JP2000223794A - Printed sheet and its manufacture - Google Patents

Printed sheet and its manufacture

Info

Publication number
JP2000223794A
JP2000223794A JP11021869A JP2186999A JP2000223794A JP 2000223794 A JP2000223794 A JP 2000223794A JP 11021869 A JP11021869 A JP 11021869A JP 2186999 A JP2186999 A JP 2186999A JP 2000223794 A JP2000223794 A JP 2000223794A
Authority
JP
Japan
Prior art keywords
insulating film
conductive layer
printed sheet
groove
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11021869A
Other languages
Japanese (ja)
Inventor
Yasushi Nakano
康司 中野
Masahiko Asano
雅彦 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11021869A priority Critical patent/JP2000223794A/en
Publication of JP2000223794A publication Critical patent/JP2000223794A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a printed sheet which is used for various electronic devices, which is easy to bend and which can be bent in a desired position, and to provide its manufacturing method. SOLUTION: A printed sheet is formed in such a way that at least, either conductive layers 2 or insulating layers 3 are formed on one face or both faces of a flexible insulating film 1 by printing a flexible resin, and that a linear groove 10 in a prescribed depth is formed by a laser beam machining operation in a prescribed place on the insulating film 1 or the insulating layer 3. As a result, it is possible to obtain the printed sheet which is easy to bend and which can be bent surely in a prescribed position, and it is possible to obtain its manufacturing method.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、各種電子機器に用
いられる印刷シート及びその製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing sheet used for various electronic devices and a method for manufacturing the same.

【0002】[0002]

【従来の技術】近年、各種電子機器の多様化や高密度化
に伴い、これらの機器の操作部や表示部に用いられるパ
ネルシートやエレクトロルミネセンス素子、あるいは機
器内部の電気的接続に用いられる配線基板などの印刷シ
ートは、真直ぐな平面状態で装着されるだけではなく、
折り曲げた状態で機器へ装着されることも多く、折り曲
げ易く、かつ所定の位置で確実に折り曲げが可能なもの
が要求されている。
2. Description of the Related Art In recent years, with the diversification and high density of various electronic devices, they have been used for panel sheets and electroluminescent elements used for operation units and display units of these devices, or for electrical connection inside the devices. Printed sheets such as wiring boards are not only installed in a straight, flat state,
It is often mounted on a device in a bent state, and there is a demand for a device that can be easily bent and can be reliably bent at a predetermined position.

【0003】このような従来の印刷シートについて、配
線基板を例として図6及び図7を用いて説明する。
[0003] Such a conventional printing sheet will be described with reference to FIGS. 6 and 7 taking a wiring board as an example.

【0004】なお、構成を判り易くするために、各図面
は厚さ方向の寸法を拡大して表わしている。
[0004] In order to make the configuration easy to understand, the drawings are enlarged in the thickness direction.

【0005】図6は従来の配線基板の斜視図であり、同
図において、1はポリエチレンテレフタレートやポリイ
ミド等の可撓性を有する絶縁フィルムで、この下面に銀
やカーボン等の導電粉を分散したポリエステルやエポキ
シ等の可撓性を有する樹脂によって、複数の導電層2が
印刷形成されている。
FIG. 6 is a perspective view of a conventional wiring board. In FIG. 6, reference numeral 1 denotes a flexible insulating film such as polyethylene terephthalate or polyimide, on which a conductive powder such as silver or carbon is dispersed. A plurality of conductive layers 2 are formed by printing with a flexible resin such as polyester or epoxy.

【0006】そして、導電層2の両端の電極2Aと2B
を除く全面に、導電層2を覆うようにポリエステルやエ
ポキシ等の可撓性を有する樹脂によって絶縁層3が印刷
形成されると共に、機器に装着した際に折り曲げる箇所
の両端には、それぞれ配線基板を折り曲げ易くするため
の窪み4Aと4Bが形成されて配線基板が構成されてい
る。
The electrodes 2A and 2B at both ends of the conductive layer 2
The insulating layer 3 is printed and formed on the entire surface except for the conductive layer 2 by a flexible resin such as polyester or epoxy so as to cover the conductive layer 2. The recesses 4A and 4B for facilitating bending are formed to form a wiring board.

