JP7156319B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JP7156319B2 JP7156319B2 JP2020008622A JP2020008622A JP7156319B2 JP 7156319 B2 JP7156319 B2 JP 7156319B2 JP 2020008622 A JP2020008622 A JP 2020008622A JP 2020008622 A JP2020008622 A JP 2020008622A JP 7156319 B2 JP7156319 B2 JP 7156319B2
- Authority
- JP
- Japan
- Prior art keywords
- metal body
- dummy
- terminal
- bus bar
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/347—Dispositions of multiple die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020008622A JP7156319B2 (ja) | 2020-01-22 | 2020-01-22 | 電力変換装置 |
| PCT/JP2020/044189 WO2021149352A1 (ja) | 2020-01-22 | 2020-11-27 | 電力変換装置 |
| US17/833,195 US12089380B2 (en) | 2020-01-22 | 2022-06-06 | Power conversion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020008622A JP7156319B2 (ja) | 2020-01-22 | 2020-01-22 | 電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021118562A JP2021118562A (ja) | 2021-08-10 |
| JP2021118562A5 JP2021118562A5 (https=) | 2022-01-04 |
| JP7156319B2 true JP7156319B2 (ja) | 2022-10-19 |
Family
ID=76993323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020008622A Active JP7156319B2 (ja) | 2020-01-22 | 2020-01-22 | 電力変換装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12089380B2 (https=) |
| JP (1) | JP7156319B2 (https=) |
| WO (1) | WO2021149352A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021209724A1 (de) * | 2021-09-03 | 2023-03-09 | Zf Friedrichshafen Ag | Inverteranordnung für ein Fahrzeug sowie Fahrzeug mit der Inverteranordnung |
| WO2023058381A1 (ja) * | 2021-10-06 | 2023-04-13 | 株式会社デンソー | 電力変換装置 |
| JP7694488B2 (ja) * | 2022-07-08 | 2025-06-18 | トヨタ自動車株式会社 | 燃料電池ユニット |
| KR20240026646A (ko) * | 2022-08-22 | 2024-02-29 | 현대자동차주식회사 | 연료 전지 장치 |
| JP7760974B2 (ja) * | 2022-09-22 | 2025-10-28 | トヨタ自動車株式会社 | 電力変換装置 |
| US12291104B1 (en) | 2023-11-03 | 2025-05-06 | GM Global Technology Operations LLC | System for mutual inductance cancellation for T-type multilevel converters |
| US12500540B2 (en) * | 2023-11-03 | 2025-12-16 | GM Global Technology Operations LLC | System for mutual inductance cancellation for H-type multilevel converters |
| US12397652B2 (en) * | 2023-11-03 | 2025-08-26 | GM Global Technology Operations LLC | System for mutual inductance cancellation for X-type multilevel converters |
| TR2023015276A2 (tr) * | 2023-11-17 | 2024-02-21 | Türki̇ye'ni̇n Otomobi̇li̇ Gi̇ri̇şi̇m Grubu Sanayi̇ Ve Ti̇caret Anoni̇m Şi̇rketi̇ | Bi̇r kapasi̇tör |
| US20250309779A1 (en) * | 2024-03-27 | 2025-10-02 | GM Global Technology Operations LLC | System and method for mutual inductance cancellation for two-level converters |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011125083A (ja) | 2009-12-08 | 2011-06-23 | Denso Corp | 電力変換装置 |
| JP2016158358A (ja) | 2015-02-24 | 2016-09-01 | 株式会社デンソー | 半導体モジュール |
| JP2016157850A (ja) | 2015-02-25 | 2016-09-01 | トヨタ自動車株式会社 | 半導体モジュール、半導体装置、及び、半導体装置の製造方法 |
| JP2020010560A (ja) | 2018-07-11 | 2020-01-16 | 株式会社デンソー | 電力変換装置 |
| JP2020010549A (ja) | 2018-07-11 | 2020-01-16 | 株式会社デンソー | 電力変換装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4392153A (en) * | 1978-05-01 | 1983-07-05 | General Electric Company | Cooled semiconductor power module including structured strain buffers without dry interfaces |
| EP2244289B1 (en) * | 2000-04-19 | 2014-03-26 | Denso Corporation | Coolant cooled type semiconductor device |
| US6956742B2 (en) * | 2002-09-27 | 2005-10-18 | Rockwell Automation Technologies, Inc. | Compact liquid converter assembly |
| JP2005332863A (ja) | 2004-05-18 | 2005-12-02 | Denso Corp | パワースタック |
| JP5445507B2 (ja) * | 2010-06-03 | 2014-03-19 | 株式会社デンソー | 電力変換装置 |
| JP5488565B2 (ja) * | 2011-03-29 | 2014-05-14 | 株式会社デンソー | 電力変換装置 |
| JP5344013B2 (ja) * | 2011-09-06 | 2013-11-20 | 株式会社デンソー | 電力変換装置 |
| FR2985597B1 (fr) * | 2012-01-05 | 2014-10-24 | Valeo Equip Electr Moteur | Dispositif d'assemblage de capacites pour convertisseur electronique |
| JP2014090629A (ja) * | 2012-10-31 | 2014-05-15 | Denso Corp | 電力変換装置 |
| JP6458444B2 (ja) * | 2014-10-21 | 2019-01-30 | 株式会社デンソー | 電力変換装置 |
| JP6750514B2 (ja) * | 2017-01-18 | 2020-09-02 | 株式会社デンソー | 半導体装置 |
| JP6836201B2 (ja) * | 2017-12-19 | 2021-02-24 | 株式会社デンソー | 電力変換装置 |
| JP6915633B2 (ja) * | 2018-07-25 | 2021-08-04 | 株式会社デンソー | 電力変換装置 |
| JP7167959B2 (ja) * | 2020-03-30 | 2022-11-09 | 株式会社デンソー | コンデンサ素子用バスバ、コンデンサ、および、電力変換装置 |
-
2020
- 2020-01-22 JP JP2020008622A patent/JP7156319B2/ja active Active
- 2020-11-27 WO PCT/JP2020/044189 patent/WO2021149352A1/ja not_active Ceased
-
2022
- 2022-06-06 US US17/833,195 patent/US12089380B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011125083A (ja) | 2009-12-08 | 2011-06-23 | Denso Corp | 電力変換装置 |
| JP2016158358A (ja) | 2015-02-24 | 2016-09-01 | 株式会社デンソー | 半導体モジュール |
| JP2016157850A (ja) | 2015-02-25 | 2016-09-01 | トヨタ自動車株式会社 | 半導体モジュール、半導体装置、及び、半導体装置の製造方法 |
| JP2020010560A (ja) | 2018-07-11 | 2020-01-16 | 株式会社デンソー | 電力変換装置 |
| JP2020010549A (ja) | 2018-07-11 | 2020-01-16 | 株式会社デンソー | 電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12089380B2 (en) | 2024-09-10 |
| US20220304185A1 (en) | 2022-09-22 |
| JP2021118562A (ja) | 2021-08-10 |
| WO2021149352A1 (ja) | 2021-07-29 |
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