JP7104353B2 - はんだペースト及びはんだペースト用フラックス - Google Patents

はんだペースト及びはんだペースト用フラックス Download PDF

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Publication number
JP7104353B2
JP7104353B2 JP2020552045A JP2020552045A JP7104353B2 JP 7104353 B2 JP7104353 B2 JP 7104353B2 JP 2020552045 A JP2020552045 A JP 2020552045A JP 2020552045 A JP2020552045 A JP 2020552045A JP 7104353 B2 JP7104353 B2 JP 7104353B2
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JP
Japan
Prior art keywords
mass
solder
flux
mass ppm
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2020552045A
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English (en)
Japanese (ja)
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JPWO2020241574A1 (cg-RX-API-DMAC7.html
Inventor
浩由 川▲崎▼
正人 白鳥
勇司 川又
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of JPWO2020241574A1 publication Critical patent/JPWO2020241574A1/ja
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Publication of JP7104353B2 publication Critical patent/JP7104353B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020552045A 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス Active JP7104353B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019098936 2019-05-27
JP2019098936 2019-05-27
PCT/JP2020/020549 WO2020241574A1 (ja) 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス

Publications (2)

Publication Number Publication Date
JPWO2020241574A1 JPWO2020241574A1 (cg-RX-API-DMAC7.html) 2020-12-03
JP7104353B2 true JP7104353B2 (ja) 2022-07-21

Family

ID=73552178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020552045A Active JP7104353B2 (ja) 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス

Country Status (3)

Country Link
JP (1) JP7104353B2 (cg-RX-API-DMAC7.html)
TW (1) TWI817013B (cg-RX-API-DMAC7.html)
WO (1) WO2020241574A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7007619B1 (ja) 2021-05-31 2022-02-10 千住金属工業株式会社 フラックス及びソルダペースト
TWI923942B (zh) * 2022-12-22 2026-05-01 美商阿爾發金屬化工公司 焊接方法、焊料膏、膏熔劑及焊料接點

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016681A (ja) 2004-07-05 2006-01-19 Nosaku:Kk 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法
JP2006181637A (ja) 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd フラックス及びこれを用いたはんだ付方法
JP2013214704A (ja) 2012-03-06 2013-10-17 Mitsubishi Materials Corp はんだバンプの製造方法
JP2015098052A (ja) 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719627B2 (ja) * 1997-10-07 2005-11-24 内橋エステック株式会社 はんだ合金
MX2013009113A (es) * 2012-05-10 2013-11-01 Senju Metal Industry Co Aleacion de soldadura para audio.
EP2773484B1 (en) * 2012-10-09 2017-05-24 Alpha Assembly Solutions Inc. Lead-free and antimony-free tin solder reliable at high temperatures
KR101974761B1 (ko) * 2014-02-04 2019-09-05 센주긴조쿠고교 가부시키가이샤 Cu 볼, Cu 핵 볼, 납땜 조인트, 땜납 페이스트, 폼 땜납, 및 Cu 볼 및 Cu핵 볼의 제조 방법
JP6047214B1 (ja) * 2015-11-02 2016-12-21 田中電子工業株式会社 ボールボンディング用貴金属被覆銅ワイヤ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016681A (ja) 2004-07-05 2006-01-19 Nosaku:Kk 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法
JP2006181637A (ja) 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd フラックス及びこれを用いたはんだ付方法
JP2013214704A (ja) 2012-03-06 2013-10-17 Mitsubishi Materials Corp はんだバンプの製造方法
JP2015098052A (ja) 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉

Also Published As

Publication number Publication date
JPWO2020241574A1 (cg-RX-API-DMAC7.html) 2020-12-03
TWI817013B (zh) 2023-10-01
TW202106889A (zh) 2021-02-16
WO2020241574A1 (ja) 2020-12-03

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