JPWO2020241574A1 - - Google Patents
Info
- Publication number
- JPWO2020241574A1 JPWO2020241574A1 JP2020552045A JP2020552045A JPWO2020241574A1 JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1 JP 2020552045 A JP2020552045 A JP 2020552045A JP 2020552045 A JP2020552045 A JP 2020552045A JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019098936 | 2019-05-27 | ||
| JP2019098936 | 2019-05-27 | ||
| PCT/JP2020/020549 WO2020241574A1 (ja) | 2019-05-27 | 2020-05-25 | はんだペースト及びはんだペースト用フラックス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020241574A1 true JPWO2020241574A1 (cg-RX-API-DMAC7.html) | 2020-12-03 |
| JP7104353B2 JP7104353B2 (ja) | 2022-07-21 |
Family
ID=73552178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020552045A Active JP7104353B2 (ja) | 2019-05-27 | 2020-05-25 | はんだペースト及びはんだペースト用フラックス |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7104353B2 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI817013B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2020241574A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7007619B1 (ja) | 2021-05-31 | 2022-02-10 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| TWI923942B (zh) * | 2022-12-22 | 2026-05-01 | 美商阿爾發金屬化工公司 | 焊接方法、焊料膏、膏熔劑及焊料接點 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11114691A (ja) * | 1997-10-07 | 1999-04-27 | Uchihashi Estec Co Ltd | はんだ合金 |
| JP2006016681A (ja) * | 2004-07-05 | 2006-01-19 | Nosaku:Kk | 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法 |
| JP2006181637A (ja) * | 2004-12-03 | 2006-07-13 | Tamura Seisakusho Co Ltd | フラックス及びこれを用いたはんだ付方法 |
| JP2013214704A (ja) * | 2012-03-06 | 2013-10-17 | Mitsubishi Materials Corp | はんだバンプの製造方法 |
| JP2015098052A (ja) * | 2013-10-16 | 2015-05-28 | 三井金属鉱業株式会社 | 半田合金及び半田粉 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2013009113A (es) * | 2012-05-10 | 2013-11-01 | Senju Metal Industry Co | Aleacion de soldadura para audio. |
| EP2773484B1 (en) * | 2012-10-09 | 2017-05-24 | Alpha Assembly Solutions Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
| KR101974761B1 (ko) * | 2014-02-04 | 2019-09-05 | 센주긴조쿠고교 가부시키가이샤 | Cu 볼, Cu 핵 볼, 납땜 조인트, 땜납 페이스트, 폼 땜납, 및 Cu 볼 및 Cu핵 볼의 제조 방법 |
| JP6047214B1 (ja) * | 2015-11-02 | 2016-12-21 | 田中電子工業株式会社 | ボールボンディング用貴金属被覆銅ワイヤ |
-
2020
- 2020-05-25 JP JP2020552045A patent/JP7104353B2/ja active Active
- 2020-05-25 TW TW109117353A patent/TWI817013B/zh active
- 2020-05-25 WO PCT/JP2020/020549 patent/WO2020241574A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11114691A (ja) * | 1997-10-07 | 1999-04-27 | Uchihashi Estec Co Ltd | はんだ合金 |
| JP2006016681A (ja) * | 2004-07-05 | 2006-01-19 | Nosaku:Kk | 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法 |
| JP2006181637A (ja) * | 2004-12-03 | 2006-07-13 | Tamura Seisakusho Co Ltd | フラックス及びこれを用いたはんだ付方法 |
| JP2013214704A (ja) * | 2012-03-06 | 2013-10-17 | Mitsubishi Materials Corp | はんだバンプの製造方法 |
| JP2015098052A (ja) * | 2013-10-16 | 2015-05-28 | 三井金属鉱業株式会社 | 半田合金及び半田粉 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7104353B2 (ja) | 2022-07-21 |
| TWI817013B (zh) | 2023-10-01 |
| TW202106889A (zh) | 2021-02-16 |
| WO2020241574A1 (ja) | 2020-12-03 |
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