JP3265770B2 - Method for manufacturing surface mount components - Google Patents

Method for manufacturing surface mount components

Info

Publication number
JP3265770B2
JP3265770B2 JP30649293A JP30649293A JP3265770B2 JP 3265770 B2 JP3265770 B2 JP 3265770B2 JP 30649293 A JP30649293 A JP 30649293A JP 30649293 A JP30649293 A JP 30649293A JP 3265770 B2 JP3265770 B2 JP 3265770B2
Authority
JP
Japan
Prior art keywords
electrode
electrodes
substrate
ground electrode
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30649293A
Other languages
Japanese (ja)
Other versions
JPH07162213A (en
Inventor
章 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP30649293A priority Critical patent/JP3265770B2/en
Publication of JPH07162213A publication Critical patent/JPH07162213A/en
Application granted granted Critical
Publication of JP3265770B2 publication Critical patent/JP3265770B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、例えば、方向性結合器
等に用いられる表面実装部品の製造方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a surface mount component used for, for example, a directional coupler.

【0002】[0002]

【従来の技術】従来の、表面実装部品として、例えば、
方向性結合器を図5及び図6に示す。図5において、1
は誘電体からなる基板であり、基板1の表面の中央に、
1か所で直角に折れ曲がった第1のストリップライン2
が形成され、第1のストリップライン2の一端から、基
板1の第1の側面側1aの最寄りのコーナーにかけて引
き出し電極3a及び入力電極4が形成され、他端から入
力電極4の対角にかけて引き出し電極3b及び第1の出
力電極5が形成されている。
2. Description of the Related Art Conventional surface mount components include, for example,
The directional coupler is shown in FIGS. In FIG. 5, 1
Is a substrate made of a dielectric material,
1st stripline 2 bent at right angle in one place
Are formed, and a lead electrode 3a and an input electrode 4 are formed from one end of the first strip line 2 to a nearest corner of the first side surface 1a of the substrate 1, and a lead is drawn from the other end to a diagonal of the input electrode 4. The electrode 3b and the first output electrode 5 are formed.

【0003】また、第1のストリップライン2と一定間
隔を隔てて、第2のストリップライン6が形成され、ス
トリップライン6の一端から、入力電極4と対向する基
板1の第2の側面側1bのコーナーにかけて引き出し電
極7a及び第2の出力電極8が形成され、他端から出力
電極5と出力電極8の中間の基板1の端部にかけて引き
出し電極7b及びアイソレーション電極9が形成されて
いる。
A second strip line 6 is formed at a predetermined interval from the first strip line 2, and one end of the strip line 6 is connected to a second side 1b of the substrate 1 facing the input electrode 4. The extraction electrode 7a and the second output electrode 8 are formed at the corner of the above, and the extraction electrode 7b and the isolation electrode 9 are formed from the other end to the end of the substrate 1 between the output electrode 5 and the output electrode 8.

【0004】また、図6に示すように、基板1の裏面に
は、表面の入力電極4、出力電極5,8及びアイソレー
ション電極9と対向する位置に切り欠き10aを設けた
接地電極10が形成されている。さらに、基板1の側面
に、入力電極4,出力電極5,8及びアイソレーション
電極9と導通する端面電極11a,11b,11c,1
1d及び接地電極10と導通する端面電極11e,11
fを形成し、方向性結合器12が構成されている。な
お、入力電極4,出力電極5,8及びアイソレーション
電極9は、ストリップライン2,6と端面電極11a乃
至11dを接続する接続電極として機能するものであ
る。
[0006] As shown in FIG. 6, a ground electrode 10 having a notch 10 a at a position facing the input electrode 4, output electrodes 5, 8 and the isolation electrode 9 on the front surface is provided on the back surface of the substrate 1. Is formed. Further, end electrodes 11a, 11b, 11c, 1 that are electrically connected to the input electrodes 4, the output electrodes 5, 8, and the isolation electrodes 9 are provided on the side surfaces of the substrate 1.
1d and end electrodes 11e, 11 which are electrically connected to the ground electrode 10.
f to form a directional coupler 12. The input electrodes 4, output electrodes 5, 8 and isolation electrode 9 function as connection electrodes for connecting the strip lines 2, 6 to the end face electrodes 11a to 11d.

