JP7152617B2 - 放熱シート - Google Patents

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Publication number
JP7152617B2
JP7152617B2 JP2021548353A JP2021548353A JP7152617B2 JP 7152617 B2 JP7152617 B2 JP 7152617B2 JP 2021548353 A JP2021548353 A JP 2021548353A JP 2021548353 A JP2021548353 A JP 2021548353A JP 7152617 B2 JP7152617 B2 JP 7152617B2
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JP
Japan
Prior art keywords
boron nitride
nitride particles
particle size
heat
heat dissipation
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JP2021548353A
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English (en)
Japanese (ja)
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JPWO2021059648A1 (zh
Inventor
諭司 國安
貴之 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Publication of JPWO2021059648A1 publication Critical patent/JPWO2021059648A1/ja
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Publication of JP7152617B2 publication Critical patent/JP7152617B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/285—Ammonium nitrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021548353A 2019-09-25 2020-06-30 放熱シート Active JP7152617B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019173834 2019-09-25
JP2019173834 2019-09-25
PCT/JP2020/025719 WO2021059648A1 (ja) 2019-09-25 2020-06-30 放熱シート

Publications (2)

Publication Number Publication Date
JPWO2021059648A1 JPWO2021059648A1 (zh) 2021-04-01
JP7152617B2 true JP7152617B2 (ja) 2022-10-12

Family

ID=75164971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548353A Active JP7152617B2 (ja) 2019-09-25 2020-06-30 放熱シート

Country Status (3)

Country Link
JP (1) JP7152617B2 (zh)
CN (1) CN114467367B (zh)
WO (1) WO2021059648A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133587A1 (ja) 2011-03-28 2012-10-04 日立化成工業株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにｌｅｄ装置
JP2017036190A (ja) 2015-08-12 2017-02-16 三菱化学株式会社 窒化ホウ素凝集粒子組成物、ｂｎ凝集粒子含有樹脂組成物及びそれらの成形体、並びに窒化ホウ素凝集粒子の製造方法、
JP2019006837A (ja) 2015-10-29 2019-01-17 日東電工株式会社 熱伝導性シート及び半導体モジュール
WO2019065150A1 (ja) 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
JP2019116401A (ja) 2017-12-27 2019-07-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
JP2019137608A (ja) 2014-02-05 2019-08-22 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5340202B2 (ja) * 2010-02-23 2013-11-13 三菱電機株式会社 熱硬化性樹脂組成物、ｂステージ熱伝導性シート及びパワーモジュール
JP6274014B2 (ja) * 2013-05-27 2018-02-07 三菱ケミカル株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
JP6678999B2 (ja) * 2015-09-03 2020-04-15 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133587A1 (ja) 2011-03-28 2012-10-04 日立化成工業株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにｌｅｄ装置
JP2019137608A (ja) 2014-02-05 2019-08-22 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、成形体、及びシート
JP2017036190A (ja) 2015-08-12 2017-02-16 三菱化学株式会社 窒化ホウ素凝集粒子組成物、ｂｎ凝集粒子含有樹脂組成物及びそれらの成形体、並びに窒化ホウ素凝集粒子の製造方法、
JP2019006837A (ja) 2015-10-29 2019-01-17 日東電工株式会社 熱伝導性シート及び半導体モジュール
WO2019065150A1 (ja) 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
JP2019116401A (ja) 2017-12-27 2019-07-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材

Also Published As

Publication number Publication date
CN114467367A (zh) 2022-05-10
CN114467367B (zh) 2024-05-07
WO2021059648A1 (ja) 2021-04-01
JPWO2021059648A1 (zh) 2021-04-01

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