【0007】また、以上のような構成の配線基板は、そ
のままの真直ぐな平面状態で機器に装着される他、図7
に示すように、窪み4A,4Bの部分で折り曲げられ、
電極2A,2Bが機器内部の電子回路(図示せず)へ接
続されて、各々の電子回路間の電気的接続を行うように
機器に装着されるものであった。
The wiring board having the above-described structure is mounted on a device in a straight and flat state as it is.
As shown in the figure, it is bent at the recesses 4A and 4B,
The electrodes 2A and 2B are connected to an electronic circuit (not shown) inside the device, and are mounted on the device so as to make an electrical connection between the respective electronic circuits.

【0008】[0008]

【発明が解決しようとする課題】しかしながら上記従来
の印刷シートにおいては、絶縁フィルム1自身が一定の
厚さを有していることに加え、導電層2の数が増え印刷
シートの幅が大きいものである場合、絶縁フィルムの弾
性力によって所定の幅の窪み4A,4Bだけでは鋭角に
折り曲げ難く、また、曲げ位置のばらつきが生じ易いと
いう課題があった。
However, in the above-mentioned conventional printing sheet, in addition to the insulating film 1 having a constant thickness, the number of conductive layers 2 is increased and the width of the printing sheet is large. In this case, there is a problem that it is difficult to bend at an acute angle only by the depressions 4A and 4B having a predetermined width due to the elastic force of the insulating film, and that the bending positions are apt to vary.

【0009】本発明は、このような従来の課題を解決す
るものであり、折り曲げ易く、かつ所定の位置で確実に
折り曲げが可能な印刷シート及びその製造方法を提供す
ることを目的とする。
An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a printing sheet which is easy to bend and can be reliably bent at a predetermined position, and a method for manufacturing the same.

【0010】[0010]

【課題を解決するための手段】上記課題を解決するため
に本発明は、可撓性を有する絶縁フィルムの片面または
両面に、導電層または絶縁層の少なくとも一方を可撓性
を有する樹脂によって印刷形成すると共に、絶縁フィル
ムまたは絶縁層の所定の箇所にレーザ加工によって所定
深さの直線状の溝を形成して印刷シートを構成するもの
である。
According to the present invention, at least one of a conductive layer and an insulating layer is printed on one or both sides of a flexible insulating film using a flexible resin. The printing sheet is formed by forming a linear groove having a predetermined depth by laser processing in a predetermined portion of the insulating film or the insulating layer.

【0011】これにより、折り曲げ易く、所定の位置で
確実に折り曲げが可能な印刷シートを得ることができ
る。
As a result, it is possible to obtain a printed sheet which can be easily bent and can be reliably bent at a predetermined position.

【0012】[0012]

【発明の実施の形態】本発明の請求項1に記載の発明
は、可撓性を有する絶縁フィルムの片面または両面に、
可撓性を有する樹脂によって導電層または絶縁層の少な
くとも一方を印刷形成すると共に、上記絶縁フィルムま
たは絶縁層の少なくとも一方の所定の箇所に、レーザ加
工によって所定深さの直線状の溝を形成したものであ
り、レーザ加工によって所定の箇所に直線状の溝が形成
されているため、この位置で折り曲げ易く、確実に折り
曲げが可能な印刷シートを得ることができるという作用
を有する。
BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is characterized in that a flexible insulating film is provided on one or both sides thereof.
At least one of the conductive layer and the insulating layer was formed by printing with a flexible resin, and a linear groove having a predetermined depth was formed by laser processing at a predetermined portion of at least one of the insulating film and the insulating layer. Since a linear groove is formed at a predetermined position by laser processing, it is possible to obtain a printed sheet that can be easily bent at this position and can be reliably bent.

【0013】請求項2に記載の発明は、請求項1記載の
発明において、絶縁フィルムの片面に少なくとも導電層
を印刷形成し、他方の面に直線状の溝を形成したもので
あり、導電層が印刷形成された面とは逆の面に溝が形成
されているため、印刷シートの幅全体に溝を直線状に形
成できると共に、絶縁フィルムの厚さに合わせ適切な深
さの溝を設けることができるという作用を有する。
According to a second aspect of the present invention, in the first aspect of the invention, at least a conductive layer is formed by printing on one surface of the insulating film and a linear groove is formed on the other surface. Since the groove is formed on the surface opposite to the surface on which the print is formed, the groove can be formed linearly over the entire width of the print sheet, and a groove having an appropriate depth is provided according to the thickness of the insulating film. It has the effect of being able to.

