JP2005150658A - Substrate packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To decrease the number of use times of necessaries as to packaging work such as a packaging program, a metal mask for solder printing, etc. to facilitate the management of them, and to clearly define the criteria for arranging multiple wiring substrates onto a framework to efficiently perform the packaging steps. <P>SOLUTION: This is a method to mount onto a framework 1 each of four wiring substrates T<SB>1</SB>to T<SB>4</SB>to perform both-sides packaging of a first surface A and a second surface B, thus simultaneously doing packaging, wherein a packaging operation is carried out while each of the four wiring substrates T<SB>1</SB>to T<SB>4</SB>are line symmetrical to a virtual symmetrical line S<SB>0</SB>, and the two wiring substrates T<SB>1</SB>and T<SB>3</SB>and the two wiring substrates T<SB>2</SB>and T<SB>4</SB>, which are line symmetrical to the virtual symmetrical line S<SB>0</SB>, are alternately reversed, and mounted onto the framework 1 in this fashion. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of mounting a plurality of substrates to be mounted on a front and back both sides on a frame and mounting a plurality of electronic components simultaneously.

  Conventionally, in order to increase the mounting efficiency on a plurality of wiring boards, there is a method in which the same plurality of wiring boards are appropriately arranged and electronic components are simultaneously mounted on them. In order to mount electronic components on both the front and back sides of each wiring board, a board assembly is configured using a frame body to which a plurality of boards can be attached, and wiring is provided on one side or the other side. Each of the wiring boards is arranged on the frame so that any one of the circuit patterns on the front surface or the back surface of all the plurality of substrates appears. In this arrangement method, for example, one side of a board assembly mounted so that all the surfaces of a plurality of wiring boards are exposed faces upward, and the circuit pattern on the surface of each wiring board is placed on the plurality of wiring boards. Masking is performed with a surface solder printing metal mask corresponding to the entire pattern corresponding to the arrangement of the substrate, and solder is printed on a necessary portion. When solder printing on the surfaces of all the wiring boards appearing on one side of the board assembly is completed, the board assembly is opposed to the electronic component insertion tool after setting up such as supplying predetermined electronic parts to the mounting machine. And mount it on the mounting machine, read the mounting program for the surface reflecting the entire pattern for mounting, and execute the process of mounting electronic components on the surface of all the wiring boards that appear on one side of the board assembly To do. After mounting electronic components on the surface of the plurality of wiring boards arranged on one side of the board assembly in this way, the board assembly is turned upside down, and the other side is turned on the one side. The same process was repeated again to perform solder printing and electronic component mounting for the back surface of the wiring board.

  Therefore, according to the conventional electronic component double-side mounting method, two types of solder printing metal masks for one side and the other side of the board assembly reflecting the circuit patterns on the front and back sides of each wiring board are prepared. In order to mount electronic components after solder printing, it is necessary to prepare two types of electronic component mounting programs. Therefore, for example, when a circuit pattern of a wiring board is newly designed or changed, it is necessary to deal with two types of masks and programs, so that the burden of managing these is large. Also, in the process of mounting electronic components, the operation of the production facility is interrupted and the electronic components are reset from the front side to the back side, or individual mounting programs corresponding to one side and the other side of the board assembly As the number of setups such as reading in increased, production efficiency deteriorated.

  It is an object of the present invention to reduce the number of necessary products related to mounting work such as mounting programs and solder printing metal masks, thereby facilitating the management of these, and to determine the placement criteria for a plurality of wiring boards on the frame. It is to define clearly and perform the mounting process efficiently.

  In order to solve the above-mentioned problem, the invention of claim 1 is a method of mounting a plurality of substrates to be mounted on both sides of the front and back sides simultaneously to a frame, and mounting the even number of substrates with respect to a virtual symmetry line. Two substrates that are symmetrical and symmetrical with respect to the virtual symmetric line are mounted on the frame body in a state where the two substrates are reversed with respect to each other. .

