JP7021687B2 - Manufacturing method of adhesive tape for protecting semiconductor elements and adhesive tape for protecting semiconductor elements - Google Patents

Description

The present invention relates to an adhesive tape for protecting a semiconductor element and a method for manufacturing an adhesive tape for protecting a semiconductor element.

In response to the recent increase in the functionality of electronic devices and the expansion into mobile applications, the demand for higher density and higher integration of semiconductor devices is increasing, and the capacity and density of IC packages are increasing.

As a method for manufacturing these semiconductor devices, for example, the adhesive tape for semiconductor wafer processing described in Patent Document 1 is attached to a semiconductor wafer, and the outer peripheral side of the semiconductor wafer is fixed by wafer ring while dying saw. The semiconductor wafer is cut and separated (individualized) into individual semiconductor elements in a dicing step using the above, and then an expanding step is performed, and then a pickup step of picking up the separated semiconductor elements is performed, and then , This semiconductor element is transferred to a mounting process for mounting on a substrate (for example, a tape substrate, an organic hard substrate, etc.). The semiconductor element picked up by the mounting probe is mounted on the substrate in the mounting process, and then the underfill material is filled between the substrate and the semiconductor element to be bonded to the substrate. Then, the semiconductor device is manufactured by sealing the semiconductor element and the upper surface side of the substrate with a semiconductor encapsulant.

Here, by repeatedly carrying out this method for manufacturing a semiconductor device, a plurality of semiconductor elements are taken out from one semiconductor wafer, whereby a plurality of semiconductor devices are manufactured. Further, this repetition is carried out from one semiconductor wafer until no semiconductor element exists, and for example, the manufacturing of the semiconductor device may be carried over to the next day or later in the middle.

In this case, the production of the semiconductor device is discontinued while the semiconductor element remains on the semiconductor wafer, the expanding state is released, and the semiconductor wafer (semiconductor element) in the adhesive tape (substrate) for semiconductor wafer processing is released. The outer peripheral side may be stored or moved while being fixed by wafer ring. Then, on or after the next day, the manufacturing of the semiconductor device is restarted by carrying out the subsequent steps from the above-mentioned expanding step.

However, after releasing the expanding state, if the outer peripheral side of the semiconductor wafer in the adhesive tape for processing a semiconductor wafer is simply stored or moved in a cassette case or the like with the outer peripheral side fixed by a wafer ring, it depends on the storage condition. However, there is a problem that the semiconductor wafer (semiconductor element) is contaminated by external foreign substances such as dust and water vapor, and the reliability of the semiconductor device manufactured by using the semiconductor element is lowered due to this. there were.

It should be noted that such a problem is remarkably recognized in the large-sized semiconductor wafer as the semiconductor wafer becomes large in recent years and the number of semiconductor elements acquired from one semiconductor wafer increases. Will be.

Japanese Unexamined Patent Publication No. 2009-245989

The present invention is an adhesive tape for protecting a semiconductor element, which can store and move the semiconductor element by accurately suppressing or preventing contamination by external foreign matter while the outer peripheral side of the semiconductor element on the substrate is fixed by wafer ring. Another object of the present invention is to provide a method for manufacturing a semiconductor device protective adhesive tape for manufacturing such a semiconductor device protective adhesive tape.

Such an object is achieved by the present invention described in the following (1) to (4).
(1) Used to protect the semiconductor element in a laminate having a substrate, a semiconductor element fixed to the central portion of the substrate, and a wafer ring fixed to the edge of the substrate.
An adhesive tape for protecting a semiconductor element, which is composed of a laminated body including a sheet-shaped base material containing a resin material and an adhesive layer laminated on the base material.
The adhesive layer is formed on almost the entire surface of the base material, and the semiconductor element protective adhesive tape further includes a non-adhesive adhesive layer attached to a central portion excluding the edge portion of the adhesive layer. By that
It selectively has adhesiveness at the edge of the adhesive tape for protecting the semiconductor element.
The adhesive layer adheres to the wafer ring on the opposite side of the laminate to the substrate, so that the semiconductor element is sealed by the substrate, the wafer ring, and the adhesive tape for protecting the semiconductor element. Adhesive tape for protecting semiconductor devices.

( 2 ) The adhesive tape for protecting a semiconductor element according to ( 1 ) above, wherein the base material has a circular shape in a plan view.

(3) The adhesive tape for protecting a semiconductor element according to (1) or (2) above, wherein the substrate has a disk shape and the wafer ring has a cylindrical shape .

( 4 ) The method for manufacturing an adhesive tape for protecting a semiconductor element according to ( 1 ) above.
After preparing a sheet-shaped base material containing a resin material, the adhesive layer and the sticking layer are laminated in this order on almost the entire surface of the base material, respectively.
The adhesive tape for protecting a semiconductor element, which comprises a step of peeling the adhesive layer from the edge portion of the adhesive layer to form the adhesive layer attached to the central portion excluding the edge portion of the adhesive layer. Production method.

By attaching the adhesive tape for protecting the semiconductor element of the present invention to the side opposite to the substrate of the wafer ring, the semiconductor element is sealed in the sealed space formed by the substrate, the wafer ring and the adhesive tape for protecting the semiconductor element. be able to. Therefore, the semiconductor element can be stored and moved by accurately suppressing or preventing contamination by external foreign substances.

Further, the manufacturing of the semiconductor device can be restarted by a simple operation of peeling off the adhesive tape for protecting the semiconductor element from the wafer ring.

It is a vertical sectional view which shows an example of the semiconductor device manufactured using the adhesive tape for processing a wafer for semiconductors. It is a vertical sectional view for demonstrating the method of manufacturing the semiconductor device shown in FIG. 1 using the adhesive tape for processing a wafer for semiconductors. It is a vertical sectional view for demonstrating the method of manufacturing the semiconductor device shown in FIG. 1 using the adhesive tape for processing a wafer for semiconductors. It is a vertical sectional view which shows the embodiment of the adhesive tape for processing a wafer for semiconductors. It is a vertical cross-sectional view which shows the state in which the semiconductor element protection adhesive tape of this invention is adhered to the laminate which has the adhesive tape for processing a semiconductor wafer, the semiconductor wafer, and the wafer ring. It is a vertical sectional view which shows 1st Embodiment of the adhesive tape for protecting a semiconductor element of this invention. It is a vertical sectional view for demonstrating the method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. It is a vertical sectional view for demonstrating the method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. It is a vertical sectional view which shows the 2nd Embodiment of the adhesive tape for protecting a semiconductor element of this invention. It is a vertical sectional view for demonstrating the method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. It is a vertical sectional view which shows the 3rd Embodiment of the adhesive tape for protecting a semiconductor element of this invention. It is a vertical sectional view for demonstrating the method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. 11. It is a vertical sectional view for demonstrating the method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. 11. It is a vertical cross-sectional view which shows the state in which the semiconductor element protection adhesive tape of this invention is adhered to the laminate which has the adhesive tape for processing a semiconductor wafer, the semiconductor chip, and a wafer ring.

Hereinafter, the method for manufacturing the semiconductor element protective adhesive tape and the semiconductor element protective adhesive tape of the present invention will be described in detail.

First, prior to explaining the adhesive tape for protecting a semiconductor element of the present invention, the semiconductor device to which the present invention is applied will be described.

<Semiconductor device>
FIG. 1 is a vertical cross-sectional view showing an example of a semiconductor device manufactured by using an adhesive tape for processing a wafer for a semiconductor. In the following description, the upper side in FIG. 1 is referred to as "upper" and the lower side is referred to as "lower".

The semiconductor device 10 shown in FIG. 1 seals a semiconductor chip (semiconductor element) 20, an interposer (substrate) 30 that supports the semiconductor chip 20, a plurality of conductive bumps (terminals) 70, and a semiconductor chip 20. It has a mold portion (sealing portion) 17 for stopping.

The interposer 30 is an insulating substrate, and is made of various resin materials such as polyimide, epoxy, cyanate, and bismaleimide triazine (BT resin). The plan view shape of the interposer 30 is usually a quadrangle such as a square or a rectangle.

On the upper surface (one surface) of the interposer 30, for example, a terminal 41 made of a conductive metal material such as copper is provided in a predetermined shape.

Further, the interposer 30 is formed with a plurality of vias (through holes) (through holes) which are not shown so as to penetrate in the thickness direction thereof.

One end (upper end) of each bump 70 is electrically connected to a part of the terminal 41 via each via, and the other end (lower end) protrudes from the lower surface (the other surface) of the interposer 30. There is.

The portion of the bump 70 protruding from the interposer 30 has a substantially spherical shape (ball shape).

The bump 70 is made of a brazing material such as solder, silver brazing, copper brazing, and phosphor copper brazing as a main material.

Further, a terminal 41 is formed on the interposer 30. The terminal 21 of the semiconductor chip 20 is electrically connected to the terminal 41 via the connecting portion 81.

In this embodiment, as shown in FIG. 1, the terminal 21 is configured to protrude from the surface side formed on the semiconductor chip 20, and the terminal 41 is also configured to protrude from the interposer 30. ing.

Further, the gap between the semiconductor chip 20 and the interposer 30 is filled with an underfill material composed of various resin materials, and the cured product of the underfill material forms a sealing layer 80. .. The sealing layer 80 has a function of improving the bonding strength between the semiconductor chip 20 and the interposer 30, and a function of preventing foreign matter, moisture, and the like from entering the gap.

Further, on the upper side of the interposer 30, a semiconductor chip 20 and a molded portion 17 formed so as to cover the interposer 30 are composed of a cured product of a semiconductor encapsulating material, whereby the inside of the semiconductor device 10 is formed. In, the semiconductor chip 20 is sealed, and foreign matter, moisture, and the like are prevented from entering the semiconductor chip 20.

The semiconductor device 10 having such a configuration is manufactured as follows, for example, by a method for manufacturing a semiconductor device using an adhesive tape (dicing tape) for processing a wafer for semiconductors.

<Manufacturing method of semiconductor devices>
2 and 3 are vertical cross-sectional views for explaining a method of manufacturing the semiconductor device shown in FIG. 1 using an adhesive tape for processing a wafer for semiconductors. In the following description, the upper side in FIGS. 2 and 3 is referred to as "upper" and the lower side is referred to as "lower".

[1A] First, a semiconductor wafer processing adhesive tape 100 having a base material 4 and an adhesive layer 2 laminated on the upper surface of the base material 4 (hereinafter, may be simply referred to as “processing adhesive tape 100”). (See FIG. 2A).
A detailed description of the processing adhesive tape 100 will be given later.

[2A] Next, as shown in FIG. 2B, a processing adhesive tape 100 is placed on a dicer table (not shown), and the surface of the semiconductor wafer 7 on the side without the semiconductor chip is located at the center 122 thereof. Is placed on the adhesive layer 2 and lightly pressed to laminate (paste) the semiconductor wafer 7 (pasting step).

