JP7153195B2 - Mother board, mother board manufacturing method - Google Patents

Description

The present invention relates to a mother substrate, a mother substrate manufacturing method, and a mother substrate manufacturing apparatus.

2. Description of the Related Art Conventionally, a method described in Patent Document 1 is known as a method for manufacturing a parent substrate. In the method of manufacturing a mother board (screen printing method) described in Patent Document 1, a first pattern and a second pattern are formed on one screen mask, and the first pattern is formed on the printing surface of the first printed circuit board. a first printing step of printing a pattern; a step of carrying out the printed circuit board on which the first pattern has been printed to the next step; and printing of the second pattern on the printing surface of the second printed circuit board. It is disclosed that it comprises a second printing process and a process of carrying out the printed circuit board on which the second pattern has been printed to the next process.

JP 2008-272964 A

However, in the process disclosed in Patent Document 1, when trying to manufacture a mother substrate having different patterns formed on the front and back surfaces, two types of screen masks are used: a screen mask for printing the front surface and a screen mask for printing the back surface. A screen mask is required. Therefore, if a single screen mask can be used to manufacture a parent substrate having different patterns on the front and back surfaces, it is possible to reduce costs and improve manufacturing efficiency.

The present invention has been completed based on the circumstances as described above, and an object of the present invention is to suitably manufacture a mother substrate.

The present invention relates to a parent substrate having a plurality of child substrates arranged side by side in a plate surface direction,
The child board is
a first pattern portion made of a conductor having a predetermined pattern on one surface side;
A second pattern portion made of a conductor having a pattern different from that of the first pattern portion on the other surface side,
Among the plurality of child boards,
a sub-board on which the first pattern portion is arranged on the front surface is a sub-substrate with a first pattern portion on the surface;
When the sub-board on which the second pattern portion is arranged on the front surface is the sub-substrate with the second pattern portion on the surface,
The front first pattern sub-substrate and the front second pattern sub-substrate are arranged side by side in such a manner that the front and rear surfaces are two-fold rotationally symmetrical with respect to a predetermined axis parallel to the substrate surface of the main substrate. It is characterized by

According to such a mother board, when the front and back of the mother board are reversed (rotated 180 degrees) with respect to a predetermined axis, the front surface first pattern section child board is arranged with the first pattern section facing the front side before the reversal. The front second pattern sub-board is placed in the position where the first pattern part was facing the front side, and the front second pattern sub-board is placed with the second pattern part facing the front side before the reversal. At this position, the sub-board of the first pattern portion is arranged with the second pattern portion on the front side. That is, when the mother substrate is reversed with respect to a predetermined axis, the front and back surfaces of the mother substrate form the same pattern. As a result, when manufacturing a parent substrate using a masking member for forming a conductor of a predetermined pattern, one masking member is also used, and the front and back of the parent substrate (base material) are reversed on the basis of a predetermined axis. By doing so, it is possible to manufacture a parent substrate having child substrates with different conductor patterns on the front and back surfaces.

The present invention also provides a method for manufacturing a mother substrate having a plurality of daughter substrates arranged side by side in a plate surface direction,
The parent substrate is formed by forming a conductor on a plate-shaped base material,
The child board has a first pattern portion made of the conductor having a predetermined pattern on the front surface, and a second pattern portion made of the conductor having a pattern different from the first pattern portion on the back surface. is,
By forming the conductor while covering the surface of the base material with a masking member, the first pattern portion is formed on the surface of some of the child substrates among the plurality of child substrates, and the first pattern portion is formed on the surface of the other child substrates. a surface pattern forming step of forming the second pattern portion on the surface of the child substrate;
After the surface pattern forming step, a reversing step of reversing the front and back of the base material with reference to a predetermined axis parallel to the plate surface of the base material;
After the reversing step, by forming the conductor while covering the back surface of the base material with the masking member, the second substrate is formed on the back surface of the other sub-board among the plurality of sub-boards. and a rear surface pattern forming step of forming the first pattern portion and the second pattern portion on the rear surface of the part of the slave substrates.