【0014】請求項3に記載の発明は、請求項1または
2記載の発明において、直線状の溝を複数の箇所に形成
したものであり、機器への装着状態に合わせて直線状の
溝を組み合わせ、コの字状やZ字状あるいは蛇腹状等の
複雑な折り曲げが可能な印刷シートが得られるという作
用を有する。
According to a third aspect of the present invention, in the first or the second aspect of the present invention, a linear groove is formed at a plurality of locations. It has the effect of obtaining a print sheet that can be folded in a complicated manner such as a combination, a U-shape, a Z-shape, or a bellows shape.

【0015】請求項4に記載の発明は、請求項1〜3の
いずれか一つに記載の発明において、直線状の溝を導電
層部分を除き略破線状に形成したものであり、印刷シー
トの導電層や絶縁層が印刷された面側に折り曲げ用の溝
を形成する場合、略破線状にすることによって、導電層
を切断することなく直線状の溝を形成することができる
という作用を有する。
According to a fourth aspect of the present invention, there is provided a printing sheet according to any one of the first to third aspects, wherein the linear groove is formed in a substantially broken line shape except for the conductive layer portion. When forming a groove for bending on the surface side on which the conductive layer or the insulating layer is printed, by forming the groove substantially in a broken line, it is possible to form a linear groove without cutting the conductive layer. Have.

【0016】請求項5に記載の発明は、レーザ加工によ
って所定深さの直線状の溝を形成する請求項1〜4のい
ずれか一つに記載の印刷シートの製造方法としたもので
あり、折り曲げ易く、所定の位置で確実に折り曲げが可
能な印刷シートを容易に製造することができるという作
用を有する。
According to a fifth aspect of the present invention, there is provided a method of manufacturing a printed sheet according to any one of the first to fourth aspects, wherein a linear groove having a predetermined depth is formed by laser processing. This has the effect that a printed sheet that can be easily bent and can be reliably bent at a predetermined position can be easily manufactured.

【0017】以下、本発明の実施の形態による印刷シー
トについて、配線基板を例として図1〜図5を用いて説
明する。
Hereinafter, a printed sheet according to an embodiment of the present invention will be described with reference to FIGS.

【0018】なお、構成を判り易くするために、各図面
は厚さ方向の寸法を拡大して表わしている。
In addition, in order to make the configuration easy to understand, each drawing shows an enlarged size in the thickness direction.

【0019】また、従来の技術の項で説明した構成と同
一構成の部分には同一符号を付して、詳細な説明を省略
する。
The same components as those described in the section of the related art are denoted by the same reference numerals, and detailed description will be omitted.

【0020】図1は本発明の一実施の形態による配線基
板の斜視図であり、同図において、1はポリエチレンテ
レフタレートやポリイミド等の可撓性を有する絶縁フィ
ルムで、この下面に銀やカーボン等の導電粉を分散した
ポリエステルやエポキシ等の可撓性を有する樹脂によっ
て、複数の導電層2が印刷形成されている。
FIG. 1 is a perspective view of a wiring board according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a flexible insulating film such as polyethylene terephthalate or polyimide. A plurality of conductive layers 2 are formed by printing with a flexible resin such as polyester or epoxy in which conductive powder is dispersed.

【0021】そして、導電層2の両端の電極2Aと2B
を除く全面に、導電層2を覆うようにポリエステルやエ
ポキシ等の可撓性を有する樹脂によって絶縁層3が印刷
形成されると共に、絶縁フィルム1の上面の所定の箇所
には、レーザ加工によって折り曲げ用の所定深さの直線
状の溝10が形成されて配線基板が構成されている。
The electrodes 2A and 2B at both ends of the conductive layer 2
The insulating layer 3 is printed and formed with a flexible resin such as polyester or epoxy so as to cover the conductive layer 2 on the entire surface except for the conductive layer 2, and a predetermined portion of the upper surface of the insulating film 1 is bent by laser processing. The wiring board is formed by forming a linear groove 10 having a predetermined depth for use.

