CN101195700B - 发光二极管框体组成物及其制造方法 - Google Patents

发光二极管框体组成物及其制造方法 Download PDF

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CN101195700B
CN101195700B CN2006101608895A CN200610160889A CN101195700B CN 101195700 B CN101195700 B CN 101195700B CN 2006101608895 A CN2006101608895 A CN 2006101608895A CN 200610160889 A CN200610160889 A CN 200610160889A CN 101195700 B CN101195700 B CN 101195700B
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light emitting
emitting diode
frame body
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resin
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CN101195700A (zh
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汪秉龙
庄峰辉
陈家宏
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Harvatek Corp
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Harvatek Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Abstract

一种发光二极管框体组成物及其制造方法，其中框体为封罩结构，用以封盖蓝光发光芯片以形成发光二极管结构，而框体制造方法包括：首先均匀混合树脂、钛以及荧光粉，以构成框体的组成物，然后将组成物置入模具中进行热压模处理，以压制成框体。通过蓝光发光芯片所发出的蓝光激发框体的荧光粉以发出均匀的黄光，而后再与蓝光混合成白光，从而可大大改善发光二极管的白光发光颜色偏蓝的问题。

Description

发光二极管框体组成物及其制造方法
技术领域
本发明涉及发光二极管技术，特别涉及一种发光二极管框体制造技术。
背景技术
在发光二极管的发展初期，因为其发光亮度不足，因此通常仅应用于指示灯中，而近年来因为技术改善，其发光亮度不断提高，其应用领域也随之拓展，现已逐步应用于交通信号灯、探照灯、闪光灯、液晶显示器的背光源以及未来看好的照明市场中。
由于半导体材料及组成成份的不同，因此发光二极管可发出不同颜色的光线，如红光、蓝光、绿色、黄光以及白光等，其中白光发光二极管因可取代传统的灯具，而最受重视。
传统的白光发光二极管100如图1所示，其中支架103上设有蓝光发光芯片105，通过导线107、108与支架103电连接，以构成导电通路，蓝光发光芯片105表面上涂布有黄色荧光层104，框体101及框体底座102对应固设于支架103的两侧，以封盖蓝光发光芯片105，框体101顶面上开设有窗口106以便于光线透出。该发光二极管以蓝光发光芯片105所产生的蓝光为基础，再激发黄色荧光层104产生黄光，并通过混合蓝光及黄光的方式产生白光，然而，就框体101而言，其仅能够反射蓝光发光芯片105所发出的蓝光，蓝光发光芯片105无法通过框体101来产生黄光，因而对白光发光二极管100整体所发出白光颜色偏蓝现象毫无帮助，同时使得白光发光二极管100无法发挥最好的发光效果。因此，如何通过改良发光二极管的框体材料，来改善发光二极管发光颜色偏蓝的现象，便成为业者亟欲解决的问题。
发明内容
针对现有技术中的上述问题，本发明的主要目的在于提供一种用以改善发光二极管发光颜色偏蓝现象的发光二极管框体组成物及其制造方法。
为了实现上述目的，本发明提供了一种发光二极管框体组成物及其制造方法，其中框体为封罩结构，用以封盖蓝光发光芯片以形成发光二极管结构，而框体的制造方法包括：首先均匀混合树脂(环氧树脂或硅)、钛以及荧光粉，以构成框体的组成物，然后将组成物置入模具中进行热压模处理，以压制成框体。通过蓝光发光芯片所发出的蓝光激发框体的荧光粉以发出均匀的黄光，而后再与蓝光混合成白光。
附图说明
图1为传统发光二极管的结构图；
图2为本发明的发光二极管框体的制造流程图。
附图中，各标号所代表的部件列表如下：
101：框体                102：框体底座
103：支架                104：黄色荧光层
105：蓝光发光芯片        106：窗口
107、108：导线           201、202、203：步骤
具体实施方式
请参阅图2，其为发光二极管框体的制造流程图，该框体为装设于发光二极管四周的封罩结构。首先，在步骤201中，先提供树脂(环氧树脂或硅)、钛以及荧光粉，所述荧光粉优选为黄色荧光粉，其中树脂∶钛∶荧光粉的优选比例大约介于100∶10∶1～1∶1∶1之间，在步骤202中，均匀混合该树脂、钛以及荧光粉，以形成组成物，将组成物置入模具中进行热压模处理，以压制成框体，如步骤203所示。
按照图2中的制造流程所制作的发光二极管框体为含有荧光粉的封罩结构，用以封盖蓝光发光芯片，当蓝光发光芯片发出蓝光时，其不但可以经由顶面荧光层来激发出黄光，并且在蓝光发光芯片四周的任一方向上更可通过蓝光激发框体中的荧光粉来产生黄光。因此，在框体内部，蓝光芯片所发出的蓝光在各方向上均可激发出黄光，以与蓝光混光成白光，而不会有未与黄光混合的蓝光射出，由此可使黄蓝光比例维持一定，以减少白光的发光颜色偏蓝的情形发生。
以上所述仅为本发明的优选实施例，并非因此即限制本发明的专利范围，凡是在本发明特征范围内所作的其它等效变化或修饰，均应包括在本发明的专利范围内。

Claims (2)

1.一种发光二极管框体的组成物，所述组成物由树脂、钛以及黄色荧光粉组成，所述树脂∶钛∶黄色荧光粉的组成比例介于100∶10∶1～1∶1∶1之间，其中所述树脂为环氧树脂或硅中的任一种。
2.一种发光二极管框体的制造方法，所述框体为封罩结构，用以封盖所述发光二极管，所述制造方法包括下列步骤：
a)提供树脂、钛以及黄色荧光粉，其组成比例介于100∶10∶1～1∶1∶1之间，其中所述树脂为环氧树脂或硅中的任一种；
b)均匀混合所述树脂、钛及黄色荧光粉，以形成组成物；以及
c)将所述组成物进行热压模，以形成框体。
CN2006101608895A 2006-12-08 2006-12-08 发光二极管框体组成物及其制造方法 Expired - Fee Related CN101195700B (zh)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614172B2 (en) * 2000-02-02 2003-09-02 Industrial Technology Research Institute High efficiency white light emitting diode
CN1677695A (zh) * 2004-03-29 2005-10-05 宏齐科技股份有限公司 白光发光二极管单元

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614172B2 (en) * 2000-02-02 2003-09-02 Industrial Technology Research Institute High efficiency white light emitting diode
CN1677695A (zh) * 2004-03-29 2005-10-05 宏齐科技股份有限公司 白光发光二极管单元

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