JP7030057B2 - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
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- JP7030057B2 JP7030057B2 JP2018546798A JP2018546798A JP7030057B2 JP 7030057 B2 JP7030057 B2 JP 7030057B2 JP 2018546798 A JP2018546798 A JP 2018546798A JP 2018546798 A JP2018546798 A JP 2018546798A JP 7030057 B2 JP7030057 B2 JP 7030057B2
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- led module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/28—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating front of vehicle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/66—Details of globes or covers forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/28—Cover glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q2400/00—Special features or arrangements of exterior signal lamps for vehicles
- B60Q2400/30—Daytime running lights [DRL], e.g. circuits or arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Description
1 LEDモジュール
10 発光ダイオード
10S 均質マルチLED光源
11 封止材
11A,11B 封止材層
110 半透明組成物
110_a,110_b 半透明封止材の成分
111 金属粒子組成物
112 金属酸化物顔料組成物
113 染色組成物
12 容器
120 ベース
121 側壁
122 光出射開口
13 キャリア
2 デバイス
4 混合カップ
5 ドライバ
7 従来技術LEDモジュール
70S 個別的光源
40,41,42,43 方法のステップ
P LEDピッチ
Claims (14)
- キャリア上に配列された多数の発光ダイオード(LED)と、
前記LEDを覆う封止材と、
を含むLEDモジュールであり、
前記封止材が、半透明組成物及び金属酸化物顔料を有する第1封止材層と、第2封止材層とを含み、
前記第2封止材層が、半透明組成物と金属粒子組成物との混合物を含み、
前記金属粒子組成物が、前記第2封止材層を通過する光を散乱し、非活性時に当該LEDモジュールへ所望の色を与える金属顔料を含み、前記LEDに対して、当該LEDモジュールの非活性状態時に所望の隠蔽度を与え、当該LEDモジュールの活性状態時に所望の均質度を与え、
前記封止材が柔軟性である、
LEDモジュール。 - 請求項1に記載のLEDモジュールであり、
前記金属粒子組成物が、前記金属顔料に加えてさらに金属酸化物顔料を含む、
LEDモジュール。 - 請求項1に記載のLEDモジュールであり、
前記封止材を当該LEDモジュールを組み込み得るデバイスハウジングの色に一致させるように、前記金属粒子組成物が構成されている、LEDモジュール。 - 請求項1乃至3のうち何れか1項に記載のLEDモジュールであり、
前記封止材の前記半透明組成物が、可視光スペクトラムの1つ以上の特定領域の光を吸収するように選択されている、
LEDモジュール。 - 請求項1乃至4のうち何れか1項に記載のLEDモジュールであり、
発光構造体のRGBW配列を含む、LEDモジュール。 - 請求項1乃至5のうち何れか1項に記載のLEDモジュールであり、
前記封止材の半透明組成物がポリジメチルシロキサンを含む、
LEDモジュール。 - 請求項1乃至6のうち何れか1項に記載のLEDモジュールであり、
前記第2封止材層がさらに染色組成物を含む、
LEDモジュール。 - 請求項1乃至7のうち何れか1項に記載のLEDモジュールであり、
前記金属顔料がアルミニウム粒子及び/又は銀粒子を含む、
LEDモジュール。 - 請求項1乃至8のうち何れか1項に記載のLEDモジュールであり、
活性状態時の前記LEDにより生成される光の所望の均質度に基づいて、及び/又は非活性状態時の前記LEDの所望の隠蔽度に基づいて、前記第2封止材層中の前記金属粒子組成物の重量負荷が決定される、
LEDモジュール。 - 請求項1乃至9のうち何れか1項に記載のLEDモジュールであり、
前記金属粒子組成物の重量負荷が、前記第2封止材層の0.001 wt% と 0.5 wt%との間の範囲にある、
LEDモジュール。 - 請求項1乃至10のうち何れか1項に記載のLEDモジュールであり、
発光ダイオードを配列させたベースと、該ベースに隣接する側壁とにより画成され、光出射開口を形成する容器を含む、LEDモジュール。 - デバイスハウジング及び請求項1乃至11のうち何れか1項に記載の少なくとも1個のLEDモジュールを含むデバイスであり、
前記LEDモジュールが、前記デバイスハウジングの開口を通して光を出射するように配列され、
前記封止材の各組成物が、前記デバイスハウジングの色に従って選択されている、
デバイス。 - LEDモジュールの製造方法であって、
ベース及び側壁により画成される容器を提供するステップ;
前記容器の前記ベースに沿って多数のLEDを配列するステップ;
半透明組成物及び金属酸化物顔料を有する第1封止材層を前記容器内に注入して前記LEDを覆い、続いて前記第1封止材層を硬化させるステップ;
第2封止材層の半透明組成物と金属粒子組成物との相対的量を決定するステップ;
前記半透明組成物と前記金属粒子組成物とを含む第2封止材層混合物を準備するステップ;
前記第2封止材層混合物を前記容器内に注入し、続いて前記第2封止材層を硬化させるステップ;
を含み、
前記第2封止材層が柔軟性であり、
