TW201315304A - Printed circuit board and method of manufacturing the same - Google Patents

Abstract

Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes preparing a base substrate; forming a circuit layer including circuit patterns and a connection pad on the base substrate; forming a first solder resist layer formed on the base substrate and the circuit layer and having a first opening portion exposing the connection pad; and forming a second solder resist layer formed over the base substrate and the first solder resist layer and having a second opening portion exposing a portion of an upper surface of the connection pad.

Description

Printed circuit board and method of manufacturing same

The present invention relates to a printed circuit board and a method of fabricating the same.

With the current trend toward miniaturization, light weight, and high-performance development of electronic components, as disclosed in Japanese Patent Laid-Open Publication No. JP 11-163529, filed on Jun. The joint form is changed to a flip chip joint form.

Due to the high density composition within the semiconductor component, substrates for flip chip packaging also require high density.

Therefore, the bump pitch of the flip-chip substrate is continuously refined, and the quality characteristics of the solder photoresist become an important factor for forming fine bumps.

In particular, when using a fine bump pitch, the most important factor is the insulation reliability between the solder bump and the adjacent wire after the semiconductor component is fixed.

The present invention provides a printed circuit board and a method of fabricating the same that enhances the insulation reliability between the connection pads of the external connection ends and the circuit pattern.

According to a first embodiment of the present invention, a printed circuit board is provided, comprising a substrate, a circuit layer, a first solder resist layer and a second solder resist layer. The circuit layer includes a circuit pattern and a connection pad formed on a surface of the substrate. The first solder resist layer is formed on the substrate and the circuit layer, and the first solder resist layer is exposed The first opening of the connection pad is exited. The second solder resist layer is coated on the substrate and the circuit layer, and the second solder resist layer has a second opening portion exposing a portion of the upper surface of the connection pad.

The first opening portion may expose an upper surface of the connection pad and both sides.

The first opening portion may expose an upper surface and a side surface of the connection pad.

The first opening may expose an upper surface of the connection pad.

The first opening has a size larger than the second opening.

The printed circuit board may further include an external connection end formed in the second opening portion.

According to a second embodiment of the present invention, a method of manufacturing a printed circuit board is provided, the method comprising: preparing a substrate; forming a circuit layer on the substrate, the circuit layer comprising a plurality of circuit patterns and a connection pad; forming a first a solder resist layer on the substrate and the circuit layer, the first solder resist layer has a first opening portion, the first opening portion exposes the connection pad; and a second solder resist layer is formed on the substrate and the first solder resist layer, and the second The solder resist layer has a second opening portion that exposes a portion of the upper surface of the connection pad.

The forming the first solder resist layer may include: applying a solder photoresist on the substrate and the circuit layer; and patterning the solder photoresist to form a solder resist pattern such that the first solder resist layer forms the first opening portion The connection pads are exposed to form a first solder resist layer.

The step of forming a second solder resist layer may include: applying a solder photoresist on the substrate and the first solder resist layer; and patterning the solder photoresist to form a solder resist pattern such that the second solder resist layer forms a second The opening portion exposes a portion of the upper surface of the connection pad to form a second solder resist layer.

When the first solder resist layer is formed, the first opening portion may be formed to expose the connection pad The upper surface and the two sides.

When the first solder resist layer is formed, the first opening portion may be formed to expose the upper surface of the connection pad and a side surface.

When the first solder resist layer is formed, the first opening portion may be formed to expose the upper surface of the connection pad.

When the first solder resist layer is formed, the first opening portion may be formed to have a size larger than the second opening portion.

In the method of manufacturing a printed circuit board, the method further includes: forming an external connection end in the second opening after forming the second solder resist layer.

In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the exemplary embodiments,

The various features and advantages of the present invention are described more clearly in the description of the drawings.

Words used in the description of the present invention and the scope of the patent application should not be construed as being interpreted in the ordinary meaning or in the definition of the dictionary, but should be described in an optimal manner based on the concept that the inventor can appropriately define the term. The law is interpreted as having meaning and concepts related to the technical field of the present invention.

The objects, features, and advantages of the present invention will be further described in the following description. In the specification, the reference numerals are used to refer to the elements in the drawings, and the same reference numerals are used to indicate similar elements. In addition, if the detailed description of the related art of the present invention causes the focus of the present invention to be out of focus, The detailed description will be omitted from the manual. In the specification, the terms "first" and "second" are used to distinguish different components and are not intended to limit each component.