  According to the first aspect of the present invention, when an even number of substrates are arranged as described above, the arrangement of each of the two groups of substrates arranged on the left and right of the virtual symmetry line is virtually reversed left and right, and each substrate is turned upside down. When reversed, the overall pattern, which is a combination of the mounting patterns (mounting positions of electronic components) on a plurality of (even) substrates, is the same before and after the reversal. As a result, when mounting multiple boards at the same time, only one “mounting pattern” is required for both the front and back sides. Thus, it is possible to easily design and change the necessary products such as “and the same positioning of the substrate in each mounting before and after reversal”.

  The invention of claim 2 is characterized in that, in the invention of claim 1, the plurality of substrates arranged on the same side with respect to the virtual symmetry line all face the same side.

  According to the invention of claim 2, in addition to the operation and effect of claim 1, the front and back of the substrate are mistaken both when attaching the substrate to the frame and when removing the substrate from the frame and storing it. Less is.

  According to the present invention, it is possible to reduce the number of various components including software such as a mounting program necessary for mounting electronic components, thereby facilitating management of these components, or to efficiently perform mounting operations.

Regarding the first embodiment of the present invention, first, an electronic component double-sided mounting method on four wiring boards will be described below with a focus on a method for arranging individual wiring boards on a frame. In the figure, “X” and “Y” indicate the horizontal direction and the vertical direction orthogonal to each other in the same plane, and “Z” indicates the vertical direction orthogonal to the plane. And “B” indicate the front surface and the back surface in a state where the wiring board is turned over along the horizontal direction X, respectively. Individual circuit patterns for the front surface and the back surface are formed on the front surface A and the back surface B of each of the four wiring boards T (T _{1 to} T ₄ ), and are assembled in the substrate assembly Q _1. Thus, after the mounting of the electronic components on the front and back surfaces A and B of the respective wiring boards T _{1 to} T ₄ is finished and appropriately removed from the frame 1, four identical wiring boards T can be obtained. In the following description, “T” is used as the reference numeral of the wiring board, and various subscripts added to “T” are for clearly expressing the difference in arrangement. FIG. 1A is a schematic plan view showing a board assembly Q ₁ in a state where _four wiring boards T _{1 to} T ₄ are arranged two by two horizontally and vertically. As shown in the drawing, the board assembly Q ₁ includes a frame body 1 having a substantially “field” shape for mounting _four wiring boards T _{1 to} T 4 one by one in four board mounting spaces, and the frame body 1. Each of the wiring boards T _{1 is formed in} a rectangular shape substantially similar to the outer shape of the wiring board 2 and arranged in parallel along the horizontal direction X and the vertical direction Y at approximately equal intervals so that they can be easily removed in a subsequent process. ~ T ₄ .

Next, the configuration of the board assembly Q ₁ , that is, the method for arranging the wiring boards T _{1 to} T _{4 on} the frame 1 will be described in more detail. Here, a symmetric line that places the two substrates arranged along the horizontal direction X in a line-symmetrical relationship is assumed to be a virtual symmetric line S ₀ . In the case of the embodiment, the wiring boards T ₁ and T ₃ that are lines perpendicular to the lateral direction X and belong to the left first group G ₁ (L) described later, and the right second group G ₁ (R). A center line that bisects the arrangement interval in the horizontal direction X with each of the wiring boards T ₂ and T ₄ belonging to 1 corresponds to the symmetry line S ₀ . Further, the rectangular surface of the substrate assembly Q ₁ shown in FIG. 1A is defined as the upper surface U facing the upper side along the vertical direction Z. As shown in the drawing, two wiring boards T ₁ and T ₃ belonging to the left first group G ₁ (L) are arranged along the vertical direction Y on the left side of the plane of symmetry of the board assembly Q _{1 from} the symmetry line S _0. The two wiring boards T ₂ and T ₄ belonging to the right second group G ₁ (R) are similarly arranged on the right side and the right side of the drawing, and the left first group G Both ( ₁ ) (L) wiring boards T ₁ and T ₃ are framed with the front surface A on the upper surface U and the right second group G ₁ (R) both wiring boards T ₂ and T ₄ with the back surface B on the upper surface U. It is attached to the body 1. Therefore, on the upper surface U of the board assembly Q ₁ , “front surface A—back surface B— reflecting the circuit patterns of the _four wiring boards T _{1 to} T ₄ in the order of“ upper left-upper right-lower left-lower right ”. An overall pattern Pa having a combination of “front surface A−back surface B” is formed.