According to such a mother substrate manufacturing method, one masking member can be used both for the front surface pattern forming process and for the back surface pattern forming process. That is, by using one masking member, it is possible to manufacture a parent substrate having child substrates with different conductor patterns on the front and back surfaces.

Further, the manufacturing method includes a transporting step of transporting the base material,
In the reversing step, the substrate may be reversed about an axis orthogonal to the conveying direction as the predetermined axis.

According to such a method for manufacturing a mother substrate, even if the base material is turned over, the position of the base material is less likely to shift in the direction (width direction) perpendicular to the conveying direction. Thereby, in the transporting step, a transporting device having a minimum width for transporting the base material can be employed.

Further, in the reversing step, the base material may be reversed when the conductor is formed only on the surface of the base material.

According to such a method for manufacturing a mother substrate, a base material whose surface is not coated with a conductor can undergo a surface pattern forming process, and a base material whose surface is coated with a conductor is turned over to form a back surface. The manufacturing process of the parent substrate can be controlled so that it can go through the patterning process.

Further, the present invention provides an apparatus for manufacturing a mother substrate having a plurality of daughter substrates arranged side by side in a plate surface direction,
The parent substrate is formed by forming a conductor on a plate-shaped base material,
a conductor forming device for forming a conductor in a predetermined pattern on the base material;
a reversing device for reversing the front and back of the base material with respect to a predetermined axis;
a conveying device that conveys the base material from the reversing device to the conductor forming device,
The reversing device is for reversing the base material along an axis perpendicular to the conveying direction as the predetermined axis, and reversing the base material when the conductor is formed only on the surface of the base material. It is characterized by

According to such a mother board manufacturing apparatus, it is preferable to use a single masking member, turn over the base material about a predetermined axis, and have a mother board having a child board with different conductor patterns on the front and back surfaces. can be manufactured to

According to the present invention, it is possible to suitably manufacture the parent substrate.

The figure which looked at the surface of the mother board|substrate which concerns on embodiment from the front side. View of the back side of the mother board from the front side View of one side of the slave board viewed from the front side View of the other side of the slave board viewed from the front side Side view of mother board manufacturing equipment Diagram showing surface printing process (surface pattern forming process) Figure with the masking member removed in the surface printing process (surface pattern forming process) Diagram showing the reversing process Diagram showing the back side printing process (back side pattern forming process) Figure with the masking member removed in the back side printing process (back side pattern formation process)

<Embodiment>
An embodiment of the present invention will be described with reference to FIGS. 1 to 10. FIG. As shown in FIG. 1, the mother board 1 in the present embodiment has a rectangular shape when viewed from the front. These X direction and Y direction are common in each drawing. In FIG. 1, the front side of the paper surface of the mother substrate 1 is surface A, and in FIG. The face is the back face B. Further, the direction orthogonal to the plane formed by the X direction and the Y direction is defined as the vertical direction, the vertical upper side (the front side of the paper in FIG. 1) is the front side, and the vertical lower side (the back side of the paper in FIG. 1) is the back side. The child boards 2 of the mother board 1 of the present embodiment are separated from each other and provided in the interior material of a vehicle as a vehicle. It is a control board used for

As shown in FIG. 1, the main substrate 1 is formed by printing (forming) conductors 30 in a predetermined pattern on a substrate P which is rectangular in plan view and has a plate shape. It has a plurality of slave boards 2 . The mother board 1 has 12 child boards 2 in total, with four child boards 2 arranged in the X direction and three child boards 2 arranged in the Y direction. As shown in FIGS. 1 and 2, the mother board 1 has, on its front and back surfaces A and B, peripheral edge pattern portions 3 made of conductors 30 printed in a predetermined pattern on the peripheral edge portion, and front and back surfaces of the child substrate 2. has a first pattern portion 10 and a second pattern portion 20 each made of a conductor 30 printed in a predetermined pattern.

