JP7038534B2 - Manufacturing method of molded circuit parts and molded circuit parts - Google Patents

Description

The present invention relates to a method for manufacturing a molded circuit component and a molded circuit component.

In recent years, in electronic devices such as mobile phones and medical devices such as endoscopes, it is required to accommodate a circuit board inside or outside a housing due to miniaturization and multifunctionality. For example, a three-dimensional circuit board (MID) in which a circuit and a component mounting portion are formed on a three-dimensional substrate is known (see, for example, Patent Document 1). In this technique, a solder resist is formed so that a component mounting portion opens, and an electronic component is mounted on the component mounting portion by soldering to manufacture a three-dimensional circuit board (MID).

In addition, as a method for manufacturing molded parts, a resist coat film is formed on the surface of a molded product molded into a predetermined shape with a molding material containing a catalyst for electroless plating, and the molded product is irradiated with a laser to irradiate a laser irradiation site. While removing the resist coat film with, the surface of the molded product is cut and roughened at the same time, and then electroless plating is applied to the laser irradiation site of the molded product to manufacture molded parts with a metal pattern formed on the molded product. (See, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2016-139832 Japanese Unexamined Patent Publication No. 11-6073

By the way, in a molded circuit component having a three-dimensional structure, it is difficult to cover the conductive wiring with a solder resist like a printed wiring board of a flat plate, and it is difficult to secure the insulating property of the conductive wiring, prevent corrosion, and suppress the spread of solder. be. For this reason, in conventional molded circuit parts, a resist film is formed on a molded product having a three-dimensional structure by using a dipping method, a spray coating method, or the like. Since a contact portion for making a connection is required, it is necessary to selectively form the contact portion.

However, in the above-mentioned Patent Document 1, since the component mounting portion is selectively opened by performing exposure and development after forming a resist film on the entire surface by spray coating, exposure is performed if the three-dimensional shape is complicated. There was a problem that it could not be done.

Further, in Patent Document 2 described above, since the wiring is formed by forming a resist film on the entire surface of the molded product and performing laser and plating processing, the wiring is not covered with the resist, so that the wiring is external to the outside. In addition to being unable to secure the insulating property of the solder, there is a problem that the spread of the solder cannot be suppressed.

The present invention has been made in view of the above, and even if the three-dimensional shape is complicated, the present invention is to manufacture a molded circuit component capable of ensuring the insulating property of the conductive wiring, preventing corrosion, and suppressing the spread of solder. It is an object of the present invention to provide a method and a molded circuit component.

In order to solve the above-mentioned problems and achieve the object, the method for manufacturing a molded circuit component according to the present invention is the first method for a main body having a three-dimensional structure in which a plating catalyst is formed of a kneaded resin. A first laser step of activating the surface of the main body by one laser irradiation, a first plating step of forming a first conductive wiring portion by performing electroless plating, and at least the first conductivity. A resist step of forming a resist layer substantially entirely including a wiring portion, and a second laser step of removing a part of the resist layer by a second laser irradiation and at the same time activating the surface of the main body portion. It is characterized by including a second plating step of forming a second conductive wiring portion by performing electroless plating.

Further, in the method for manufacturing a molded circuit component according to the present invention, in the above invention, the second laser irradiation exceeds the first conductive wiring portion so as to include at least a part of the first conductive wiring portion. It is characterized by wrapping and irradiating.

Further, the molded circuit component according to the present invention includes a main body portion formed of a resin in which a plating catalyst is kneaded and having a three-dimensional structure, and a first conductive wiring portion provided on the surface of the main body portion. A resist portion having an opening in a part of the first conductive wiring portion and provided on the surface of the main body portion and the first conductive wiring portion, and a resist portion provided in the opening portion, the first one. A second conductive wiring portion provided in contact with the conductive wiring portion is provided.

According to the present invention, even if the three-dimensional shape is complicated, it is possible to secure the insulating property of the conductive wiring, prevent corrosion, and suppress the spread of solder.

FIG. 1 is a schematic diagram showing a schematic configuration of a molded circuit component according to the first embodiment of the present invention. FIG. 2 is a top view showing a schematic configuration of a molded circuit component according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. FIG. 4 is a flowchart illustrating a manufacturing process of a molded circuit component according to the first embodiment of the present invention. FIG. 5A is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 5B is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 5C is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 5D is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 5E is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 5F is a schematic diagram illustrating a process of a molded circuit component according to the first embodiment of the present invention. FIG. 6 is a partial cross-sectional view of a molded circuit component according to the second embodiment of the present invention. FIG. 7A is a cross-sectional view illustrating the process of the molded circuit component according to the second embodiment of the present invention. FIG. 7B is a cross-sectional view illustrating the process of the molded circuit component according to the second embodiment of the present invention. FIG. 7C is a cross-sectional view illustrating the process of the molded circuit component according to the second embodiment of the present invention. FIG. 8 is a partial cross-sectional view of a molded circuit component according to another embodiment of the present invention.

