JP7067330B2 - Etching device, etching method and manufacturing method of printed wiring board - Google Patents

Description

The present invention relates to an etching apparatus, an etching method and a method for manufacturing a printed wiring board, and more particularly to an etching apparatus, an etching method and a method for manufacturing a printed wiring board applicable to an ultrathin substrate.

Electronic components such as semiconductor chips have extremely high integration densities, and printed wiring boards to be mounted are becoming narrower. Therefore, the thickness of the metal-clad laminate used is also very thin. Then, in order to further reduce the thickness of the laminated board, it is considered to use an ultrathin base material having a thickness of 30 μm or less. When an ultra-thin base material is used, the strength is insufficient, and defects such as curling of the base material and cutting of the base material are likely to occur during the manufacturing process, which makes handling difficult.

In particular, the etching process for removing unnecessary metal foil is a main cause of defects in the process because the metal leaf that greatly affects the maintenance of strength is eliminated. Therefore, there is a method of increasing the metal foil portion to increase the strength at the time of forming the circuit pattern, but this is inefficient because the ratio of the product in the substrate is reduced. Further, in the spray method in which the etching solution is sprayed from a spray or a nozzle at the time of etching, the insulating (base material) portion from which the metal foil is removed by the pressure of the etching solution, particularly the interface between the circuit portion and the metal removing portion is elastic. Since it is the interface of materials with different ratios, pressure is concentrated and the thin base material is often cracked.

Therefore, in order to make it possible for the product to withstand the spray-type etching process even with an ultra-thin base material and to perform the work easily, it is used for reinforcement above and below the plate-like object with a metal layer having a metal layer on the surface. It has been proposed to attach a protective plate to increase the strength, facilitate handling in a processing line, and to perform etching by a spray method by forming pores in the protective plate (for example, Patent Document). 1).

Japanese Unexamined Patent Publication No. 2009-149930

However, when an ultrathin substrate having a thickness of 30 μm or less is used, the technique described in Patent Document 1 sprays the etching solution from above and below, so that the interface portion between the circuit portion and the metal removing portion is used. It is difficult to prevent cracks from occurring in thin substrates.

In view of this background, the present invention has an etching apparatus, an etching method, and a method for manufacturing a printed wiring board that can suppress defects due to insufficient strength of the substrate even when an ultrathin substrate is used. The purpose is to provide.

The present invention relates to the following.
[1] An etching apparatus for etching a laminate having a first metal layer on one surface and a second metal layer on the other surface having a thickness of 30 μm or less, at least of the laminate. Etching on a pair of facing edges, a jig installed so as to apply tension to the laminate, a transport belt for transporting the laminate on which the jig is installed, and a first metal layer of the laminate. An etching apparatus including a first etching portion for ejecting a liquid, an inversion portion for inverting the front and back of the laminated body, and a second etching portion for ejecting the etching liquid onto the second metal layer of the laminated body.
[2] The jig is the etching apparatus according to [1], which holds and holds the laminated body in the laminated direction.
[3] The etching apparatus according to [1] or [2], wherein the jig has a shape that is plane-symmetrical with respect to the laminated body when installed on the laminated body.
[4] The etching apparatus according to any one of [1] to [3], wherein the transport belt includes a fixing portion for fixing the jig.
[5] The etching apparatus according to any one of [1] to [4], wherein the transport belt is provided with a groove into which the jig can be fitted.
[6] In the first etching section, the etching solution is jetted in a state where at least a part of the surface of the laminated body facing the first metal layer is in contact with the transport belt. Either etching device.
[7] In the second etching section, the etching solution is jetted in a state where at least a part of the surface of the laminated body facing the second metal layer is in contact with the transport belt. Either etching device.
[8] A step of preparing a laminate having a first metal layer on one surface of a substrate having a thickness of 30 μm or less and a second metal layer on the other surface, and at least one pair of the laminates. A step of installing a jig on the facing edge portion so as to apply tension to the laminated body, a step of transporting the laminated body on which the jig is installed by a transport belt, and a step of ejecting an etching solution onto the first metal layer. An etching method including a step of inverting the front and back of the laminated body, and a step of spraying an etching solution onto the second metal layer of the laminated body.
[9] A method for manufacturing a printed wiring board, which comprises a step of forming a circuit pattern by the etching method of [8].