Hereinafter, a printed circuit board and a method of manufacturing the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Printed circuit board - first embodiment

1 is a cross-sectional view showing the structure of a printed circuit board in accordance with a first embodiment of the present invention.

As shown in FIG. 1 , the configuration of the printed circuit board 100 includes a substrate 110 , a circuit layer 120 , a first solder resist layer 130 , and a second solder resist layer 140 . The circuit layer 120 includes a circuit pattern 121 and is formed on one surface of the substrate 110 . The first soldering layer 130 is formed on the substrate 110 and the circuit layer 120, and the first solder resist layer 130 has a first opening portion (ie, the position of the numeral 131 in FIG. 6), and the first opening portion The connection pad 122 is exposed, the second solder resist layer 140 is coated on the substrate 110 and the first solder resist layer 130, and the second solder resist layer 140 has a second opening portion 141, and the second opening portion 141 exposes the connection pad 122. Part of the upper surface.

In this configuration, the printed circuit board 100 further includes an external connection end 150 formed in the second opening portion 141.

Here, the external connection end 150 may be a solder bump, but is not limited thereto.

In addition, the substrate 110 is a circuit board in which at least one circuit layer including the connection pads is formed on an insulating layer, and in an embodiment, the substrate 110 can be a printed circuit board. For convenience of explanation, Figure 1 shows a kind of omitting The specific structure of the internal circuit. However, it is well understood by those of ordinary skill in the art that in a general circuit board like substrate 110, at least one circuit layer is formed over the insulating layer.

The resin insulating layer can serve as an insulating layer. The resin insulating layer may be a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyamidamine, or a resin having a reinforcing material such as glass fiber or an inorganic filler impregnated therein, for example, like A prepreg, a photocurable resin, or other similar material, but the above is not intended to define an insulating layer.

The circuit layer 120 includes a connection pad 122 in which any conductive metal as a circuit can be applied, and copper is commonly used as a material for the circuit layer in the printed circuit board.

The first opening portion 131 may be formed to expose the upper surface of the connection pad 122 and both side surfaces.

The first opening portion 131 may have a size larger than the second opening portion 141.

The first opening portion 131 may be formed between the circuit pattern 121 and the connection pad 122. This means that the first opening portion 131 is formed between the circuit pattern 121 and the connection pad 122 such that the first opening portion 131 exposes all other surfaces except the surface where the connection pad 122 contacts the substrate 110.

The first solder resist layer 130 and the second solder resist layer 140 may be, for example, a solder resist ink, a solder resist film, an encapsulant, or other similar materials in the prior art. Composition, but not limited to this.

In addition, the first solder resist layer 130 and the second solder resist layer 140 may each be composed of the same or different materials.

If necessary, the exposed connection pads 122 may further include a surface treatment layer (not shown in FIG. 1) formed on the connection pads 122.

The material used as the surface treatment layer in any of the prior art can be used for the surface treatment layer herein, and is not particularly limited. However, the surface treatment layer can be, for example, electroplated gold, immersion gold plating, organic solderability preservative (OSP) or immersion tin plating, immersion silver plating, electroless nickel and immersion gold (ENIG), direct immersion. Direct immersion gold (DIG), hot air solder leveling (HASL) or other similar methods.

In the printed circuit board 100 according to the embodiment of the present invention, the formation of the first solder resist layer 130 prevents excessive development from occurring when the second opening portion 141 of the second solder resist layer 140 is formed, to avoid the circuit pattern 121 and the connection pad 122. A short circuit occurs between them to improve insulation reliability.

In addition, according to the printed circuit board 100 of the embodiment of the present invention, a printed circuit board having a solder resist having, for example, a minute-sized opening and a photoresist having a high degree of matching can be remarkably improved in manufacturing a fine bump pitch substrate. Insulation reliability.

Printed circuit board - second embodiment

2 is a cross-sectional view showing the structure of a printed circuit board in accordance with a second embodiment of the present invention.

In the structure of the second embodiment, the description of the same portions as those of the first embodiment will be omitted, and only the different portions of the two embodiments will be discussed.