【0005】次に、このように構成された方向性結合器
12の製造方法を示す。まず、図7に示すように、誘電
体からなるマザー基板13の表面に、ストリップライン
2,6,引き出し電極3a,3b,7a,7b,入力電
極4,出力電極5,8及びアイソレーション電極9がマ
トリックス状に形成される。また、図8に示すように、
マザー基板13の裏面に、表面の入力電極4,出力電極
5,8及びアイソレーション電極9と対向する位置に切
り欠き10aを設けた接地電極10が形成される。そし
て、マザー基板13を分割線14a,14bに沿って切
断し複数の小基板15に分割した後、小基板15の分割
面に、端面電極11a乃至11bが形成され、方向性結
合器12が得られる。
[0005] Next, a method of manufacturing the directional coupler 12 configured as described above will be described. First, as shown in FIG. 7, strip lines 2, 6, lead electrodes 3a, 3b, 7a, 7b, input electrodes 4, output electrodes 5, 8, and isolation electrodes 9 are formed on the surface of a mother substrate 13 made of a dielectric material. Are formed in a matrix. Also, as shown in FIG.
On the rear surface of the mother substrate 13, a ground electrode 10 having a notch 10a at a position facing the input electrode 4, output electrode 5, 8 and isolation electrode 9 on the front surface is formed. After the mother substrate 13 is cut along the dividing lines 14a and 14b and divided into a plurality of small substrates 15, end electrodes 11a to 11b are formed on the divided surface of the small substrate 15, and the directional coupler 12 is obtained. Can be

【0006】なお、マザー基板13の表面のストリップ
ライン2,6,引き出し電極3a,3b,7a,7b,
入力電極4,出力電極5,8,アイソレーション電極9
及び裏面の接地電極10は、全面に薄膜を形成した後パ
ターンによりレジスト印刷され、その後、フォトエッチ
ングにより形成されるものである。
The strip lines 2, 6 on the surface of the mother substrate 13 and the extraction electrodes 3a, 3b, 7a, 7b,
Input electrode 4, output electrode 5, 8, isolation electrode 9
In addition, the ground electrode 10 on the back surface is formed by forming a thin film on the entire surface, printing a resist by a pattern, and then forming the thin film by photoetching.

【0007】[0007]

【発明が解決しようとする課題】ところが、上記従来例
の表面実装部品の製造方法においては、マザー基板13
の表面のストリップライン2,6,引き出し電極3a,
3b,7a,7b,入力電極4,出力電極5,8及びア
イソレーション電極9がパターンの位置ずれにより、図
7のA方向にずれて形成された場合、図9に示すよう
に、全ての小基板15において、出力電極5及びアイソ
レーション電極9と端面電極11b,11dがオープン
状態となるとともに、最下段の小基板15の出力電極8
と端面電極11cがオープン状態となり、一方、B方向
にずれて形成された場合、図10に示すように、最上段
の小基板15の入力電極4と端面電極11aがオープン
状態となる。
However, in the above-mentioned conventional method of manufacturing a surface mount component, the mother board 13 is not provided.
Strip lines 2, 6 on the surface of
When the 3b, 7a, 7b, the input electrode 4, the output electrode 5, 8 and the isolation electrode 9 are formed so as to be shifted in the direction A of FIG. 7 due to the positional shift of the pattern, as shown in FIG. On the substrate 15, the output electrode 5, the isolation electrode 9, and the end face electrodes 11 b and 11 d are opened, and the output electrode 8 of the lowermost small substrate 15 is opened.
And the end surface electrode 11c is in an open state, while the input electrode 4 and the end surface electrode 11a of the uppermost small substrate 15 are in an open state as shown in FIG.

【0008】また、裏面の接地電極10がパターンの位
置ずれにより、図8のA方向にずれて形成された場合
は、図11に示すように、最下段以外の小基板15にお
いて、出力電極5及びアイソレーション電極9と導通す
る端面電極11b,11dが、接地電極10とショート
状態となり、一方、B方向にずれて形成された場合は、
全ての小基板15において、図12に示すように、接地
電極10と端面電極11e,11fがオープン状態とな
る。さらに、接地電極11がC方向にずれて形成された
場合は、最右列以外の小基板15において、図13に示
すように、入力電極4と導通する端面電極11aが接地
電極10とショート状態となる。
When the ground electrode 10 on the back surface is formed so as to be displaced in the direction A in FIG. 8 due to the displacement of the pattern, as shown in FIG. When the end electrodes 11b and 11d that are electrically connected to the isolation electrode 9 are short-circuited with the ground electrode 10, and formed to be shifted in the B direction,
In all the small substrates 15, as shown in FIG. 12, the ground electrode 10 and the end electrodes 11e and 11f are in an open state. Further, when the ground electrode 11 is formed to be shifted in the C direction, as shown in FIG. 13, in the small substrates 15 other than the rightmost column, the end face electrode 11a conducting to the input electrode 4 is short-circuited with the ground electrode 10. Becomes