The semiconductor wafer 7 may be attached to the processing adhesive tape 100 in advance and then installed on the dicer table.

Further, as the semiconductor wafer 7, a wafer having a thickness of 100 μm or more and 600 μm or less is usually used.

[3A] Next, the outer peripheral portion 121 (edge portion) of the adhesive layer 2 is fixed by a cylindrical wafer ring 9, and then the semiconductor wafer 7 is cut using a dicing saw (blade) (not shown). The semiconductor chip 20 is obtained by dicing the semiconductor wafer 7 into pieces (individualization step; see FIG. 2C).

At this time, the processing adhesive tape 100 has a buffering action, and prevents cracking, chipping, etc. when cutting the semiconductor wafer 7.

Further, the cutting of the semiconductor wafer 7 using the blade is carried out so as to reach the middle of the base material 4 in the thickness direction as shown in FIG. 2 (c). As a result, the semiconductor wafer can be reliably separated.

At this time, for the purpose of preventing the dust generated when the semiconductor wafer 7 is cut from scattering, and further suppressing the semiconductor wafer 7 from being unnecessarily heated, the semiconductor wafer 7 is used. The semiconductor wafer 7 is cut while supplying cutting water to the wafer 7.

Further, as the wafer ring 9, a wafer ring 9 having a thickness of 1.0 mm or more and 1.5 mm or less is usually used.

[4A] Next, by applying energy to the adhesive layer 2 included in the processing adhesive tape 100, the adhesiveness of the adhesive layer 2 to the semiconductor wafer 7 is reduced (energy applying step).
As a result, the adhesive layer 2 and the semiconductor wafer 7 are separated from each other.

The method of applying energy to the adhesive layer 2 is not particularly limited, and examples thereof include a method of irradiating the adhesive layer 2 with energy rays, a method of heating the adhesive layer 2, and the like. Among them, the energy is applied to the adhesive layer 2. It is preferable to use a method of irradiating the wire from the base material 4 side of the adhesive tape 100 for processing.

Such a method is suitably used as a method for imparting energy because the semiconductor chip 20 does not need to undergo an unnecessary thermal history and energy can be relatively easily and efficiently applied to the adhesive layer 2. Be done.

Further, examples of the energy beam include ultraviolet rays, electron beams, particle beams such as ion beams, and combinations of two or more of these energy rays. Among these, it is particularly preferable to use ultraviolet rays. According to the ultraviolet rays, the adhesiveness of the adhesive layer 2 to the semiconductor wafer 7 can be efficiently lowered.

[5A] Next, the adhesive tape 100 for processing is radially stretched by an expanding device (not shown), and the fragmented semiconductor wafers 7 (semiconductor chips 20) are opened at regular intervals (expanding step; FIG. 2 (d). ), After that, the semiconductor chip 20 is pushed up using a needle or the like, and in this state, it is picked up by suction with a vacuum collet or air tweezers (pickup step; see FIG. 2 (e)). ..

[6A] Next, the picked up semiconductor chip 20 is passed from a vacuum collet or an air tweezers to a mounting probe or the like and turned upside down, and then, as shown in FIG. 3A, the terminal 21 included in the semiconductor chip 20 is provided. And the terminal 41 provided in the interposer 30 are placed on the interposer 30 so as to face each other via the solder bump 85 provided on the terminal 41. That is, the semiconductor chip (semiconductor element) 20 is placed on the interposer (board) 30 with the surface of the semiconductor chip 20 in contact with the processing adhesive tape 100 facing up.

[7A] Next, as shown in FIG. 3B, the interposer 30 and the semiconductor chip 20 are brought close to each other while heating the solder bump 85 interposed between the terminal 21 and the terminal 41.

As a result, the molten solder bump 85 comes into contact with both the terminal 21 and the terminal 41, and by cooling in this state, the connection portion 81 is formed, and as a result, the terminal 21 and the terminal are formed via the connection portion 81. 41 is electrically connected (mounting process; see FIG. 3 (c)).

[8A] Next, the gap formed between the semiconductor chip 20 and the interposer 30 is filled with an underfill material (sealing material) composed of various resin materials, and then the underfill material is filled. By curing, a sealing layer 80 composed of a cured product of the underfill material is formed (sealing layer forming step; see FIG. 3D).

[9A] Next, the semiconductor chip 20 is sealed by the interposer 30 and the mold portion 17 by forming a mold portion 17 on the upper side of the interposer 30 so as to cover the semiconductor chip 20 and the interposer 30. While stopping, the bump 70 electrically connected to a part of the terminal 41 via the via provided in the interposer 30 is formed so as to protrude from the lower side of the interposer 30 (see FIG. 3 (e)). ).

Here, for sealing by the mold portion 17, for example, a molding mold having an internal space corresponding to the shape of the mold portion 17 to be formed is prepared, and the semiconductor chip 20 and the interposer 30 arranged in the internal space are used. The internal space is filled with a semiconductor encapsulating material in the form of powder so as to cover the above. Then, in this state, the semiconductor encapsulating material is cured by heating to obtain a cured product of the semiconductor encapsulating material.

The semiconductor device 10 can be obtained by the method for manufacturing a semiconductor device having the above steps. More specifically, by repeatedly performing the steps [5A] to [9A] after performing the steps [1A] to [9A], a plurality of semiconductor devices 10 are collectively combined from one semiconductor wafer 7. Can be manufactured.

Hereinafter, the adhesive tape 100 for processing a wafer for semiconductors used in such a method for manufacturing a semiconductor device 10 will be described.

<Adhesive tape for processing wafers for semiconductors>
FIG. 4 is a vertical sectional view showing an embodiment of an adhesive tape for processing a wafer for a semiconductor. FIG. 5 is a vertical sectional view showing a state in which the semiconductor element protection adhesive tape of the present invention is adhered to a laminate having a semiconductor wafer processing adhesive tape, a semiconductor wafer, and a wafer ring. In the following description, the upper side in FIGS. 4 and 5 is referred to as "upper" and the lower side is referred to as "lower".

The processing adhesive tape 100 is composed of a laminated body including a base material 4 and an adhesive layer 2 laminated on the upper surface (one surface) of the base material 4. Hereinafter, the base material 4 and the adhesive layer 2 will be described.

The processing adhesive tape 100 has a function of reducing the adhesiveness of the adhesive layer 2 to the semiconductor wafer 7 by applying energy to the adhesive layer 2 included in the adhesive tape 100. Examples of the method of applying energy to the adhesive layer 2 include a method of irradiating the adhesive layer 2 with energy rays and a method of heating the adhesive layer 2. Among them, the semiconductor chip 20 has an unnecessary heat history. Since it is not necessary to pass through, a method of irradiating the adhesive layer 2 with energy rays is preferably used. Therefore, in the following, as the adhesive layer 2, the adhesive layer 2 whose adhesiveness is lowered by irradiation with energy rays will be described as a representative.

<Base material 4>
The base material 4 is mainly made of a resin material and has a function of supporting the adhesive layer 2 provided on the base material 4. Further, the purpose is to realize stretching of the adhesive tape 100 for processing using the expander in the step [5A] in the plane direction.

The resin material is not particularly limited, and for example, the same resin material as described in the base material 204 included in the adhesive tape 200 for protecting a semiconductor element described later can be used.

Further, the base material 4 preferably contains a conductive material having conductivity. By including such a conductive material, the conductive material can function as an antistatic agent, and the semiconductor chip 20 in the individualization step [3A] and the pickup step [5A] can be used. It is possible to accurately suppress or prevent the generation of static electricity.

As the conductive material, the same conductive material as described in the base material 204 included in the adhesive tape 200 for protecting a semiconductor element, which will be described later, can be used.

The average thickness of the base material 4 is not particularly limited, but is preferably 10 μm or more and 300 μm or less, more preferably 30 μm or more and 200 μm or less, and further preferably 80 μm or more and 200 μm or less. When the average thickness of the base material 4 is within this range, the dicing of the semiconductor wafer 7 in the step [3A] can be carried out with excellent workability.

Further, it is preferable that the surface of the base material 4 is exposed with functional groups such as hydroxyl groups and amino groups having reactivity with the constituent materials contained in the pressure-sensitive adhesive layer 2.

Further, the base material 4 may be composed of a laminated body (multilayer body) in which a plurality of layers made of different resin materials are laminated. Further, it may be composed of a blend film obtained by dry-blending the resin material.

<Adhesive layer>
The adhesive layer 2 has a function of adhering and supporting the semiconductor wafer 7 when dicing the semiconductor wafer 7 in the step [3A]. Further, the adhesive layer 2 is in a state where the adhesiveness to the semiconductor wafer 7 is lowered by applying energy to the adhesive layer 2, whereby peeling can easily occur between the adhesive layer 2 and the semiconductor wafer 7. Is to be.

The adhesive layer 2 having such a function is composed of a resin composition containing (1) a base resin having adhesiveness and (2) a curable resin that cures the adhesive layer 2 as a main material.

Hereinafter, each component contained in the resin composition will be described in sequence.
(1) Base Resin The base resin has adhesiveness and is contained in the resin composition in order to impart adhesiveness to the semiconductor wafer 7 to the adhesive layer 2 before irradiating the adhesive layer 2 with energy rays. It is something that can be done.

The base resin is not particularly limited, and for example, the same base resin as that described in the adhesive layer 202 included in the adhesive tape 200 for protecting a semiconductor element described later can be used.

(2) Curable Resin The curable resin has, for example, curability that can be cured by irradiation with energy rays. As a result of the base resin being incorporated into the crosslinked structure of the curable resin by this curing, the adhesive strength of the adhesive layer 2 is reduced.

The curable resin is not particularly limited, and for example, the same curable resin as described in the adhesive layer 202 included in the adhesive tape 200 for protecting a semiconductor element described later can be used.

The curable resin is preferably blended in an amount of 5 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the base resin, more preferably 10 parts by weight or more and 300 parts by weight or less, and 20 parts by weight or more. It is more preferably blended in an amount of 200 parts by weight or less. By adjusting the blending amount of the curable resin as described above, the pick-up property of the semiconductor chip 20 in the step [5A] can be improved.

(3) Photopolymerization Initiator Further, the adhesive layer 2 is deteriorated in adhesiveness to the semiconductor wafer 7 by irradiation with energy rays, but when ultraviolet rays or the like are used as the energy rays, the curable resin is used. , It is preferable to contain a photopolymerization initiator in order to facilitate the initiation of polymerization of the curable resin.

The photopolymerization initiator is not particularly limited, and for example, the same photopolymerization initiator as described in the pressure-sensitive adhesive layer 202 included in the adhesive tape 200 for protecting a semiconductor element described later can be used.