According to the present invention, there is provided an etching apparatus, an etching method, and a method for manufacturing a printed wiring board, which can suppress defects due to insufficient strength of the substrate even when an ultrathin substrate is used. can do.

It is a schematic diagram of the etching apparatus which concerns on embodiment of this invention. It is sectional drawing of the laminated body to be etched by the etching apparatus which concerns on embodiment of this invention. It is a perspective view which installed the jig in the laminated body to be etched by the etching apparatus which concerns on embodiment of this invention. It is sectional drawing which shows that the jig is installed in the laminated body to be etched by the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram explaining the jig to the laminated body to be etched by the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the fixing part provided in the transport belt of the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the groove provided in the transport belt of the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the 1st etching part of the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the reversing mechanism of the reversing part of the etching apparatus which concerns on embodiment of this invention. It is a schematic diagram which shows the 2nd etching part of the etching apparatus which concerns on embodiment of this invention.

[Etching equipment]
As shown in FIG. 1, the etching apparatus according to the embodiment of the present invention includes a transport belt 30 for transporting a laminate 10 on which a jig 20 is installed, a first etching section 40, an inversion section 50, and a second etching. A unit 60 is provided.

As shown in FIG. 2, the laminate 10 has the first metal layer 12 on one surface of the base material 11 having a thickness of 30 μm or less, and the second metal layer 13 on the other surface.

Examples of the base material 11 include inorganic fibers such as E glass, D glass, S glass and Q glass, organic fibers such as polyimide, polyester and tetrafluoroethylene, and a mixture thereof.
Examples of the shape of the base material 11 include woven fabrics, non-woven fabrics, robinks, chopped strand mats, and surfaced mats.
The thickness t of the base material 11 is preferably 25 μm or less, more preferably 20 μm or less, still more preferably 15 μm or less, from the viewpoint of contributing to the miniaturization of the laminated board 10. The thickness t of the base material 11 is preferably 5 μm or more, more preferably 7 μm or more, still more preferably 10 μm or more, from the viewpoint of maintaining the strength of the laminated board 10.

The first metal layer 12 and the second metal layer 13 are metal foils capable of forming a pattern such as a circuit pattern. As shown in FIG. 2, the first metal layer 12 and the second metal layer 13 are etched to form a pattern such as a circuit pattern by using a resist 14 arranged so as to have a desired pattern.
Examples of the first metal layer 12 and the second metal layer 13 include copper foil, nickel foil, aluminum foil and the like, and among these, copper foil is preferable. The type of copper foil is not particularly limited, and electrolytic copper foil, rolled copper foil and the like can be used.
The first metal layer 12 and the second metal layer 13 may be subjected to a rust preventive treatment, a chromate treatment, a silane coupling agent treatment, or the like, if necessary.

As shown in FIG. 3, the jig 20 is installed so as to apply tension to the laminated body 10 to at least one pair of facing edge portions 10a of the laminated body 10. By applying tension to the laminated body 10, the jig 20 can stably perform the transport process, the etching process, and the like.

As a method of installing the jig 20 on the laminated body 10, it is preferable to hold the laminated body 10 by sandwiching it in the laminated body direction as shown in FIG. The means of the jig 20 that sandwiches the laminated body 10 includes, for example, a means of providing a magnet having a different pole in each of the separated jigs 20, a means of providing an elastic member so that each of the separated jigs 20 attracts each other, and a means of separating. Examples thereof include means for fixing the laminated body 10 after the jig 20 is in a state of sandwiching the laminated body 10. When a means having a magnet having a different pole in each of the separated jigs 20 is adopted, when the jig 20 is removed, a magnet stronger than the magnetic force of the jig 20 is brought closer to the end of the jig 20. Since the end of the jig 20 in which the magnet is close is the opposite pole of the magnet, each jig 20 can be removed by repulsion.

As shown in FIG. 5, the jig 20 preferably has a shape that is plane-symmetrical with respect to the laminated body 10 when installed on the laminated body 10. Since the shape is plane-symmetrical with respect to the jig 20 laminated body 10, even if the front and back sides of the laminated body 10 are reversed, the transport process, the etching process, and the like can be stably performed. Examples of the shape that is plane-symmetrical with respect to the laminated body 10 of the jig 20 include a cylindrical shape as shown in FIG. 5 (a) and a quadrangular prism shape as shown in FIG. 5 (b).

