JPS5839088A - Flexible electric circuit substrate - Google Patents
Flexible electric circuit substrateInfo
- Publication number
- JPS5839088A JPS5839088A JP13746481A JP13746481A JPS5839088A JP S5839088 A JPS5839088 A JP S5839088A JP 13746481 A JP13746481 A JP 13746481A JP 13746481 A JP13746481 A JP 13746481A JP S5839088 A JPS5839088 A JP S5839088A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- electric circuit
- flexible electric
- circuit board
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はポリイミド樹脂等の可撓性合成樹脂シートの表
面に銅箔等の金属箔を積層し回路を形成した7レキシプ
ル亀気回路基板番ζ係り、その目的とするところは折曲
げの容易性確保と折曲げ時暑とおける回路面に半田付け
したトランジスター等の実装部品の脱落防止を目的とす
る。[Detailed Description of the Invention] The present invention relates to a 7-lexiple circuit board No. ζ in which a circuit is formed by laminating a metal foil such as copper foil on the surface of a flexible synthetic resin sheet such as polyimide resin, and its object is to However, the purpose is to ensure ease of bending and to prevent components such as transistors soldered to the circuit surface from falling off when they are exposed to heat during bending.
この種のフレキシブル電気回路基板は従来より折曲げて
使用できることにより電子機器の分野SCおいて賞月さ
れている。しかしながら回路を形成せる金属箔はある程
度の剛性を有し、急激な折曲げをおこなうと折損、破損
するおそれがあり、また折曲げ時の応力が折曲げ部近傍
にとどまらないで遠くまで伝わるため半田付けした実装
部品が脱落しやすいという欠点があった。而して実装部
品は折曲げ部よりはなして実装する必要があ引゛このた
め務C使用するフレキシブル電気回路基板か大型化する
欠点かあった。This type of flexible electric circuit board has been prized in the field of electronic equipment (SC) because it can be used in a folded manner. However, the metal foil that forms the circuit has a certain degree of rigidity, and there is a risk of breakage or damage if it is sharply bent.Also, the stress from bending is not confined to the vicinity of the bend, but is transmitted over a long distance, so soldering There was a drawback that attached mounted components were likely to fall off. Therefore, it is necessary to mount the mounted components away from the bent portion, which has the disadvantage of increasing the size of the flexible electric circuit board used in Function C.
この欠点を除去すべく、従来第2図及び第8図の如く、
フレキシブル電気回路基板(1)の折曲げ部(2)に穿
孔(8)や切欠(4)を並設しておき、該折曲げ部(2
)に応力集中が$ξるのを利用して折曲げやすくしたも
のがある。而して該従来品は実用性は高いが、製造工程
において穿孔(8)や切欠(4)を設ける工程が必要で
あるという欠点があった。In order to eliminate this drawback, conventionally, as shown in Figs. 2 and 8,
Perforations (8) and notches (4) are provided in parallel at the bent portion (2) of the flexible electric circuit board (1), and the bent portion (2)
) is made easier to bend by taking advantage of stress concentration. Although this conventional product has high practicality, it has a drawback in that it requires a step of providing perforations (8) and notches (4) in the manufacturing process.
本発明は上記欠点を除去せんとするものであり、その要
旨とするところは金属箔よりなる回路の巾を折曲げ部に
おいて狭小せしめて成ることを特徴とするフレキシブル
電気回路基板に係る。The present invention aims to eliminate the above-mentioned drawbacks, and its gist relates to a flexible electric circuit board characterized in that the width of a circuit made of metal foil is narrowed at the bent portion.
以下本発明を図示例に基づき説明する。The present invention will be explained below based on illustrated examples.
第1図及び第2図番こ示すのは本発明によるフレキシブ
ル電気回路基板(1)の一実施例である。Figures 1 and 2 show an embodiment of a flexible electric circuit board (1) according to the present invention.
(5)は、ポリイミド樹脂でなる可撓性合成樹脂シート
で、通例0.0025〜0.7011厚ノモノ”t’ア
!(6)は銅箔で形成された回路で、通例0.085m
程度の厚さのものである。(5) is a flexible synthetic resin sheet made of polyimide resin, usually 0.0025 to 0.7011 thick. (6) is a circuit made of copper foil, usually 0.085 m thick.
It is about the same thickness.
(7)は回路番ζ半田付けされたトランジスタ、ダイオ
ード等の実装部品である。(7) is circuit number ζ soldered mounted components such as transistors and diodes.
(2)は折曲げ部で、該部分に#いて回路(6)はその
幅を狭小せしめた挟小部(8)を形成している。この挟
小部(8)は銅箔のエツチング加工等番とよる回路形成
時に#いて同時に形成されるので、製造上の工程増加等
は生じない。(2) is a bent part, and the circuit (6) is placed in this bent part to form a narrow part (8) whose width is narrowed. Since this narrow portion (8) is formed at the same time as the circuit is formed by etching the copper foil, no additional manufacturing steps are required.