In the present embodiment, the base material P is made of, for example, a woven glass cloth made by knitting glass fibers in a cloth shape and impregnated with an epoxy resin. Also, the conductor 30 is made of hardened cream solder, for example. Furthermore, electronic parts such as an IC chip and a switch are mounted on the conductors 30 of the child board 2, but the electronic parts will be omitted in the description of the present embodiment.

The mother substrate 1 is provided with grooves 4 for separating the plurality of child substrates 2 from the mother substrate 1 . Therefore, the shape of the groove portion 4 forms the external shape of the daughter board 2 after separation. 3 and 4 show one of the sub-boards 2 after separation (one of the front surface first pattern sub-substrates 2A to be described later). As shown in FIG. 3, the child board 2 is a diagram in which a first pattern portion 10 made of a conductor 30 printed in a predetermined pattern on one surface of the base material P and the child board 2 are reversed. As shown in FIG. 4, a second pattern portion 20 made of a conductor 30 printed in a pattern different from that of the first pattern portion 10 is provided on the other surface (rear surface of one surface) of the base material P. . As shown in FIGS. 3 and 4, the child board 2 has an outer shape symmetrical with respect to the Y direction passing through the center in the X direction. and an enlarged diameter portion 12 having a larger diameter in the X direction than the uneven portion 11 .

As shown in FIG. 1, the mother board 1 includes a surface first pattern part child board 2A, which is the child board 2 on which the first pattern part 10 is arranged on the surface A, and a second pattern part child board 2A. a surface second pattern sub-board 2B, which is the sub-board 2 on which the part 20 is arranged on the surface A; After the plurality of child boards 2 are separated from the mother board 1 by the grooves 4, the first surface pattern child board 2A and the second surface pattern child board 2B are the same child board 2. FIG.

Here, assuming that an axis parallel to the board surface of the mother board 1 and extending in the Y direction at the center of the mother board 1 in the X direction is a predetermined axis C, on the left side of the predetermined axis C is: Six front surface first pattern sub-boards 2A are arranged side by side, and on the right side of the predetermined axis C, six front surface second pattern sub-boards 2B are arranged side by side. Of the six front surface first pattern sub-substrates 2A, the three on the left side are arranged so that the enlarged diameter portion 12 is on the upper side in the Y direction, and the three on the right side have the uneven portion 11. It is arranged so as to be on the upper side in the Y direction. Similarly, among the six front surface second pattern sub-substrates 2B, the three substrates in the right row are arranged so that the enlarged diameter portion 12 is on the upper side in the Y direction, and the three substrates in the left row are uneven. The portion 11 is arranged on the upper side in the Y direction.

The front surface first pattern sub-board 2A and the front surface second pattern sub-substrate 2B are arranged side by side in such a manner that the front and rear surfaces are two-fold rotationally symmetrical with respect to a predetermined axis C. As shown in FIG. Specifically, when the parent substrate 1 is turned over with respect to the predetermined axis C, as shown in FIG. As shown in FIG. 2, the front surface second pattern sub-substrate 2B is arranged in the position where the first pattern portion 10 is on the front side. Further, as shown in FIG. 1, the front surface first pattern part 2B is placed at the position where the front surface second pattern part sub-board 2B was arranged with the second pattern part 20 facing the front side before the reversal, as shown in FIG. The component board 2A is arranged with the second pattern portion 20 on the front side. That is, when the mother board 1 is turned over with respect to the predetermined axis C, the predetermined patterns on the daughter board 2 form the same pattern on the front and back surfaces A and B of the mother board 1 .

Next, the manufacturing apparatus 5 for the mother board 1 will be described. As shown in FIG. 5, the manufacturing apparatus 5 for the mother board 1 includes a reversing device 60 for reversing the front and back of the base material P with respect to a predetermined axis C, and a printing device for printing the conductors 30 having a predetermined pattern on the base material P. (Electric conductor forming device) 50 and a conveying device 70 that conveys the substrate P from at least the reversing device 60 to the printing device 50 . A rack 80 in which the base material P is stored is arranged downstream (on the left side) of the printing device 50 . The conveying device 70 is provided so as to pass through the insides of the reversing device 60, the printing device 50, and the rack 80, and conveys the substrate P in the X direction. Note that the X direction and the transport direction X are the same direction.

