JP7063224B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
- Publication number
- JP7063224B2 JP7063224B2 JP2018190659A JP2018190659A JP7063224B2 JP 7063224 B2 JP7063224 B2 JP 7063224B2 JP 2018190659 A JP2018190659 A JP 2018190659A JP 2018190659 A JP2018190659 A JP 2018190659A JP 7063224 B2 JP7063224 B2 JP 7063224B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- radiator
- semiconductor
- connecting member
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
12 :放熱器
16 :セラミック基板
20 :リードフレーム
24 :半導体チップ
28 :接続部材
32 :半導体チップ
36 :リードフレーム
40 :セラミック基板
44 :放熱器
50 :絶縁樹脂
60 :ヒートパイプ
Claims (1)
- 半導体モジュールであって、
第1放熱器と、
前記第1放熱器上に配置された第1半導体チップと、
前記第1半導体チップ上に配置されており、前記第1半導体チップの上面に接続された接続部材と、
前記接続部材上に配置されており、前記接続部材の上面に接続された第2半導体チップと、
前記第2半導体チップ上に配置されている第2放熱器と、
前記第1放熱器、前記第1半導体チップ、前記接続部材、前記第2半導体チップ、及び、前記第2放熱器の積層方向に沿って伸びており、前記第1放熱器、前記接続部材、及び、前記第2放熱器に接している複数のヒートパイプ、
を有しており、
複数の前記ヒートパイプが、前記第1半導体チップの4隅において前記第1半導体チップの側面に接しているとともに、前記第2半導体チップの4隅において前記第2半導体チップの側面に接している、
半導体モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018190659A JP7063224B2 (ja) | 2018-10-09 | 2018-10-09 | 半導体モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018190659A JP7063224B2 (ja) | 2018-10-09 | 2018-10-09 | 半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020061427A JP2020061427A (ja) | 2020-04-16 |
JP7063224B2 true JP7063224B2 (ja) | 2022-05-09 |
Family
ID=70220249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018190659A Active JP7063224B2 (ja) | 2018-10-09 | 2018-10-09 | 半導体モジュール |
Country Status (1)
Country | Link |
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JP (1) | JP7063224B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022054685A1 (ja) * | 2020-09-10 | 2022-03-17 | デンカ株式会社 | 積層体、放熱構造体及び半導体モジュール |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005303018A (ja) | 2004-04-13 | 2005-10-27 | Fuji Electric Holdings Co Ltd | 半導体装置 |
JP2009146950A (ja) | 2007-12-11 | 2009-07-02 | Denso Corp | 半導体装置およびその製造方法 |
WO2011043493A1 (ja) | 2009-10-08 | 2011-04-14 | 日本電気株式会社 | 半導体装置 |
US20170358556A1 (en) | 2016-06-13 | 2017-12-14 | Micron Technology, Inc. | Semiconductor device assembly with through-mold cooling channel formed in encapsulant |
JP2018101685A (ja) | 2016-12-20 | 2018-06-28 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
-
2018
- 2018-10-09 JP JP2018190659A patent/JP7063224B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005303018A (ja) | 2004-04-13 | 2005-10-27 | Fuji Electric Holdings Co Ltd | 半導体装置 |
JP2009146950A (ja) | 2007-12-11 | 2009-07-02 | Denso Corp | 半導体装置およびその製造方法 |
WO2011043493A1 (ja) | 2009-10-08 | 2011-04-14 | 日本電気株式会社 | 半導体装置 |
US20170358556A1 (en) | 2016-06-13 | 2017-12-14 | Micron Technology, Inc. | Semiconductor device assembly with through-mold cooling channel formed in encapsulant |
JP2018101685A (ja) | 2016-12-20 | 2018-06-28 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
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JP2020061427A (ja) | 2020-04-16 |
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