JP7112505B2 - 電子デバイス積層体の製造方法、および、電子デバイス積層体 - Google Patents

電子デバイス積層体の製造方法、および、電子デバイス積層体 Download PDF

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JP7112505B2
JP7112505B2 JP2020548275A JP2020548275A JP7112505B2 JP 7112505 B2 JP7112505 B2 JP 7112505B2 JP 2020548275 A JP2020548275 A JP 2020548275A JP 2020548275 A JP2020548275 A JP 2020548275A JP 7112505 B2 JP7112505 B2 JP 7112505B2
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layer
electronic device
organic
gas barrier
substrate
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JP2020548275A
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Japanese (ja)
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JPWO2020066496A1 (ja
Inventor
英二郎 岩瀬
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Fujifilm Corp
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Fujifilm Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
JP2020548275A 2018-09-27 2019-09-03 電子デバイス積層体の製造方法、および、電子デバイス積層体 Active JP7112505B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018181972 2018-09-27
JP2018181972 2018-09-27
PCT/JP2019/034609 WO2020066496A1 (ja) 2018-09-27 2019-09-03 電子デバイス積層体の製造方法、および、電子デバイス積層体

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JPWO2020066496A1 JPWO2020066496A1 (ja) 2021-08-30
JP7112505B2 true JP7112505B2 (ja) 2022-08-03

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JP2020548275A Active JP7112505B2 (ja) 2018-09-27 2019-09-03 電子デバイス積層体の製造方法、および、電子デバイス積層体

Country Status (5)

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JP (1) JP7112505B2 (ko)
KR (1) KR102528054B1 (ko)
CN (1) CN112771996A (ko)
TW (1) TW202013789A (ko)
WO (1) WO2020066496A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112701129B (zh) * 2021-01-07 2023-10-31 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021924A1 (ja) 2011-08-05 2013-02-14 三菱化学株式会社 有機エレクトロルミネッセンス発光装置及びその製造方法
JP2013069615A (ja) 2011-09-26 2013-04-18 Toppan Printing Co Ltd 有機elディスプレイ及びその製造方法
JP2015230869A (ja) 2014-06-06 2015-12-21 コニカミノルタ株式会社 電子デバイス
WO2016133130A1 (ja) 2015-02-17 2016-08-25 コニカミノルタ株式会社 封止構造体
JP2017043062A (ja) 2015-08-28 2017-03-02 富士フイルム株式会社 ガスバリアフィルムの製造方法
JP2017117653A (ja) 2015-12-24 2017-06-29 パイオニア株式会社 発光装置
WO2018163937A1 (ja) 2017-03-09 2018-09-13 パイオニア株式会社 発光装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6026331B2 (ja) 2013-03-22 2016-11-16 富士フイルム株式会社 有機el積層体
JP2017117663A (ja) * 2015-12-24 2017-06-29 アイシン精機株式会社 固体酸化物型電池セル及びその評価装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013021924A1 (ja) 2011-08-05 2013-02-14 三菱化学株式会社 有機エレクトロルミネッセンス発光装置及びその製造方法
JP2013069615A (ja) 2011-09-26 2013-04-18 Toppan Printing Co Ltd 有機elディスプレイ及びその製造方法
JP2015230869A (ja) 2014-06-06 2015-12-21 コニカミノルタ株式会社 電子デバイス
WO2016133130A1 (ja) 2015-02-17 2016-08-25 コニカミノルタ株式会社 封止構造体
JP2017043062A (ja) 2015-08-28 2017-03-02 富士フイルム株式会社 ガスバリアフィルムの製造方法
JP2017117653A (ja) 2015-12-24 2017-06-29 パイオニア株式会社 発光装置
WO2018163937A1 (ja) 2017-03-09 2018-09-13 パイオニア株式会社 発光装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SUGA, T., et al.,Direct bonding of polymer to glass wafers using surface activated bonding(SAB) method at room temperature,2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration,米国,IEEE,2012年03月23日,161-161,doi:10.1109/LTB-3D.2012.6238098

Also Published As

Publication number Publication date
WO2020066496A1 (ja) 2020-04-02
KR20210043697A (ko) 2021-04-21
KR102528054B1 (ko) 2023-05-02
TW202013789A (zh) 2020-04-01
JPWO2020066496A1 (ja) 2021-08-30
CN112771996A (zh) 2021-05-07

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