JP6995612B2 - Adhesive sheet with integrated dicing tape - Google Patents

Description

The present invention relates to a dicing tape integrated adhesive sheet that can be used in the manufacturing process of a semiconductor device.

In the manufacturing process of a semiconductor device, a dicing tape-integrated adhesive sheet having a corresponding size is attached to the semiconductor wafer as a work, and then the semiconductor wafer and the adhesive sheet are individualized. In some cases, a semiconductor chip with a small piece of adhesive sheet may be obtained. Examples of the dicing tape integrated adhesive sheet include a so-called dicing die bond film and a dicing tape integrated back surface protective film. The dicing die bond film has, for example, a dicing tape having a laminated structure including a base material and an adhesive layer, and a dicing film in close contact with the adhesive layer, and is a semiconductor chip with a small piece of die bond film for die bonding. Used to obtain. On the other hand, the dicing tape integrated back surface protective film has, for example, a dicing tape having a laminated structure including a base material and an adhesive layer, and a back surface protective film in close contact with the adhesive layer, and is used for protecting the back surface of a semiconductor chip. It is used to obtain a semiconductor chip with a backside protective film of a small piece of. Techniques related to these dicing tape-integrated adhesive sheets are described in, for example, Patent Documents 1 to 4 below.

Japanese Unexamined Patent Publication No. 2007-2173 Japanese Unexamined Patent Publication No. 2010-177401 Japanese Unexamined Patent Publication No. 2011-151360 Japanese Unexamined Patent Publication No. 2016-21244

In order to obtain a semiconductor chip with an adhesive sheet, blade dicing is performed on the semiconductor wafer held on the adhesive sheet surface of the dicing tape integrated adhesive sheet as described above. May be struck. In blade dicing, the semiconductor wafer and the adhesive sheet of the dicing tape integrated adhesive sheet that holds the semiconductor wafer are cut by a dicing blade that rotates at high speed, and small pieces of the adhesive sheet are formed. It is individualized into a plurality of semiconductor chips accompanied by. In this blade dicing step, cutting is advanced while running water is continuously supplied to the dicing blade and the semiconductor wafer for the purpose of removing cutting chips that are inevitably generated.

In such a cutting process, when the cutting depth of the dicing blade that cuts the semiconductor wafer or the like from the side opposite to the dicing tape reaches the base material of the dicing tape, fibrous cutting chips are generated. Sometimes. In the base material, frictional heat is generated at the points where it comes into contact with the high-speed rotating dicing blade, and the base material constituting the base material softened and melted by the frictional heat is stretched by the tensile action received from the high-speed rotating dicing blade, thereby forming a fibrous material. It is considered that cutting chips are generated. This fibrous debris often remains attached to the work that has undergone the blade dicing step under running water supply. From the viewpoint of achieving high surface cleanliness in the work, it is desired that the amount of such fibrous debris generated during blade dicing is smaller.

On the other hand, as a method for obtaining a semiconductor chip with a dicing tape-integrated adhesive sheet, the dicing tape-integrated adhesive sheet is held in a state where the semiconductor wafer is held on the adhesive sheet surface of the dicing tape-integrated adhesive sheet. A method of expanding an adhesive sheet in its radial direction is known. In this method, first, a semiconductor wafer that is cut together with an adhesive sheet and processed so that it can be separated into a plurality of semiconductor chips is bonded to, for example, a dicing tape-integrated adhesive sheet. It is held on the surface of the sheet. Then, the semiconductor wafer is held so as to cut the adhesive sheet so that a plurality of adhesive sheet pieces, each of which is in close contact with the semiconductor chip, are generated from the adhesive sheet on the dicing tape. The dicing tape integrated adhesive sheet is expanded in its radial direction. A semiconductor with a small piece of adhesive sheet when the expansion of the dicing tape-integrated adhesive sheet causes the adhesive sheet and the semiconductor wafer on it to be split along the planned cutting point. Chips will be generated. In such an expanding step for cutting, it is required that the dicing tape-integrated adhesive sheet is appropriately divided along the adhesive sheet and the semiconductor wafer on the adhesive sheet to be appropriately divided.