Hereinafter, embodiments for carrying out the present invention will be described in detail together with drawings. The present invention is not limited to the following embodiments. In addition, each figure referred to in the following description merely schematically shows the shape, size, and positional relationship to the extent that the content of the present invention can be understood. That is, the present invention is not limited to the shapes, sizes, and positional relationships exemplified in each figure. Further, in the following description, a molded circuit component used for a medical device at the tip of an endoscope or the like will be described as an example.

(Embodiment 1)
[Composition of molded circuit parts]
FIG. 1 is a schematic diagram showing a schematic configuration of a molded circuit component according to the first embodiment of the present invention. FIG. 2 is a top view showing a schematic configuration of a molded circuit component according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line III-III of FIG.

The molded circuit component 1 shown in FIGS. 1 to 3 is a first main body portion 2 formed of a resin in which a plating catalyst is kneaded and having a tapered three-dimensional structure, and a first main body portion 2 provided on the surface of the main body portion 2. The conductive wiring portion 3 of the above, and the resist layer 4 having an opening 31 in a part of the first conductive wiring portion 3 and provided on the surface of the main body portion 2 and the first conductive wiring portion 3, and the opening portion. A second conductive wiring portion 5 provided in 31 and provided in contact with the first conductive wiring portion 3 is provided.

[Manufacturing method of molded circuit parts]
Next, a method of manufacturing the molded circuit component 1 will be described.
FIG. 4 is a flowchart illustrating a manufacturing process of the molded circuit component 1. 5A to 5F are schematic views illustrating each process of the molded circuit component 1.

As shown in FIG. 4, first, the plating catalyst is formed of a kneaded resin, and the surface of the main body 2 is activated by the first laser irradiation with respect to the main body 2 having a three-dimensional structure. (Step S101). Specifically, the laser beam L100 irradiates the circuit forming portion of the main body portion 2. As a result, as shown in FIGS. 5A and 5B, the surface of the main body 2 irradiated with the laser is slightly removed, and the plating catalyst kneaded with the resin material is activated to enable plating. (Fig. 5A → Fig. 5B).

Subsequently, the first plating step of forming the first conductive wiring portion 3 by performing electroless plating on the main body portion 2 is executed (step S102). Specifically, the electroless plating is performed, for example, when the first conductive wiring portion 3 is formed of a copper coating, the main body portion 2 is immersed in an electroless copper plating solution. As a result, as shown in FIGS. 5B and 5C, the first conductive wiring portion 3 is formed on the surface of the main body portion 2 irradiated with the laser.

After that, a resist step of forming the resist layer 4 so as to include at least the first conductive wiring portion 3 is executed (step S103). Specifically, the resist layer 4 is coated with a resist resin by dipping or spraying. As a result, as shown in FIGS. 5C and 5D, the resist layer 4 is formed as a whole so as to include the first conductive wiring portion 3.

Subsequently, a second laser step of removing a part of the resist layer 4 by the second laser irradiation and at the same time activating the surface of the main body 2 is executed (step S104). Specifically, as shown in FIGS. 5D and 5E, the laser beam is irradiated so as to provide an opening 31 in the resist layer 4, which is a portion of the main body 2 that forms the second conductive wiring portion 5. .. In this case, the opening 31 of the main body 2 irradiated with the laser is slightly removed, and the plating catalyst kneaded with the resin material is activated to enable plating.

After that, the second plating step of forming the second conductive wiring portion 5 by performing electroless plating is executed (step S105). Specifically, the electroless plating is performed, for example, when the second conductive wiring portion 5 is formed of a copper coating, the main body portion 2 is immersed in an electroless copper plating solution. As a result, as shown in FIGS. 5E and 5F, a second conductive wiring portion 5 is formed in the opening portion 31 of the main body portion 2 irradiated with the laser.

According to the first embodiment of the present invention described above, even if the three-dimensional shape is complicated, it is possible to secure the insulating property of the first conductive wiring portion 3, prevent corrosion, and suppress the spread of solder.

Further, according to the first embodiment of the present invention, the component mounting portion and the connection portion with the external device can be selectively formed while covering the first conductive wiring portion 3 with the resist layer 4.

Further, according to the first embodiment of the present invention, by using the laser beam, it is possible to easily deal with a complicated three-dimensional shape that cannot be exposed by exposure, so that it is not necessary to manufacture an exposure mask. As a result, since the developing process can be omitted, the manufacturing can be simplified and the cost can be reduced.

Furthermore, according to the first embodiment of the present invention, the region of the opening 31 of the resist layer 4 and the region of the component mounting portion (second conductive wiring portion 5) can be made the same size. The wiring density can be increased.