【0009】また、マザー基板13を小基板15に分割
する際に、分割線14a,14bよりずれて切断された
場合も、図9乃至図13と同様に、入力電極4,出力電
極5,8,アイソレーション電極9及び接地電極10と
端面電極11a乃至11fとの導通及び絶縁に不具合が
生じ、方向性結合器としての機能を果たせず、製品の歩
留まりが低下する。
When the mother substrate 13 is divided into the small substrates 15 and cut off from the dividing lines 14a, 14b, the input electrodes 4, the output electrodes 5, 8 In addition, the conduction and insulation between the isolation electrode 9 and the ground electrode 10 and the end face electrodes 11a to 11f may be inferior, failing to function as a directional coupler, and lowering the product yield.

【0010】本発明は、このような問題を解消するため
になされたものであり、パターンずれ及び切断ずれが生
じても、端面電極と接続電極又は接地電極との導通を保
つことが可能な表面実装部品の製造方法を提供すること
を目的とするものである。
The present invention has been made in order to solve such a problem, and a surface capable of maintaining conduction between an end face electrode and a connection electrode or a ground electrode even if a pattern shift or a cutting shift occurs. It is an object of the present invention to provide a method for manufacturing a mounted component.

【0011】[0011]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明においては、誘電体からなるマザー基板の
表面に主電極及び該主電極から引き出される接続電極を
マトリックス状に形成し、裏面に前記接続電極と対向す
る切り欠きを設けた接地電極を形成し、前記マザー基板
を分割線に沿って複数の小基板に分割し、該分割された
小基板の分割面に前記接続電極又は接地電極と導通する
端面電極を形成してなる表面実装部品の製造方法におい
て、前記接続電極及び接地電極の切り欠きを、前記分割
線に跨がって形成したことを特徴とするものである。
In order to achieve the above object, according to the present invention, a main electrode and connection electrodes extending from the main electrode are formed in a matrix on the surface of a mother substrate made of a dielectric material. A ground electrode provided with a notch facing the connection electrode on the back surface is formed, the mother substrate is divided into a plurality of small substrates along a division line, and the connection electrode or the divided surface of the divided small substrate is divided. In a method for manufacturing a surface mount component having an end face electrode which is electrically connected to a ground electrode, the notch of the connection electrode and the ground electrode is formed so as to extend over the dividing line.

【0012】[0012]

【作用】上記の構成によれば、マザー基板の表裏面にお
いて、端面電極と導通する接続電極及び端面電極と接地
電極を絶縁するための切り欠きを、小基板に分割するた
めの分割線に跨がって形成することにより、電極形成時
のパターンずれや、小基板に分割する際に切断ずれが発
生しても、小基板の表裏面の、端面電極と導通する位置
に接続電極及び接地電極が存在するとともに、小基板の
裏面の、端面電極と接地電極を絶縁する位置に切り欠き
が存在し、端面電極と接続電極又は接地電極との導通に
不具合が生じることがない。
According to the above construction, the notch for insulating the connection electrode conducting to the end face electrode and the insulation for the end face electrode and the ground electrode are formed on the front and back surfaces of the mother board over the dividing line for dividing the board into small substrates. Even if a pattern shift occurs during electrode formation or a cutting shift occurs when the substrate is divided into small substrates, the connection electrode and the ground electrode are located at positions on the front and back surfaces of the small substrate that are electrically connected to the end surface electrodes. And a notch is provided on the back surface of the small substrate at a position where the end face electrode and the ground electrode are insulated, so that there is no problem in conduction between the end face electrode and the connection electrode or the ground electrode.

【0013】[0013]

【実施例】以下、本発明による、方向性結合器として用
いられる表面実装部品の製造方法の実施例を図面を用い
て説明する。なお、従来例と同一若しくは相当する部分
には、同一符号を付しその説明を省略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of manufacturing a surface mount component used as a directional coupler according to the present invention will be described below with reference to the drawings. Parts that are the same as or correspond to those of the conventional example are denoted by the same reference numerals, and description thereof is omitted.