As shown in FIG. 2, the structure of the printed circuit board 100 includes a substrate 110, a circuit layer 120, a first solder resist layer 130, and a second solder resist layer 140. Circuit The layer 120 includes a circuit pattern 121 and a connection pad 122 formed on one surface of the substrate 110. The first solder resist layer 130 is formed on the substrate 110 and the circuit layer 120, and the first solder resist layer 130 has a first opening portion exposing the connection pad 122 (ie, a position of the reference numeral 131 in FIG. 9). The second solder resist layer 140 is coated on the substrate 110 and the first solder resist layer 130, and the second solder resist layer 140 has a second opening portion 141 exposing a portion of the upper surface of the connection pad 122.

In this configuration, the first opening portion 131 may expose the upper surface and a side surface of the connection pad 122.

Here, the printed circuit board 100 may further include an external connection end 150 formed on the second opening portion 141.

The external connection end 150 can be a solder bump, but is not limited thereto.

Printed circuit board - third embodiment

Figure 3 is a cross-sectional view showing the structure of a printed circuit board in accordance with a third embodiment of the present invention.

In the structure of the third embodiment, the description of the same portions as those of the first embodiment will be omitted, and only the different portions of the two embodiments will be discussed.

As shown in FIG. 3, the structure of the printed circuit board 100 includes a substrate 110, a circuit layer 120, a first solder resist layer 130, and a second solder resist layer 140. The circuit layer 120 includes a circuit pattern 121 and a connection pad 122 formed on one surface of the substrate 110. The first solder resist layer 130 is formed on the substrate 110 and the circuit layer 120, and the first solder resist layer 130 has a first opening portion exposing the connection pad 122 (ie, the position of the reference numeral 131 in FIG. 12). The second solder resist layer 140 covers the substrate 110 and the first solder resist layer 130, and the second solder resist layer 140 has a second opening portion 141 exposing a portion of the upper surface of the connection pad 122.

In this configuration, the first opening portion 131 may expose the upper surface of the connection pad 122.

Here, the printed circuit board 100 may further include an external connection end 150 formed on the second opening portion 141.

The external connection end 150 can be a solder bump, but is not limited thereto.

Method of manufacturing printed circuit board - first embodiment

4 to 8 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

First, as shown in FIG. 4, a substrate 110 is prepared.

In this structure, the substrate 110 is a circuit board, wherein at least one circuit layer includes a connection pad formed on an insulation layer, and the substrate 110 can be a printed circuit board. For convenience of explanation, FIG. 4 illustrates a specific structure in which internal circuits are omitted. However, it is well understood by those of ordinary skill in the art that in a general circuit board like substrate 110, at least one circuit layer is formed over the insulating layer.

The resin insulating layer can serve as an insulating layer. The resin insulating layer may be a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyamidamine, or a resin having a reinforcing material such as glass fiber or an inorganic filler impregnated therein, for example, like Dip material, photo-curable resin, or other similar materials, but the above is not intended to define an insulating layer.

Next, as shown in FIG. 5, a circuit layer 120 having a circuit pattern 121 and a connection pad 122 is formed on the substrate 110.

Then, as shown in FIG. 6, a first solder resist layer 130 is formed on the substrate 110 and the circuit layer 120, and the first solder resist layer 130 has a connection pad exposed. The first opening portion 131 of 122.

More specifically, when the first solder resist layer 130 is formed, the solder photoresist is first applied to the substrate 110 and the circuit layer 120.

Thereafter, the solder resist is patterned to form a solder resist pattern such that the first opening portion 131 is formed to expose the connection pad 122, thereby forming the first solder resist layer 130.

Here, the solder resist layer may be composed of, for example, a solder resist ink, a solder resist film, an encapsulating material, or other similar materials in the prior art, but is not limited thereto.

Further, the solder resist layer may be patterned by an exposure process and a development process, but is not limited thereto.

Further, when the first solder resist layer 130 is formed, the first opening portion 131 may be formed to expose the upper surface and both side surfaces of the connection pad 122.

In other words, such a structure represents that the first opening portion 131 is formed between the circuit pattern 121 and the connection pad 122 such that the first opening portion 131 exposes all other surfaces except the surface where the connection pad 122 contacts the substrate 110.