As shown in FIG. 6, the transport belt 30 preferably includes a fixing portion 31 for fixing the jig 20. When the transport belt 30 includes the fixing portion 31, the laminated body 10 on which the jig 20 is installed can be stably transported. The shape of the fixing portion 31 may be any shape as long as the jig 20 can be fixed, and examples thereof include a hook shape, a protrusion shape, and a holding shape.

As shown in FIG. 7, the transport belt 30 preferably includes a groove 32 into which the jig 20 can be fitted. When the transport belt 30 is provided with the groove 32, the laminated body 10 in which the jig 20 is installed can be stably transported. The shape of the groove 32 may be matched to the shape of the jig 20, and for example, when the jig 20 has a cylindrical shape as shown in FIG. 7, it can be a semicircular groove.

As shown in FIGS. 1 and 8, the first etching unit 40 has a jet mechanism 41 such as a spray and a nozzle for ejecting an etching solution onto the first metal layer 12 of the laminated body 10. The jet mechanism 41 may be a single jet mechanism 41 or a plurality of jet jet mechanisms 41.
The flow rate at which the etching solution is ejected by the jet mechanism 41 varies depending on the manufacturing conditions such as the thickness of the metal foil to be etched, the width of the circuit to be manufactured, and the circuit density, but the etching solution is the first metal. From the viewpoint of directly spraying on the layer 12 to perform sufficient etching, it is preferably 100 ml / min or more, more preferably 150 ml / min or more, and further preferably 200 ml / min or more.
The pump pressure of the jet mechanism 41 when jetting the etching liquid is 0.01 MPa or more from the viewpoint of making it possible to remove the etching liquid staying on the laminated body 10 and supplying a sufficient etching liquid to the first metal layer 12. It is preferably 0.03 MPa or more, more preferably 0.05 MPa or more, and even more preferably 0.05 MPa or more.
The liquid pressure of the etching solution with respect to the laminated body 10 by the jet mechanism 41 is preferably 0.2 MPa or less, and more preferably 0.15 MPa or less, from the viewpoint of preventing damage in the etching process of the spray method on the ultrathin substrate. It is preferably 0.1 MPa or less, and more preferably 0.1 MPa or less.

The etching solution used in the first etching unit 40 may be either acidic or alkaline, and an etching solution suitable for etching the first metal layer 12 can be appropriately selected. The etching solution is preferably ferric chloride from the viewpoint of productivity and versatility.

As shown in FIG. 8, it is preferable that the first etching section 40 jets the etching solution in a state where at least a part of the surface of the laminated body 10 facing the first metal layer 12 is in contact with the transport belt 30. Here, examples of the surface of the laminated body 10 that comes into contact with the transport belt 30 include the second metal layer 13 and the resist 14. By spraying the etching solution in a state where at least a part of the surface of the laminated body 10 is in contact with the conveying belt 30, the conveying belt 30 can support the surface side of the opposing laminated body 10, and the first metal is supported by the etching solution. It is possible to prevent defects due to cracking of the laminated body 10 due to the pressure applied from the layer 12 side. In order to bring at least a part of the surface of the laminated body 10 into contact with the transport belt 30, for example, the depth of the groove 32 is adjusted so that at least a part of the surface of the laminated body 10 and the transport belt 30 are in contact with each other. Examples thereof include means for causing the transport belt 30 to be brought close to the laminated body 10 so that at least a part of the surface of the laminated body 10 and the transport belt 30 are brought into contact with each other.

The inversion unit 50 is provided between the first etching unit 40 and the second etching unit 60.
The reversing portion 50 has a reversing mechanism for reversing the front and back of the laminated body 10. The reversing mechanism is not particularly limited as long as it can invert the front and back of the laminated body 10 in a series of flow of the transport process and has a function.
An example of the inversion mechanism will be described with reference to FIG. First, as shown in FIG. 9A, when the laminated body 10 reaches the reversing portion 50, the short jig 20 (20a) is fixed by the reversing member 51a, and the long jig 20 (20b) is fixed by the reversing member 51b. Fix it. Next, a long jig with a short jig 20a as a fixed axis so that the first metal layer 12 shown in FIG. 9 (a) is in the state of the upper surface and the second metal layer 13 shown in FIG. 9 (b) is in the state of the upper surface. 20b is lifted and the front and back of the laminated body 10 are reversed. When reversing, it is preferable that the end position A of the short jig 20a, the end position B of the reversing member 51a, and the end position C of the long jig 20b are at different positions so that they do not interfere with each other. .. Next, the reversing members 51a and 51b are opened, and the laminated body 10 whose front and back sides are inverted is transported by the transport belt 30.