As shown in FIG. 6, the printing device 50 has a plurality of holes 52 arranged in a predetermined pattern, a masking member 51 that partially covers the base material P from the front side, and a masking member 51 on the front side of the masking member 51. , and a spatula-like squeegee 53 for extending the uncured conductor 30 (cream solder) and imprinting it into the hole 52 . The masking member 51 is a thin plate-like member made of metal and is sometimes called a metal mask. The arrangement pattern of the hole portions 52 of the masking member 51 is, as shown in FIGS. the shape of the printed conductor 30).

As shown in FIG. 8, the reversing device 60 has a reversing mechanism 61 for reversing the base material P around the Y direction perpendicular to the transport direction X as an axis. The reversing mechanism 61 does not reverse the substrate P when the conductor 30 is not printed on the surface A of the substrate P (the same surface as the surface A of the mother substrate 1), and only the surface A of the substrate P is electrically conductive. It is assumed that the substrate P is inverted when the body 30 is being printed. For example, the reversing mechanism 61 determines whether or not an electronic component is mounted on the surface A of the base material P using an image, reads the peripheral pattern portion 3 to determine the front and back sides of the base material P, and the like. Whether or not the material P is to be reversed can be controlled.

Next, a method for manufacturing the mother board 1 will be described. The method of manufacturing the mother board 1 can be roughly divided into a surface printing process (surface pattern forming process) for printing the conductors 30 on the surface A of the base material P, and after the surface printing process, the base material P is turned over. a reversing step, after the reversing step, a back surface printing step (back surface pattern forming step) for printing the conductors 30 on the back surface B of the base material P (the same surface as the back surface B of the mother substrate 1); and a conveying step of conveying.

As shown in FIG. 5 , first, the base material P is arranged upstream (on the right side) of the conveying device 70 and then conveyed to the reversing device 60 . At this time, since the conductor 30 is not printed on the surface A of the base material P, the reversing mechanism 61 is not driven. Therefore, the base material P is conveyed to the printing device 50 with the surface A facing the front side without being turned upside down.

In the surface printing step, as shown in FIG. 6, the uncured conductor 30 is applied (formed) to the surface A of the base material P conveyed to the printing device 50 while covering the masking member 51 . Specifically, after the masking member 51 is placed on the surface A of the base material P and the uncured conductor 30 is placed on the front side of the masking member 51, the squeegee 53 is slid to remove the masking member 51. An uncured conductor 30 is imprinted into the hole 52 . 6 shows a cross section of the substrate P taken along line DD shown in FIG.

The masking member 51 is removed from the base material P after the uncured conductor 30 is imprinted into the plurality of holes 52 . Then, the first pattern portion 10 and the second pattern portion 20 are printed on the surface A of the substrate P, as shown in FIG. Specifically, in the substrate P (mother board 1), among the parts to be the plurality of child boards 2, the first pattern is formed on the surface of the part to be the surface first pattern part child board (partial child board) 2A. The second pattern portion 20 is printed on the surface of the portion where the portion 10 will be the surface second pattern portion sub-board (another sub-board) 2B.

After that, after placing the electronic component on the conductor 30 by a mounting device (not shown), the electronic component and the conductor 30 are connected by heating the base material P in a reflow furnace (not shown). Then, as shown in FIG. 5, the base material P is transported to and accommodated in the rack 80 .

Subsequently, the substrate P accommodated in the rack 80 is arranged upstream of the conveying device 70 again, and then conveyed to the reversing device 60 . At this time, as shown in FIG. 8, the base material P (indicated by the two-dot chain line) having the conductor 30 printed only on its surface A is transported into the reversing device 60 with the conductor 30 on the front side. be. Then, the reversing mechanism 61 is driven to reverse the substrate P about the Y direction orthogonal to the transport direction X (reversing step). Then, the base material P is conveyed to the printing device 50 with the back surface B, on which the conductors 30 and the like are not arranged, facing the front side.