Subsequently, as shown in FIG. 7, the second solder resist layer 140 is formed to cover the substrate 110 and the first solder resist layer 130. The second solder resist layer 140 has a second opening portion 141 that exposes a portion of the upper surface of the connection pad 122.

More specifically, when the second solder resist layer 140 is formed, the solder photoresist is first applied to the substrate 110 and the first solder resist layer 130.

Thereafter, the solder photoresist is patterned to form a solder resist pattern such that the second opening portion 141 is formed to expose a portion of the upper surface of the connection pad 122, from The second solder resist layer 140 is formed.

Meanwhile, when the first solder resist layer 130 is formed, the first opening portion 131 may be formed to have a size larger than the second opening portion 141.

Thereafter, as shown in FIG. 8, the external connection end 150 is formed in the second opening portion 141.

Here, the external connection terminal 150 may be a solder bump, but is not limited thereto.

In the printed circuit board 100 according to the embodiment of the present invention, the formation of the first solder resist layer 130 prevents excessive development from occurring when the second opening portion 141 of the second solder resist layer 140 is formed, to avoid the circuit pattern 121 and the connection pad 122. A short circuit occurs between them to improve insulation reliability.

In addition, the printed circuit board 100 according to the embodiment of the present invention can significantly improve the solder resist having, for example, a solder resist having a minute size opening and a highly correlated configuration with a matte solder when manufacturing a fine bump pitch substrate. Insulation reliability of printed circuit boards.

Method of manufacturing printed circuit board - second embodiment

9 to 11 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board according to a second embodiment of the present invention, which will be explained starting from the structure shown in Fig. 5.

In the structure of the second embodiment, the description of the same portions as those of the first embodiment will be omitted, and only the different portions of the two embodiments will be discussed.

As shown in FIG. 5, a circuit layer 120 including a circuit pattern 121 and a connection pad 122 is formed on the substrate 110.

Thereafter, as shown in FIG. 9, the first solder resist layer 130 is formed on the substrate. The first solder resist layer 130 has a first opening portion 131 exposing the connection pad 122 on the circuit layer 120 and the circuit layer 120.

Here, when the first solder resist layer 130 is formed, the first opening portion 131 may expose the upper surface and a side surface of the connection pad 122.

FIG. 9 illustrates the connection pad 122 as an example, and the first opening portion 131 exposes the right side surface of the connection pad 122, but is not limited thereto.

Hereinafter, the flow of the method of manufacturing the printed circuit board in FIGS. 10 and 11 is the same as that of the seventh and eighth drawings, and the detailed description thereof will be omitted.

As shown in FIG. 10, the second solder resist layer 140 is formed to cover the substrate 110 and the first solder resist layer 130. The second solder resist layer 140 has a second opening portion 141, and the second opening portion 141 is exposed on the connection pad 122. Part of the surface.

Thereafter, as shown in FIG. 11, the external connection end 150 is formed in the second opening portion 141.

Method of manufacturing printed circuit board - third embodiment

12 to 14 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board according to a third embodiment of the present invention, which will be explained starting from the structure shown in Fig. 5.

In the structure of the third embodiment, the description of the same portions as those of the first embodiment will be omitted, and only the different portions of the two embodiments will be discussed.

As shown in FIG. 5, a circuit layer 120 including a circuit pattern 121 and a connection pad 122 is formed on the substrate 110.

Thereafter, as shown in FIG. 12, a first solder resist layer 130 is formed on the substrate 110 and the circuit layer 120, and the first solder resist layer 130 has a first opening portion 131 exposing the connection pad 122.

Here, when the first solder resist layer 130 is formed, the first opening portion 131 may expose the upper surface of the connection pad 122.

FIG. 12 illustrates an example in which the first opening portion 131 exposes a portion of the upper surface of the connection pad 122, but may also include an example in which the first opening portion 131 exposes all surfaces of the connection pad 122.

Hereinafter, the flow of the method of manufacturing the printed circuit board in FIGS. 13 and 14 is the same as that of the seventh and eighth drawings, and the detailed description thereof will be omitted.

As shown in FIG. 13, the second solder resist layer 140 is formed to cover the substrate 110 and the first solder resist layer 130. The second solder resist layer 140 has a second opening portion 141, and the second opening portion 141 is exposed on the connection pad 122. Part of the surface.

