JP2553628Y2 - Flexible wiring board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bendable flexible wiring board in which a wiring pattern is formed on a flexible insulating substrate, and more particularly, to enabling the flexible wiring board to be easily bent at a desired position. Related to the technology.

[0002]

2. Description of the Related Art A flexible wiring board has been used as a wiring board in an electronic circuit device and a substrate for mounting electronic components. This flexible wiring board is obtained by laminating a conductor layer on a flexible insulating film such as a polymer film to form a wiring pattern, and can be bent or bent as necessary. In addition, since it is in the form of a film, there is also an advantage that the wiring board can be made thin.

Therefore, by utilizing such characteristics, a limited space between the mechanism of the optical system housed inside the camera body and the housing of the camera, for example, as in a recent electronic camera. In addition, it can be used when electronic circuits must be efficiently stored, by mounting electronic components on a thin flexible wiring board and wiring inside the camera with a wiring pattern formed on the same board,
Since the electronic circuit can be formed and mounted according to the shape of the space inside the camera body, the mounting efficiency is greatly improved.

Further, when wiring is performed to an electronic device having a movable portion, such as a printer head of a serial printer, a drive circuit and the printer head are connected by a flexible wiring board so that the movement of the printer head is not hindered. A drive signal can be provided.

[0005]

When such a flexible printed circuit board is mounted on an electronic device, the flexible printed circuit board is bent at a specific position due to the shape of the mounted portion and the wiring layout. It depends on the formation ratio of the wiring pattern laminated on the insulator film. For example, in a portion where the wiring pattern is a very wide solid pattern, the area occupied by the conductive layer having high hardness becomes large, so that the flexible wiring board in that portion becomes hard and hard to be bent.

For this reason, the conventional flexible wiring board has a disadvantage that it is difficult to bend at a desired position depending on the state of the wiring pattern. In addition, when the hardness of the flexible substrate is uniform throughout, there is also a disadvantage that the bending position varies.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to enable a flexible wiring board to be easily bent at a desired position and to reduce variations in the bending position.

[0008]

According to the present invention, in order to solve the above-mentioned problems, a conductive layer is laminated on a flexible insulating substrate and a wiring pattern is formed by the conductive layer. In a flexible wiring board, the formation ratio of the wiring pattern on the insulating substrate is set such that the hardness of the bent portion of the flexible wiring substrate is smaller than the hardness of the region adjacent to the bent portion. It is formed so as to be smaller than an adjacent region.

[0009]

In the above configuration, in a flexible wiring board having a wiring pattern formed by a conductor layer, the formation ratio of the wiring pattern on the insulation substrate and the thickness of the conductor layer are determined such that the bent portion is closer to the bent portion. By forming the conductive member so as to be smaller than the region, the amount of the conductive member in the bent portion of the flexible substrate can be made smaller than that in the phosphor contact portion. Thereby, the hardness of the bent portion can be further reduced, and the bending can be extremely facilitated.

In addition, since the hardness of the bending position of the flexible wiring board is reduced in advance to make it easy to bend, the bending can be surely performed at the position where the bending is required, and the variation in the bending position is eliminated.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially enlarged view of a bent portion of a flexible wiring board 5 according to an embodiment of the present invention, and FIG. 2 is a flexible wiring board 5 having the bent portion of FIG.
It is a schematic diagram showing the whole. In the flexible wiring board shown in these figures, a wiring pattern 2 is formed by laminating a conductor layer on a flexible insulating substrate 1 such as a polymer film.

When the flexible wiring board 5 is mounted on an electronic device, it is to be bent at the portions indicated by the bending lines AA 'and BB'. Therefore, a blank pattern portion or a pattern lacking portion 4 having no linear conductive layer is formed in the solid pattern 3 of the wiring pattern 2 along the bending lines AA 'and BB'.

FIG. 3 is an enlarged view schematically showing the relationship between such a blank pattern portion 4 and a bending line (indicated by CC 'in FIG. 3), which is formed on the insulator substrate 1. The blank pattern portion 4 is formed in the solid pattern 3 along the folding line CC ′.

In the flexible wiring board 5 having the above configuration, the bending lines AA 'and B-
Since the blank pattern portion 4 is formed along B ',
In the bent portion near the bending line, the insulating substrate 1
The formation ratio of the wiring pattern 2 above becomes small. Therefore, the amount of the conductive member having a large hardness in the bent portion is reduced, and the hardness of the substrate is reduced, so that the flexible wiring board 5 can be easily bent near the bending line.