The present invention has been conceived under such circumstances, and an object thereof is suitable for suppressing the generation of fibrous debris during blade dicing, and at the same time, good cutting in the expanding step for cutting. It is an object of the present invention to provide a dicing tape integrated adhesive sheet suitable for realizing the property.

The dicing tape integrated adhesive sheet provided by the present invention includes a dicing tape and an adhesive sheet. The dicing tape has a laminated structure including a base material and an adhesive layer. The adhesive sheet is removably adhered to the adhesive layer of the dicing tape. The substrate contains ethylene-vinyl acetate copolymer (EVA) as a main component and 3 to 45% by mass of ionomer resin. The main component in the base material is a component that occupies the largest mass ratio among the constituent components of the base material. The content ratio of the ionomer resin in the base material is preferably 5 to 40% by mass, more preferably 7 to 35% by mass, and more preferably 9 to 25% by mass. The dicing tape integrated adhesive sheet having such a structure can be used in the manufacturing process of the semiconductor device. Specifically, the dicing tape-integrated adhesive sheet of the present invention is a dicing die bond film in which the structure of a so-called dicing film is adopted for the adhesive sheet, and the adhesive adhesion for die bonding of the size equivalent to a chip is adopted. It can be used to obtain a semiconductor chip with a sex sheet. Further, the dicing tape integrated adhesive sheet of the present invention is a dicing tape integrated back surface protective film in which the structure of the so-called back surface protective film is adopted for the adhesive sheet, and is used for protecting the back surface of a semiconductor chip having a size equivalent to that of a chip. It can be used to obtain a semiconductor chip with a viscous adhesive sheet.

As described above, the base material of the dicing tape of the dicing tape integrated adhesive sheet contains EVA as a main component. The configuration in which the base material of the dicing tape contains EVA as the main component is suitable for realizing a base material having high uniformity and easy to stretch, and thus a dicing tape. Suitable for realizing a material and thus a dicing tape. In the expansion process for cutting, the dicing tape of the dicing tape integrated adhesive sheet or its base material has high uniformity and is easy to stretch, which means that the entire area of the adhesive sheet and the semiconductor wafer to be cut on the dicing tape is planned to be cut. It is suitable for exerting a splitting force with high uniformity, and therefore suitable for achieving good splitting property.

In addition, as described above, the base material of the dicing tape of the dicing tape integrated adhesive sheet contains 3 to 45% by mass of ionomer resin. The ionomer resin is a polymer material in which polymer chains are crosslinked by metal ions to form aggregates, and tends to have excellent wear resistance. The configuration in which the dicing tape base material contains such an ionomer resin in addition to EVA as the main component is contained in EVA as the main component, so that it is possible to secure appropriate hardness in a base material that is highly uniform and easily stretchable. It is suitable for suppressing the generation of fibrous debris derived from a base material due to the above-mentioned frictional heat and tensile action during blade dicing. When the cutting depth of the dicing blade reaches the dicing tape base material during blade dicing for the semiconductor wafer on the dicing tape integrated adhesive sheet, the base material contains ionomer resin in addition to EVA as the main component. This configuration is suitable for suppressing the generation of fibrous debris derived from the base material. The configuration in which the ionomer resin content of the dicing tape base material is 3% by mass or more is suitable for exhibiting such a fibrous waste suppressing effect to a significant extent in the dicing tape integrated adhesive sheet. The configuration in which the ionomer resin content of the dicing tape base material is 45% by mass or less causes the base material to exhibit a fibrous waste suppressing effect during blade dicing in the dicing tape integrated adhesive sheet. It is suitable for fully enjoying the above-mentioned effect (good splitting property in the expanding step for splitting) by containing EVA as the main component.