In the back surface printing process, as shown in FIG. 9 , the uncured conductor 30 is applied to the back surface B of the base material P conveyed to the printing device 50 while covering the masking member 51 . Specifically, after the masking member 51 is placed on the back surface B of the base material P and the uncured conductor 30 is placed on the front side of the masking member 51, the squeegee 53 is slid to remove the masking member 51. An uncured conductor 30 is imprinted into the hole 52 . 9 shows a cross section of the substrate P taken along the line DD shown in FIG. Also, the masking member 51 used in the back surface printing process is the same as the masking member 51 used in the front surface printing process, and the arrangement pattern of the holes 52 is the same.

The masking member 51 is removed from the base material P after the uncured conductor 30 is imprinted into the plurality of holes 52 . Then, as shown in FIG. 10, the first pattern portion 10 and the second pattern portion 20 are printed on the rear surface B of the base material P. Next, as shown in FIG. Specifically, in the substrate P (mother board 1), among the parts to be the plurality of child boards 2, the first pattern part is formed on the back surface of the part to be the surface second pattern part child board (another child board) 2B. A second pattern portion 20 is printed on the back surface of the portion where 10 is to be the surface first pattern portion sub-board (a part of sub-substrate) 2A.

After that, after placing the electronic component on the conductor 30 by a mounting device (not shown), the electronic component and the conductor 30 are connected by heating the base material P in a reflow furnace (not shown). Thus, the mother board 1 is manufactured from the base material P. As shown in FIG.

Next, the effects of this embodiment will be described. In this embodiment, the mother board 1 has a plurality of child boards 2 arranged side by side in the direction of the plate surface. 10, and a second pattern portion 20 made of conductors 30 having a pattern different from that of the first pattern portion 10 on the other surface (rear surface of one surface) side. The subsidiary board 2 having the first pattern portion 10 arranged on the surface A is referred to as a front first pattern subsidiary board 2A, and the subsidiary board 2 having the second pattern portion 20 arranged on the front surface A is referred to as a front second pattern subsidiary board 2B. In this case, the surface first pattern sub-substrate 2A and the surface second pattern sub-substrate 2B are arranged so that the front and back surfaces are two-fold rotationally symmetrical with respect to a predetermined axis C parallel to the substrate surface of the mother substrate 1. are arranged side by side.

According to such a mother board 1, when the front and back of the mother board 1 are reversed (rotated 180 degrees) with respect to the predetermined axis C, the front surface first pattern section child board 2A will face the first pattern section 10 before the reversal. The front second pattern sub-board 2B is placed with the first pattern 10 on the front side, and the front second pattern sub-substrate 2B is placed on the second pattern part 20 before reversing. The front surface first pattern sub-board 2A is placed with the second pattern portion 20 facing the front side at the position where it was arranged with the front side. That is, when the mother substrate 1 is reversed with respect to the predetermined axis C, the front and back surfaces of the mother substrate 1 form the same pattern. As a result, when the mother board 1 is manufactured using the masking member 51 for printing the conductors 30 of a predetermined pattern, one masking member 51 is also used, and the mother board 1 (the base board) is formed with the predetermined axis C as a reference. By reversing the front and back of the material P), it is possible to manufacture the mother substrate 1 having the daughter substrate 2 in which the patterns of the conductors 30 are different on the front and back surfaces A and B.

Further, the present embodiment is a method for manufacturing a mother board 1 having a plurality of child boards 2 arranged side by side in the direction of the plate surface. The child board 2 has a first pattern portion 10 made of conductors 30 of a predetermined pattern on the front surface and a conductor 30 of a pattern different from the first pattern portion 10 on the back surface. By forming the conductor 30 in a state where the surface A of the base material P is covered with the masking member 51, some of the child boards 2 are After the surface printing step (surface pattern forming step) of printing the first pattern portion 10 on the surface of the daughter board 2A and the second pattern portion 20 on the surface of the other daughter board 2B, and the surface printing step, the substrate After the reversing step of reversing the front and back of the base material P with respect to a predetermined axis parallel to the plate surface of the material P, and after the reversing step, the conductor is coated with the masking member 51 on the back surface B of the base material P. By forming 30, the first pattern portion 10 is printed on the back surface of the other child substrate 2B among the plurality of child substrates 2, and the second pattern portion 20 is printed on the back surface of some of the child substrates 2A. and a step (back pattern forming step).

