JP7156319B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP7156319B2
JP7156319B2 JP2020008622A JP2020008622A JP7156319B2 JP 7156319 B2 JP7156319 B2 JP 7156319B2 JP 2020008622 A JP2020008622 A JP 2020008622A JP 2020008622 A JP2020008622 A JP 2020008622A JP 7156319 B2 JP7156319 B2 JP 7156319B2
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JP
Japan
Prior art keywords
metal body
dummy
terminal
bus bar
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020008622A
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English (en)
Japanese (ja)
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JP2021118562A5 (https=
JP2021118562A (ja
Inventor
誠一郎 西町
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2020008622A priority Critical patent/JP7156319B2/ja
Priority to PCT/JP2020/044189 priority patent/WO2021149352A1/ja
Publication of JP2021118562A publication Critical patent/JP2021118562A/ja
Publication of JP2021118562A5 publication Critical patent/JP2021118562A5/ja
Priority to US17/833,195 priority patent/US12089380B2/en
Application granted granted Critical
Publication of JP7156319B2 publication Critical patent/JP7156319B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07351Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • H10W72/341Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347Dispositions of multiple die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020008622A 2020-01-22 2020-01-22 電力変換装置 Active JP7156319B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020008622A JP7156319B2 (ja) 2020-01-22 2020-01-22 電力変換装置
PCT/JP2020/044189 WO2021149352A1 (ja) 2020-01-22 2020-11-27 電力変換装置
US17/833,195 US12089380B2 (en) 2020-01-22 2022-06-06 Power conversion device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020008622A JP7156319B2 (ja) 2020-01-22 2020-01-22 電力変換装置

Publications (3)

Publication Number Publication Date
JP2021118562A JP2021118562A (ja) 2021-08-10
JP2021118562A5 JP2021118562A5 (https=) 2022-01-04
JP7156319B2 true JP7156319B2 (ja) 2022-10-19

Family

ID=76993323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020008622A Active JP7156319B2 (ja) 2020-01-22 2020-01-22 電力変換装置

Country Status (3)

Country Link
US (1) US12089380B2 (https=)
JP (1) JP7156319B2 (https=)
WO (1) WO2021149352A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021209724A1 (de) * 2021-09-03 2023-03-09 Zf Friedrichshafen Ag Inverteranordnung für ein Fahrzeug sowie Fahrzeug mit der Inverteranordnung
WO2023058381A1 (ja) * 2021-10-06 2023-04-13 株式会社デンソー 電力変換装置
JP7694488B2 (ja) * 2022-07-08 2025-06-18 トヨタ自動車株式会社 燃料電池ユニット
KR20240026646A (ko) * 2022-08-22 2024-02-29 현대자동차주식회사 연료 전지 장치
JP7760974B2 (ja) * 2022-09-22 2025-10-28 トヨタ自動車株式会社 電力変換装置
US12291104B1 (en) 2023-11-03 2025-05-06 GM Global Technology Operations LLC System for mutual inductance cancellation for T-type multilevel converters
US12500540B2 (en) * 2023-11-03 2025-12-16 GM Global Technology Operations LLC System for mutual inductance cancellation for H-type multilevel converters
US12397652B2 (en) * 2023-11-03 2025-08-26 GM Global Technology Operations LLC System for mutual inductance cancellation for X-type multilevel converters
TR2023015276A2 (tr) * 2023-11-17 2024-02-21 Türki̇ye'ni̇n Otomobi̇li̇ Gi̇ri̇şi̇m Grubu Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ Bi̇r kapasi̇tör
US20250309779A1 (en) * 2024-03-27 2025-10-02 GM Global Technology Operations LLC System and method for mutual inductance cancellation for two-level converters

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125083A (ja) 2009-12-08 2011-06-23 Denso Corp 電力変換装置
JP2016158358A (ja) 2015-02-24 2016-09-01 株式会社デンソー 半導体モジュール
JP2016157850A (ja) 2015-02-25 2016-09-01 トヨタ自動車株式会社 半導体モジュール、半導体装置、及び、半導体装置の製造方法
JP2020010560A (ja) 2018-07-11 2020-01-16 株式会社デンソー 電力変換装置
JP2020010549A (ja) 2018-07-11 2020-01-16 株式会社デンソー 電力変換装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
EP2244289B1 (en) * 2000-04-19 2014-03-26 Denso Corporation Coolant cooled type semiconductor device
US6956742B2 (en) * 2002-09-27 2005-10-18 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
JP2005332863A (ja) 2004-05-18 2005-12-02 Denso Corp パワースタック
JP5445507B2 (ja) * 2010-06-03 2014-03-19 株式会社デンソー 電力変換装置
JP5488565B2 (ja) * 2011-03-29 2014-05-14 株式会社デンソー 電力変換装置
JP5344013B2 (ja) * 2011-09-06 2013-11-20 株式会社デンソー 電力変換装置
FR2985597B1 (fr) * 2012-01-05 2014-10-24 Valeo Equip Electr Moteur Dispositif d'assemblage de capacites pour convertisseur electronique
JP2014090629A (ja) * 2012-10-31 2014-05-15 Denso Corp 電力変換装置
JP6458444B2 (ja) * 2014-10-21 2019-01-30 株式会社デンソー 電力変換装置
JP6750514B2 (ja) * 2017-01-18 2020-09-02 株式会社デンソー 半導体装置
JP6836201B2 (ja) * 2017-12-19 2021-02-24 株式会社デンソー 電力変換装置
JP6915633B2 (ja) * 2018-07-25 2021-08-04 株式会社デンソー 電力変換装置
JP7167959B2 (ja) * 2020-03-30 2022-11-09 株式会社デンソー コンデンサ素子用バスバ、コンデンサ、および、電力変換装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125083A (ja) 2009-12-08 2011-06-23 Denso Corp 電力変換装置
JP2016158358A (ja) 2015-02-24 2016-09-01 株式会社デンソー 半導体モジュール
JP2016157850A (ja) 2015-02-25 2016-09-01 トヨタ自動車株式会社 半導体モジュール、半導体装置、及び、半導体装置の製造方法
JP2020010560A (ja) 2018-07-11 2020-01-16 株式会社デンソー 電力変換装置
JP2020010549A (ja) 2018-07-11 2020-01-16 株式会社デンソー 電力変換装置

Also Published As

Publication number Publication date
US12089380B2 (en) 2024-09-10
US20220304185A1 (en) 2022-09-22
JP2021118562A (ja) 2021-08-10
WO2021149352A1 (ja) 2021-07-29

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