JP7007491B2 - ウェハー洗浄装置 - Google Patents
ウェハー洗浄装置 Download PDFInfo
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- JP7007491B2 JP7007491B2 JP2020543530A JP2020543530A JP7007491B2 JP 7007491 B2 JP7007491 B2 JP 7007491B2 JP 2020543530 A JP2020543530 A JP 2020543530A JP 2020543530 A JP2020543530 A JP 2020543530A JP 7007491 B2 JP7007491 B2 JP 7007491B2
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- tray
- cleaning liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
(付記1)
洗浄液を収容し、ウェハーがディッピングさせられることにより洗浄液がオーバーフローさせられる洗浄槽;
前記洗浄槽の外側に備えられ、前記カセットを前記洗浄槽内の洗浄液にディッピングさせる複数のリフト部;
前記洗浄槽とリフト部が収容され、洗浄液が排水される排水口が備えられた外部水槽;及び
前記外部水槽の内部底面に着脱可能であり、洗浄液を溜めて前記排水口に案内するトレイ;
を含むウェハー洗浄装置。
前記トレイには、
前記洗浄槽を支持するサポーターと、前記リフト部が貫通させられる装着口が備えられ、
前記外部水槽の排水口の内側に安着される排水ポートが下向きに突出するように備えられる、
付記1に記載のウェハー洗浄装置。
前記トレイには、前記外部水槽の内側面と接する周縁部分に上向きに突出した外部側壁と、前記装着口にそれぞれ上向きに突出した複数の内部側壁が備えられる、付記2に記載のウェハー洗浄装置。
前記トレイは、前記排水ポートに行くほど下向きに傾斜して構成される、付記2に記載のウェハー洗浄装置。
前記外部水槽の内側面とトレイとの間に備えられ、前記外部水槽の内側面に落ちた洗浄液を前記トレイに案内する第1ガイド部をさらに含む、付記1に記載のウェハー洗浄装置。
前記第1ガイド部は、前記外部水槽の下部内側面にボルト締結される、付記5に記載のウェハー洗浄装置。
前記第1ガイド部は、洗浄液が流れ下るように案内する傾斜面を有するバー形状に構成される、付記5に記載のウェハー洗浄装置。
前記第1ガイド部は、非金属系の材質で構成される、付記5に記載のウェハー洗浄装置。
前記リフト部の周縁面とトレイとの間に備えられ、前記リフト部の周縁面に落ちた洗浄液を前記トレイに案内する第2ガイド部をさらに含む、付記1に記載のウェハー洗浄装置。
前記第2ガイド部は、前記リフト部の下部周縁面にボルト締結される、付記9に記載のウェハー洗浄装置。
前記第2ガイド部は、前記リフト部の下部を囲むと共に洗浄液が流れ下るように案内する傾斜面を有する筒状に構成される、付記9に記載のウェハー洗浄装置。
前記第2ガイド部は、非金属系の材質で構成される、付記9に記載のウェハー洗浄装置。
前記トレイは、非金属系の材質で構成される、付記1乃至12のいずれか一つに記載のウェハー洗浄装置。
Claims (13)
- 洗浄液を収容し、ウェハーが収納されたカセットがディッピングさせられることにより洗浄液がオーバーフローさせられる洗浄槽;
前記洗浄槽の外側に備えられ、前記カセットを前記洗浄槽内の洗浄液にディッピングさせる複数のリフト部;
前記洗浄槽とリフト部が収容され、洗浄液が排水される排水口が備えられた外部水槽;及び
前記外部水槽の内部底面に着脱可能であり、洗浄液を溜めて前記排水口に案内するトレイ;
を含むウェハー洗浄装置。 - 前記トレイには、
前記洗浄槽を支持するサポーターと、前記リフト部が貫通させられる装着口が備えられ、
前記外部水槽の排水口の内側に安着される排水ポートが下向きに突出するように備えられる、
請求項1に記載のウェハー洗浄装置。 - 前記トレイには、前記外部水槽の内側面と接する周縁部分に上向きに突出した外部側壁と、前記装着口にそれぞれ上向きに突出した複数の内部側壁が備えられる、請求項2に記載のウェハー洗浄装置。
- 前記トレイは、前記排水ポートに行くほど下向きに傾斜して構成される、請求項2に記載のウェハー洗浄装置。
- 前記外部水槽の内側面とトレイとの間に備えられ、前記外部水槽の内側面に落ちた洗浄液を前記トレイに案内する第1ガイド部をさらに含む、請求項1に記載のウェハー洗浄装置。
- 前記第1ガイド部は、前記外部水槽の下部内側面にボルト締結される、請求項5に記載のウェハー洗浄装置。
- 前記第1ガイド部は、洗浄液が流れ下るように案内する傾斜面を有するバー形状に構成される、請求項5に記載のウェハー洗浄装置。
- 前記第1ガイド部は、非金属系の材質で構成される、請求項5に記載のウェハー洗浄装置。
- 前記リフト部の周縁面とトレイとの間に備えられ、前記リフト部の周縁面に落ちた洗浄液を前記トレイに案内する第2ガイド部をさらに含む、請求項1に記載のウェハー洗浄装置。
- 前記第2ガイド部は、前記リフト部の下部周縁面にボルト締結される、請求項9に記載のウェハー洗浄装置。
- 前記第2ガイド部は、前記リフト部の下部を囲むと共に洗浄液が流れ下るように案内する傾斜面を有する筒状に構成される、請求項9に記載のウェハー洗浄装置。
- 前記第2ガイド部は、非金属系の材質で構成される、請求項9に記載のウェハー洗浄装置。
- 前記トレイは、非金属系の材質で構成される、請求項1乃至12のいずれか一項に記載のウェハー洗浄装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0069784 | 2018-06-18 | ||
KR1020180069784A KR102185097B1 (ko) | 2018-06-18 | 2018-06-18 | 웨이퍼 세정장치 |
PCT/KR2019/002813 WO2019245129A1 (ko) | 2018-06-18 | 2019-03-11 | 웨이퍼 세정장치 |
Publications (2)
