JP7026143B2 - 蒸着装置 - Google Patents
蒸着装置 Download PDFInfo
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- JP7026143B2 JP7026143B2 JP2019565967A JP2019565967A JP7026143B2 JP 7026143 B2 JP7026143 B2 JP 7026143B2 JP 2019565967 A JP2019565967 A JP 2019565967A JP 2019565967 A JP2019565967 A JP 2019565967A JP 7026143 B2 JP7026143 B2 JP 7026143B2
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- evaporation source
- vapor deposition
- limiting plate
- deposition apparatus
- vapor
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- 238000000427 thin-film deposition Methods 0.000 title claims description 25
- 238000007740 vapor deposition Methods 0.000 claims description 139
- 238000001704 evaporation Methods 0.000 claims description 91
- 230000008020 evaporation Effects 0.000 claims description 91
- 239000000463 material Substances 0.000 claims description 77
- 230000007246 mechanism Effects 0.000 claims description 35
- 239000011364 vaporized material Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000009834 vaporization Methods 0.000 claims description 8
- 230000008016 vaporization Effects 0.000 claims description 8
- 239000010408 film Substances 0.000 description 38
- 238000010586 diagram Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010549 co-Evaporation Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Polarising Elements (AREA)
- Glass Compositions (AREA)
Description
上記蒸発源は、蒸着材料を収容し、上記蒸着材料を加熱する加熱機構を備える。
上記支持機構は、蒸着対象物を上記蒸発源に対向する位置で支持する。
上記制限板は、上記蒸発源と上記蒸着対象物の中点に対して上記蒸着対象物側に配置され、上記蒸着材料の飛散経路を制限する。
上記チャンバは、上記蒸発源、上記支持機構及び上記制限板を収容する。
上記支持機構は、上記チャンバに対して移動可能に構成されていてもよい。
図1は、本実施形態に係る蒸着装置100の構成を示す側面図であり、図2は、蒸着装置100の一部構成の斜視図である。以下の図において相互に直交する三方向をそれぞれX方向、Y方向及びZ方向とする。X方向及びY方向は例えば水平方向、Z方向は例えば鉛直方向である。
蒸着装置100の動作について説明する。図6乃至図8は蒸着装置100の動作を示す模式図である。
制限板104による効果について、比較例との比較の上で説明する。図9は、比較例に係る蒸着装置300を示す模式図である。同図に示すように、蒸着装置300は、蒸発源303及び制限板304を備える。蒸発源303は、蒸着材料を収容する収容箱311及びノズル313を備え、制限板304はノズル313の近傍に配置されている。
本実施形態に係る蒸着装置100の構成は上述のものに限られない。例えば、上記構成においては蒸発源103及び制限板104の位置はチャンバ101に対して固定され、支持機構102がチャンバ101に対して移動することによって成膜されるとした。
101…チャンバ
102…支持機構
103…蒸発源
104…制限板
111…収容箱
112…加熱機構
113…ノズル
S…蒸着対象物
M…マスク
R…蒸着材料
Claims (3)
- 蒸着材料を収容し、前記蒸着材料を加熱する加熱機構を備える蒸発源と、
蒸着対象物を前記蒸発源に対向する位置で支持する支持機構と、
前記蒸発源と前記蒸着対象物の中点に対して前記蒸発源側に配置されず前記蒸着対象物側に配置され、前記蒸発源から第1の角度範囲で蒸着材料が飛散して前記蒸着対象物に到達する領域であるストレート領域と、前記蒸発源から前記第1の角度範囲よりも広い第2の角度範囲で蒸着材料が飛散して前記蒸着対象物に到達する領域であるクロス領域とがほぼ一致するように、前記蒸着材料の飛散経路を制限する制限板と、
前記蒸発源、前記支持機構及び前記制限板を収容するチャンバと
を具備し、
前記蒸発源と前記制限板との相対位置は固定されており、前記蒸発源及び前記制限板と前記支持機構との相対位置が変化可能に、前記蒸発源及び前記制限板、又は前記支持機構が移動可能に構成され、
前記制限板は、前記蒸発源及び前記制限板、又は前記支持機構の移動方向に対して垂直な面に沿う板状部材であり、
前記蒸発源は、第1の蒸着材料を収容する第1の蒸発源と、第2の蒸着材料を収容する第2の蒸発源とを含み、
前記制限板は、前記第1の蒸発源及び前記第2の蒸発源を挟んで、前記移動方向に沿って対向して一対設けられ、該一対の制限板の間には制限板が位置しない
蒸着装置。 - 請求項1に記載の蒸着装置であって、
前記蒸発源と前記制限板は、互いの相対位置を維持したまま前記チャンバに対して移動可能に構成されている
蒸着装置。 - 請求項1に記載の蒸着装置であって、
前記蒸発源及び前記制限板は前記チャンバに対して固定され、
前記支持機構は、前記チャンバに対して移動可能に構成されている
蒸着装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019002738 | 2019-01-10 | ||