In this embodiment, the blank pattern is formed in the solid pattern of the wiring pattern. However, the width of the normal wiring pattern, which is not the solid pattern, is gradually reduced at the bent portion to form the wiring pattern. The easy bending portion may be formed with a small ratio.

FIG. 4 is an enlarged view of a portion around the bent portion of the flexible wiring board 5 according to another embodiment of the present invention. The width of the wiring pattern 2 formed on the substrate 1 is increased, so that a so-called top hat pattern is formed.

FIG. 5 is a partially enlarged view of a portion around a bent portion of a flexible wiring board 5 according to still another embodiment of the present invention, and the width of two adjacent wiring patterns 2 intersecting the bent portion is shown by a bending line. A blank portion of the wiring pattern 2 is formed at the bent portion by changing the ratio on both sides of the bent portion along CC ′ so that the ratio is reversed.

FIG. 6 is a partially enlarged view of a portion around a bent portion of a flexible wiring board 5 according to still another embodiment of the present invention, and the width of two adjacent wiring patterns 2 intersecting the bent portion is shown by a bending line. The portion adjacent to the bent portion along C-C 'is widely formed so as to be alternately combined.

In these embodiments, in the portion adjacent to the bent portion of the flexible wiring board 5, the amount of the conductive member increases, so that the hardness of the substrate becomes larger than that of the bent portion, and the hardness of the bent portion relatively increases. Is small and easy to bend, so that the flexible wiring board 5 can be reliably bent along the bending line CC ′.

In the above embodiment, the wide portion of the wiring pattern is formed on both sides of the bent portion. However, in some cases, the wide portion may be formed only on one side.

[0021]

As described above, according to the present invention, the hardness of the bent portion of the flexible wiring board is smaller than the hardness of the region adjacent to the bent portion, so that the bending of the substrate at the bending position is extremely easy. become. Also,
Since the bending can be surely performed at the bending position, variation in the bending position at the time of bending is greatly reduced.

Therefore, even when the flexible wiring board is mounted along the corners of the electronic circuit device or when the wiring is folded back by 180 degrees, the flexible wiring substrate can be easily bent at an appropriate position. Can significantly improve the assembly efficiency, and can also reduce unnecessary space for wiring by eliminating unnecessary bending of wiring.

[Brief description of the drawings]

FIG. 1 is a partially enlarged view of a portion around a bent portion of a flexible wiring board according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a schematic shape of an entire flexible wiring board having a bent portion in FIG. 1;

FIG. 3 is an explanatory view showing a simplified wiring pattern of a bent portion of the flexible wiring board according to one embodiment of the present invention.

FIG. 4 is an enlarged plan view of a bent portion of a flexible wiring board according to another embodiment of the present invention.

FIG. 5 is an enlarged plan view of a bent portion of a flexible wiring board according to still another embodiment of the present invention.

FIG. 6 is an enlarged plan view of a bent portion of a flexible wiring board according to still another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulator board 2 Wiring pattern 3 Solid pattern 4 Blank pattern part 5 Flexible wiring board

Claims (3)

(57) [Scope of request for utility model registration] 1. A bendable flexible wiring board in which a conductive layer is laminated on a flexible insulating substrate and a wiring pattern is formed by the conductive layer, wherein the solid pattern in the wiring pattern is Flexiv
At the position of the bending line of the wiring board,
A pattern blank portion where no conductor layer is present is linearly formed.
A flexible wiring board characterized by being formed. 2. A laminate of a conductor layer on a flexible insulator substrate
And forming a wiring pattern by the conductor layer.
A flexible wiring board, wherein one of the wiring patterns is a pair of protrusions protruding in the same direction.
Bending of the flexible wiring board
That it is formed on both sides of the cutting line and along the bending line.
Characteristic flexible wiring board. 3. A conductor layer is laminated on a flexible insulator substrate.
And forming a wiring pattern by the conductor layer.
A flexible wiring substrate, wherein two adjacent wiring patterns in the wiring pattern are formed.
Each along the bending line of the flexible printed circuit board.
Bend the single protruding pattern part
Frame formed alternately on both sides of the
Kisible wiring board.