Then, the substrate assembly Q ₁ described above is 180 ° about the virtual symmetry line S ₀ so that the arrangement of the left first group G ₁ (L) and the right second group G ₁ (R) is horizontally reversed. rotation [see FIG. 1 (b)], as shown in (c) of FIG. 1, the lower surface of the substrate, D assembly Q ₁ is are reversed to face the upper side in the vertical direction Z. Here, the white broken lines “B” and “A” are the back and front surfaces of the respective wiring boards that are paired with the solid white lines “A” and “B” appearing on the upper surface U before inversion. Is shown. That is, as a result of reversing the front and back, two wiring boards T ₂ and T ₄ belonging to the second group G ₁ (R) on the right side of the plane of symmetry S ₀ are arranged with the surface A facing upward. On the right side of the paper, the two wiring boards T ₁ and T ₃ belonging to the left first group G ₁ (L) are arranged in the same manner with the back surface B facing upward. An overall pattern Pa identical to the overall pattern Pa on the upper surface U is formed. In FIG. 1, the virtual symmetry line S ₀ is assumed as the rotation axis in order to illustrate the arrangement of the front surface A and the rear surface B of each wiring board T before and after the front and back inversion of the board assembly Q _{1 in} an easy-to-understand manner. There is no need to ask where the rotary shaft is in the work process. In short, if the board assembly Q ₁ is turned upside down so that the arrangement of the boards in the left first and right second groups G ₁ (L), G ₁ (R) is reversed left and right, There is no problem because the entire pattern Pa before and after inversion is the same.

Therefore, after mounting electronic components on each of the wiring boards T _{1 to} T ₄ [see FIG. 1 (a)] appearing on the upper surface U of the board assembly Q ₁ as in the conventional method, In order to mount an electronic component on the lower surface D side of the board assembly Q ₁ shown in (c), first, as described above, the board assembly Q ₁ is turned upside down as in the case of the upper face U. The lower surface D is faced upward and placed on a work table or the like, and solder is printed by masking the lower surface D with a metal mask (not shown) reflecting the entire pattern Pa of the upper surface U. The entire pattern Pa on the lower surface D has the same combination as the upper surface U in the order of “front surface A−back surface B−front surface A−back surface B”, and the same metal mask can be used. Then, after printing the solder when mounting the electronic components on the solder printing position of each wiring board T ₁ through T ₄ appearing on the lower surface D of the substrate assembly Q ₁ is, the electronic components set state to the mounting machine, Since the mounting position of the board assembly Q ₁ determined by the jig is maintained as it is on the upper surface U, and the same mounting program as that on the upper surface U can be read and the man-hours related to the setup can be performed. Is reduced. In addition, since the number of necessary parts related to electronic component mounting such as the mask and the program can be reduced, the burden of managing these is reduced, and it becomes easy to cope with design changes such as circuit pattern and electronic component changes. . Further, in the board assembly Q ₁ , both the wiring boards T ₁ and T ₃ belonging to the left first group G ₁ (L) arranged on the left side of the virtual symmetry line S ₀ are either the front surface A or the back surface B. Since the same surface is attached to the frame 1 so as to represent the upper surface U or the lower surface D, both when mounting the substrate on the frame and when removing and storing the substrate from the frame after mounting the electronic component In this case, the front and back of each wiring board T is less likely to be mistaken.