The photopolymerization initiator is preferably blended in an amount of 0.1 parts by weight or more and 50 parts by weight or less, and more preferably 0.5 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the base resin. .. By adjusting the blending amount of the photopolymerization initiator as described above, the pick-up property of the semiconductor chip 20 becomes suitable.

(4) Cross-linking agent Further, the curable resin may contain a cross-linking agent. The inclusion of the cross-linking agent improves the curability of the curable resin.

The cross-linking agent is not particularly limited, but for example, the same cross-linking agent as described in the pressure-sensitive adhesive layer 202 included in the adhesive tape 200 for protecting semiconductor elements described later can be used.

The cross-linking agent is preferably blended in an amount of 0.01 parts by weight or more and 50 parts by weight or less with respect to 100 parts by weight of the base resin, and more preferably 5 parts by weight or more and 50 parts by weight or less. By adjusting the blending amount of the cross-linking agent as described above, the pick-up property of the semiconductor chip 20 becomes suitable.

(5) Conductive material (antistatic agent)
Further, it is preferable that the resin composition constituting the pressure-sensitive adhesive layer 2 contains a conductive material having conductivity. By including such a conductive material, the conductive material can function as an antistatic agent, and the semiconductor chip 20 in the individualization step [3A] and the pickup step [5A] can be used. The generation of static electricity is accurately suppressed or prevented.

The conductive material is not particularly limited as long as it has conductivity, but the same conductive material as described in the base material 204 included in the adhesive tape 200 for protecting semiconductor elements described later can be used. ..

When one of the base material 4 and the adhesive layer 2 contains the conductive material, it is preferable that the base material 4 contains the conductive material. As a result, it is possible to more accurately suppress or prevent the generation of static electricity in the semiconductor chip 20 without reliably adhering the conductive material to the semiconductor chip 20.

(6) Other components Further, in the resin composition constituting the pressure-sensitive adhesive layer 2, a pressure-sensitive adhesive, an antiaging agent, and a pressure-sensitive adhesive are added as other components in addition to the above-mentioned components (1) to (5). , At least one of a filler, a colorant, a flame retardant, a softener, an antioxidant, a plasticizer, a surfactant and the like may be contained.

The tackifier is not particularly limited, and for example, rosin resin, terpene resin, kumaron resin, phenol resin, aliphatic petroleum resin, aromatic petroleum resin, and aliphatic aromatic copolymerized petroleum. Examples thereof include resins, and one or more of these can be used in combination.

The average thickness of the adhesive layer 2 is not particularly limited, but is preferably 1 μm or more and 30 μm or less, more preferably 5 μm or more and 30 μm or less, and further preferably 10 μm or more and 20 μm or less. By setting the average thickness of the adhesive layer 2 within such a range, the adhesive layer 2 exhibits good adhesive force before the energy is applied to the adhesive layer 2, and after the energy is applied to the adhesive layer 2. , Exhibits good peelability between the adhesive layer 2 and the semiconductor wafer 7.

The adhesive layer 2 may be composed of a laminated body (multilayer body) in which a plurality of layers composed of different resin compositions are laminated.

In the method for manufacturing a semiconductor device using the semiconductor wafer processing adhesive tape 100 as described above, as described above, after performing the steps [1A] to [9A], the steps [5A] to [9A] are performed. By repeating this process, a plurality of semiconductor devices 10 are manufactured from one semiconductor wafer 7.

In this case, in order to carry over the production of the plurality of semiconductor devices 10 from one semiconductor wafer 7 to the next day or later on the way, the semiconductor device 10 is manufactured while the semiconductor chip 20 remains on the semiconductor wafer 7. Is cut off, the expanding state is released, and the processing adhesive tape 100 is fixed by the wafer ring 9 on the outer peripheral portion 121 side of the semiconductor wafer 7 (semiconductor chip 20), that is, the processing adhesive tape 100 (substrate). ), The semiconductor wafer 7 (semiconductor chip 20), and the laminate 150 having the wafer ring 9 may be stored and further moved. Then, for example, by carrying out the subsequent step from the expanding step in the above-mentioned step [5A] on or after the next day, the production of the semiconductor device 10 is restarted.

However, after the expanding state is released, if the processing adhesive tape 100 is simply stored in the cassette case or the like in the state of the laminate 150 in which the processing adhesive tape 100 is fixed by the wafer ring 9 on the outer peripheral portion 121 side of the semiconductor wafer 7, the storage thereof is performed. Depending on the situation, the semiconductor wafer 7 (semiconductor chip 20) may be contaminated by external foreign matter such as dust and water vapor, and as a result, the reliability of the semiconductor device 10 manufactured by using the semiconductor chip 20 may be contaminated. There was a problem that it decreased.

On the other hand, in the present invention, it is composed of a laminated body including a sheet-shaped base material 204 containing a resin material and an adhesive layer 202 laminated on the base material 204, and an edge portion of the laminated body. In the above, a semiconductor element protective adhesive tape 200 (hereinafter, may be simply referred to as “protective adhesive tape 200”) having adhesiveness selectively is prepared. Then, the protective adhesive tape 200 is adhered to the wafer ring 9 with the adhesiveness of the adhesive layer 202 on the side opposite to the processing adhesive tape 100 of the laminate 150. As a result, the sealed space 250 is formed by the processing adhesive tape 100, the wafer ring 9, and the protective adhesive tape 200, and as a result, the semiconductor wafer 7 (semiconductor chip 20) is sealed in the closed space 250. (See FIG. 5). Since the semiconductor wafer 7 (semiconductor chip 20) can be stored in the cassette case or the like in the sealed space 250 in this way, the semiconductor wafer 7 is caused by external foreign matter such as dust and water vapor. It is possible to accurately suppress or prevent the (semiconductor chip 20) from being contaminated. Therefore, the reliability of the semiconductor device 10 manufactured by using the semiconductor chip 20 can be improved.

Then, for example, after the next day, the semiconductor device 10 is performed by performing the simple operation of peeling the protective adhesive tape 200 from the wafer ring 9 and then the expanding step in the above-mentioned step [5A]. Production can be resumed.

Hereinafter, the adhesive tape 200 for protecting the semiconductor element will be described.
<Adhesive tape for protecting semiconductor elements>
<< First Embodiment >>
FIG. 6 is a vertical sectional view showing a first embodiment of the adhesive tape for protecting a semiconductor element of the present invention. In the following description, the upper side in FIG. 6 is referred to as "upper" and the lower side is referred to as "lower".

In the present embodiment, the protective adhesive tape 200 includes a disk-shaped base material 204 containing a resin material and an adhesive layer 202 formed by laminating almost the entire upper surface (one side) of the base material 204. , It is composed of a laminated body including a sticking layer 205 formed by laminating (sticking) on a central portion excluding the edge portion of the upper surface of the adhesive layer 202. That is, in the protective adhesive tape 200 of the present embodiment, the adhesive layer 202 is formed on almost the entire surface of the base material 204, and the protective adhesive tape 200 is further formed on the central portion excluding the edge portion of the adhesive layer 202. The pasted layer 205 is provided.

By adopting the protective adhesive tape 200 in such a configuration, in a laminated body including the base material 204 and the adhesive layer 202 laminated on the base material 204, the adhesive is selectively adhered at the edge of the laminated body. The sex is demonstrated. Therefore, the protective adhesive tape 200 can be attached to the wafer ring 9 with the adhesiveness at the edge portion.

Hereinafter, these base materials 204, the adhesive layer 202, and the sticking layer 205 will be described.
In the protective adhesive tape 200, in the present embodiment, the adhesive layer 202 has a function of reducing the adhesiveness of the adhesive layer 202 to the wafer ring 9 by applying energy, whereby the semiconductor is used. By applying energy when the production of the apparatus 10 is restarted, the adhesiveness of the adhesive layer 202 can be lowered and the protective adhesive tape 200 can be easily peeled off.

Examples of the method of applying energy to the adhesive layer 202 include a method of irradiating the adhesive layer 202 with energy rays and a method of heating the adhesive layer 202. Among them, the semiconductor chip 20 has an unnecessary heat history. Since it is not necessary to pass through, a method of irradiating the adhesive layer 202 with energy rays is preferably used. Therefore, in the following, as the adhesive layer 202, a layer whose adhesiveness is lowered by irradiation with energy rays will be described as a representative.

<Base material 204>
The base material 204 is mainly made of a resin material and has a function of supporting the adhesive layer 202 and the sticking layer 205 provided on the base material 204. The base material 204 has a disk shape as a whole, that is, a circular shape in a plan view.

The resin material is not particularly limited, and is, for example, low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, polyethylene such as ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, and homozygous. Polypropylene such as polyprolene, polyvinyl chloride, polybutene, polybutadiene, polymethylpentene, polyolefin resin (olefin polymer) such as polyisobutylene, ethylene-vinyl acetate copolymer, zinc ion cross-linking body, sodium ion cross-linking body Ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-hexene Like olefin copolymers such as copolymers, polyester resins (esters polymers) such as polyethylene terephthalates, polyethylene naphthalates, polybutylene terephthalates, and polybutylene naphthalates, polyurethanes, polyimides, polyamides, and polyether ether ketones. Polyether-based thermoplastic elastomers such as polyether ketones, polyether sulfones, polystyrenes, fluororesins, silicone resins, cellulose-based resins, styrene-based thermoplastic elastomers (styrene-based polymers), and polypropylene-based thermoplastic elastomers (olefin-based highs). Polymers), acrylic resins, polyester-based thermoplastic elastomers, polyvinylisoprenes, polycarbonates (carbonate-based polymers) and other thermoplastic resins, and mixtures of these thermoplastic resins are used. Among them, ester polymers and styrene-based high-grade products are used. It is preferably a copolymer containing a molecule, an olefin polymer, a carbonate polymer, an ionomer, or at least one of these polymers.

Since these resin materials are materials capable of transmitting energy rays such as light (visible light, near infrared rays, ultraviolet rays), X-rays, and electron beams, the energy rays are transmitted from the base material 204 side to the base material 204. It can be preferably used when irradiating the adhesive layer 202. Therefore, when the production of the semiconductor device 10 is restarted, the adhesive layer 202 is irradiated with energy rays from the base material 204 side to reduce the adhesiveness of the adhesive layer 202 and easily peel off the protective adhesive tape 200. be able to.

In particular, as the resin material, it is preferable to use a mixture of polypropylene and an elastomer, or a mixture of polyethylene and an elastomer.

The elastomer is a block copolymer (styrene-isoprene block copolymer: SIS) composed of a polystyrene segment represented by the following general formula (1) and a vinyl polyisoprene segment represented by the following general formula (2). ) Is preferable.

（一般式（１）中、ｎは２以上の整数を表す。）

(In the general formula (1), n represents an integer of 2 or more.)