As shown in FIGS. 1 and 10, the second etching section 60 has a jet mechanism 61 such as a spray and a nozzle for jetting the etching solution onto the second metal layer 13 of the laminated body 10. The jet mechanism 61 may be a single jet mechanism 61 or a plurality of jet jet mechanisms 61.
The flow rate at which the etching solution is ejected by the jet mechanism 61 varies depending on the manufacturing conditions such as the thickness of the metal foil to be etched, the width of the circuit to be manufactured, and the circuit density, but the etching solution is used as the second metal. From the viewpoint of directly spraying on the layer 13 to perform sufficient etching, it is preferably 100 ml / min or more, more preferably 150 ml / min or more, and further preferably 200 ml / min or more.
The pump pressure of the jet mechanism 61 when jetting the etching liquid is 0.01 MPa or more from the viewpoint of making it possible to remove the etching liquid staying on the laminated body 10 and supplying a sufficient etching liquid to the second metal layer 13. It is preferably 0.03 MPa or more, more preferably 0.05 MPa or more, and even more preferably 0.05 MPa or more.
The liquid pressure of the etching solution with respect to the laminated body 10 by the jet mechanism 61 is preferably 0.2 MPa or less, and more preferably 0.15 MPa or less, from the viewpoint of preventing damage in the etching process of the spray method on the ultrathin substrate. It is preferably 0.1 MPa or less, and more preferably 0.1 MPa or less.
In the etching process in the second etching section, the etching process of the first metal layer 12 has been completed, and since there is an interface portion between the circuit portion and the metal removing portion by the first metal layer 12, cracking of the base material or the like occurs. Since it is more likely to occur than the first etching section 40, it is preferable that the flow velocity, the pump pressure and the liquid pressure are lower in the second etching section than in the first etching section 40.

The etching solution used in the second etching section 60 may be either acidic or alkaline, and an etching solution suitable for etching the second metal layer 13 can be appropriately selected. The etching solution is preferably ferric chloride from the viewpoint of productivity and versatility.

As shown in FIG. 10, it is preferable that the second etching section 60 jets the etching solution in a state where at least a part of the surface of the laminated body 10 facing the second metal layer 13 is in contact with the transport belt 30. Here, examples of the surface of the laminated body 10 that comes into contact with the transport belt 30 include the first metal layer 12 and the resist 14. By spraying the etching solution in a state where at least a part of the surface of the laminated body 10 is in contact with the conveying belt 30, the conveying belt 30 can support the surface side of the opposing laminated body 10, and the second metal is supported by the etching solution. It is possible to prevent defects due to cracking of the laminated body 10 due to the pressure applied from the layer 13 side. In order to bring at least a part of the surface of the laminated body 10 into contact with the transport belt 30, for example, the depth of the groove 32 is adjusted so that at least a part of the surface of the laminated body 10 and the transport belt 30 are in contact with each other. Examples thereof include means for causing the transport belt 30 to be brought close to the laminated body 10 so that at least a part of the surface of the laminated body 10 and the transport belt 30 are brought into contact with each other.

According to the etching apparatus according to the present embodiment, even when an ultrathin base material is used, it is possible to suppress defects due to insufficient strength of the base material during the etching process.

[Etching method]
The etching method according to the embodiment of the present invention includes a step of preparing a laminate having a first metal layer on one surface of a substrate having a thickness of 30 μm or less and a second metal layer on the other surface. , A step of installing a jig so as to apply tension to the laminate at at least one pair of facing edges of the laminate, a step of transporting the laminate on which the jig is installed by a transport belt, and a step of transporting the laminate to the first metal layer. It is characterized by including a step of injecting an etching solution, a step of inverting the front and back of the laminated body, and a step of injecting the etching solution into a second metal layer of the laminated body.

