JP7121547B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP7121547B2 JP7121547B2 JP2018107050A JP2018107050A JP7121547B2 JP 7121547 B2 JP7121547 B2 JP 7121547B2 JP 2018107050 A JP2018107050 A JP 2018107050A JP 2018107050 A JP2018107050 A JP 2018107050A JP 7121547 B2 JP7121547 B2 JP 7121547B2
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- 239000004065 semiconductor Substances 0.000 title claims description 120
- 239000000758 substrate Substances 0.000 claims description 63
- 230000001681 protective effect Effects 0.000 claims description 59
- 210000000746 body region Anatomy 0.000 claims description 52
- 239000012535 impurity Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 239000002344 surface layer Substances 0.000 description 12
- 230000005684 electric field Effects 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000006378 damage Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229910001195 gallium oxide Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
(1)半導体装置1は、保護用トランジスタTr2の閾値電圧の温度依存性を利用して、メイントランジスタTr1を熱破壊から保護することができる。保護用トランジスタTr2の閾値電圧の温度依存性は、半導体基板10を構成する半導体材料に因らずに、様々な半導体材料に共通して生じる現象である。上記実施形態では、半導体基板10の半導体材料が炭化シリコンの場合を例示したが、この例に代えて、半導体基板10の半導体材料がシリコン、窒化物半導体、酸化ガリウム又はダイヤモンドであってもよい。このように、この半導体装置1に用いられる技術は、様々な種類の半導体材料に適用することができ、汎用性に優れた技術である。
10:半導体基板
11:ドレイン領域
12:ドリフト領域
13:メインボディ領域
14:ソース領域
15:保護用ボディ領域
16:電界進展領域
17:保護用ソース領域
22:ドレイン電極
24:ソース電極
30:絶縁ゲート部
30T トレンチ
32:ゲート絶縁膜
34:ゲート電極
40:ゲート電極板
Claims (3)
- メイントランジスタと、
前記メイントランジスタのゲート・ソース間に接続されており、前記メイントランジスタに熱結合している保護用トランジスタと、を備えており、
前記保護用トランジスタのゲート及びドレインが前記メイントランジスタのゲートに接続されており、前記保護用トランジスタのソースが前記メイントランジスタのソースに接続されており、
前記保護用トランジスタの閾値電圧が前記メイントランジスタの閾値電圧よりも高く、
前記メイントランジスタと前記保護用トランジスタは、半導体基板に一体的に形成されており、
前記半導体基板のうちの前記メイントランジスタが形成されているメイン領域と前記半導体基板のうちの前記保護用トランジスタが形成されている保護用領域の双方に対向する絶縁ゲート部が設けられており、
前記絶縁ゲート部がトレンチ型であり、
前記絶縁ゲート部の一方の側面に接して前記メイン領域が設けられており、前記絶縁ゲート部の他方の側面に接して前記保護用領域が設けられている、半導体装置。 - 前記半導体基板は、
前記メイン領域に設けられており、前記絶縁ゲート部に対向しており、チャネルが形成されるメインボディ領域と、
前記保護用領域に設けられており、前記絶縁ゲート部に対向しており、チャネルが形成される保護用ボディ領域と、を有しており、
前記保護用ボディ領域の不純物濃度が、前記メインボディ領域の不純物濃度よりも濃い、請求項1に記載の半導体装置。 - 前記半導体基板の材料が、ワイドバンドギャップ半導体である、請求項1又は2に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018107050A JP7121547B2 (ja) | 2018-06-04 | 2018-06-04 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018107050A JP7121547B2 (ja) | 2018-06-04 | 2018-06-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019212738A JP2019212738A (ja) | 2019-12-12 |
JP7121547B2 true JP7121547B2 (ja) | 2022-08-18 |
Family
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018107050A Active JP7121547B2 (ja) | 2018-06-04 | 2018-06-04 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7121547B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005217332A (ja) | 2004-01-30 | 2005-08-11 | Nec Electronics Corp | 半導体装置 |
JP2008177250A (ja) | 2007-01-16 | 2008-07-31 | Sharp Corp | 温度センサを組み込んだ電力制御装置及びその製造方法 |
JP2015015329A (ja) | 2013-07-04 | 2015-01-22 | 三菱電機株式会社 | ワイドギャップ半導体装置 |
-
2018
- 2018-06-04 JP JP2018107050A patent/JP7121547B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005217332A (ja) | 2004-01-30 | 2005-08-11 | Nec Electronics Corp | 半導体装置 |
JP2008177250A (ja) | 2007-01-16 | 2008-07-31 | Sharp Corp | 温度センサを組み込んだ電力制御装置及びその製造方法 |
JP2015015329A (ja) | 2013-07-04 | 2015-01-22 | 三菱電機株式会社 | ワイドギャップ半導体装置 |
Also Published As
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JP2019212738A (ja) | 2019-12-12 |
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