（一般式（２）中、ｎは２以上の整数を表す。）

(In the general formula (2), n represents an integer of 2 or more.)

Further, the base material 204 preferably contains a conductive material having conductivity. By including such a conductive material, the conductive material exerts a function as an antistatic agent, and when the protective adhesive tape 200 is peeled off, static electricity is generated in the wafer ring 9 and thus the semiconductor chip 20. It can be accurately suppressed or prevented.

The conductive material is not particularly limited as long as it has conductivity, and examples thereof include a surfactant, a permanent antistatic polymer (IDP), a metal material, a metal oxide material, and a carbon-based material. And one or more of these can be used in combination.

Among these, examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants.

As the permanent antistatic polymer (IDP), for example, all IDPs such as a polyether and a polyolefin block polymer series, a polyester amide series, a polyester amide, a polyether ester amide, and a polyurethane series can be used.

Examples of the metal material include gold, silver, copper, silver-coated copper, nickel and the like, and these metal powders are preferably used.

Examples of the metal oxide material include indium tin oxide (ITO), indium oxide (IO), antimontin oxide (ATO), indium zinc oxide (IZO), tin oxide (SnO ₂ ), zinc oxide (ZnO), and the like. These metal oxide powders are preferably used.

Further, examples of the carbon-based material include carbon black, single-walled carbon nanotubes, carbon nanotubes such as multi-walled carbon nanotubes, carbon nanofibers, CN nanotubes, CN nanofibers, BCN nanotubes, BCN nanofibers, and graphene.

Further, the base material 204 includes softeners such as mineral oil, fillers such as calcium carbonate, silica, talc, mica and clay, antioxidants, light stabilizers, lubricants, dispersants, neutralizers, colorants and the like. May be contained.

The average thickness of the base material 204 is not particularly limited, but is preferably 10 μm or more and 600 μm or less, and more preferably 30 μm or more and 250 μm or less. When the average thickness of the base material 204 is within this range, when the protective adhesive tape 200 is adhered to the wafer ring 9, the protective adhesive tape 200 is surely suppressed or prevented from bending. Since the adhesive layer 202 and the adhesive layer 205 can be supported, it is possible to reliably prevent the protective adhesive tape 200 from coming into contact with the semiconductor chip 20.

Further, it is preferable that the surface of the base material 204 is exposed with functional groups such as hydroxyl groups and amino groups having reactivity with the constituent materials contained in the pressure-sensitive adhesive layer 202.

Further, the base material 204 may be composed of a laminated body (multilayer body) in which a plurality of layers made of different resin materials are laminated. Further, it may be composed of a blend film obtained by dry-blending the resin material.

Although the base material 204 has a disk shape as a whole, it may be provided with a protruding portion protruding from a part of the edge portion in a direction orthogonal to the thickness direction as a grip portion. Thereby, the protective adhesive tape 200 can be peeled off from the wafer ring 9 by gripping the grip portion. Therefore, such peeling can be performed more easily.

<Adhesive layer>
The adhesive layer 202 has a function of adhering the protective adhesive tape 200 to the wafer ring 9 with its adhesiveness. Further, in the present embodiment, the adhesive layer 202 is less adhesive to the wafer ring 9 by irradiating the adhesive layer 202 with energy rays, whereby the adhesive layer 202 and the wafer ring 9 can be easily peeled off. It is a state that can occur.

The adhesive layer 202 having such a function is mainly composed of (1) a base resin having adhesiveness and (2) a curable resin for curing the adhesive layer 202, similarly to the adhesive layer 2 provided in the adhesive tape 100 for processing. It is composed of a resin composition contained as a material.

Hereinafter, each component contained in the resin composition will be described in sequence.
(1) Base Resin The base resin has adhesiveness and is contained in the resin composition in order to impart adhesiveness to the wafer ring 9 to the adhesive layer 202 before irradiating the adhesive layer 202 with energy rays. It is a thing.

Examples of such a base resin include acrylic resin (adhesive), silicone resin (adhesive), polyester resin (adhesive), polyvinyl acetate resin (adhesive), and polyvinyl ether resin (adhesive). , Stylized elastomer resin (adhesive), polyisoprene resin (adhesive), polyisobutylene resin (adhesive) or urethane resin (adhesive), which are known as adhesive layer components. However, it is particularly preferable to use an acrylic resin. Acrylic resins are preferably used as base resins because they have excellent heat resistance and can be obtained relatively easily and at low cost.

Acrylic resin refers to a polymer (homopolymer or copolymer) containing a (meth) acrylic acid ester as a main component of a monomer as a base polymer.

The (meth) acrylic acid ester is not particularly limited, and is, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and butyl (meth) acrylate. , (Meta) isobutyl acrylate, (meth) s-butyl acrylate, (meth) t-butyl acrylate, (meth) pentyl acrylate, (meth) hexyl acrylate, (meth) heptyl acrylate, (meth) Octyl acrylate, (meth) isooctyl acrylate, (meth) 2-ethylhexyl acrylate, (meth) nonyl acrylate, (meth) isononyl acrylate, (meth) decyl acrylate, (meth) isodecyl acrylate, (meth) ) Undecyl acrylate, (meth) dodecyl acrylate, (meth) tridecyl acrylate, (meth) tetradecyl acrylate, (meth) pentadecyl acrylate, (meth) hexadecyl acrylate, (meth) heptadecyl acrylate, (meth) (Meta) acrylic acid alkyl esters such as octadecyl acrylate, (meth) acrylic acid cycloalkyl esters such as (meth) acrylic acid cyclohexyl, (meth) acrylic acid aryl esters such as (meth) acrylic acid phenyl, etc. These can be mentioned, and one or more of these can be used in combination. Among these, (meth) acrylic acid alkyl esters such as (meth) methyl acrylate, (meth) ethyl acrylate, (meth) butyl acrylate, (meth) 2-ethylhexyl acrylate, and (meth) octyl acrylate. Is preferable. The (meth) acrylic acid alkyl ester is particularly excellent in heat resistance and can be obtained relatively easily and inexpensively.

In addition, in this specification, (meth) acrylic acid ester is used in the meaning which includes both acrylic acid ester and methacrylic acid ester.

Further, it is preferable that the glass transition point of this acrylic resin is 20 ° C. or lower. As a result, the adhesive layer 202 can exhibit excellent adhesiveness before the adhesive layer 202 is irradiated with energy rays.

As the acrylic resin, a resin containing a copolymerizable monomer is used as a monomer component constituting the polymer, if necessary, for the purpose of modifying the cohesive force, heat resistance and the like.

The copolymerizable monomer is not particularly limited, and is, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, (meth). Hydroxyl group-containing monomers such as 6-hydroxyhexyl acrylate, epoxy group-containing monomers such as glycidyl (meth) acrylate, (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, etc. Carboxyl group-containing monomers, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride, (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol ( Amid-based monomers such as meta) acrylamide, N-methylolpropane (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, aminoethyl (meth) acrylate, (meth) acrylic acid. Amino group-containing monomers such as N, N-dimethylaminoethyl, t-butylaminoethyl (meth) acrylate, cyano group-containing monomers such as (meth) acrylonitrile, ethylene, propylene, isoprene, butadiene, isobutylene and the like. Olefin-based monomers, styrene, α-methylstyrene, styrene-based monomers such as vinyltoluene, vinyl acetate-based monomers such as vinyl acetate and vinyl propionate, vinyl ether-based monomers such as methylvinyl ether and ethyl vinyl ether, vinyl chloride, chloride. Halogen atom-containing monomers such as vinylidene, methoxyethyl (meth) acrylate, alkoxy group-containing monomers such as ethoxyethyl (meth) acrylate, N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine , N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazin, N-vinylpyrazine, N-vinylpyrrole, N-vinylimidazole, N-vinyloxazole, N-vinylmorpholin, N-vinylcaprolactam, N- (meth) Examples thereof include a monomer having a nitrogen atom-containing ring such as acryloylmorpholine, and one or a combination of two or more of these can be used.

The content of these copolymerizable monomers is preferably 40% by weight or less, more preferably 10% by weight or less, based on all the monomer components constituting the acrylic resin.

Further, the copolymerizable monomer may be contained at the end of the main chain in the polymer constituting the acrylic resin, or may be contained in the main chain, and further, the end of the main chain and the main chain. It may be included in both the inside and the inside.

Further, the copolymerizable monomer may contain a polyfunctional monomer for the purpose of cross-linking between polymers.

Examples of the polyfunctional monomer include 1,6-hexanediol (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. , Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerinji (meth) acrylate, epoxy (meth) acrylate, polyester ( Examples thereof include meta) acrylate, urethane (meth) acrylate, divinylbenzene, butyldi (meth) acrylate, and hexyldi (meth) acrylate, and one or more of these can be used in combination.

Further, ethylene-vinyl acetate copolymer, vinyl acetate polymer and the like can also be used as the copolymerizable monomer component.

In addition, such an acrylic resin (polymer) can be produced by polymerizing a single monomer component or a mixture of two or more kinds of monomer components. Further, the polymerization of these monomer components can be carried out by using a polymerization method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method.

As the acrylic resin obtained by polymerizing the monomer components described above, an acrylic resin having a carbon-carbon double bond in the side chain, in the main chain, or at the end of the main chain (“double”). It may also be referred to as "bond-introduced acrylic resin"). When the acrylic resin is a double bond introduction type acrylic resin, the obtained adhesive layer 202 can exhibit the function as the above-mentioned adhesive layer 202 even if the addition of the curable resin described later is omitted. Can be done.

Such a double bond-introduced acrylic resin has one carbon-carbon double bond in each of 1/100 or more of the side chains in the polymer constituting the acrylic resin. It is preferably a double bond-introduced acrylic resin (sometimes referred to as "double bond side chain-introduced acrylic resin"). As described above, introducing a carbon-carbon double bond into the side chain of an acrylic resin is advantageous from the viewpoint of molecular design. The double bond side chain introduction type acrylic resin may have a carbon-carbon double bond in the main chain or at the end of the main chain.

The method for synthesizing such a double bond-introducing acrylic resin (that is, a method for introducing a carbon-carbon double bond into an acrylic resin) is not particularly limited, and for example, a functional group is used as a copolymerizable monomer. After copolymerizing with the monomer having a functional group to synthesize a functional group-containing acrylic resin (sometimes referred to as "functional group-containing acrylic resin"), it is combined with the functional group in the functional group-containing acrylic resin. A compound having a reactive functional group and a carbon-carbon double bond (sometimes referred to as a "carbon-carbon double bond-containing reactive compound") is added to a functional group-containing acrylic resin to carbon-carbon. Examples thereof include a method of synthesizing a double bond-introduced acrylic resin by subjecting a condensation reaction or an addition reaction while maintaining the energy ray curability (energy ray polymerization property) of the double bond.