JP2019002738 | 2019-01-10 | ||
PCT/JP2019/035545 WO2020144894A1 (ja) | 2019-01-10 | 2019-09-10 | 蒸着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020144894A1 JPWO2020144894A1 (ja) | 2021-02-18 |
JP7026143B2 true JP7026143B2 (ja) | 2022-02-25 |
Family
ID=71521199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019565967A Active JP7026143B2 (ja) | 2019-01-10 | 2019-09-10 | 蒸着装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7026143B2 (ja) |
KR (1) | KR102372878B1 (ja) |
CN (1) | CN111684100B (ja) |
TW (1) | TWI816883B (ja) |
WO (1) | WO2020144894A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012156072A (ja) | 2011-01-28 | 2012-08-16 | Konica Minolta Holdings Inc | 真空蒸着装置、有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子 |
JP2012167309A (ja) | 2011-02-10 | 2012-09-06 | Canon Tokki Corp | 蒸着装置並びに蒸着方法 |
WO2014119452A1 (ja) | 2013-01-29 | 2014-08-07 | シャープ株式会社 | 蒸着ユニットおよび蒸着装置 |
WO2016171075A1 (ja) | 2015-04-22 | 2016-10-27 | シャープ株式会社 | 蒸着装置および蒸着方法 |
JP2017025347A (ja) | 2015-07-15 | 2017-02-02 | シャープ株式会社 | 蒸着方法及び蒸着装置 |
Family Cites Families (6)
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JP4570232B2 (ja) * | 2000-10-20 | 2010-10-27 | 株式会社アルバック | プラズマディスプレイ保護膜形成装置および保護膜形成方法 |
JP2009170200A (ja) * | 2008-01-15 | 2009-07-30 | Sony Corp | 表示装置の製造方法 |
KR101723348B1 (ko) * | 2013-06-21 | 2017-04-05 | 샤프 가부시키가이샤 | 유기 일렉트로 루미네센스 소자의 제조 방법 및 유기 일렉트로 루미네센스 표시 장치 |
JP6618183B2 (ja) * | 2015-03-10 | 2019-12-11 | AC Biode株式会社 | 二次電池並びに充電装置及び放電装置 |
CN106282930B (zh) * | 2015-06-26 | 2020-05-01 | 佳能特机株式会社 | 蒸镀装置 |
WO2018025637A1 (ja) | 2016-08-02 | 2018-02-08 | 株式会社アルバック | 真空蒸着装置 |
-
2019
- 2019-09-10 CN CN201980006665.4A patent/CN111684100B/zh active Active
- 2019-09-10 JP JP2019565967A patent/JP7026143B2/ja active Active
- 2019-09-10 WO PCT/JP2019/035545 patent/WO2020144894A1/ja active Application Filing
- 2019-09-10 KR KR1020207020857A patent/KR102372878B1/ko active IP Right Grant
- 2019-09-18 TW TW108133494A patent/TWI816883B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012156072A (ja) | 2011-01-28 | 2012-08-16 | Konica Minolta Holdings Inc | 真空蒸着装置、有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子 |
JP2012167309A (ja) | 2011-02-10 | 2012-09-06 | Canon Tokki Corp | 蒸着装置並びに蒸着方法 |
WO2014119452A1 (ja) | 2013-01-29 | 2014-08-07 | シャープ株式会社 | 蒸着ユニットおよび蒸着装置 |
WO2016171075A1 (ja) | 2015-04-22 | 2016-10-27 | シャープ株式会社 | 蒸着装置および蒸着方法 |
JP2017025347A (ja) | 2015-07-15 | 2017-02-02 | シャープ株式会社 | 蒸着方法及び蒸着装置 |
Also Published As
Publication number | Publication date |
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KR102372878B1 (ko) | 2022-03-08 |
TW202026448A (zh) | 2020-07-16 |
WO2020144894A1 (ja) | 2020-07-16 |
CN111684100B (zh) | 2022-09-27 |
KR20200105675A (ko) | 2020-09-08 |
JPWO2020144894A1 (ja) | 2021-02-18 |
TWI816883B (zh) | 2023-10-01 |
CN111684100A (zh) | 2020-09-18 |
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