【0022】以上のような配線基板の製造方法について
説明すると、図2に示すように、まず縦横500mm程
度のシート状のポリエチレンテレフタレートやポリイミ
ド等の可撓性を有する絶縁フィルム11の下面に、銀や
カーボン等の導電粉を分散したポリエステルやエポキシ
等の可撓性を有する樹脂によって、複数の導電層2を印
刷形成した後、導電層2の両端の電極2Aと2Bを除く
全面に、導電層2を覆うようにポリエステルやエポキシ
等の可撓性を有する樹脂によって絶縁層3を印刷形成す
る。
The method of manufacturing the wiring board as described above will be described. As shown in FIG. 2, first, a sheet-like flexible insulating film 11 such as polyethylene terephthalate or polyimide having a length and width of about 500 mm is formed on the lower surface of silver. After printing and forming a plurality of conductive layers 2 with a flexible resin such as polyester or epoxy in which conductive powder such as carbon or carbon is dispersed, the conductive layer 2 is formed on the entire surface of the conductive layer 2 except for the electrodes 2A and 2B at both ends. The insulating layer 3 is formed by printing with a flexible resin such as polyester or epoxy so as to cover the insulating layer 3.

【0023】そして、次に絶縁フィルム11の上面、つ
まり導電層2や絶縁層3を印刷形成した面の裏面の、機
器に装着した際に折り曲げる箇所にレーザ光線によって
所定深さの直線状の溝10Aを形成し、最後に、個々の
外形を切断加工することによって、図1に示したような
配線基板が完成する。
Then, a linear groove having a predetermined depth is formed by a laser beam on the upper surface of the insulating film 11, that is, on the back surface of the surface on which the conductive layer 2 and the insulating layer 3 are printed and formed, where the bending is performed when the device is mounted on a device. 10A is formed, and finally, the individual outer shapes are cut to complete the wiring board as shown in FIG.

【0024】なお、直線状の溝10Aは、レーザ光線に
よって加工しているため、絶縁フィルム11の材質や厚
さ等によって、レーザ光線の強さを調整し、溝10Aの
深さや幅等を適切なものとすることができる。
Since the linear groove 10A is processed by a laser beam, the intensity of the laser beam is adjusted according to the material and thickness of the insulating film 11, and the depth and width of the groove 10A are appropriately adjusted. It can be.

【0025】そして、以上のような構成の配線基板は、
図3に示すように、溝10の部分で折り曲げ、電極2
A,2Bが機器内部の電子回路(図示せず)に接続され
て、各々の電子回路間の電気的接続を行うように機器に
装着される。
The wiring board having the above configuration is
As shown in FIG. 3, the electrode 2 is bent at the groove 10 and
A and 2B are connected to an electronic circuit (not shown) inside the device, and are mounted on the device so as to make electrical connection between the respective electronic circuits.

【0026】このように本実施の形態によれば、レーザ
加工により形成した直線状の溝に沿って折り曲げができ
るため、折り曲げ易く、所定の位置で確実に折り曲げが
可能な印刷シート及びその製造方法を得ることができる
ものである。
As described above, according to the present embodiment, a printed sheet that can be bent along a linear groove formed by laser processing, is easily bent, and can be reliably bent at a predetermined position, and a method of manufacturing the same. Can be obtained.

【0027】そして、導電層2や絶縁層3が印刷形成さ
れた面とは逆の面に溝10が形成されているため、印刷
シートの幅全体に溝を直線状に形成できると共に、絶縁
フィルム1の材質や厚さに合わせ適切な深さの溝を設け
ることもできる。
Since the groove 10 is formed on the surface opposite to the surface on which the conductive layer 2 and the insulating layer 3 are formed by printing, the groove can be formed linearly over the entire width of the printed sheet and the insulating film can be formed. It is also possible to provide a groove having an appropriate depth according to the material and thickness.