As a control means for introducing a carbon-carbon double bond into an acrylic resin in 1/100 or more of the side chains, for example, a condensation reaction or addition to a functional group-containing acrylic resin is performed. Examples thereof include a method in which the content of the carbon-carbon double bond-containing reactive compound, which is a compound to be reacted, is appropriately adjusted.

Further, when a carbon-carbon double bond-containing reactive compound is subjected to a condensation reaction or an addition reaction with a functional group-containing acrylic resin, the reaction can be effectively advanced by using a catalyst. The catalyst is not particularly limited, but a tin-based catalyst such as dibutyltin dilaurate is preferably used. The content of the tin-based catalyst is not particularly limited, but is preferably 0.05 parts by weight or more and 1 part by weight or less with respect to 100 parts by weight of the functional group-containing acrylic resin.

The functional group A in the functional group-containing acrylic resin and the functional group B in the carbon-carbon double bond-containing reactive compound include, for example, a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group, and an isocyanate. Examples of the combination of the functional group A in the functional group-containing acrylic resin and the functional group B in the carbon-carbon double bond-containing reactive compound include a carboxylic acid group (carboxyl). Various combinations such as a combination of a group) and an epoxy group, a combination of a carboxylic acid group and an aziridine group, a combination of a hydroxyl group and an isocyanate group, and a combination of a hydroxyl group and a carboxyl group can be mentioned. It is preferably a combination of a group and an isocyanate group. Thereby, the reaction tracking between these functional groups A and B can be easily performed.

Further, in the combination of these functional groups A and B, any functional group may be the functional group A of the functional group-containing acrylic resin or the functional group B of the carbon-carbon double bond-containing reactive compound. However, for example, in the case of a combination of a hydroxyl group and an isocyanate group, the hydroxyl group is the functional group A in the functional group-containing acrylic resin, and the isocyanate group is the functional group in the carbon-carbon double bond-containing reactive compound. It is preferably the group B.

In this case, examples of the monomer having a functional group A constituting the functional group-containing acrylic resin include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Those having a carboxyl group, those having an acid anhydride group such as maleic anhydride and itaconic acid anhydride, 2-hydroxyethyl (meth) acrylic acid, 2-hydroxypropyl (meth) acrylic acid, (meth) acrylic acid. 4-Hydroxybutyl, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethyl) Cyclohexyl) Methyl (meth) acrylate, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 2-hydroxypropyl vinyl ether, 4-hydroxybutyl vinyl ether, ethylene glycol monovinyl ether, diethylene glycol monovinyl ether, propylene glycol monovinyl ether, dipropylene glycol mono Examples thereof include those having a hydroxyl group such as vinyl ether, those having an epoxy group such as glycidyl (meth) acrylate and allyl glycidyl ether.

Examples of the carbon-carbon double bond-containing reactive compound having a functional group B include those having an isocyanate group, such as (meth) acryloyl isocyanate, (meth) acryloyloxymethyl isocyanate, and 2- (meth) acryloyloxy. Examples thereof include ethyl isocyanate, 2- (meth) acryloyloxypropyl isocyanate, 3- (meth) acryloyloxypropyl isocyanate, 4- (meth) acryloyloxybutyl isocyanate, m-propenyl-α, α-dimethylbenzyl isocyanate, and epoxy. Examples of those having a group include glycidyl (meth) acrylate.

The acrylic resin preferably has a low content of low molecular weight substances from the viewpoint that the acrylic resin does not remain on the wafer ring 9 when the protective adhesive tape 200 is peeled off from the wafer ring 9. In this case, the weight average molecular weight of the acrylic resin is preferably set to 300,000 to 5,000,000, more preferably 500,000 to 5,000,000, and even more preferably 800,000 to 3,000,000. If the weight average molecular weight of the acrylic resin is less than the lower limit depending on the type of the monomer component or the like, the antifouling property for the wafer ring 9 or the like is lowered, and the adhesive residue is left when the wafer ring 9 is peeled off. May occur.

The acrylic resin has a functional group (reactive functional group) that is reactive with a cross-linking agent and a photopolymerization initiator, such as a hydroxyl group and a carboxyl group (particularly, a hydroxyl group). Is preferable. As a result, since the cross-linking agent and the photopolymerization initiator are linked to the acrylic resin which is a polymer component, it is possible to accurately suppress or prevent the leakage of these cross-linking agents and the photopolymerization initiator from the adhesive layer 202. As a result, the adhesiveness of the adhesive layer 202 to the wafer ring 9 is surely lowered by the time of irradiation with energy rays.

(2) Curable Resin The curable resin has, for example, curability that can be cured by irradiation with energy rays. As a result of the base resin being incorporated into the crosslinked structure of the curable resin by this curing, the adhesive strength of the adhesive layer 202 is reduced.

Such a curable resin has, for example, a low molecular weight having at least two or more polymerizable carbon-carbon double bonds as functional groups that can be three-dimensionally crosslinked by irradiation with energy rays such as ultraviolet rays and electron beams. Compounds are used. Specifically, for example, trimethylolpropanetri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-Hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, 1,4-butylene glycol di (meth) ) Acrylate, esterified product of (meth) acrylic acid and polyhydric alcohol such as polyethylene glycol di (meth) acrylate, glycerin di (meth) acrylate, ester acrylate oligomer, 2-propenyl-di-3-butenyl cyanurate Cyanurate compounds having a carbon-carbon double bond-containing group such as tris (2-acryloxyethyl) isocyanurate, tris (2-methacryloxyethyl) isocyanurate, 2-hydroxyethyl bis (2-acrylate). Loxyethyl) isocyanurate, bis (2-acryloxyethyl) 2-[(5-acryloxyhexyl) -oxy] ethyl isocyanurate, tris (1,3-diacryloxy-2-propyl-oxycarbonylamino-n-hexyl) ) Isocyanurate, Tris (1-acryloxyethyl-3-methacryloxy-2-propyl-oxycarbonylamino-n-hexyl) isocyanurate, Tris (4-acryloxy-n-butyl) Isocyanurate-like carbon-carbon di Examples thereof include isocyanurate-based compounds having a heavy bond-containing group, commercially available oligoester acrylates, aromatic-based and aliphatic-based urethane acrylates, and one or more of these are used in combination. be able to. Among these, it is preferable to include an oligomer having a functional group number of 6 or more, and more preferably to include an oligomer having a functional group number of 15 or more. This makes it possible to cure the curable resin more reliably by irradiating with energy rays. Further, such a curable resin is preferably urethane acrylate. This has the effect of suppressing glue cracking during pickup due to moderate flexibility.

The urethane acrylate is not particularly limited, but for example, a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene). The terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) has a hydroxyl group ( Examples thereof include those obtained by reacting a meta) acrylate (for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate, etc.).

Further, the curable resin is not particularly limited, but it is preferable that two or more curable resins having different weight average molecular weights are mixed. By using such a curable resin, the degree of cross-linking of the resin by energy ray irradiation can be easily controlled, and the protective adhesive tape 200 can be easily peeled off from the wafer ring 9. Further, as such a curable resin, for example, a mixture of a first curable resin and a second curable resin having a larger weight average molecular weight than the first curable resin may be used.

The curable resin is preferably blended in an amount of 5 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the base resin, more preferably 10 parts by weight or more and 300 parts by weight or less, and 20 parts by weight or more. It is more preferably blended in an amount of 200 parts by weight or less. By adjusting the blending amount of the curable resin as described above, the protective adhesive tape 200 can be easily peeled off from the wafer ring 9.

In this curable resin, when a double bond-introduced acrylic resin is used as the acrylic resin described above, that is, a carbon-carbon double bond is placed in the side chain, in the main chain, or at the end of the main chain. When a possessed material is used, its addition to the resin composition may be omitted. This is because, when the acrylic resin is a double bond-introduced acrylic resin, the pressure-sensitive adhesive layer 202 is provided by the carbon-carbon double bond function of the double-bond-introduced acrylic resin by irradiation with energy rays. Is cured, which reduces the adhesive strength of the adhesive layer 202.

(3) Photopolymerization Initiator Further, the adhesive layer 202 is deteriorated in adhesiveness to the wafer ring 9 by irradiation with energy rays, but when ultraviolet rays or the like are used as the energy rays, the curable resin may be used. It is preferable to contain a photopolymerization initiator in order to facilitate the polymerization initiation of the curable resin.

Examples of the photopolymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1. -Propane-1-one, 2-hydroxy-1-{4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propane-1-one, benzyldiphenylsulfide, Tetramethylthium monosulfide, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, 1 -Hydroxycyclohexylphenylketone, Michelersketone, acetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2- Morphorinopropane-1, benzoinmethyl ether, benzoin ethyl ether, benzoinpropyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl, benzoin, dibenzyl, α-hydroxycyclohexylphenylketone, benzyldimethylketal, 2-hydroxymethylphenylpropane, 2 -Naphthalenesulfonyl chloride, 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime, benzophenone, benzoylbenzoic acid, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4 , 4'-dichlorobenzophenone, 3,3'-dimethyl-4-methoxybenzophenone, o-acrylicoxybenzophenone, p-acrylicoxybenzophenone, o-methacryloxybenzophenone, p-methacryloxybenzophenone, p- (meth) acrylicoxy Benzophenone-4-carboxylic acid esters of acrylates such as ethoxybenzophenone, 1,4-butanediol mono (meth) acrylate, 1,2-ethanediol mono (meth) acrylate, 1,8-octanediol mono (meth) acrylate. , Thioxanson, 2-chlorothioxanson, 2-methylthioxanson, 2,4-dimethylthioxanson, isopropylthioxanson, 2,4-dichlorothioxanson, 2,4-diethylthioxane Son, 2,4-diisopropylthioxanthone, azobisisobutyronitrile, β-chloranthraquinone, camphorquinone, halogenated ketone, acylphosphinoxide, acylphosphonate, polyvinylbenzophenone, chlorothioxanthone, dodecylthioxanthone, Dimethylthioxanthone, diethylthioxanthone, 2-ethylanthraquinone, t-butylanthraquinone, 2,4,5-trially-luimidazole dimer, etc. may be mentioned, and one or more of these may be used in combination. Can be done.

Among these, benzophenone derivatives and alkylphenone derivatives are preferable. These compounds have a hydroxyl group as a reactive functional group in the molecule, and can be linked to a base resin or a curable resin via this reactive functional group, and can further function as a photopolymerization initiator. It can be surely demonstrated.

The photopolymerization initiator is preferably blended in an amount of 0.1 parts by weight or more and 50 parts by weight or less, and more preferably 0.5 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the base resin. .. By adjusting the blending amount of the photopolymerization initiator as described above, the peelability of the protective adhesive tape 200 from the wafer ring 9 can be made suitable.

(4) Cross-linking agent Further, the curable resin may contain a cross-linking agent. The inclusion of the cross-linking agent improves the curability of the curable resin.

