JP7044965B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP7044965B2
JP7044965B2 JP2017106159A JP2017106159A JP7044965B2 JP 7044965 B2 JP7044965 B2 JP 7044965B2 JP 2017106159 A JP2017106159 A JP 2017106159A JP 2017106159 A JP2017106159 A JP 2017106159A JP 7044965 B2 JP7044965 B2 JP 7044965B2
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Japan
Prior art keywords
light emitting
syringe
emitting device
manufacturing
nozzle
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JP2017106159A
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English (en)
Japanese (ja)
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JP2018200997A5 (cg-RX-API-DMAC10.html
JP2018200997A (ja
Inventor
直樹 桑村
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Nichia Corp
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Nichia Corp
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Priority to JP2017106159A priority Critical patent/JP7044965B2/ja
Publication of JP2018200997A publication Critical patent/JP2018200997A/ja
Publication of JP2018200997A5 publication Critical patent/JP2018200997A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2017106159A 2017-05-30 2017-05-30 発光装置の製造方法 Active JP7044965B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017106159A JP7044965B2 (ja) 2017-05-30 2017-05-30 発光装置の製造方法

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Application Number Priority Date Filing Date Title
JP2017106159A JP7044965B2 (ja) 2017-05-30 2017-05-30 発光装置の製造方法

Publications (3)

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JP2018200997A JP2018200997A (ja) 2018-12-20
JP2018200997A5 JP2018200997A5 (cg-RX-API-DMAC10.html) 2020-05-07
JP7044965B2 true JP7044965B2 (ja) 2022-03-31

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ID=64668288

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JP2017106159A Active JP7044965B2 (ja) 2017-05-30 2017-05-30 発光装置の製造方法

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JP (1) JP7044965B2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023037727A1 (cg-RX-API-DMAC10.html) * 2021-09-08 2023-03-16

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024011A (ja) 1999-07-05 2001-01-26 Hitachi Ltd 半導体装置の製造方法およびそれに使用されるポッティング装置
JP2005338251A (ja) 2004-05-25 2005-12-08 Seiko Epson Corp 光源装置及びプロジェクタ
JP2008126208A (ja) 2006-11-24 2008-06-05 Sharp Corp 塗布装置および塗布方法、モールド製品
JP2009182077A (ja) 2008-01-30 2009-08-13 Panasonic Corp ポッティング装置およびポッティング方法
JP2013521652A (ja) 2010-03-03 2013-06-10 クリー インコーポレイテッド 光学素子に光学材料を塗布するためのシステム及び方法
WO2014030342A1 (ja) 2012-08-21 2014-02-27 コニカミノルタ株式会社 Ｌｅｄ装置及びその製造方法
US20150226385A1 (en) 2014-02-11 2015-08-13 Cree, Inc. Systems and Methods for Application of Coatings Including Thixotropic Agents onto Optical Elements, and Optical Elements Having Coatings Including Thixotropic Agents

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620760B2 (ja) * 1989-10-03 1994-03-23 ローム株式会社 樹脂吐出装置
JPH1012642A (ja) * 1996-06-26 1998-01-16 Toshiba Corp 樹脂塗布方法およびその装置
KR100974925B1 (ko) * 2008-06-30 2010-08-10 서울반도체 주식회사 Ｌｅｄ 제조를 위한 현탁액 분배장치 및 분배방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024011A (ja) 1999-07-05 2001-01-26 Hitachi Ltd 半導体装置の製造方法およびそれに使用されるポッティング装置
JP2005338251A (ja) 2004-05-25 2005-12-08 Seiko Epson Corp 光源装置及びプロジェクタ
JP2008126208A (ja) 2006-11-24 2008-06-05 Sharp Corp 塗布装置および塗布方法、モールド製品
JP2009182077A (ja) 2008-01-30 2009-08-13 Panasonic Corp ポッティング装置およびポッティング方法
JP2013521652A (ja) 2010-03-03 2013-06-10 クリー インコーポレイテッド 光学素子に光学材料を塗布するためのシステム及び方法
WO2014030342A1 (ja) 2012-08-21 2014-02-27 コニカミノルタ株式会社 Ｌｅｄ装置及びその製造方法
US20150226385A1 (en) 2014-02-11 2015-08-13 Cree, Inc. Systems and Methods for Application of Coatings Including Thixotropic Agents onto Optical Elements, and Optical Elements Having Coatings Including Thixotropic Agents

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JP2018200997A (ja) 2018-12-20

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