As described above, the dicing tape-integrated adhesive sheet is suitable for suppressing the generation of fibrous waste during blade dicing, and is also suitable for achieving good splitability in the expansion step for splitting. be. Specifically, it is as shown in Examples and Comparative Examples described later. Such a dicing tape-integrated adhesive sheet can be used both when blade dicing is performed and when expansion for cutting is performed as a method for obtaining a semiconductor chip with an adhesive sheet. ..

The base material of the dicing tape in this dicing tape integrated adhesive sheet is a base material test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, a distance of -15 ° C., and a tensile speed of 100 mm / min (first condition). The tensile elastic modulus shown in the conducted tensile test is preferably 9 MPa or more, more preferably 10 MPa or more, more preferably 11 MPa or more, and even more preferably 12 MPa or more. Such a configuration is used for dicing from the expanded dicing tape or its base material in the expansion step for cutting performed using the dicing tape integrated adhesive sheet in order to obtain a semiconductor chip with an adhesive sheet. It is preferable for applying a sufficient breaking force to the adhesive sheet and the semiconductor wafer on the tape, and therefore, it is preferable for achieving good breaking property.

The base material of the dicing tape in the dicing tape integrated adhesive sheet has a tensile elastic modulus of preferably 30 MPa or less, more preferably 30 MPa or less, which is shown in the tensile test performed under the first condition for the base material test piece having a width of 10 mm. Is 20 MPa or less, more preferably 15 MPa or less. In such a configuration, in the expansion step for cutting performed using the dicing tape integrated adhesive sheet in order to obtain a semiconductor chip with an adhesive sheet, the dicing tape is stretched with high uniformity and the dicing is performed. It is preferable for applying a highly uniform and breaking force to the entire area of the adhesive sheet and the semiconductor wafer to be cut on the tape, and therefore, it is preferable for realizing good breaking property in the expanding step for cutting.

The base material of the dicing tape in the dicing tape integrated adhesive sheet has a tensile stress of preferably 25 N, which is shown by a strain value of 10% in the tensile test performed under the first condition for the base material test piece having a width of 10 mm. Below, it is more preferably 20 N or less, and more preferably 12 N or less. Further, the dicing tape base material has a tensile stress of preferably 25 N or less, more preferably 20 N or less, more preferably 20 N or less, which is shown by a strain value of 30% in the tensile test performed under the first condition for a base material test piece having a width of 10 mm. Is 18N or less. These configurations are made by using the dicing tape integrated adhesive sheet in order to obtain a semiconductor chip with the adhesive sheet, and the adhesive sheet is fragmented on the dicing tape in the expansion step for cutting. It is preferable to prevent the end portion of the dicing tape from being partially or wholly peeled off from the dicing tape.

The base material of the dicing tape in the dicing tape integrated adhesive sheet is a base material test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, a 25 ° C. and a tensile speed of 100 mm / min (second condition). The tensile elastic modulus shown in the tensile test is preferably 15 MPa or less, more preferably 10 MPa or less, and more preferably 7.5 MPa or less. The dicing tape base material has a tensile stress of preferably 15 N or less, more preferably 10 N or less, more preferably 10 N or less, which is shown by a strain value of 10% in the tensile test performed under the second condition for a base material test piece having a width of 10 mm. It is 6N or less. Further, the dicing tape base material has a tensile stress of preferably 15 N or less, more preferably 12 N or less, which is shown by a strain value of 30% in the tensile test performed under the second condition for the base material test piece having a width of 10 mm. It is preferably 10 N or less. These configurations are for increasing the separation distance of the semiconductor chips with a plurality of adhesive sheets after the expansion step for splitting performed while the dicing tape-integrated adhesive sheet holds the semiconductor wafer. In the step of re-expanding the dicing tape, it is preferable to prevent the end portion of the adhesive sheet piece on the dicing tape from being partially or wholly peeled off from the dicing tape.

