JPWO2020241574A1 - - Google Patents

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Publication number
JPWO2020241574A1
JPWO2020241574A1 JP2020552045A JP2020552045A JPWO2020241574A1 JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1 JP 2020552045 A JP2020552045 A JP 2020552045A JP 2020552045 A JP2020552045 A JP 2020552045A JP WO2020241574 A1 JPWO2020241574 A1 JP WO2020241574A1
Authority
JP
Japan
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Application number
JP2020552045A
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JP7104353B2 (ja
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Publication of JPWO2020241574A1 publication Critical patent/JPWO2020241574A1/ja
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Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2020552045A 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス Active JP7104353B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019098936 2019-05-27
JP2019098936 2019-05-27
PCT/JP2020/020549 WO2020241574A1 (ja) 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス

Publications (2)

Publication Number Publication Date
JPWO2020241574A1 true JPWO2020241574A1 (ja) 2020-12-03
JP7104353B2 JP7104353B2 (ja) 2022-07-21

Family

ID=73552178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020552045A Active JP7104353B2 (ja) 2019-05-27 2020-05-25 はんだペースト及びはんだペースト用フラックス

Country Status (3)

Country Link
JP (1) JP7104353B2 (ja)
TW (1) TWI817013B (ja)
WO (1) WO2020241574A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11114691A (ja) * 1997-10-07 1999-04-27 Uchihashi Estec Co Ltd はんだ合金
JP2006016681A (ja) * 2004-07-05 2006-01-19 Nosaku:Kk 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法
JP2006181637A (ja) * 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd フラックス及びこれを用いたはんだ付方法
JP2013214704A (ja) * 2012-03-06 2013-10-17 Mitsubishi Materials Corp はんだバンプの製造方法
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012363597B2 (en) * 2012-05-10 2016-07-21 Senju Metal Industry Co., Ltd Audio solder alloy
WO2014057261A1 (en) * 2012-10-09 2014-04-17 Alpha Metals, Inc. Lead-free and antimony-free tin solder reliable at high temperatures
WO2015118611A1 (ja) * 2014-02-04 2015-08-13 千住金属工業株式会社 Ｃｕボール、Ｃｕ核ボール、はんだ継手、はんだペースト、およびフォームはんだ
JP6047214B1 (ja) * 2015-11-02 2016-12-21 田中電子工業株式会社 ボールボンディング用貴金属被覆銅ワイヤ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11114691A (ja) * 1997-10-07 1999-04-27 Uchihashi Estec Co Ltd はんだ合金
JP2006016681A (ja) * 2004-07-05 2006-01-19 Nosaku:Kk 金属製器ならびに該金属製器に用いる金属からなる金属製品およびその製造方法
JP2006181637A (ja) * 2004-12-03 2006-07-13 Tamura Seisakusho Co Ltd フラックス及びこれを用いたはんだ付方法
JP2013214704A (ja) * 2012-03-06 2013-10-17 Mitsubishi Materials Corp はんだバンプの製造方法
JP2015098052A (ja) * 2013-10-16 2015-05-28 三井金属鉱業株式会社 半田合金及び半田粉

Also Published As

Publication number Publication date
JP7104353B2 (ja) 2022-07-21
TWI817013B (zh) 2023-10-01
WO2020241574A1 (ja) 2020-12-03
TW202106889A (zh) 2021-02-16

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