【0014】本発明は、マザー基板の表面の分割線に跨
がって接続電極を形成するとともに、マザー基板の裏面
の分割線に跨がって接地電極の切り欠きを形成してなる
ものである。
According to the present invention, a connection electrode is formed over a dividing line on the front surface of a mother substrate, and a cutout of a ground electrode is formed over a dividing line on the back surface of the mother substrate. is there.

【0015】すなわち、図1に示すように、長辺側の両
端部に縁部16a,16aを有し誘電体からなるマザー
基板16の表面に、ストリップライン2,6,引き出し
電極3a,3b,7a,7b,入力電極4,出力電極
5,8,アイソレーション電極9及び出力電極8の対角
に位置するダミー電極18を、マトリックス状に形成す
る。このうち、偶数段のストリップライン2,6,引き
出し電極3a,3b,7a,7b,入力電極4,出力電
極5,8,アイソレーション電極9及びダミー電極18
は、奇数段のストリップライン2,6,引き出し電極3
a,3b,7a,7b,入力電極4,出力電極5,8,
アイソレーション電極9及びダミー電極18に対して1
80°反転した形で形成する。
That is, as shown in FIG. 1, strip lines 2, 6, lead-out electrodes 3a, 3b, and 3b are provided on the surface of a mother board 16 made of a dielectric material having edges 16a, 16a at both ends on the long side. Dummy electrodes 18a, 7b, input electrodes 4, output electrodes 5, 8, isolation electrodes 9, and dummy electrodes 18 located at diagonal positions of the output electrodes 8 are formed in a matrix. Among them, the even-numbered strip lines 2, 6, extraction electrodes 3a, 3b, 7a, 7b, input electrodes 4, output electrodes 5, 8, isolation electrodes 9, and dummy electrodes 18
Are the strip lines 2 and 6 of the odd-numbered stages and the extraction electrode 3
a, 3b, 7a, 7b, input electrode 4, output electrode 5, 8,
1 for the isolation electrode 9 and the dummy electrode 18
It is formed in an inverted form of 80 °.

【0016】また同時に、マザー基板16の縁部16
a,16aにも、入力電極4,出力電極5,8,アイソ
レーション電極9及びダミー電極18から延長した、ダ
ミー電極19を形成する。
At the same time, the edge 16 of the mother substrate 16
A dummy electrode 19 extending from the input electrode 4, the output electrodes 5, 8, the isolation electrode 9 and the dummy electrode 18 is also formed on the electrodes a and 16a.

【0017】マザー基板16の裏面には、図2に示すよ
うに、表面の入力電極4,出力電極5,8,アイソレー
ション電極9及びダミー電極18,19と対向する位置
に、円形又は半円形の切り欠き20aを設けた接地電極
20を形成する。
As shown in FIG. 2, a circular or semi-circular surface is formed on the rear surface of the mother substrate 16 at a position facing the input electrodes 4, output electrodes 5, 8, isolation electrodes 9, and dummy electrodes 18, 19 on the front surface. The ground electrode 20 provided with the notch 20a is formed.

【0018】このような構成により、マザー基板16の
表面の分割線14a,14bにかかる入力電極4,出力
電極5,8,アイソレーション電極9及びダミー電極1
8,19は、分割線14a,14bに跨がるとともに、
裏面の切り欠き20aも分割線14a又は14bに跨が
ることになる。
With such a configuration, the input electrodes 4, output electrodes 5, 8, isolation electrodes 9, and dummy electrodes 1 on the dividing lines 14a, 14b on the surface of the mother board 16 are formed.
8, 19 straddle the dividing lines 14a, 14b,
The notch 20a on the back also straddles the dividing line 14a or 14b.

【0019】そして、分割線14a,14bで切断し複
数の小基板17に分割した後、図3に示すように、小基
板17の分割面に、入力電極4,出力電極5,8及びア
イソレーション電極9と導通する端面電極11a,11
b,11c,11dと、接地電極20と導通する端面電
極11eと、ダミー電極18と導通する端面電極11f
とを形成し、表面実装型の方向性結合器21を得る。な
お、入力電極4,出力電極5,8及びアイソレーション
電極9は、ストリップライン2,6と端面電極11a乃
至11dを接続する接続電極として機能するものであ
る。
Then, after cutting along the dividing lines 14a, 14b and dividing into a plurality of small substrates 17, as shown in FIG. End electrodes 11a, 11 that are electrically connected to electrode 9.
b, 11c, 11d, an end face electrode 11e conducting to the ground electrode 20, and an end face electrode 11f conducting to the dummy electrode 18.
Are formed to obtain the surface-mounted directional coupler 21. The input electrodes 4, output electrodes 5, 8 and isolation electrode 9 function as connection electrodes for connecting the strip lines 2, 6 to the end face electrodes 11a to 11d.