According to such a method of manufacturing the mother board 1, one masking member 51 can be used for both the front surface printing process and the rear surface printing process. That is, by using one masking member 51, it is possible to manufacture the mother substrate 1 having the daughter substrate 2 having different patterns of the conductors 30 on the front and back surfaces.

Further, the manufacturing method includes a transporting step of transporting the substrate P, and in the reversing step, the substrate P is reversed along an axis orthogonal to the transporting direction X as a predetermined axis.

According to such a method for manufacturing the mother substrate 1, even if the base material P is turned over, the position of the base material P is less likely to shift in the Y direction (width direction) orthogonal to the transport direction X. Thereby, in the transporting step, a transporting device having a minimum width for transporting the base material P can be employed.

Further, in the reversing step, the base material P is reversed when the conductor 30 is printed only on the surface A of the base material P.

According to the manufacturing method of the mother board 1, the base material P having the surface A not coated with the conductor 30 can be subjected to the surface printing process, and the base material P having the surface A coated with the conductor 30 can be printed. can control the manufacturing process of the mother board 1 so that it can be reversed and passed through the back side printing process.

Further, the present embodiment is a manufacturing apparatus 5 for a mother substrate 1 having a plurality of child substrates 2 arranged side by side in the plate surface direction. A printing device (conductor forming device) 50 that prints (forms) the conductor 30 of a predetermined pattern on the substrate P, and a reversing device that reverses the front and back of the substrate P with respect to a predetermined axis. 60, and a conveying device 70 for conveying the base material P from the reversing device 60 to the printing device 50. The reversing device 60 reverses the base material P along an axis orthogonal to the conveying direction X as a predetermined axis. , and the substrate P is reversed when the conductor 30 is printed only on the surface A of the substrate P.

According to the apparatus 5 for manufacturing the mother board 1, one masking member 51 is also used, and the child board 2 having different patterns of the conductors 30 on the front and back surfaces is obtained by reversing the front and back sides of the base material P with respect to a predetermined axis. can be suitably manufactured.

<Other embodiments>
The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. can be implemented with various changes.

(1) The predetermined axis can be changed as appropriate in addition to the above embodiment. In the above embodiment, the predetermined axis is the axis extending in the Y direction orthogonal to the transport direction X, but is not limited to this. For example, the predetermined axis may be an axis parallel to the transport direction X. In this case, on the parent substrate, the front surface first pattern child substrate and the front surface second pattern child substrate are arranged side by side in such a manner that the front and back surfaces are two-fold rotationally symmetrical with respect to an axis parallel to the transport direction X.

(2) In addition to the above embodiment, the number of child boards can be changed as appropriate. In the above-described embodiment, 12 sub-substrates in total, 4 sub-substrates in the X direction and 3 sub-substrates in the Y direction, are arranged side by side, but the present invention is not limited to this. For example, a total of 16 child boards, four in the X direction and four in the Y direction, may be arranged side by side.

(3) Other than the above embodiments, the arrangement of child boards can be changed as appropriate. For example, on the left side of the predetermined axis C, the three substrates in the left row are surface first pattern sub-substrates arranged so that the enlarged diameter portion is on the upper side in the Y direction, and the three substrates in the right row are uneven substrates. on the right side of the predetermined axis C, the three substrates in the right row are arranged so that the enlarged diameter portion is on the upper side in the Y direction. The three substrates in the left row may be the first surface pattern sub-substrates arranged so that the concave/convex portions are on the upper side in the Y direction.

(4) The child board exemplified in the above embodiment is a control board used in a lighting device as an interior material. may be Further, the child board is not limited to those provided for vehicles, and may be provided for various vehicles. For example, the above-mentioned mother board and its manufacture are also used for sub-boards used for trains and amusement vehicles as ground vehicles, airplanes and helicopters as flying vehicles, and ships and submarines as sea and undersea vehicles. method can be applied.