The etching method according to the embodiment of the present invention can appropriately include a washing step, a dehydration step, and the like in order to remove the etching solution.

The etching method of the present invention can be satisfactorily carried out by using the etching apparatus of the present invention.

According to the etching method according to the present embodiment, even when an ultrathin base material is used, it is possible to suppress defects due to insufficient strength of the base material during the etching process.

[Manufacturing method of printed wiring board]
The method for manufacturing a printed wiring board according to an embodiment of the present invention is characterized by including a step of forming a circuit pattern by the above etching method.
As a method for manufacturing a printed wiring board according to an embodiment of the present invention, the etching apparatus and the etching method of the present invention are adopted in the etching step of a metal layer in a known circuit pattern forming method such as a subtractive method and an additive method. be able to.

According to the method for manufacturing a printed wiring board according to the present embodiment, even when an ultrathin base material is used, it is possible to suppress defects due to insufficient strength of the base material during the etching process. This makes it possible to reduce defective products in the manufacture of printed wiring boards.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples as long as the gist thereof is not exceeded.

(Example 1)
An ultra-thin base material (thickness 15 μm, trade name “Glass Cloth # 1017”, manufactured by Nitto Boseki Co., Ltd.) has a copper foil (first metal layer) with a thickness of 12 μm on one side and a thickness on the other side. A copper-clad laminate (laminated body) having a 12 μm copper foil (second metal layer) (trade name “MCL-E700G U0.03”, manufactured by Hitachi Kasei Co., Ltd.) was prepared. Etching resist (trade name "Fotech H-9025", manufactured by Hitachi Kasei Co., Ltd.) is laminated on the prepared copper-clad laminate, and the pattern of the first layer of the composite pattern for the multilayer printed wiring board described in JIS C5012 is applied to one side. The pattern of the sixth layer of the composite pattern for the multilayer printed wiring board was printed on the other surface to prepare a developed substrate (baked circuit board).
After peeling the PET of the etching resist, a jig was installed on at least one pair of facing edges of the copper-clad laminate so as to apply tension to the copper-clad laminate. The jig used was separable and each of the separated jigs was equipped with a magnet having a different pole. The jig was installed so as to sandwich the copper-clad laminate after separation.
Next, the copper-clad laminate on which the jig was installed was transported by a transport belt. The line speed of transport by the transport belt was set to 0.8 m / min.
Next, the etching solution was sprayed onto the first metal layer by a spray nozzle (jet mechanism). The etching chemical solution was ferric chloride, and the solution temperature was 30 ° C. The etching conditions were carried out using a spray nozzle having a pump pressure of 0.08 MPa and an etching solution flow rate of 300 ml / min at a distance of 250 mm between the spray nozzle and the copper-clad laminate.
Next, the front and back of the copper-clad laminate were inverted.
Next, the etching solution was sprayed onto the second metal layer by a spray nozzle (jet mechanism). The etching chemical solution was ferric chloride, and the solution temperature was 30 ° C. The etching conditions were carried out using a spray nozzle having a pump pressure of 0.08 MPa and an etching solution flow rate of 300 ml / min at a distance of 250 mm between the spray nozzle and the copper-clad laminate.
Then, after undergoing a washing step and a dehydration step, the jig was removed from the copper-clad laminate to obtain a printed wiring board.

(Comparative Example 1)
A baked substrate was produced in the same manner as in Example 1.
The produced baked substrate was etched by an etching apparatus capable of simultaneously etching the first metal layer and the second metal layer. The spray nozzles installed above and below the etching apparatus were the same as in Example 1, and the etching conditions were also the same as in Example 1.
In Comparative Example 1, a printed wiring board was obtained by the same procedure as in Example 1 except for the etching step.