The cross-linking agent is not particularly limited, and is, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a urea resin-based cross-linking agent, a methylol-based cross-linking agent, a chelate-based cross-linking agent, an aziridine-based cross-linking agent, a melamine-based cross-linking agent, and a multivalent cross-linking agent. Examples thereof include a metal chelate-based cross-linking agent, an acid anhydride-based cross-linking agent, a polyamine-based cross-linking agent, and a carboxyl group-containing polymer-based cross-linking agent. Among these, isocyanate-based cross-linking agents are preferable.

The isocyanate-based cross-linking agent is not particularly limited, but is, for example, a trimer of a polyisocyanate compound and a polyisocyanate compound of polyisocyanate, or a trimer of a terminal isocyanate compound obtained by reacting a polyisocyanate compound with a polyol compound. Alternatively, a blocked polyisocyanate compound or the like in which a terminal isocyanate urethane prepolymer is sealed with phenol, oximes or the like can be mentioned.

Further, as the polyvalent isocyanate, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane -2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, 4,4'-diphenylether diisocyanate, 4 , 4'-[2,2-bis (4-phenoxyphenyl) propane] diisocyanate, 2,2,4-trimethyl-hexamethylene diisocyanate, etc., and one or a combination of two or more of these may be used. be able to. Among these, at least one polyvalent isocyanate selected from the group consisting of 2,4-tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate and hexamethylene diisocyanate is preferable.

The cross-linking agent is preferably blended in an amount of 0.01 parts by weight or more and 50 parts by weight or less with respect to 100 parts by weight of the base resin, and more preferably 5 parts by weight or more and 50 parts by weight or less. By adjusting the blending amount of the cross-linking agent as described above, the peelability of the protective adhesive tape 200 from the wafer ring 9 can be made suitable.

(5) Conductive material (antistatic agent)
Further, it is preferable that the resin composition constituting the adhesive layer 202 contains a conductive material having conductivity. By including such a conductive material, the conductive material exerts a function as an antistatic agent, and when the protective adhesive tape 200 is peeled off, static electricity is generated in the wafer ring 9 and thus the semiconductor chip 20. It can be accurately suppressed or prevented.

The conductive material is not particularly limited as long as it has conductivity, but the same conductive material as described above as the conductive material contained in the base material 204 can be used.

When one of the base material 204 and the adhesive layer 202 contains the conductive material, it is preferable that the base material 204 contains the conductive material. As a result, it is possible to more accurately suppress or prevent the generation of static electricity in the semiconductor chip 20 without reliably adhering the conductive material to the semiconductor chip 20.

(6) Other components Further, in the resin composition constituting the pressure-sensitive adhesive layer 202, as other components in addition to the above-mentioned components (1) to (5), a tackifier, an antiaging agent, and a pressure-sensitive adhesive are used. , At least one of a filler, a colorant, a flame retardant, a softener, an antioxidant, a plasticizer, a surfactant and the like may be contained.

The tackifier is not particularly limited, and for example, rosin resin, terpene resin, kumaron resin, phenol resin, aliphatic petroleum resin, aromatic petroleum resin, and aliphatic aromatic copolymerized petroleum. Examples thereof include resins, and one or more of these can be used in combination.

The average thickness of the adhesive layer 202 is not particularly limited, but is preferably 1 μm or more and 30 μm or less, more preferably 5 μm or more and 30 μm or less, and further preferably 10 μm or more and 20 μm or less. By setting the average thickness of the adhesive layer 202 within such a range, the adhesive layer 202 exhibits good adhesive force before the energy is applied to the adhesive layer 202, and after the energy is applied to the adhesive layer 202. , Exhibits good peelability between the adhesive layer 202 and the wafer ring 9.

The adhesive layer 202 may be composed of a laminated body (multilayer body) in which a plurality of layers composed of different resin compositions are laminated, and in this case, the layer to which the wafer ring 9 is bonded (multilayer body). The layer located on the opposite side of the base material 204) may contain an oil repellent material.

In the present embodiment, the adhesive layer 202 has a function of reducing the adhesiveness of the adhesive layer 202 to the wafer ring 9 by applying energy, and (1) a base resin and (2) curability. A case where a resin is contained as a main material, and (3) a photopolymerization initiator, (4) a cross-linking agent, (5) a conductive material, and (6) other components are preferably contained will be described. However, when the adhesiveness of the adhesive layer 202 is strong enough to be peeled off from the wafer ring 9 even if the application of energy is omitted, the adhesive layer 202 contains (1) a base resin as a main material. It is possible to omit the addition of (2) the curable resin and (3) the photopolymerization initiator to the adhesive layer 202.

<Attachment layer 205>
The sticking layer 205 is mainly made of a resin material, and is formed by laminating (sticking) on the central portion of the adhesive layer 202 excluding the edge portion. As a result, in the laminated body including the base material 204, the adhesive layer 202, and the sticking layer 205, it has a function of selectively exhibiting adhesiveness at the edge of the laminated body.

The resin material is not particularly limited, and for example, the same resin material as described above as the resin material contained in the base material 204 can be used.

Further, the sticking layer 205 may contain a conductive material having conductivity. The conductive material is not particularly limited as long as it has conductivity, but the same conductive material as described above as the conductive material contained in the base material 204 can be used.

The average thickness of the sticking layer 205 is not particularly limited, but is preferably 5 μm or more and 150 μm or less, and more preferably 15 μm or more and 100 μm or less. When the average thickness of the sticking layer 205 is within this range, it is possible to reliably prevent the sticking layer 205 from coming into contact with the semiconductor chip 20 when the protective adhesive tape 200 is adhered to the wafer ring 9. ..

Further, it is preferable that the average thickness of the sticking layer 205 having an average thickness within such a range is thinner than the average thickness of the base material 204. This makes it possible to more reliably prevent the sticking layer 205 from coming into contact with the semiconductor chip 20 when the protective adhesive tape 200 is adhered to the wafer ring 9.

Further, the width of the edge portion, that is, the adhesive region formed in the laminated body by attaching the adhesive layer 205 to the adhesive layer 202 is preferably 2 mm or more and 30 mm or less, and 5 mm or more and 15 mm or less. More preferred. As a result, the protective adhesive tape 200 can be reliably attached to the wafer ring 9.

Further, the protective adhesive tape 200 preferably has a total light transmittance of 85% or more and 98% or less in the D65 standard light source measured according to the method specified in JIS K 7361-1. It is more preferable that it is 90% or more and 98% or less. As a result, the state of the semiconductor chip 20 sealed in the sealed space 250 can be visually recognized while the protective adhesive tape 200 is adhered to the wafer ring 9.

Further, the protective adhesive tape 200 preferably has a 10% attenuation time of 5 seconds or less when a voltage of ± 5000 V is applied to the surface of the adhesive layer 202, and is preferably 0.1 seconds or more and 3 seconds or less. More preferred. Even if the protective adhesive tape 200 is peeled off from the wafer ring 9 because the time is within the range where the 10% attenuation time is required, the static electricity caused by the peeling causes the semiconductor wafer 7 to be charged. Can be accurately suppressed or prevented. Therefore, this charging causes a defect in the circuit of the semiconductor chip 20 built in the semiconductor wafer 7, and as a result, it is possible to accurately suppress or prevent the semiconductor chip 20 from being damaged. Therefore, the semiconductor chip 20 can be accurately suppressed or prevented. The semiconductor device 10 provided with the above can be manufactured with a good yield.

The semiconductor element protective adhesive tape 200 having such a configuration can be manufactured, for example, as follows.

(Manufacturing method of adhesive tape for protecting semiconductor elements)
7 and 8 are vertical cross-sectional views for explaining a method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. In the following description, the upper side in FIGS. 7 and 8 is referred to as "upper" and the lower side is referred to as "lower".

[1B] First, the base material 204 is prepared (see FIG. 7A).
The method for producing the base material 204 is not particularly limited, and examples thereof include general molding methods such as a calendar method, an inflation extrusion method, an extrusion molding method such as a T-die extrusion method, and a wet casting method. When the base material 204 is composed of a laminated body, for example, a molding method such as a coextrusion method or a dry laminating method is used as a method for manufacturing the base material 204 having such a structure.

Further, the base material 204 can be used without stretching, and if necessary, a uniaxial or biaxial stretching treatment may be used.

[2B] Next, the adhesive layer 202 is formed on the upper surface of the base material 204 (see FIG. 7B).
The surface (upper surface) of the base material 204 is subjected to corona treatment, chromic acid treatment, mat treatment, ozone exposure treatment, flame exposure treatment, and high-voltage impact for the purpose of improving the adhesion between the base material 204 and the adhesive layer 202. Surface treatments such as exposure treatment, ionizing radiation treatment, primer treatment, and anchor coating treatment may be applied.

Further, the adhesive layer 202 is adhered by applying or spraying a liquid material in which a resin composition which is a constituent material of the adhesive layer 202 is dissolved in a solvent to form a varnish on the base material 204, and then volatilizing the solvent. It can be obtained by forming the layer 202.

The solvent is not particularly limited, and examples thereof include methyl ethyl ketone, acetone, toluene, ethyl acetate, and dimethyl formaldehyde, and one or a combination of two or more of these can be used.

Further, the application or spraying of the liquid material on the base material 204 can be performed by using a method such as a die coat, a curtain die coat, a gravure coat, a comma coat, a bar coat and a lip coat.

[3B] Next, a sticking layer 205 is prepared, and the sticking layer 205 is stuck on almost the entire surface of the adhesive layer 202 formed on the base material 204 (see FIG. 7 (c)).

As a result, a laminated body 210 in which the base material 204, the adhesive layer 202, and the sticking layer 205 are laminated in this order is obtained.

The sticking layer 205 can be manufactured in the same manner as the manufacturing method described in the base material 204.

Further, the sticking layer 205 can be attached to the adhesive layer 202 by laminating the adhesive layer 205 on the adhesive layer 202 with the adhesiveness of the adhesive layer 202.

The method of laminating the sticking layer 205 on the adhesive layer 202 is not particularly limited, and for example, a laminating method using a roll or a laminating method using a press can be used. Among these, the laminating method using a roll is preferable from the viewpoint of productivity that continuous production can be performed.

In the present embodiment, after the sheet-shaped base material 204 is prepared by the steps [1B] to [3B], the adhesive layer 202 and the sticking layer 205 are provided on almost the entire surface of the base material 204, respectively. The step of laminating in this order is configured.

[4B] Next, the laminate 210 is turned over so that the sticking layer 205 is on the lower side, and then punched in an annular shape so as to penetrate the adhesive layer 202 and the base material 204 on the sticking layer 205 (FIG. 7 (FIG. 7). d) See.).