(Embodiment 2)
Next, Embodiment 2 of the present invention will be described. A part of the first conductive wiring portion formed in the molded circuit component according to the second embodiment is exposed from the resist layer. Therefore, in the following, after explaining the configuration of the molded circuit component according to the second embodiment, the manufacturing method of the molded circuit component according to the second embodiment will be described. The same components as those of the molded circuit component 1 according to the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

[Composition of molded circuit parts]
FIG. 6 is a partial cross-sectional view of the molded circuit component according to the second embodiment. The molded circuit component 1a shown in FIG. 6 has an exposed portion 32 in which a part of the first conductive wiring portion 3 is exposed from the resist layer 4. The exposed portion 32 is formed by being exposed from the resist layer 4 by a predetermined distance (length) from the portion in contact with the second conductive wiring portion 5.

[Manufacturing method of molded circuit parts]
Next, a method of manufacturing the molded circuit component 1a will be described. The molded circuit component 1a executes the same process as the manufacturing process according to the first embodiment described above, and differs only in the second laser process. Therefore, in the following, only the second laser process will be described. 7A to 7C are cross-sectional views illustrating each process of the molded circuit component 1a.

As shown in FIGS. 7A and 7B, a part of the resist layer 4 is removed by the second laser irradiation, and at the same time, the surface of the main body 2 is activated. In this case, the second laser irradiation overlaps the first conductive wiring portion 3 so as to include at least a part of the first conductive wiring portion 3 and irradiates the resist layer 4 for a predetermined distance D1.

After that, as shown in FIG. 7C, the second plating step of forming the second conductive wiring portion 5 is executed by performing electroless plating. In this case, the electroless plating is immersed in the exposed surface of the first conductive wiring portion 3. As a result, since the first conductive wiring portion 3 and the second conductive wiring portion 5 are reliably and electrically connected, it is possible to prevent disconnection between the wirings and improve the yield and quality. ..

According to the second embodiment of the present invention described above, in the second laser step, the first conductive wiring portion 3 is provided so that the second laser irradiation includes at least a part of the first conductive wiring portion 3. Since the resist layer 4 is irradiated with the resist layer 4 for a predetermined distance D1 in an overlapping manner, it is possible to prevent disconnection between the wirings and improve the yield and quality.

(Other embodiments)
In the first and second embodiments described above, the first conductive wiring portion 3 and the second conductive wiring portion 5 are brought into contact with each other. For example, the first conductive wiring portion 3 and the second conductive wiring portion 5 are brought into contact with each other. It may be connected to and from by another member. For example, as shown in the molded circuit component 1b of FIG. 8, the first conductive wiring portion 3 and the second conductive wiring portion 5 may be connected by a connecting member 6 such as a solder or a bump.

In addition, various inventions can be formed by appropriately combining the plurality of components disclosed in the first and second embodiments of the present invention. For example, some components may be deleted from all the components described in the above-described first and second embodiments of the present invention. Further, the components described in the above-described first and second embodiments of the present invention may be appropriately combined.

Further, in the first and second embodiments of the present invention, the above-mentioned "part" and "layer" can be read as "means" and "circuit". For example, the first conductive wiring portion can be read as a first conductive wiring means or a first conductive wiring circuit.

In the description of the flowchart in the present specification, the context of the steps between the steps is clarified by using expressions such as "first", "after", and "continued", but in order to carry out the present invention. The order of the required steps is not uniquely defined by those representations. That is, the order of the processes in the flowchart described in the present specification can be changed within a consistent range.

Although some of the embodiments of the present application have been described in detail with reference to the drawings, these are examples, and various embodiments are described based on the knowledge of those skilled in the art, including the embodiments described in the disclosure column of the present invention. It is possible to carry out the present invention in another modified or improved form.

1,1a, 1b Molded circuit parts 2 Main body part 3 First conductive wiring part 4 Resist layer 5 Second conductive wiring part 6 Connection member 31 Opening part 32 Exposed part

Claims (3)

It is a manufacturing method of molded circuit parts.
The first laser step of activating the surface of the main body portion by irradiating the main body portion having a three-dimensional structure with the plating catalyst formed of the kneaded resin by the first laser irradiation.
The first plating process of forming the first conductive wiring part three-dimensionally by performing electroless plating, and
A resist step of forming a resist layer on substantially the entire surface so as to include at least the first conductive wiring portion.
A second laser step of removing a part of the resist layer by the second laser irradiation to expose the resin surface and at the same time activating the surface of the main body portion.
The second plating step of forming the second conductive wiring portion by performing electroless plating on the region from which the resist layer was removed in the second laser step, and the second plating step.
A method for manufacturing a molded circuit component, which comprises. The molding circuit according to claim 1, wherein the second laser irradiation overlaps and irradiates the first conductive wiring portion so as to include at least a part of the first conductive wiring portion. How to manufacture parts. The main body, which is made of smelted resin and has a three-dimensional structure, and the catalyst for plating
A first conductive wiring portion three-dimensionally provided on the surface of the main body portion,
A resist portion having an opening in a part of the first conductive wiring portion and provided on the surface of the main body portion and the first conductive wiring portion.
A second conductive wiring portion provided in the opening and provided in contact with the first conductive wiring portion, and a second conductive wiring portion.
Equipped with
A molded circuit component manufactured by the manufacturing method according to claim 1 or 2 .

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