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JP2021514542A JP2021514542A (ja) | 2021-06-10 |
JP7007491B2 true JP7007491B2 (ja) | 2022-01-24 |
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JP2020543530A Active JP7007491B2 (ja) | 2018-06-18 | 2019-03-11 | ウェハー洗浄装置 |
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US (1) | US20210035822A1 (ja) |
JP (1) | JP7007491B2 (ja) |
KR (1) | KR102185097B1 (ja) |
CN (1) | CN111712909B (ja) |
WO (1) | WO2019245129A1 (ja) |
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CN114721231B (zh) * | 2022-04-17 | 2023-04-11 | 江苏晟驰微电子有限公司 | 一种用于光刻版清洗的工装夹具 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001015469A (ja) | 1999-06-28 | 2001-01-19 | Nec Corp | Wet処理方法と装置 |
JP2004221343A (ja) | 2003-01-15 | 2004-08-05 | Tokyo Electron Ltd | 超音波洗浄装置 |
JP2009218514A (ja) | 2008-03-12 | 2009-09-24 | Fujitsu Microelectronics Ltd | 洗浄装置、洗浄方法及び半導体装置の製造方法 |
JP2012507881A (ja) | 2008-11-04 | 2012-03-29 | シルトロン インク | 対象物の湿式処理装置及び方法、並びにそれに使用される流体拡散板及びバレル |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62213257A (ja) * | 1986-03-14 | 1987-09-19 | Mitsubishi Electric Corp | 湿式処理槽 |
JP3225441B2 (ja) * | 1991-04-23 | 2001-11-05 | 東京エレクトロン株式会社 | 処理装置 |
JP3003017B2 (ja) * | 1993-05-26 | 2000-01-24 | 東京エレクトロン株式会社 | 洗浄処理装置 |
JPH11168077A (ja) * | 1997-12-04 | 1999-06-22 | Sony Corp | 基板洗浄装置 |
KR19990039059U (ko) * | 1998-04-03 | 1999-11-05 | 김영환 | 반도체 웨이퍼 세정용 에이치큐디알 베스의 순수냉각장치 |
KR20030008448A (ko) * | 2001-07-18 | 2003-01-29 | 삼성전자 주식회사 | 보조 싱크대를 갖는 습식 세정 장치의 배쓰 유닛 |
JP2014170782A (ja) * | 2013-03-01 | 2014-09-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR20180060059A (ko) * | 2016-11-28 | 2018-06-07 | 에스케이실트론 주식회사 | 웨이퍼 세정 장치 |
-
2018
- 2018-06-18 KR KR1020180069784A patent/KR102185097B1/ko active IP Right Grant
-
2019
- 2019-03-11 US US16/981,228 patent/US20210035822A1/en active Pending
- 2019-03-11 CN CN201980013114.0A patent/CN111712909B/zh active Active
- 2019-03-11 JP JP2020543530A patent/JP7007491B2/ja active Active
- 2019-03-11 WO PCT/KR2019/002813 patent/WO2019245129A1/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001015469A (ja) | 1999-06-28 | 2001-01-19 | Nec Corp | Wet処理方法と装置 |
JP2004221343A (ja) | 2003-01-15 | 2004-08-05 | Tokyo Electron Ltd | 超音波洗浄装置 |
JP2009218514A (ja) | 2008-03-12 | 2009-09-24 | Fujitsu Microelectronics Ltd | 洗浄装置、洗浄方法及び半導体装置の製造方法 |
JP2012507881A (ja) | 2008-11-04 | 2012-03-29 | シルトロン インク | 対象物の湿式処理装置及び方法、並びにそれに使用される流体拡散板及びバレル |
Also Published As
Publication number | Publication date |
---|---|
KR102185097B1 (ko) | 2020-12-01 |
US20210035822A1 (en) | 2021-02-04 |
CN111712909A (zh) | 2020-09-25 |
KR20190142619A (ko) | 2019-12-27 |
WO2019245129A1 (ko) | 2019-12-26 |
CN111712909B (zh) | 2023-08-22 |
JP2021514542A (ja) | 2021-06-10 |
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