Thereafter, as shown in Fig. 14, the external connection end 150 is formed in the second opening portion 141.

According to the printed circuit board of the present invention and the method of manufacturing the same, the first solder resist layer surrounding the circuit pattern is formed, and then the second solder resist layer exposing the connection pad is formed, thereby preventing the opening portion in the second solder resist layer from being formed At the time, excessive development occurs. Therefore, short circuit between the circuit pattern and the connection pads can be avoided, thereby improving insulation reliability.

In view of the above, the present invention has been described above by way of a preferred embodiment, but is not intended to limit the printed circuit board of the present invention and the method of manufacturing the same. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention.

Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Printed circuit board

110‧‧‧Substrate

120‧‧‧ circuit layer

121‧‧‧ circuit pattern

122‧‧‧Connecting mat

130‧‧‧First solder mask

131‧‧‧First opening

140‧‧‧Second solder mask

141‧‧‧second opening

150‧‧‧External connection

1 is a cross-sectional view showing the structure of a printed circuit board in accordance with a first embodiment of the present invention.

2 is a cross-sectional view showing the structure of a printed circuit board in accordance with a second embodiment of the present invention.

Figure 3 is a cross-sectional view showing the structure of a printed circuit board in accordance with a third embodiment of the present invention.

4 to 8 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

9 to 11 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board in accordance with a second embodiment of the present invention.

12 to 14 are cross-sectional views showing the flow of a method of manufacturing a printed circuit board in accordance with a third embodiment of the present invention.

100‧‧‧Printed circuit board

110‧‧‧Substrate

120‧‧‧ circuit layer

121‧‧‧ circuit pattern

122‧‧‧Connecting mat

130‧‧‧First solder mask

140‧‧‧Second solder mask

141‧‧‧second opening

150‧‧‧External connection

Claims (14)

A printed circuit board comprising: a substrate; a circuit layer having a plurality of circuit patterns and a connection pad, the circuit patterns and the connection pads being formed on a surface of the substrate; a first solder resist layer formed on On the substrate and the circuit layer, the first solder resist layer has a first opening portion, the first opening portion exposing the connection pad; and a second solder resist layer covering the substrate and the first And the second solder resist layer has a second opening portion exposing a portion of an upper surface of the connection pad. The printed circuit board of claim 1, wherein the first opening exposes an upper surface and both sides of the connection pad. The printed circuit board of claim 1, wherein the first opening exposes an upper surface and a side surface of the connection pad. The printed circuit board of claim 1, wherein the first opening exposes an upper surface of the connection pad. The printed circuit board of claim 1, wherein the first opening has a size that is larger than a size of the second opening. The printed circuit board of claim 1, further comprising an external connection end formed in the second opening. A method of manufacturing a printed circuit board, comprising: preparing a substrate; forming a circuit layer on the substrate, the circuit layer comprising a plurality of circuits a pattern and a connection pad; forming a first solder resist layer on the substrate and the circuit layer, the first solder resist layer having a first opening portion, the first opening portion exposing the connection pad; and forming a second A solder resist layer is coated on the substrate and the first solder resist layer, and the second solder resist layer has a second opening portion exposing a portion of an upper surface of the connection pad. The method of claim 7, wherein the forming the first solder resist layer comprises: applying a solder photoresist on the substrate and the circuit layer; and patterning the solder photoresist to form A solder resist pattern is formed such that the first opening portion is formed to expose the connection pad, thereby forming the first solder resist layer. The method of claim 7, wherein the forming the second solder resist layer comprises: applying a solder photoresist on the substrate and the first solder resist layer; and patterning the solder resist, And forming a solder resist pattern such that the second opening portion is formed to expose a portion of an upper surface of the connection pad, thereby forming the second solder resist layer. The method of claim 7, wherein when the first solder resist layer is formed, the first opening portion is formed to expose an upper surface and both side surfaces of the connection pad. The method of claim 7, wherein the first opening portion is formed to expose an upper surface and a side surface of the connection pad. The method of claim 7, wherein the first opening portion is formed to expose an upper surface of the connection pad when the first solder resist layer is formed. The method of claim 7, wherein the first opening portion is formed, and the first opening portion has a size larger than a size of the second opening portion . The method of claim 7, further comprising forming an external connection end in the second opening after forming the second solder resist layer.