(Comparative Example 2)
A baked substrate was produced in the same manner as in Example 1.
The manufactured baked substrate is placed on a FR-4 substrate (trade name "MCL-67 t1.0", manufactured by Hitachi Kasei Co., Ltd.) that has been fully etched so that the first metal layer is on the upper surface. The four sides were attached and fixed with cellophane tape (trade name "Cellotape (registered trademark)", manufactured by Nichiban Co., Ltd.).
One surface of the fixed baked substrate was etched by an etching apparatus capable of etching one surface of the first metal layer. The spray nozzle installed in the etching apparatus was the same as in Example 1, and the etching conditions were also the same as in Example 1.
For the baked substrate on which the first metal layer has been etched, the cellophane tape on four sides is peeled off, and the copper foil is placed on the FR-4 substrate that has been fully etched so that the second metal layer is on the upper surface, and the four sides are cellophane. It was fixed with tape.
The fixed baked substrate was etched with a second metal layer by an etching apparatus capable of etching one surface. The spray nozzle installed in the etching apparatus was the same as in Example 1, and the etching conditions were also the same as in Example 1.
In Comparative Example 2, a printed wiring board was obtained by the same procedure as in Example 1 except for the etching step.

[Confirmation of effect]
In Example 1 and Comparative Examples 1 and 2, 10 layers of 510 mm × 510 mm were continuously charged and etched. At that time, the following items were evaluated in each example. The results are shown in Table 1.
<Defective rate>
After the etching treatment was completed, it was observed whether the substrate had defects such as curls, cracks, and breaks, and the defect rate was calculated from the number of sheets judged to be defective.
The criteria for judging that it is defective are shown below.
(1) Edge defect: When there is a crack or break of "10 mm or more" from the edge of the base material (2) In-plane defect: There are 10 cracks or breaks of "0.3 mm or more" in the surface of the base material. If there is more than <working time>
The time until the etching process of the 10 laminated bodies was completed was measured.

In Example 1, defects due to the etching process did not occur, and the working time was short, so that the product yield was good.
In Comparative Example 1, the defect rate was 100% because the shapes of all 10 substrates could not be maintained due to the liquid pressure of the etching solution in the etching process.
In Comparative Example 2, when the cellophane tape for fixing the baked substrate was peeled off, the base material was cracked, and the defect rate was 10%. Further, in Comparative Example 2, since it takes time to replace the cellophane tape, it takes a long time to work.

10 ... Laminated body 11 ... Base material 12 ... First metal layer 13 ... Second metal layer 14 ... Resist 20 ... Jig 20a ... Short jig 20b ... Long jig 30 ... Conveying belt 31 ... Fixed part 32 ... Groove 40 ... First etching Part 41 ... Injection mechanism 50 ... Inversion parts 51a, 51b ... Inversion member 60 ... Second etching part 61 ... Injection mechanism

Claims (9)

An etching apparatus for etching a laminate having a first metal layer on one surface and a second metal layer on the other surface having a thickness of 30 μm or less.
A jig installed so as to apply tension to the laminated body at at least one pair of facing edges of the laminated body, and a jig.
A transport belt for transporting the laminated body on which the jig is installed, and a transport belt.
A first etching portion for jetting an etching solution onto the first metal layer of the laminate,
An inversion part that inverts the front and back of the laminated body, and
An etching apparatus including a second etching portion for jetting an etching solution onto the second metal layer of the laminated body. The etching apparatus according to claim 1, wherein the jig holds and holds the laminated body in the laminated direction. The etching apparatus according to claim 1 or 2, wherein the jig has a shape that is plane-symmetrical with respect to the laminated body when installed on the laminated body. The etching apparatus according to any one of claims 1 to 3, wherein the transport belt includes a fixing portion for fixing the jig. The etching apparatus according to any one of claims 1 to 4, wherein the transport belt includes a groove into which the jig can be fitted. The first etching portion according to any one of claims 1 to 5, wherein the etching solution is jetted in a state where at least a part of the surface of the laminated body facing the first metal layer is in contact with the transport belt. The etching equipment described. The second etching portion according to any one of claims 1 to 6, wherein the etching solution is jetted in a state where at least a part of the surface of the laminated body facing the second metal layer is in contact with the transport belt. The etching equipment described. A step of preparing a laminate having a first metal layer on one surface of a substrate having a thickness of 30 μm or less and a second metal layer on the other surface.
A step of installing a jig on at least one pair of facing edges of the laminate so as to apply tension to the laminate.
The process of transporting the laminated body on which the jig is installed with a transport belt, and
The step of jetting the etching solution onto the first metal layer and
The step of inverting the front and back of the laminated body and
An etching method comprising a step of jetting an etching solution onto the second metal layer of the laminate. A method for manufacturing a printed wiring board, which comprises a step of forming a circuit pattern by the etching method according to claim 8.

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