【0028】また、図4(a)に示すように、直線状の
溝10Bを複数の箇所に形成することによって、機器へ
の装着状態に合わせて直線状の溝を組み合わせ、図4
(b)に示すようなコの字状や、Z字状あるいは蛇腹状
等の複雑な折り曲げを行うことができる。
Further, as shown in FIG. 4A, by forming the linear grooves 10B at a plurality of locations, the linear grooves are combined according to the mounting state to the equipment, and
Complex bending such as a U-shape, a Z-shape, or a bellows shape as shown in FIG.

【0029】なお、以上の説明では絶縁フィルム1の下
面、つまり導電層2や絶縁層3が印刷形成された側の面
とは逆の面に溝10,10Bを形成した構成について説
明したが、導電層2や絶縁層3が印刷形成された側の面
に溝を形成しても同様の効果が得られることは言うまで
もない。
In the above description, the structure in which the grooves 10 and 10B are formed on the lower surface of the insulating film 1, that is, the surface opposite to the surface on which the conductive layer 2 and the insulating layer 3 are printed is described. It goes without saying that a similar effect can be obtained by forming a groove on the surface on which the conductive layer 2 and the insulating layer 3 are printed.

【0030】そして、図5に示すように、導電層2や絶
縁層3が印刷された面側に折り曲げ用の溝を形成する場
合、溝10Cを導電層2の部分を除いた略破線状とする
ことによって、絶縁層3だけではなく、絶縁フィルム1
に達する深さの溝を形成しても、導電層2を切断するこ
となく溝を形成することができる。
As shown in FIG. 5, when a groove for bending is formed on the surface on which the conductive layer 2 and the insulating layer 3 are printed, the groove 10C is formed in a substantially broken line shape excluding the conductive layer 2 portion. By doing so, not only the insulating layer 3 but also the insulating film 1
Can be formed without cutting the conductive layer 2.

【0031】また、製造方法の手順によっては、絶縁フ
ィルム1に溝10を形成した後に絶縁層3を形成して
も、本発明の実施が可能なことは勿論である。
Also, depending on the procedure of the manufacturing method, the present invention can of course be carried out even if the insulating layer 3 is formed after forming the groove 10 in the insulating film 1.

【0032】さらに、以上の説明では、絶縁フィルム上
に導電層や絶縁層を印刷形成した配線基板を例として説
明したが、フィルムに絵柄や模様、さらには接点やパタ
ーン等の導電層や絶縁層が印刷形成されたパネルシー
ト、あるいは絶縁フィルムに光透過性電極層や発光体
層、誘電体層、背面電極層等が順次重ねて形成されたエ
レクトロルミネセンス素子等、様々な印刷シートにおい
ても本発明の実施が可能なことも勿論である。
Further, in the above description, a wiring board in which a conductive layer or an insulating layer is printed and formed on an insulating film has been described as an example, but the film has a conductive layer or an insulating layer such as a picture or pattern, and further, a contact or a pattern. The present invention can be applied to various printed sheets such as a panel sheet on which is formed by printing, or an electroluminescent element in which a light-transmitting electrode layer, a luminescent layer, a dielectric layer, a back electrode layer, etc. are sequentially laminated on an insulating film. It goes without saying that the invention can be implemented.

【0033】[0033]

【発明の効果】以上のように本発明によれば、折り曲げ
易く、確実な位置で折り曲げられる印刷シート及びその
製造方法を提供することができるという有利な効果が得
られる。
As described above, according to the present invention, there is obtained an advantageous effect that it is possible to provide a printing sheet which can be easily bent and can be bent at a reliable position, and a method for manufacturing the same.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態による配線基板の斜視図FIG. 1 is a perspective view of a wiring board according to an embodiment of the present invention;

【図2】同製造方法を示す斜視図FIG. 2 is a perspective view showing the manufacturing method.

【図3】同要部である溝部分で折り曲げた状態の斜視図FIG. 3 is a perspective view showing a state where the main body is bent at a groove portion which is a main part of the same.

【図4】同溝を複数とした斜視図FIG. 4 is a perspective view showing a plurality of grooves.

【図5】同溝を絶縁層上に形成した斜視図FIG. 5 is a perspective view showing the groove formed on an insulating layer.

【図6】従来の配線基板の斜視図FIG. 6 is a perspective view of a conventional wiring board.

【図7】同折り曲げた状態の斜視図FIG. 7 is a perspective view of the folded state.