畝上の如く形成されるフレキシブル電気回路基板(1)
は、折曲げ部に応力が集中するので該部分を利用して鋭
角な折曲げが回路であり、折曲げ時において実装部品の
脱落するかそれも少ないのである。また回路に挟小部を
設けるのは可撓性合成樹脂上に金属箔でなる回路をエツ
チング、プレスの打抜き加工番こより形成するときに同
時に形成できるので製造上従来工程と何等かわることが
ないという利点がある。Flexible electric circuit board formed like a ridge (1)
Since stress is concentrated at the bent portion, the circuit is bent at an acute angle by utilizing this portion, and there is little possibility that the mounted components will fall off during bending. In addition, the small parts in the circuit can be formed at the same time as the metal foil circuit is formed on the flexible synthetic resin by etching and press punching, so there is no difference in manufacturing from the conventional process. There are advantages.
第1図及び第2図は本発明の一実施例を示す斜視図、第
8図及び第4図は従来例を示す斜視図である。
特許出願人
松下電工株式会社
代理人弁理士 竹 元 敏 丸
(ほか2名)
*IJ!1
”’1138
l2IIj
!I 4 @
手続補正書
l
昭和56年 特許願 第137464 号2、発明の名
称
フレキシブル電気回路基板
3、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真1048番地
名 称(583)松下電工株式会社
代表者 小 林 郁4、代理人
住 所 大阪府門真市大字門真1048番地
(1)明細書の第3頁第4行にrO,0025Jとある
をrO,025Jと訂正する。
(2)明細書の第3頁第17行に「回路」とあるを[可
能Jと訂正する。
(3)明細書の第3頁第20行乃至第4頁第1行に「回
路を工・ノチング、プレスの打抜き加工により」とある
を「回路を工・ノチング加工により」と訂正する。1 and 2 are perspective views showing one embodiment of the present invention, and FIGS. 8 and 4 are perspective views showing a conventional example. Patent applicant Matsushita Electric Works Co., Ltd. Representative patent attorney Toshimaru Takemoto (and 2 others) *IJ! 1 ”'1138 l2IIj !I 4 @ Procedural Amendment 1 1982 Patent Application No. 137464 2 Name of invention Flexible electric circuit board 3 Relationship to the person making the amendment Patent applicant address Oaza, Kadoma City, Osaka Prefecture 1048 Kadoma Name (583) Matsushita Electric Works Co., Ltd. Representative Iku Kobayashi 4, Agent Address 1048 Kadoma Oaza, Kadoma City, Osaka Prefecture (1) rO,0025J is on page 3, line 4 of the specification. Correct it as rO, 025J. (2) Correct the word "circuit" on page 3, line 17 of the specification to [possible J]. (3) In the specification, from page 3, line 20 to page 4, line 1, the phrase "by machining/notching or punching the circuit" is corrected to "by machining/notching the circuit."
Claims (1)
番ζ銅箔等の金属箔を積層し回路を形成した7レキシプ
ル亀気回路基板において、回路の巾を折曲げ部において
狭小せしめて成ることを特徴とするフレキシブル電気回
路基板。(1) Surface number ζ of a flexible synthetic resin sheet such as polyimide resin A 7-lexiple circuit board in which a circuit is formed by laminating metal foil such as copper foil, and the width of the circuit is narrowed at the bent part. A flexible electric circuit board characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13746481A JPS5839088A (en) | 1981-08-31 | 1981-08-31 | Flexible electric circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13746481A JPS5839088A (en) | 1981-08-31 | 1981-08-31 | Flexible electric circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5839088A true JPS5839088A (en) | 1983-03-07 |
Family
ID=15199211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13746481A Pending JPS5839088A (en) | 1981-08-31 | 1981-08-31 | Flexible electric circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839088A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116059U (en) * | 1990-03-13 | 1991-12-02 | ||
JPH0556092U (en) * | 1991-02-15 | 1993-07-27 | 有限会社こまつ屋 | Dry cleaning equipment |
JPH0686363U (en) * | 1993-05-14 | 1994-12-13 | 日本ケミコン株式会社 | Flexible wiring board |
JP2013246345A (en) * | 2012-05-28 | 2013-12-09 | Sharp Corp | Display module |
JP2016114420A (en) * | 2014-12-12 | 2016-06-23 | 日本精工株式会社 | Sensor, substrate for the same, and manufacturing method for the same |
WO2017145344A1 (en) * | 2016-02-25 | 2017-08-31 | 日本精工株式会社 | Sensor, sensor substrate, and sensor manufacturing method |
-
1981
- 1981-08-31 JP JP13746481A patent/JPS5839088A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116059U (en) * | 1990-03-13 | 1991-12-02 | ||
JPH0556092U (en) * | 1991-02-15 | 1993-07-27 | 有限会社こまつ屋 | Dry cleaning equipment |
JPH0686363U (en) * | 1993-05-14 | 1994-12-13 | 日本ケミコン株式会社 | Flexible wiring board |
JP2013246345A (en) * | 2012-05-28 | 2013-12-09 | Sharp Corp | Display module |
JP2016114420A (en) * | 2014-12-12 | 2016-06-23 | 日本精工株式会社 | Sensor, substrate for the same, and manufacturing method for the same |
WO2017145344A1 (en) * | 2016-02-25 | 2017-08-31 | 日本精工株式会社 | Sensor, sensor substrate, and sensor manufacturing method |
CN109073412A (en) * | 2016-02-25 | 2018-12-21 | 日本精工株式会社 | The manufacturing method of sensor, the substrate of sensor and sensor |
US11231298B2 (en) | 2016-02-25 | 2022-01-25 | Nsk Ltd. | Sensor, sensor substrate, and sensor manufacturing method |
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