【0020】以上の方法により、マザー基板16上の電
極パターンが、図1及び図2に示すA,B,C,Dの各
方向にずれたり、切断が分割線14a,14bよりずれ
て行われても、入力電極4,出力電極5,8及びアイソ
レーション電極9と端面電極11a乃至11dの導通
と、接地電極20と端面電極11eの導通を損なうこと
がない。
According to the above-described method, the electrode pattern on the mother substrate 16 is shifted in each of the directions A, B, C, and D shown in FIGS. 1 and 2, and the cutting is performed while being shifted from the dividing lines 14a and 14b. However, the conduction between the input electrodes 4, the output electrodes 5, 8 and the isolation electrode 9 and the end electrodes 11a to 11d, and the conduction between the ground electrode 20 and the end electrode 11e are not impaired.

【0021】なお、本発明による表面実装部品の製造方
法は、方向性結合器だけではなく、図4に示す、基板2
2の表面の中央部に主電極23と、1方の端部に入力電
極24及びダミー電極25を有し、他方の端部に3つの
出力電極26を有し、裏面に接地電極27を有し、さら
に、入力電極24,ダミー電極25,出力電極26及び
接地電極27と導通する端面電極28を有した表面実装
型のブランチラインハイブリッド29にも適用でき、要
は表裏面に電極を有したマザー基板を複数の小基板に分
割し、分割面に表裏面の電極と導通する端面電極を形成
した電子部品に適用できるものである。
It should be noted that the method of manufacturing a surface mount component according to the present invention is not limited to the directional coupler.
2 has a main electrode 23 at the center, an input electrode 24 and a dummy electrode 25 at one end, three output electrodes 26 at the other end, and a ground electrode 27 on the back. Further, the present invention can be applied to a surface mount type branch line hybrid 29 having an end face electrode 28 that is electrically connected to the input electrode 24, the dummy electrode 25, the output electrode 26, and the ground electrode 27. The present invention can be applied to an electronic component in which a mother substrate is divided into a plurality of small substrates, and an end surface electrode that is electrically connected to electrodes on the front and back surfaces is formed on the divided surface.

【0022】[0022]

【発明の効果】以上説明したように、本発明にかかる表
面実装部品の製造方法によれば、マザー基板の表裏面の
分割線に跨がって接続電極及び接地電極の切り欠きを形
成することにより、パターンずれや切断ずれが生じても
端面電極と接続電極又は接地電極との導通を正常に行う
ことができ、製品の歩留まりを向上することができる。
As described above, according to the method for manufacturing a surface mount component according to the present invention, the notch of the connection electrode and the ground electrode is formed across the dividing line on the front and back surfaces of the mother substrate. As a result, even if a pattern shift or a cutting shift occurs, conduction between the end face electrode and the connection electrode or the ground electrode can be performed normally, and the product yield can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例による方向性結合器のマザー基
板の平面図である。
FIG. 1 is a plan view of a mother substrate of a directional coupler according to an embodiment of the present invention.

【図2】図1の底面図である。FIG. 2 is a bottom view of FIG.

【図3】本発明の実施例による方向性結合器の平面図で
ある。
FIG. 3 is a plan view of a directional coupler according to an embodiment of the present invention.

【図4】本発明の表面実装部品の製造方法が適用できる
ブランチラインハイブリッドの、(a)は平面図であ
り、(b)はA−A線断面図である。
4A is a plan view and FIG. 4B is a cross-sectional view taken along line AA of a branch line hybrid to which the method for manufacturing a surface mount component of the present invention can be applied.

【図5】従来の方向性結合器の平面図である。FIG. 5 is a plan view of a conventional directional coupler.

【図6】図5の底面図である。FIG. 6 is a bottom view of FIG. 5;

【図7】従来の方向性結合器のマザー基板の平面図であ
る。
FIG. 7 is a plan view of a mother board of a conventional directional coupler.

