JP6998499B1 - 磁気ディスク用アルミニウム合金基板、ならびに、当該磁気ディスク用アルミニウム合金基板を用いた磁気ディスク - Google Patents

磁気ディスク用アルミニウム合金基板、ならびに、当該磁気ディスク用アルミニウム合金基板を用いた磁気ディスク Download PDF

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Publication number
JP6998499B1
JP6998499B1 JP2021544286A JP2021544286A JP6998499B1 JP 6998499 B1 JP6998499 B1 JP 6998499B1 JP 2021544286 A JP2021544286 A JP 2021544286A JP 2021544286 A JP2021544286 A JP 2021544286A JP 6998499 B1 JP6998499 B1 JP 6998499B1
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Japan
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aluminum alloy
alloy substrate
particles
less
magnetic disk
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JP2021544286A
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English (en)
Japanese (ja)
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JPWO2021206095A1 (https=
Inventor
北脇高太郎
坂本遼
熊谷航
畠山英之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
UACJ Corp
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Furukawa Electric Co Ltd
UACJ Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739—Magnetic recording media substrates
    • G11B5/73911—Inorganic substrates
    • G11B5/73917—Metallic substrates, i.e. elemental metal or metal alloy substrates
    • G11B5/73919—Aluminium or titanium elemental or alloy substrates
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/047—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2021544286A 2020-04-06 2021-04-06 磁気ディスク用アルミニウム合金基板、ならびに、当該磁気ディスク用アルミニウム合金基板を用いた磁気ディスク Active JP6998499B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068368 2020-04-06
JP2020068368 2020-04-06
PCT/JP2021/014655 WO2021206095A1 (ja) 2020-04-06 2021-04-06 磁気ディスク用アルミニウム合金基板、ならびに、当該磁気ディスク用アルミニウム合金基板を用いた磁気ディスク

Publications (2)

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JPWO2021206095A1 JPWO2021206095A1 (https=) 2021-10-14
JP6998499B1 true JP6998499B1 (ja) 2022-02-04

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JP2021544286A Active JP6998499B1 (ja) 2020-04-06 2021-04-06 磁気ディスク用アルミニウム合金基板、ならびに、当該磁気ディスク用アルミニウム合金基板を用いた磁気ディスク

Country Status (5)

Country Link
US (1) US20230111915A1 (https=)
JP (1) JP6998499B1 (https=)
CN (1) CN115362501B (https=)
MY (1) MY197973A (https=)
WO (1) WO2021206095A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190475B2 (ja) * 2020-12-15 2022-12-15 株式会社Uacj 磁気ディスク用アルミニウム合金基板及び磁気ディスク
JP7794722B2 (ja) * 2022-10-17 2026-01-06 株式会社神戸製鋼所 磁気ディスク用アルミニウム合金板、磁気ディスク用アルミニウム合金ブランク及び磁気ディスク用アルミニウム合金サブストレート
KR102842601B1 (ko) * 2022-12-29 2025-08-04 고등기술연구원연구조합 알루미늄 합금 타겟 및 이의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634050A (ja) * 1986-06-24 1988-01-09 Sumitomo Light Metal Ind Ltd 磁気デイスク用アルミニウム合金基板の製造法
JP2019160384A (ja) * 2018-03-09 2019-09-19 株式会社Uacj 磁気ディスク用基板及びその製造方法、並びに、当該磁気ディスク用基板を用いた磁気ディスク
JP2019167602A (ja) * 2018-03-26 2019-10-03 株式会社Uacj 磁気ディスク用アルミニウム合金板及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金板を用いた磁気ディスク
JP2019167601A (ja) * 2018-03-26 2019-10-03 株式会社Uacj 磁気ディスク用アルミニウム合金板及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金板を用いた磁気ディスク
JP2020029595A (ja) * 2018-08-23 2020-02-27 株式会社Uacj 磁気ディスク用アルミニウム合金ブランク及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金ブランクを用いた磁気ディスク及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080109938A (ko) * 2006-05-18 2008-12-17 가부시키가이샤 고베 세이코쇼 알루미늄 합금 후판의 제조방법 및 알루미늄 합금 후판
JP6832179B2 (ja) * 2017-02-03 2021-02-24 昭和電工株式会社 磁気記録媒体用基板およびハードディスクドライブ
JP6437583B2 (ja) * 2017-02-27 2018-12-12 株式会社Uacj 磁気ディスク基板用アルミニウム合金板及びその製造方法、ならびに、この磁気ディスク基板用アルミニウム合金板を用いた磁気ディスク
JP6389546B1 (ja) * 2017-05-12 2018-09-12 株式会社Uacj 磁気ディスク用アルミニウム合金基板及びその製造方法、ならびに、この磁気ディスク用アルミニウム合金基板を用いた磁気ディスク
JP6640958B1 (ja) * 2018-11-15 2020-02-05 株式会社神戸製鋼所 磁気ディスク用アルミニウム合金板、磁気ディスク用アルミニウム合金ブランクおよび磁気ディスク用アルミニウム合金サブストレート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634050A (ja) * 1986-06-24 1988-01-09 Sumitomo Light Metal Ind Ltd 磁気デイスク用アルミニウム合金基板の製造法
JP2019160384A (ja) * 2018-03-09 2019-09-19 株式会社Uacj 磁気ディスク用基板及びその製造方法、並びに、当該磁気ディスク用基板を用いた磁気ディスク
JP2019167602A (ja) * 2018-03-26 2019-10-03 株式会社Uacj 磁気ディスク用アルミニウム合金板及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金板を用いた磁気ディスク
JP2019167601A (ja) * 2018-03-26 2019-10-03 株式会社Uacj 磁気ディスク用アルミニウム合金板及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金板を用いた磁気ディスク
JP2020029595A (ja) * 2018-08-23 2020-02-27 株式会社Uacj 磁気ディスク用アルミニウム合金ブランク及びその製造方法、ならびに、当該磁気ディスク用アルミニウム合金ブランクを用いた磁気ディスク及びその製造方法

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Publication number Publication date
MY197973A (en) 2023-07-25
WO2021206095A1 (ja) 2021-10-14
CN115362501B (zh) 2023-05-12
JPWO2021206095A1 (https=) 2021-10-14
US20230111915A1 (en) 2023-04-13
CN115362501A (zh) 2022-11-18

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