Further, the punching of the adhesive layer 202 and the base material 204 can be performed by using, for example, a method using a roll-shaped die or a method using a press die. Above all, a method using a roll-shaped die capable of continuously punching is preferable.

[5B] Next, of the adhesive layer 202 and the base material 204 on the sticking layer 205, the adhesive layer 202 and the base material 204 located outside the position punched out in an annular shape are removed (see FIG. 7 (e)). .).

As a result, the laminated body 210 can be obtained as a disk-shaped adhesive layer 202 and a base material 204 laminated on the sticking layer 205 in this order.

[6B] Next, the laminate 210 is turned over so that the base material 204 is on the lower side, and then the adhesive layer 205 on the adhesive layer 202 is punched out in an annular shape so as to penetrate inside the adhesive layer 202. (See FIG. 8 (a).).

Further, the punching of the sticking layer 205 can be performed by using, for example, a method using a roll-shaped die or a method using a press die. Above all, a method using a roll-shaped die capable of continuously punching is preferable.

[7B] Next, of the adhesive layer 205 on the adhesive layer 202, the adhesive layer 205 located outside the position punched out in an annular shape is removed (see FIG. 8B).

As a result, the laminated body 210 can be obtained as a disk-shaped pasting layer 205 laminated on the adhesive layer 202. That is, the protective adhesive tape 200 is laminated on the disk-shaped base material 204, the adhesive layer 202 formed by laminating almost the entire upper surface of the base material 204, and the central portion excluding the edge of the upper surface of the adhesive layer 202. It can be obtained as a laminated body 210 including a disk-shaped sticking layer 205 formed by laminating the layers.

In the present embodiment, the sticking layer is peeled off from the edge of the sticking layer by the steps [6B] to [7B], and the sticking layer is stuck to the central portion excluding the edge of the sticking layer. The process of forming is configured.

By going through the above steps, the protective adhesive tape 200 of the first embodiment can be manufactured.

<< Second Embodiment >>
Next, a second embodiment of the adhesive tape for protecting the semiconductor element will be described.

FIG. 9 is a vertical sectional view showing a second embodiment of the adhesive tape for protecting a semiconductor element of the present invention.
Hereinafter, the protective adhesive tape 200 of the second embodiment will be described mainly on the differences from the protective adhesive tape 200 of the first embodiment, and the same matters will be omitted.

The protective adhesive tape 200 of the present embodiment is provided with an adhesive layer 202 formed on almost the entire surface of the base material 204 and selectively having adhesiveness at the edges, except that the formation of the adhesive layer 205 is omitted. Is the same as the protective adhesive tape 200 of the first embodiment.

That is, in the present embodiment, the protective adhesive tape 200 is formed by laminating a disk-shaped base material 204 containing a resin material on almost the entire upper surface (one side) of the base material 204. The adhesive layer 202 is composed of a laminated body including 202, and in such a laminated body, the adhesive layer 202 does not have adhesiveness in the adhesive area 212 having adhesiveness located at the edge portion and the central portion excluding the edge portion of the adhesive layer 202. It has a non-adhesive region 222.

By adopting the protective adhesive tape 200 in such a configuration, in a laminated body including the base material 204 and the adhesive layer 202 laminated on the base material 204, the adhesive is selectively adhered at the edge of the laminated body. The sex is demonstrated.

In the protective adhesive tape 200 having such a configuration, the base material 204 has the same structure as the base material 204 included in the protective adhesive tape 200 of the first embodiment. The base material 204 has a circular shape in a plan view.

Further, the adhesive layer 202 is formed by being laminated on almost the entire upper surface (one surface) of the base material 204. The adhesive layer 202 includes an adhesive region 212 located at the edge portion and a non-adhesive region 222 having no adhesiveness in the central portion excluding the edge portion of the adhesive layer 202. Further, in the adhesive layer 202, the non-adhesive region 222 has a circular shape in a plan view, and the adhesive region 212 has a ring shape in a plan view.

Such an adhesive layer 202 contains (1) an adhesive base resin and (2) a curable resin that cures the adhesive layer 202 as main materials, and (3) a photopolymerization initiator and (3) a photopolymerization initiator. The adhesive layer provided in the protective adhesive tape 200 of the first embodiment is composed of a resin composition preferably containing 4) a cross-linking agent, (5) a conductive material, and (6) other components. It is the same as 202. On the other hand, in the non-adhesive region 222, the curable resin is cured by applying energy, so that the adhesiveness is lowered, and in the adhesive region 212, the curable resin is uncured because no energy is applied. This is different from the adhesive layer 202 provided in the protective adhesive tape 200 of the first embodiment in that it has adhesiveness. By providing the non-adhesive region 222 to which energy is applied and the adhesive region 212 to not apply energy in this way, the protective adhesive tape 200 is made to selectively exhibit adhesiveness at its edge. be able to.

The protective adhesive tape 200 of the second embodiment also has the same effect as that of the first embodiment.

Further, the protective adhesive tape 200 having such a configuration can be manufactured, for example, as follows.

(Manufacturing method of adhesive tape for protecting semiconductor elements)
FIG. 10 is a vertical sectional view for explaining a method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. 9. In the following description, the upper side in FIG. 10 is referred to as "upper" and the lower side is referred to as "lower".

[1C] First, the base material 204 is prepared (see FIG. 10A).
The method for producing the base material 204 is not particularly limited, and examples thereof include general molding methods such as a calendar method, an inflation extrusion method, an extrusion molding method such as a T-die extrusion method, and a wet casting method. When the base material 204 is composed of a laminated body, for example, a molding method such as a coextrusion method or a dry laminating method is used as a method for manufacturing the base material 204 having such a structure.

Further, the base material 204 can be used without stretching, and if necessary, a uniaxial or biaxial stretching treatment may be used.

[2C] Next, the adhesive layer 202 is formed on almost the entire upper surface of the base material 204 (see FIG. 10 (b)).

The surface (upper surface) of the base material 204 is subjected to corona treatment, chromic acid treatment, mat treatment, ozone exposure treatment, flame exposure treatment, and high-voltage impact for the purpose of improving the adhesion between the base material 204 and the adhesive layer 202. Surface treatments such as exposure treatment, ionizing radiation treatment, primer treatment, and anchor coating treatment may be applied.

Further, the adhesive layer 202 is adhered by applying or spraying a liquid material in which a resin composition which is a constituent material of the adhesive layer 202 is dissolved in a solvent to form a varnish on the base material 204, and then volatilizing the solvent. It can be obtained by forming the layer 202.

The solvent is not particularly limited, and examples thereof include methyl ethyl ketone, acetone, toluene, ethyl acetate, and dimethyl formaldehyde, and one or a combination of two or more of these can be used.

Further, the application or spraying of the liquid material on the base material 204 can be performed by using a method such as a die coat, a curtain die coat, a gravure coat, a comma coat, a bar coat and a lip coat.

In the present embodiment, after the sheet-shaped base material 204 containing the resin material is prepared by the above steps [1C] to [2C], the adhesive layer 202 is formed on almost the entire surface of the base material 204. Is configured.

[3C] Next, a mask 300 having an opening 310 corresponding to the shape to form the non-adhesive region 222 of the adhesive layer 202 is prepared, and then the adhesive layer 202 is irradiated with energy rays through the mask 300. (See FIG. 10 (c)).

As a result, the adhesiveness is lowered due to the curing of the curable resin contained in the region irradiated with the energy rays of the adhesive layer 202, and as a result, the non-adhesive region 222 is formed in the center of the adhesive layer 202. Will be done.

[4C] Next, the adhesive layer 202 and the base material 204 are passed through the edge of the adhesive layer 202 so that a region having adhesiveness remains without being irradiated with energy rays, thereby punching out in an annular shape. (See FIG. 10 (d).).

As a result, the laminated body 210 can be obtained by laminating the adhesive layer 202 having a disk-like overall shape and the base material 204 on the sticking layer 205 in this order. Further, the adhesive layer 202 can be obtained as having an adhesive region 212 having adhesiveness at the edge portion and a non-adhesive region 222 having reduced adhesiveness at the central portion. That is, the protective adhesive tape 200 is provided with a disk-shaped base material 204 and an adhesive layer 202 formed by laminating almost the entire upper surface of the base material 204, and the adhesive layer 202 is adhesive at the edge. It can be obtained as a laminated body 210 having an adhesive region 212 having an adhesive region 212 and a non-adhesive region 222 having reduced adhesiveness in the central portion.

In the present embodiment, the non-adhesive region 222 having no adhesiveness in the central portion is reduced by reducing the adhesiveness of the central portion excluding the edge portion of the adhesive layer 202 by the steps [3C] to [4C]. A step of forming the non-adhesive region 222 and the adhesive region 212 having adhesiveness at the edge of the adhesive layer 202 is configured.

In the present embodiment, the case where the non-adhesive region 222 and the adhesive region 212 are formed on the adhesive layer 202 without providing the protective layer on the adhesive layer 202 has been described, but the case is not limited to this case, and for example, the above. After the step [2C], a protective layer is formed on the adhesive layer 202, and after the steps [3C] to [4C], the protective layer is peeled off to form the protective adhesive tape 200 of the present embodiment. May be obtained. In this case, as the protective layer, a layer having the same structure as that described as the sticking layer 205 of the first embodiment can be used.

By going through the above steps, the protective adhesive tape 200 of the second embodiment can be manufactured.

<< Third Embodiment >>
Next, a third embodiment of the adhesive tape for protecting the semiconductor element will be described.

FIG. 11 is a vertical sectional view showing a third embodiment of the adhesive tape for protecting a semiconductor element of the present invention.

Hereinafter, the protective adhesive tape 200 of the third embodiment will be described mainly on the differences from the protective adhesive tape 200 of the first embodiment, and the same matters will be omitted.

The protective adhesive tape 200 of the present embodiment is the first except that the formation of the sticking layer 205 is omitted and the adhesive layer 202 having adhesiveness is selectively formed on the edge portion on the base material 204. It is the same as the protective adhesive tape 200 of the embodiment.

That is, in the present embodiment, the protective adhesive tape 200 is formed by selectively laminating a disk-shaped base material 204 containing a resin material on the edge of the upper surface (one side) of the base material 204. It is composed of a laminated body including the adhesive layer 202.

By adopting the protective adhesive tape 200 in such a configuration, in a laminated body including the base material 204 and the adhesive layer 202 laminated on the base material 204, the adhesive is selectively adhered at the edge of the laminated body. The sex is demonstrated.

In the protective adhesive tape 200 having such a configuration, the base material 204 has the same structure as the base material 204 included in the protective adhesive tape 200 of the first embodiment. The base material 204 has a circular shape in a plan view.

Further, the adhesive layer 202 is formed by selectively laminating on the edge portion of the upper surface (one surface) of the base material 204.

