JP7024937B2 - アレイ基板、表示パネル及び表示装置 - Google Patents
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- 239000010410 layer Substances 0.000 claims description 123
- 239000000758 substrate Substances 0.000 claims description 77
- 239000003990 capacitor Substances 0.000 claims description 60
- 239000010409 thin film Substances 0.000 claims description 14
- 239000011229 interlayer Substances 0.000 claims description 13
- 238000002161 passivation Methods 0.000 claims description 11
- 239000002096 quantum dot Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000002356 single layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
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- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
Description
本出願は、2018年3月28日に中国特許庁に提出された中国特許出願第201820433213.7号の優先権を主張し、その全ての内容が援用により本出願に取り込まれる。
前記第1TFTのドレイン電極と前記ピクセル電極とは、前記パッシベーション層の第1ビアホールを貫通して電気的に接続され、前記活性層と前記第1電極板とは、一体構造であり、前記ピクセル電極と前記第2電極板とは、一体構造である。
Claims (11)
- アレイ基板であって、
複数のピクセルユニットを含み、
各ピクセルユニットは、蓄積コンデンサを含み、前記蓄積コンデンサは、少なくとも3つの互いに平行である電極板を含み、
前記少なくとも3つの互いに平行である電極板は、第1電極板と、第2電極板と、第3電極板とを含み、
前記第1電極板は、前記第2電極板に電気的に接続され、前記第3電極板は、前記第1電極板と前記第2電極板の間に設置され、且つ前記第1電極板及び前記第2電極板は、それぞれ前記第3電極板と互いに対向する部分を有し、
前記各ピクセルユニットは、基板上に逐次設置された活性層と、ゲート電極絶縁層と、第1薄膜トランジスタTFTのゲート電極と、層間絶縁層と、同じ層に設置された第1TFTのソース電極と第1TFTのドレイン電極と、パッシベーション層と、ピクセル電極とを含み、
前記第1TFTのドレイン電極と前記ピクセル電極とは、前記パッシベーション層の第1ビアホールを貫通して電気的に接続され、
前記活性層と前記第1電極板とは、一体構造であり、
前記ピクセル電極と前記第2電極板とは、一体構造であり、
前記第3電極板と前記第1TFTのゲート電極とは、前記層間絶縁層の第2ビアホールを貫通して電気的に接続されることを特徴とするアレイ基板。 - 前記第1電極板及び前記第2電極板のうち少なくとも一つの前記第3電極板と互いに対向する部分は、前記第3電極板の方向に向かって屈曲することを特徴とする請求項1に記載のアレイ基板。
- 前記少なくとも3つの互いに平行である電極板は、第4電極板を更に含み、
前記第4電極板は、前記第1電極板に電気的に接続され、且つ前記第4電極板は、前記第1電極板と前記第3電極板の間に設置され、
前記第4電極板と前記第3電極板とは、互いに対向する部分を有することを特徴とする請求項1に記載のアレイ基板。 - 前記第3電極板と前記第1TFTのドレイン電極とは、同じ層に設置されることを特徴とする請求項1に記載のアレイ基板。
- 第2TFTと、データラインと、ゲートラインとを更に含み、
前記第2TFTのソース電極は、前記データラインに接続され、前記第2TFTのゲート電極は、前記ゲートラインに接続され、且つ前記第2TFTのソース電極と、前記第2TFTのドレイン電極と、前記第1TFTのソース電極と、前記第1TFTのドレイン電極とは、同じ層に設置され、前記第2TFTのゲート電極と前記第1TFTのゲート電極とは、同じ層に設置され、
前記第2TFTのドレイン電極と前記第1TFTのゲート電極とは、前記層間絶縁層の第3ビアホールを貫通して電気的に接続されることを特徴とする請求項1に記載のアレイ基板。 - 前記少なくとも3つの互いに平行である電極板が前記第1電極板に電気的に接続された第4電極板を更に含み、且つ前記第4電極板と前記第3電極板とが互いに対向する部分を有する場合、前記第4電極板と前記第1TFTのゲート電極とは、同じ層に設置されることを特徴とする請求項1に記載のアレイ基板。
- 前記第4電極板と前記第1電極板とは、前記ゲート電極絶縁層の第4ビアホールを貫通して電気的に接続されることを特徴とする請求項6に記載のアレイ基板。