It is sectional drawing of the dicing tape integrated adhesive sheet which concerns on one Embodiment of this invention. A part of the process of manufacturing the dicing tape integrated adhesive sheet shown in FIG. 1 is shown. The process following FIG. 2 is shown. A part of the steps in the method for manufacturing a semiconductor device in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used is shown. The process following the process shown in FIG. 4 is represented. It represents a part of the steps in another semiconductor device manufacturing method in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used. The process following the process shown in FIG. 6 is represented. The process following the process shown in FIG. 7 is represented. The process following the process shown in FIG. 8 is represented. The process following the process shown in FIG. 9 is represented. A part of the steps in the modified example of the method for manufacturing a semiconductor device in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used is shown. A part of the steps in the modified example of the method for manufacturing a semiconductor device in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used is shown. A part of the steps in the modified example of the method for manufacturing a semiconductor device in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used is shown. A part of the steps in the modified example of the method for manufacturing a semiconductor device in which the dicing tape integrated adhesive sheet shown in FIG. 1 is used is shown.

FIG. 1 is a schematic cross-sectional view of a dicing tape-integrated adhesive sheet X according to an embodiment of the present invention. The dicing tape-integrated adhesive sheet X can be used in the process of obtaining a semiconductor chip with an adhesive sheet in the manufacture of a semiconductor device. In this embodiment, the dicing tape 10 and the adhesive sheet X can be used. It has a laminated structure including an adhesive sheet 20 and a separator S. Further, the dicing tape integrated adhesive sheet X has a disk shape having a size corresponding to the semiconductor wafer to be processed in the manufacturing process of the semiconductor device, and its diameter is, for example, in the range of 345 to 380 mm (12). Inch wafer compatible type) 245 to 280 mm (8 inch wafer compatible type), 195 to 230 mm range (6 inch wafer compatible type), or 495 to 530 mm range (18 inch wafer compatible type) ..

In the dicing tape integrated adhesive sheet X, the dicing tape 10 has a laminated structure including the base material 11 and the pressure-sensitive adhesive layer 12. The adhesive sheet 20 has surfaces 20a and 20b, includes a work attachment area and a frame member attachment area on the surface 20a side, and is on the surface 20b side with respect to the adhesive layer 12 of the dicing tape 10. It is in close contact so that it can be peeled off. The separator S is arranged on the adhesive sheet 20 and can be peeled off from the adhesive sheet 20.

The base material 11 of the dicing tape 10 is an element that functions as a support in the dicing tape 10 or the dicing tape integrated adhesive sheet X. The base material 11 is a plastic base material and contains an ethylene-vinyl acetate copolymer (EVA) as a main component. The main component in the base material 11 is a component that occupies the largest mass ratio among the base material constituents. Further, the base material 11 contains an ionomer resin in addition to EVA. The ionomer resin is a polymer material in which the polymer main chains are crosslinked by metal ions to form aggregates. The content ratio of the ionomer resin in the base material 11 is 3 to 45% by mass, preferably 5 to 40% by mass, more preferably 7 to 35% by mass, and more preferably 9 to 25% by mass.

The base material 11 may contain one or more other resin materials in addition to the EVA and ionomer resins. Examples of such other resin materials include polyolefins other than EVA and ionomer resins, polyvinylidene chloride, polyvinylidene chloride, polyesters, polyurethanes, polycarbonates, polyether ether ketones, polyimides, polyetherimides, polyamides, and total aromatics. Examples thereof include polyamides, polyvinylidene sulfides, aramids, fluororesins, cellulose-based resins, and silicone resins. Examples of the polyolefin include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolyprolene, polybutene, and polymethylpentene. , Ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, ethylene-butene copolymer, and ethylene-hexene copolymer. Examples of the polyester include polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT).