【図8】図7の底面図である。FIG. 8 is a bottom view of FIG. 7;

【図9】図7の電極パターンがA方向にずれた場合の最
下段の小基板の平面図である。
9 is a plan view of the lowermost small substrate when the electrode pattern of FIG. 7 is shifted in the direction A. FIG.

【図10】図7の電極パターンがB方向にずれた場合の
小基板の平面図である。
10 is a plan view of the small substrate when the electrode pattern of FIG. 7 is shifted in the B direction.

【図11】図8の電極パターンがA方向にずれた場合の
小基板の底面図である。
11 is a bottom view of the small substrate when the electrode pattern of FIG. 8 is shifted in the direction A.

【図12】図8の電極パターンがB方向にずれた場合の
小基板の底面図である。
FIG. 12 is a bottom view of the small substrate when the electrode pattern of FIG. 8 is shifted in the B direction.

【図13】図8の電極パターンがC方向にずれた場合の
小基板の底面図である。
13 is a bottom view of the small substrate when the electrode pattern of FIG. 8 is shifted in the C direction.

【符号の説明】[Explanation of symbols]

1 基板 2,6 ストリップライン 4 入力電極 5,8 出力電極 9 アイソレーション電極 10 接地電極 11a〜11f 端面電極 17 子基板 21 方向性結合器 DESCRIPTION OF SYMBOLS 1 Substrate 2, 6 Strip line 4 Input electrode 5, 8 Output electrode 9 Isolation electrode 10 Ground electrode 11a-11f End face electrode 17 Substrate 21 Directional coupler

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】誘電体からなるマザー基板の表面に主電極
及び該主電極から引き出される接続電極をマトリックス
状に形成し、裏面に前記接続電極と対向する切り欠きを
設けた接地電極を形成し、前記マザー基板を分割線に沿
って複数の小基板に分割し、該分割された小基板の分割
面に前記接続電極又は接地電極と導通する端面電極を形
成してなる表面実装部品の製造方法において、前記接続
電極及び接地電極の切り欠きを、前記分割線に跨がって
形成したことを特徴とする表面実装部品の製造方法。
A main electrode and a connection electrode extending from the main electrode are formed in a matrix on a surface of a mother substrate made of a dielectric, and a ground electrode provided with a cutout facing the connection electrode on a back surface is formed. A method of manufacturing a surface-mounted component, comprising: dividing the mother substrate into a plurality of small substrates along a dividing line; and forming an end surface electrode that is electrically connected to the connection electrode or the ground electrode on a divided surface of the divided small substrate. 3. The method for manufacturing a surface mount component according to claim 1, wherein the notch of the connection electrode and the ground electrode is formed so as to extend over the dividing line.
【請求項2】前記表面実装部品を方向性結合器としたこ
とを特徴とする請求項1記載の表面実装部品の製造方
法。
2. The method according to claim 1, wherein said surface-mounted component is a directional coupler.
【請求項3】前記表面実装部品をブランチラインハイブ
リッドとしたことを特徴とする請求項1記載の表面実装
部品の製造方法。。
3. The method according to claim 1, wherein said surface mount component is a branch line hybrid. .
JP30649293A 1993-12-07 1993-12-07 Method for manufacturing surface mount components Expired - Fee Related JP3265770B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30649293A JP3265770B2 (en) 1993-12-07 1993-12-07 Method for manufacturing surface mount components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30649293A JP3265770B2 (en) 1993-12-07 1993-12-07 Method for manufacturing surface mount components

Publications (2)

Publication Number Publication Date
JPH07162213A JPH07162213A (en) 1995-06-23
JP3265770B2 true JP3265770B2 (en) 2002-03-18

Family

ID=17957676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30649293A Expired - Fee Related JP3265770B2 (en) 1993-12-07 1993-12-07 Method for manufacturing surface mount components

Country Status (1)

Country Link
JP (1) JP3265770B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3524630B2 (en) * 1995-04-07 2004-05-10 Fdk株式会社 Multilayer dielectric filter and method of manufacturing the same
JPH10294603A (en) * 1997-04-17 1998-11-04 Tdk Corp Laminated dielectric filter
WO2008041398A1 (en) 2006-09-29 2008-04-10 Murata Manufacturing Co., Ltd. Balance/unbalance conversion element, and method for manufacturing the same
WO2008102502A1 (en) * 2007-02-21 2008-08-28 Murata Manufacturing Co., Ltd. Microstrip line filter

Also Published As

Publication number Publication date
JPH07162213A (en) 1995-06-23

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