- 前記パッシベーション層と前記ピクセル電極の間に平坦化層が設置されており、前記平坦化層と前記第3電極板との互いに対向する部分に溝が設置されており、前記第2電極板は、前記平坦化層上に蒸着され、前記第2電極板は、前記溝の箇所で屈曲を形成し、及び/又は、
前記基板と前記第3電極板との互いに対向する部分に突起が設置されており、前記第1電極板は、前記基板上に蒸着され、前記第1電極板は、前記突起の箇所で屈曲を形成することを特徴とする請求項1に記載のアレイ基板。 - アノードと、カソードと、前記アノードと前記カソードの間に設置された発光層とを更に含み、
前記ピクセル電極は、前記アノードであり、前記各ピクセルユニットの一側に前記発光層が設置されており、前記発光層は、有機発光層或いは量子ドット発光層であることを特徴とする請求項1に記載のアレイ基板。 - 請求項1乃至9のいずれか1項に記載のアレイ基板を含む表示パネル。
- 請求項10に記載の表示パネルを含む表示装置。
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CN201820433213.7 | 2018-03-28 | ||
CN201820433213.7U CN207909879U (zh) | 2018-03-28 | 2018-03-28 | 阵列基板、显示面板及显示装置 |
PCT/CN2018/111631 WO2019184321A1 (zh) | 2018-03-28 | 2018-10-24 | 阵列基板、显示面板及显示装置 |
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EP (1) | EP3780107A4 (ja) |
JP (1) | JP7024937B2 (ja) |
KR (1) | KR102201052B1 (ja) |
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CN207909879U (zh) * | 2018-03-28 | 2018-09-25 | 京东方科技集团股份有限公司 | 阵列基板、显示面板及显示装置 |
CN110649046B (zh) * | 2019-11-01 | 2022-11-25 | 京东方科技集团股份有限公司 | 像素结构及制作方法、阵列基板、显示面板 |
CN111063698B (zh) * | 2019-12-18 | 2022-11-08 | 京东方科技集团股份有限公司 | 有机发光二极管阵列基板及制作方法、显示面板和装置 |
CN111341814A (zh) | 2020-03-11 | 2020-06-26 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示面板的制作方法 |
CN111739896B (zh) * | 2020-07-01 | 2023-08-18 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板 |
CN115394237A (zh) * | 2021-05-21 | 2022-11-25 | 京东方科技集团股份有限公司 | 显示面板和显示装置 |
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- 2018-03-28 CN CN201820433213.7U patent/CN207909879U/zh active Active
- 2018-10-24 KR KR1020197015432A patent/KR102201052B1/ko active IP Right Grant
- 2018-10-24 EP EP18893327.9A patent/EP3780107A4/en active Pending
- 2018-10-24 WO PCT/CN2018/111631 patent/WO2019184321A1/zh unknown
- 2018-10-24 JP JP2019528880A patent/JP7024937B2/ja active Active
- 2018-10-24 US US16/475,335 patent/US11094766B2/en active Active
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US11094766B2 (en) | 2021-08-17 |
EP3780107A1 (en) | 2021-02-17 |
EP3780107A4 (en) | 2021-12-22 |
JP2021516353A (ja) | 2021-07-01 |
WO2019184321A1 (zh) | 2019-10-03 |
KR102201052B1 (ko) | 2021-01-11 |
KR20190113757A (ko) | 2019-10-08 |
CN207909879U (zh) | 2018-09-25 |
US20200227498A1 (en) | 2020-07-16 |
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