DESCRIPTION OF SYMBOLS 1... Mother board 2... Child board 2A... First surface pattern part child board 2B... Second surface pattern part child board 5... Mother board manufacturing apparatus 10... First pattern part 20... Second pattern Section 30 Conductor 50 Printing device 51 Masking member 60 Reversing device 70 Conveying device P Base material

Claims (4)

A parent substrate having a plurality of child substrates arranged side by side in at least a first direction on a plate surface,
The child board is
a first pattern portion made of a conductor having a predetermined pattern on one surface side;
a second pattern portion made of a conductor having a pattern different from that of the first pattern portion on the other surface side;
and an enlarged diameter portion having a diameter in the first direction larger than that of the other portion ,
The plurality of child boards includes at least a first child board, a second child board, a third child board, and a fourth child board arranged in parallel in the first direction ,
The first sub-board and the second sub-board on which the first pattern portion is arranged are the surface first pattern sub-substrate,
When the third child board and the fourth child board on which the second pattern part is arranged on the front surface are used as the surface second pattern part child board,
The front surface first pattern member child substrate and the front surface second pattern member child substrate extend in a second direction parallel to the substrate surface of the parent substrate and perpendicular to the first direction, and the second child substrate The substrate and the third child substrate are arranged side by side in such a manner that the front and back surfaces are two-fold rotationally symmetrical with respect to a predetermined axis located between the substrate and the third child substrate ,
the second child board is arranged such that the enlarged diameter part of the second child board and the enlarged diameter part of the first child board are alternately arranged in the second direction;
the third child board is arranged such that the enlarged diameter part of the third child board and the enlarged diameter part of the second child board are adjacent to each other in the first direction;
The fourth child board is arranged such that the enlarged diameter part of the fourth child board and the enlarged diameter part of the third child board are alternately arranged in the second direction. substrate. A method for manufacturing a mother substrate having a plurality of daughter substrates arranged side by side in at least a first direction on a plate surface,
The parent substrate is formed by forming a conductor on a plate-shaped base material,
The child board has a first pattern portion made of the conductor of a predetermined pattern on the front surface, a second pattern portion made of the conductor of a pattern different from the first pattern portion on the back surface, and the second pattern portion made of the conductor of a pattern different from the first pattern portion on the back surface. and an enlarged diameter portion having a larger diameter than the other portion ,
the plurality of child boards includes at least a first child board, a second child board, a third child board, and a fourth child board arranged in parallel in the first direction;
The second child board is arranged such that the enlarged diameter part of the second child board and the enlarged diameter part of the first child board are alternately arranged in a second direction orthogonal to the first direction,
the third child board is arranged such that the enlarged diameter part of the third child board and the enlarged diameter part of the second child board are adjacent to each other in the first direction;
The fourth child board is arranged such that the enlarged diameter part of the fourth child board and the enlarged diameter part of the third child board are alternately arranged in the second direction,
By forming the conductor while covering the surface of the base material with a masking member, the first pattern portion is formed on the surface of some of the child substrates among the plurality of child substrates, and the first pattern portion is formed on the surface of the other child substrates. a surface pattern forming step of forming the second pattern portion on the surface of the child substrate;
After the surface pattern forming step, a reversing step of reversing the front and back of the base material with reference to a predetermined axis parallel to the plate surface of the base material;
After the reversing step, by forming the conductor while covering the back surface of the base material with the masking member, the second substrate is formed on the back surface of the other sub-board among the plurality of sub-boards. and a rear surface pattern forming step of forming the first pattern portion and the second pattern portion on the rear surface of the part of the child substrates. Including a conveying step of conveying the base material,
3. The method of manufacturing a mother board according to claim 2, wherein in the reversing step, the base material is reversed along an axis orthogonal to the conveying direction as the predetermined axis. 4. The method of manufacturing a mother board according to claim 2, wherein in the reversing step, the base material is reversed when the conductor is formed only on the surface of the base material.

Images