前記金属粒子組成物が、前記第2封止材層を通過する光を散乱し、非活性時に当該LEDモジュールへ所望の色を与える金属顔料を含み、前記LEDに対して、当該LEDモジュールの非活性状態時に所望の隠蔽度を与え、当該LEDモジュールの活性状態時に所望の均質度を与え、
製造方法。 - 請求項13に記載の製造方法であり、
所望の光均質度に基づいて、LEDピッチ及び/又は前記半透明組成物、前記金属酸化物顔料及び前記金属粒子組成物
の相対的比率を決定するステップ;
を含む製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16159568.1 | 2016-03-10 | ||
EP16159568 | 2016-03-10 | ||
PCT/EP2017/054725 WO2017153216A1 (en) | 2016-03-10 | 2017-03-01 | Led module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019511114A JP2019511114A (ja) | 2019-04-18 |
JP7030057B2 true JP7030057B2 (ja) | 2022-03-04 |
Family
ID=55527360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018546798A Active JP7030057B2 (ja) | 2016-03-10 | 2017-03-01 | Ledモジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190096954A1 (ja) |
EP (1) | EP3427308B1 (ja) |
JP (1) | JP7030057B2 (ja) |
KR (1) | KR102383556B1 (ja) |
CN (1) | CN108780831B (ja) |
WO (1) | WO2017153216A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD915632S1 (en) | 2013-11-15 | 2021-04-06 | 3Form, Llc | Baffle with reduced height |
USD959030S1 (en) | 2013-11-15 | 2022-07-26 | 3Form, Llc | Baffle with slit end |
USD917079S1 (en) | 2013-11-15 | 2021-04-20 | 3Form, Llc | Thin baffle |
USD916348S1 (en) * | 2013-11-15 | 2021-04-13 | 3Form, Llc | Light-weight lighting fixture |
US10889987B2 (en) | 2017-05-19 | 2021-01-12 | 3Form, Llc | Felt baffle with snap ends |
USD915631S1 (en) | 2014-11-14 | 2021-04-06 | 3Form, Llc | Baffle with closed ends |
USD915634S1 (en) | 2015-05-28 | 2021-04-06 | 3Form, Llc | Tall baffle |
DE102017130764B4 (de) * | 2017-12-20 | 2024-01-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Vorrichtung mit Halbleiterchips auf einem Primärträger und Verfahren zur Herstellung einer solchen Vorrichtung |
WO2020016041A1 (en) | 2018-07-17 | 2020-01-23 | Lumileds Holding B.V. | Lighting device comprising leds and reflection element |
US11353163B2 (en) * | 2018-12-13 | 2022-06-07 | Signify Holding B.V. | Lighting device with sparkle effect |
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2017
- 2017-03-01 CN CN201780016373.XA patent/CN108780831B/zh active Active
- 2017-03-01 WO PCT/EP2017/054725 patent/WO2017153216A1/en active Application Filing
- 2017-03-01 US US16/083,241 patent/US20190096954A1/en not_active Abandoned
- 2017-03-01 EP EP17707065.3A patent/EP3427308B1/en active Active
- 2017-03-01 KR KR1020187029204A patent/KR102383556B1/ko active IP Right Grant
- 2017-03-01 JP JP2018546798A patent/JP7030057B2/ja active Active
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EP3427308A1 (en) | 2019-01-16 |
KR102383556B1 (ko) | 2022-04-06 |
CN108780831B (zh) | 2022-01-11 |
CN108780831A (zh) | 2018-11-09 |
KR20180120755A (ko) | 2018-11-06 |
WO2017153216A1 (en) | 2017-09-14 |
EP3427308B1 (en) | 2024-04-03 |
JP2019511114A (ja) | 2019-04-18 |
US20190096954A1 (en) | 2019-03-28 |
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