The above-described wiring board placement method that provides the above-described effects will be summarized by exemplifying a case where the wiring board T described above is arranged linearly along the lateral direction X. FIGS. 2A and 2B show the arrangement of circuit patterns in one row along the horizontal direction X when the number of wiring boards T arranged on the left and right of the virtual symmetry line S ₀ is one. FIG. In order to implement the present invention, a total of two wiring boards T ₁ (L) and T ₁ (R) forming one row are arranged symmetrically to the left and right with respect to the virtual symmetry line S ₀ . They must be placed upside down with respect to each other. And, the “number of cases” of the appearance of the circuit pattern of _one wiring board T ₁ (L) on the left side of the virtual symmetry line S ₀ is either one of the front surface A and the back surface B, and The wiring board T ₁ (R) on the right side of the virtual symmetric line S ₀ may be arranged so as to represent a surface obtained by inverting the front and back corresponding to the circuit pattern appearing on the left side. As shown in FIG. 2, there are two one-row patterns P ₁₁ , P ₁₁ in one row pattern formed by the individual circuit patterns of a total of two wiring boards T ₁ (L), T ₁ (R). There are _twelve .

Then, the (a) to 3 (d) is an explanatory view similar to FIG. 2 shows the case wiring board T which are respectively disposed on left and right virtual symmetry line S ₀ is two. On the left and right sides of the virtual symmetry line S ₀ , a total of four wiring boards T ₂ (L) and T ₁ (L) and four wiring boards T ₁ (R) and T ₂ (R), respectively. The wiring board T is arranged in one row. In this case, a set of two wiring boards T ₁ (L) and T ₁ (R) arranged on the left and right sides near the virtual symmetric line S ₀ and the other two arranged outside them. A set of wiring boards T ₂ (L) and T ₂ (R) must be arranged symmetrically with respect to each other within the set, and arranged so as to be reversed from each other. And, the “number of cases” of the appearance of individual circuit patterns of the left wiring board T ₁ (L) near the virtual symmetric line S ₀ and the wiring board T ₂ (L) arranged outside the virtual wiring line T ₀ is The total is 4 (= 2 ² ). Accordingly, the two wiring boards T ₁ (R) and T ₂ (R) on the right side of the virtual symmetric line S ₀ represent the surfaces obtained by reversing the front and back in correspondence with the four circuit patterns appearing on the left side. What is necessary is just to arrange | position symmetrically as mentioned above. FIG. 3 shows four one-row patterns P _{21 to} P ₂₄ formed by individual circuit patterns of a total of four wiring boards T ₂ (L) to T ₂ (R) forming one row. Further, as shown in FIG. 4, the wiring boards T arranged on the left and right sides of the virtual symmetry line S ₀ are respectively the left three wiring boards T ₃ (L) to T ₁ (L) and the right three boards. The same applies to the case where a total of six wiring boards T ₁ (R) to T ₃ (R) are arranged in one row, and the wiring boards T are arranged symmetrically in pairs. ₁ (L), T ₁ (R), a set of wiring boards T ₂ (L), T ₂ (R) outside them, and a set of wiring boards T ₃ (L ), T ₃ (R) are only required to be reversed in the same set. At this time, the “number of cases” in the appearance of the circuit patterns of the _three wiring boards T ₃ (L) to T ₁ (L) arranged on the left side of the virtual symmetry line S ₀ is a total of 8 (= 2 ³ ) That's right. 4A to 4H, eight one-row patterns P ₃₁ formed by individual circuit patterns of a total of six wiring boards T ₃ (L) to T ₃ (R) forming one row. shows the ~P _38.

Then, in order to arrange the even number of wiring boards T so as to form an overall pattern based on the above-described one-row pattern in order to configure the board assembly, one virtual symmetric line S ₀ is used as a reference. What is necessary is just to arrange | position along the vertical direction Y combining the said 1 line pattern arbitrarily. FIGS. 5A and 5B are schematic plan views corresponding to FIG. 1A of the board assemblies Q ₂ and Q ₃ of the _second and _third embodiments. In the substrate assemblies Q ₂ and Q ₃ of the _second and _third embodiments, one row is formed by two wiring boards T arranged along the lateral direction X, respectively, as in the first embodiment. 2 is an embodiment of an assembly. The substrate assembly Q ₁ of the first embodiment is an assembly in which the same two one-line patterns P ₁₁ are arranged along the vertical direction Y, whereas the substrate assembly Q of the second embodiment. in _2, the paper below the first line pattern P _11, the same virtual symmetry line S ₀ as a reference, and another one-line pattern P ₁₂ is disposed, both a line pattern P _11, P ₁₂ is An overall pattern Pb arranged along the vertical direction Y is formed. When the board assembly Q ₂ is turned upside down so that the arrangement of the wiring boards T in the left first group G ₂ (L) and the right second group G ₂ (R) is reversed left and right, The same overall pattern Pb as the previous overall pattern Pb is formed even after inversion, and electronic parts can be efficiently mounted on both sides as in the first embodiment.

In the board assembly Q ₃ of the third embodiment, a total of three line patterns P ₁₁ , P ₁₂ , P ₁₁ are similarly arranged in order along the vertical direction Y, and an overall pattern composed of six circuit patterns. This is an assembly in which a total of six wiring boards T _{1 to} T ₆ constituting these are similarly attached to the frame body 2 so that Pc is formed. It is clear from the drawing that the same effect as that of the other embodiments can be obtained when the above-mentioned one-line pattern is combined in three lines, and the same applies to combinations of four or more lines. Moreover, although the case where one line pattern was comprised with the two wiring boards T arrange | positioned linearly along the horizontal direction X was demonstrated, the number of the board | substrates of one line is the same about arbitrary even numbers of sheets. It can be implemented.

In each of the above-described embodiments, the example in which the rectangular wiring board T is arranged in a straight line has been described. However, the present invention is not necessarily limited to this shape. If a set of two wiring boards is arranged so as to be reversed in the left-right direction symmetrically with respect to the virtual symmetry line S ₀ , a board having an indefinite shape can be implemented.

(A) is a schematic plan view showing a board assembly Q ₁ in a state where _four wiring boards T _{1 to} T ₄ are arranged two by two horizontally and vertically, and (B) shows the boards. a diagram showing a state to to 180 ° mirror-reversed about a the assembly Q ₁ imaginary symmetry line S _0, (c) is a bottom D of the substrate assembly Q ₁ is facing upward in the vertical direction Z It is a schematic plan view showing a state where the front and back are reversed. (A) and (B) are explanatory diagrams showing the arrangement of circuit patterns in one row along the horizontal direction X when there is one wiring board T arranged on the left and right sides of the virtual symmetry line S ₀ . (A) to (d) is an explanatory view similar to FIG. 2 when the wiring board T arranged respectively two on the left and right virtual symmetry line S _0. (A) to (h) are explanatory views similar to FIG. 2 when the wiring board T which are arranged on left and right virtual symmetry line S ₀ is three. FIGS. 2A and 2B are schematic plan views corresponding to FIG. 1A of the substrate assemblies Q ₂ and Q ₃ of the _second and _third embodiments.

Explanation of symbols

Q _{1 to} Q ₃ : Board assembly T, T _{1 to} T ₆ : Wiring board
S ₀ : Virtual symmetry line 1, 2: Frame

Claims (2)

A method of mounting a plurality of substrates to be mounted on both sides of the front and back sides and mounting them simultaneously on a frame,
An even number of substrates are line-symmetric with respect to the virtual symmetry line and the two substrates having a line-symmetrical relationship with respect to the virtual symmetry line are arranged in the frame body in a state where the substrates are reversed with respect to each other. A method of mounting a board, characterized by mounting and performing a mounting operation. The substrate mounting method according to claim 1, wherein all of the plurality of substrates arranged on the same side with respect to the virtual symmetry line face the same side.

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