The protective adhesive tape 200 of the first embodiment includes such an adhesive layer 202, except that the adhesive layer 202 is selectively formed not on almost the entire upper surface (one surface) of the base material 204 but on the edge portion. It is the same as the adhesive layer 202. The adhesive layer 202 selectively formed on the edge thereof has a ring shape in a plan view and is mainly composed of (1) a base resin having adhesiveness and (2) a curable resin that cures the adhesive layer 202. It is composed of a resin composition contained as a material, preferably containing (3) a photopolymerization initiator, (4) a cross-linking agent, (5) a conductive material, and (6) other components. Further, when the adhesiveness of the adhesive layer 202 is strong enough to be peeled off from the wafer ring 9 even if the application of energy is omitted, the adhesive layer 202 contains (1) a base resin as a main material. It is composed of (2) a curable resin and (3) a resin composition in which the addition of a photopolymerization initiator is omitted.

The protective adhesive tape 200 of the third embodiment also has the same effect as that of the first embodiment.

(Manufacturing method of adhesive tape for protecting semiconductor elements)
12 and 13 are vertical cross-sectional views for explaining a method of manufacturing the adhesive tape for protecting a semiconductor element shown in FIG. 11. In the following description, the upper side in FIG. 12 is referred to as "upper" and the lower side is referred to as "lower".

[1D] First, the base material 204 is prepared (see FIG. 12A).
The method for producing the base material 204 is not particularly limited, and examples thereof include general molding methods such as a calendar method, an inflation extrusion method, an extrusion molding method such as a T-die extrusion method, and a wet casting method. When the base material 204 is composed of a laminated body, for example, a molding method such as a coextrusion method or a dry laminating method is used as a method for manufacturing the base material 204 having such a structure.

Further, the base material 204 can be used without stretching, and if necessary, a uniaxial or biaxial stretching treatment may be used.

In the present embodiment, the step of preparing the sheet-shaped base material 204 is configured by the step [1D].

[2D] Next, the adhesive layer 202 is formed on the upper surface of the base material 204 (see FIG. 12 (b)).
The surface (upper surface) of the base material 204 is subjected to corona treatment, chromic acid treatment, mat treatment, ozone exposure treatment, flame exposure treatment, and high-voltage impact for the purpose of improving the adhesion between the base material 204 and the adhesive layer 202. Surface treatments such as exposure treatment, ionizing radiation treatment, primer treatment, and anchor coating treatment may be applied.

Further, the adhesive layer 202 is adhered by applying or spraying a liquid material in which a resin composition which is a constituent material of the adhesive layer 202 is dissolved in a solvent to form a varnish on the base material 204, and then volatilizing the solvent. It can be obtained by forming the layer 202.

The solvent is not particularly limited, and examples thereof include methyl ethyl ketone, acetone, toluene, ethyl acetate, and dimethyl formaldehyde, and one or a combination of two or more of these can be used.

Further, the application or spraying of the liquid material on the base material 204 can be performed by using a method such as a die coat, a curtain die coat, a gravure coat, a comma coat, a bar coat and a lip coat.

[3D] Next, a sticking layer 205 is prepared, and the sticking layer 205 is stuck on almost the entire surface of the adhesive layer 202 formed on the base material 204 (see FIG. 12 (c)).

As a result, a laminated body 210 in which the base material 204, the adhesive layer 202, and the sticking layer 205 are laminated in this order is obtained.

The sticking layer 205 can be manufactured in the same manner as the manufacturing method described in the base material 204.

Further, the sticking layer 205 can be attached to the adhesive layer 202 by laminating the adhesive layer 205 on the adhesive layer 202 with the adhesiveness of the adhesive layer 202.

The method of laminating the sticking layer 205 on the adhesive layer 202 is not particularly limited, and for example, a laminating method using a roll or a laminating method using a press can be used. Among these, the laminating method using a roll is preferable from the viewpoint of productivity that continuous production can be performed.

[4D] Next, the adhesive layer 205, the adhesive layer 202, and the base material 204 are punched out in an annular shape (see FIG. 12 (d)).

Further, the punching of the sticking layer 205, the adhesive layer 202 and the base material 204 can be performed by using, for example, a method using a roll-shaped die or a method using a press die. Above all, a method using a roll-shaped die capable of continuously punching is preferable.

[5D] Next, among the adhesive layer 205, the adhesive layer 202 and the base material 204 punched out in an annular shape, the adhesive layer 205, the adhesive layer 202 and the base material 204 located on the outside are removed (FIG. 12 (e)). reference.).

As a result, the laminated body 210 can be obtained as a base material 204 having a disk-like overall shape, an adhesive layer 202, and a sticking layer 205 laminated in this order.

[6D] Next, the adhesive layer 202 and the sticking layer 205 on the base material 204 are punched out in an annular shape so as to penetrate inside the base material 204 (see FIG. 13A).

Further, the punching of the adhesive layer 202 and the sticking layer 205 can be performed by using, for example, a method using a roll-shaped die or a method using a press die. Above all, a method using a roll-shaped die capable of continuously punching is preferable.

[7D] Next, all of the sticking layer 205 and the adhesive layer 202 located inside among the adhesive layers 202 punched out in an annular shape are removed (see FIG. 13 (b)).

As a result, the laminated body 210 can be obtained as a layered adhesive layer 202 having a ring shape on the edge side thereof on the base material 204. That is, the protective adhesive tape 200 can be obtained as a laminated body 210 including a disk-shaped base material 204 and an adhesive layer 202 formed by laminating on the edge of the upper surface of the base material 204.

In order to smoothly remove the adhesive layer 202 from the base material 204, it is preferable to perform a mold release treatment on the upper surface of the base material 204 prior to the step [2D]. Examples of the mold release treatment include a treatment of coating the upper surface of the base material 204 with a mold release agent, a treatment of forming fine irregularities on the upper surface of the base material 204, and the like. Examples of the mold release agent include silicone-based, alkyd-based, and fluorine-based ones.

Further, the adhesive layer is further formed on the adhesive layer 205 located on the edge side after removing the adhesive layer 202 and the adhesive layer 205 located inside from the adhesive layer 202 and the adhesive layer 205 punched out in an annular shape. By laminating the adhesive layer, it is also possible to form a three-layered laminate in which the adhesive layer 202, the sticking layer 205, and the adhesive layer are laminated in this order on the edge of the base material 204.

In the present embodiment, the steps [2D] to [7D] constitute a step of selectively forming the adhesive layer 202 on the edge of the base material 204.

By going through the above steps, the protective adhesive tape 200 of the third embodiment can be manufactured.

Although the method for manufacturing the semiconductor element protective adhesive tape and the semiconductor element protective adhesive tape of the present invention has been described above, the present invention is not limited thereto.

For example, any component capable of exhibiting the same function may be added to each layer of the adhesive tape for protecting a semiconductor element of the present invention, or the base material may be as described in the above-described embodiment. In addition to one composed of one layer, one composed of a plurality of layers may be used. For example, an antistatic layer may be provided on a surface opposite to the adhesive layer of the above-mentioned base material. May be good.

Further, the configuration of each layer included in the adhesive tape for protecting the semiconductor element of the present invention can be replaced with an arbitrary one capable of exhibiting the same function, or an arbitrary configuration can be added.

Further, in the above embodiment, the processing adhesive tape 100 is fixed by the wafer ring 9 on the outer peripheral portion 121 side of the semiconductor wafer 7 (semiconductor chip 20) that has been separated into pieces while being fixed to the processing adhesive tape 100. After the step [5A], the laminate 150 is attached to the wafer ring 9 with a protective adhesive tape 200 to form a closed space 250, and the semiconductor wafer 7 (semiconductor chip 20) is stored and moved. As described above, the present invention is not limited to this case, and the semiconductor chip 20 may be stored and moved by attaching the protective adhesive tape 200 to the laminate 155 formed as follows.

That is, the processing adhesive tape 100 is used as a replacement adhesive tape on which the semiconductor chips 20 picked up in the step [5A] are laminated (attached), and the semiconductor chip 20 is attached to the processing adhesive tape 100. After the processing adhesive tape 100 is fixed to the laminate 155 on the outer peripheral side of the chip 20 by the wafer ring 9, the protective adhesive is applied to the opposite side of the processing adhesive tape 100 (replacement adhesive tape) of the wafer ring 9. By attaching the tape 200, a closed space 255 may be formed so that the semiconductor chip 20 can be stored and moved (see FIG. 14).

Further, in the method for manufacturing an adhesive tape for protecting a semiconductor element of the present invention, one or more steps can be added for any purpose.

2 Adhesive layer 4 Base material 7 Wafer for semiconductor 9 Wafer ring 10 Semiconductor device 17 Mold part 20 Semiconductor chip 21 terminal 30 Interposer 41 terminal 70 Bump 80 Encapsulation layer 81 Connection part 85 Solder bump 100 Adhesive tape for semiconductor wafer processing Adhesive tape for processing)
121 Peripheral part 122 Central part 150 Laminated product 155 Laminated material 200 Adhesive tape for protecting semiconductor elements (adhesive tape for protection)
202 Adhesive layer 204 Base material 205 Adhesive layer 210 Laminated body 212 Adhesive area 222 Non-adhesive area 250 Sealed space 255 Sealed space 300 Mask 310 Opening

Claims (4)

Used to protect the semiconductor element in a laminate having a substrate, a semiconductor element fixed to the center of the substrate, and a wafer ring fixed to the edge of the substrate.
An adhesive tape for protecting a semiconductor element, which is composed of a laminated body including a sheet-shaped base material containing a resin material and an adhesive layer laminated on the base material.
The adhesive layer is formed on almost the entire surface of the base material, and the semiconductor element protective adhesive tape further includes a non-adhesive adhesive layer attached to a central portion excluding the edge portion of the adhesive layer. By that
It selectively has adhesiveness at the edge of the adhesive tape for protecting the semiconductor element.
The adhesive layer adheres to the wafer ring on the opposite side of the laminate to the substrate, so that the semiconductor element is sealed by the substrate, the wafer ring, and the adhesive tape for protecting the semiconductor element. Adhesive tape for protecting semiconductor devices. The adhesive tape for protecting a semiconductor element according to claim 1, wherein the base material has a circular shape in a plan view. The adhesive tape for protecting a semiconductor element according to claim 1 or 2, wherein the substrate has a disk shape and the wafer ring has a cylindrical shape . The method for manufacturing an adhesive tape for protecting a semiconductor element according to claim 1.
After preparing a sheet-shaped base material containing a resin material, the adhesive layer and the sticking layer are laminated in this order on almost the entire surface of the base material, respectively.
The adhesive tape for protecting a semiconductor element, which comprises a step of peeling the adhesive layer from the edge portion of the adhesive layer to form the adhesive layer attached to the central portion excluding the edge portion of the adhesive layer. Production method.

Images