제조 방법, 및 수지 조성물 | |
KR20230156792A (ko) | 질화붕소 분말 및 수지 조성물 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220815 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220815 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20220815 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221213 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230110 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7209904 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |