JP7010554B2 - パワー整流モジュール - Google Patents
パワー整流モジュール Download PDFInfo
- Publication number
- JP7010554B2 JP7010554B2 JP2017102383A JP2017102383A JP7010554B2 JP 7010554 B2 JP7010554 B2 JP 7010554B2 JP 2017102383 A JP2017102383 A JP 2017102383A JP 2017102383 A JP2017102383 A JP 2017102383A JP 7010554 B2 JP7010554 B2 JP 7010554B2
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- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- bus bar
- series
- switches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0238—Electrical distribution centers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
Description
1 2 プリント回路基板
1 3 上面
1 4 パワースイッチ(スイッチ)
1 5 下面
1 6 パワースイッチ(スイッチ)
1 7 接続領域
1 8 パワースイッチ(スイッチ)
2 0 パワースイッチ(スイッチ)
2 2 パワースイッチ(スイッチ)
2 4 パワースイッチ(スイッチ)
2 6 パワースイッチ(スイッチ)
2 8 パワースイッチ(スイッチ)
3 0 第1のバスバー(バスバー)
3 2 第2のバスバー(バスバー)
3 4 第1の長手方向縁部(第1の長手方向の縁部)
3 5 縁部
Claims (4)
- プリント回路基板(12)と、
板状の第1のバスバー(30)と、
第1の一連のパワースイッチ(14,16,18,20)であって、各パワースイッチ(14,16,18,20)が、前記プリント回路基板(12)の上面(13)に接続される一連の接続ピン(68)、及び前記第1のバスバー(30)に当てて付けられる金属ベースプレート(67)を備える、第1の一連のパワースイッチ(14,16,18,20)と、
を備える自動車のパワー整流モジュール(10)であって、
前記第1の一連のパワースイッチ(14,16,18,20)が、前記第1のバスバー(30)上に取り付けられ、前記パワースイッチ(14,16,18,20)が概して前記第1のバスバー(30)の長手方向の縁部(35)に沿って整列され、前記第1のバスバー(30)の前記長手方向の縁部(35)が、前記プリント回路基板(12)の第1の長手方向の縁部(34)に沿って配置され、前記第1のバスバー(30)のうち、前記パワースイッチ(14,16,18,20)が取り付けられる部分(42)が、前記プリント回路基板(12)に隣接して配置され、
前記モジュール(10)が、前記プリント回路基板(12)の前記上面(13)に接続される一連の接続ピン(68)を各々が備える第2の一連のパワースイッチ(22,24,26,28)を備え、前記第2の一連のパワースイッチ(22,24,26,28)が、第2のバスバー(32)上に取り付けられ、前記第2のバスバー(32)及び前記第2の一連のパワースイッチ(22,24,26,28)が、前記プリント回路基板(12)の第2の長手方向の縁部(36)に沿って、前記第1のバスバー(30)及び前記第1の一連のスイッチ(14,16,18,20)と同様に配置され、
前記第1のバスバー(30)が、前記プリント回路基板(12)の2つの対向する第1及び第2の長手方向の縁部(34,36)の一方側に、前記第2のバスバー(32)が、前記プリント回路基板(12)の2つの対向する第1及び第2の長手方向の縁部(34,36)のもう一方側に、それぞれ配置されることを特徴とするモジュール(10)。 - 前記第1のバスバー(30)が、概して、前記プリント回路基板(12)と同一平面内に配置されることを特徴とする、請求項1に記載のモジュール(10)。
- 前記第1のバスバー(30)が、前記第1のバスバー(30)と一体に構成された固定用のタブ(72,74,76)を備え、前記タブ(72,74,76)が、前記バスバー(30)の真直ぐな前記縁部(35)から前記プリント回路基板(12)の下面まで延在し、前記タブ(72,74,76)が、前記プリント回路基板(12)の前記下面(15)に固定されることを特徴とする、請求項1又は2に記載のモジュール(10)。
- 前記パワースイッチ(14,16,18,20,22,24,26,28)が表面実装部品タイプのものであることを特徴とする、請求項1から3の何れか一項に記載のモジュール(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654711 | 2016-05-25 | ||
FR1654711A FR3052013B1 (fr) | 2016-05-25 | 2016-05-25 | Module de commutation de puissance |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017212446A JP2017212446A (ja) | 2017-11-30 |
JP7010554B2 true JP7010554B2 (ja) | 2022-01-26 |
Family
ID=56802610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017102383A Active JP7010554B2 (ja) | 2016-05-25 | 2017-05-24 | パワー整流モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US10177085B2 (ja) |
EP (1) | EP3250011B1 (ja) |
JP (1) | JP7010554B2 (ja) |
KR (1) | KR102432186B1 (ja) |
CN (1) | CN107454743B (ja) |
FR (1) | FR3052013B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7172471B2 (ja) | 2018-11-09 | 2022-11-16 | 住友電装株式会社 | 基板構造体 |
EP3691103A1 (en) * | 2019-02-01 | 2020-08-05 | Aptiv Technologies Limited | Electric power module |
CN110337194B (zh) * | 2019-07-25 | 2024-02-13 | 苏州华之杰电讯股份有限公司 | 并联双mos管与pcba板的连接结构 |
AU2020393921B2 (en) | 2019-11-27 | 2023-04-06 | The Noco Company | Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB) in a battery management system (BMS) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004063681A (ja) | 2002-07-26 | 2004-02-26 | Hitachi Unisia Automotive Ltd | 半導体装置 |
JP2010161089A (ja) | 2009-01-06 | 2010-07-22 | Calsonic Kansei Corp | パワー素子とヒートシンクの取付構造 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6215681B1 (en) * | 1999-11-09 | 2001-04-10 | Agile Systems Inc. | Bus bar heat sink |
US6845017B2 (en) * | 2000-09-20 | 2005-01-18 | Ballard Power Systems Corporation | Substrate-level DC bus design to reduce module inductance |
JP4162523B2 (ja) * | 2002-06-03 | 2008-10-08 | シャープ株式会社 | インバータ |
CN101834544B (zh) * | 2010-04-27 | 2012-07-18 | 西安交通大学 | 一种用于高频开关电源同步整流电路结构 |
DE102014000126A1 (de) * | 2014-01-13 | 2015-07-16 | Auto-Kabel Management Gmbh | Leiterplatte, Schaltung und Verfahren zur Herstellung einer Schaltung |
CN203826375U (zh) * | 2014-05-20 | 2014-09-10 | 北京海特远舟新能源科技有限公司 | Mos管并联实现大电流开关控制的结构 |
-
2016
- 2016-05-25 FR FR1654711A patent/FR3052013B1/fr active Active
-
2017
- 2017-05-22 EP EP17172298.6A patent/EP3250011B1/en active Active
- 2017-05-24 US US15/603,921 patent/US10177085B2/en active Active
- 2017-05-24 JP JP2017102383A patent/JP7010554B2/ja active Active
- 2017-05-25 KR KR1020170064535A patent/KR102432186B1/ko active IP Right Grant
- 2017-05-25 CN CN201710376221.2A patent/CN107454743B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004063681A (ja) | 2002-07-26 | 2004-02-26 | Hitachi Unisia Automotive Ltd | 半導体装置 |
JP2010161089A (ja) | 2009-01-06 | 2010-07-22 | Calsonic Kansei Corp | パワー素子とヒートシンクの取付構造 |
Also Published As
Publication number | Publication date |
---|---|
US10177085B2 (en) | 2019-01-08 |
US20170345749A1 (en) | 2017-11-30 |
EP3250011A1 (en) | 2017-11-29 |
FR3052013B1 (fr) | 2019-06-28 |
EP3250011B1 (en) | 2023-09-27 |
CN107454743A (zh) | 2017-12-08 |
KR102432186B1 (ko) | 2022-08-16 |
CN107454743B (zh) | 2019-11-22 |
KR20170133280A (ko) | 2017-12-05 |
JP2017212446A (ja) | 2017-11-30 |
FR3052013A1 (fr) | 2017-12-01 |
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