【符号の説明】[Explanation of symbols]

1,11 絶縁フィルム 2 導電層 2A,2B 電極 3 絶縁層 10,10A,10B,10C 溝 1,11 insulating film 2 conductive layer 2A, 2B electrode 3 insulating layer 10, 10A, 10B, 10C groove

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4E068 AC00 DA11 5E338 AA01 AA02 AA12 AA16 BB54 BB56 BB63 CC01 EE22 EE31 5F072 YY06  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4E068 AC00 DA11 5E338 AA01 AA02 AA12 AA16 BB54 BB56 BB63 CC01 EE22 EE31 5F072 YY06

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 可撓性を有する絶縁フィルムの片面また
は両面に、可撓性を有する樹脂によって導電層または絶
縁層の少なくとも一方を印刷形成すると共に、上記絶縁
フィルムまたは絶縁層の少なくとも一方の所定の箇所
に、レーザ加工によって所定深さの直線状の溝を形成し
た印刷シート。
At least one of a conductive layer and an insulating layer is printed and formed on one or both surfaces of a flexible insulating film with a flexible resin, and at least one of the insulating film and the insulating layer is formed in a predetermined shape. A printed sheet in which a linear groove having a predetermined depth is formed by laser processing at the position (1).
【請求項2】 絶縁フィルムの片面に少なくとも導電層
を印刷形成し、他方の面に直線状の溝を形成した請求項
1記載の印刷シート。
2. The printed sheet according to claim 1, wherein at least a conductive layer is formed by printing on one surface of the insulating film, and a linear groove is formed on the other surface.
【請求項3】 直線状の溝を複数の箇所に形成した請求
項1または2記載の印刷シート。
3. The printing sheet according to claim 1, wherein a linear groove is formed at a plurality of locations.
【請求項4】 直線状の溝を導電層部分を除き略破線状
に形成した請求項1〜3のいずれか一つに記載の印刷シ
ート。
4. The printing sheet according to claim 1, wherein the linear groove is formed in a substantially dashed shape except for the conductive layer portion.
【請求項5】 レーザ加工によって所定深さの直線状の
溝を形成する請求項1〜4のいずれか一つに記載の印刷
シートの製造方法。
5. The method for manufacturing a printed sheet according to claim 1, wherein a linear groove having a predetermined depth is formed by laser processing.
JP11021869A 1999-01-29 1999-01-29 Printed sheet and its manufacture Pending JP2000223794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11021869A JP2000223794A (en) 1999-01-29 1999-01-29 Printed sheet and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11021869A JP2000223794A (en) 1999-01-29 1999-01-29 Printed sheet and its manufacture

Publications (1)

Publication Number Publication Date
JP2000223794A true JP2000223794A (en) 2000-08-11

Family

ID=12067145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11021869A Pending JP2000223794A (en) 1999-01-29 1999-01-29 Printed sheet and its manufacture

Country Status (1)

Country Link
JP (1) JP2000223794A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119299A (en) * 2006-11-14 2008-05-29 Olympus Corp Imaging module and method for manufacturing the imaging module
KR20160065689A (en) * 2014-12-01 2016-06-09 엘지디스플레이 주식회사 Light Emitting Diode Array Comprising the Flexible Printed Circuit Board, And Liquid Crystal Display Device
JP2020204750A (en) * 2019-06-19 2020-12-24 株式会社ジャパンディスプレイ Electronic apparatus and flexible wiring board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119299A (en) * 2006-11-14 2008-05-29 Olympus Corp Imaging module and method for manufacturing the imaging module
KR20160065689A (en) * 2014-12-01 2016-06-09 엘지디스플레이 주식회사 Light Emitting Diode Array Comprising the Flexible Printed Circuit Board, And Liquid Crystal Display Device
KR101716212B1 (en) 2014-12-01 2017-03-14 엘지디스플레이 주식회사 Light Emitting Diode Array Comprising the Flexible Printed Circuit Board, And Liquid Crystal Display Device
JP2020204750A (en) * 2019-06-19 2020-12-24 株式会社ジャパンディスプレイ Electronic apparatus and flexible wiring board
JP7242439B2 (en) 2019-06-19 2023-03-20 株式会社ジャパンディスプレイ Electronic devices and flexible wiring boards

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