The base material 11 may be a non-stretched film, a uniaxially stretched film, or a biaxially stretched film. Further, when the pressure-sensitive adhesive layer 12 on the base material 11 has ultraviolet curability, it is preferable that the base material 11 has ultraviolet transparency.

When the dicing tape 10 or the base material 11 is shrunk by, for example, partial heating in the process of using the dicing tape integrated adhesive sheet X, the base material 11 is preferably heat-shrinkable. The configuration in which the base material 11 contains EVA as a main component is preferable in order to ensure good heat shrinkage in the base material 11. Further, in order to realize isotropic heat shrinkage of the dicing tape 10 to the base material 11, the base material 11 is preferably a biaxially stretched film. Such a base material 11 or a dicing tape 10 has a heat shrinkage rate of, for example, 2 to 30% in a heat treatment test conducted under the conditions of a heat temperature of 100 ° C. and a heat treatment time of 60 seconds. The heat shrinkage rate is defined as at least one of a so-called MD direction heat shrinkage rate and a so-called TD direction heat shrinkage rate.

The surface of the base material 11 on the pressure-sensitive adhesive layer 12 side may be subjected to a physical treatment, a chemical treatment, or an undercoating treatment for enhancing the adhesion to the pressure-sensitive adhesive layer 12. Physical treatments include, for example, corona treatment, plasma treatment, sandmat processing, ozone exposure treatment, flame exposure treatment, high voltage impact exposure treatment, and ionizing radiation treatment. Examples of the chemical treatment include chromic acid treatment. It is preferable that the treatment for enhancing the adhesion is applied to the entire surface of the base material 11 on the pressure-sensitive adhesive layer 12 side.

The thickness of the base material 11 is preferably 40 μm or more, preferably 40 μm or more, from the viewpoint of ensuring the strength for the base material 11 to function as a support in the dicing tape 10 or the dicing tape integrated adhesive sheet X. It is 50 μm or more, more preferably 55 μm or more, and more preferably 60 μm or more. Further, from the viewpoint of achieving appropriate flexibility in the dicing tape 10 or the dicing tape integrated adhesive sheet X, the thickness of the base material 11 is preferably 200 μm or less, more preferably 180 μm or less, and more. It is preferably 150 μm or less.

The base material 11 of the dicing tape 10 in the dicing tape integrated adhesive sheet X has a basic chuck distance of 10 mm, an initial chuck distance of -15 ° C., and a tensile speed of 100 mm / min for a base material test piece having a width of 10 mm (first condition). ), The tensile elastic modulus shown in the tensile test is preferably 9 MPa or more, more preferably 10 MPa or more, more preferably 11 MPa or more, and even more preferably 12 MPa or more.

The substrate 11 has a tensile elastic modulus of preferably 30 MPa or less, more preferably 20 MPa or less, and even more preferably 15 MPa or less, which is shown in the tensile test performed under the first condition for a substrate test piece having a width of 10 mm.

The substrate 11 has a tensile stress of preferably 25 N or less, more preferably 20 N or less, still more preferably 12 N or less, which is shown by a strain value of 10% in the tensile test performed under the first condition for a substrate test piece having a width of 10 mm. Is.

The substrate 11 has a tensile stress of preferably 25 N or less, more preferably 20 N or less, and more preferably 18 N or less, which is shown by a strain value of 30% in the tensile test performed under the first condition for a substrate test piece having a width of 10 mm. be.

The substrate 11 has a tensile elastic modulus of preferably 15 MPa, which is shown in a tensile test conducted on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, 25 ° C. and a tensile speed of 100 mm / min (second condition). Below, it is more preferably 10 MPa or less, and more preferably 7.5 MPa or less.

The substrate 11 has a tensile stress of preferably 15 N or less, more preferably 10 N or less, still more preferably 6 N or less, which is shown by a strain value of 10% in a tensile test performed under the second condition for a substrate test piece having a width of 10 mm. Is.

The substrate 11 has a tensile stress of preferably 15 N or less, more preferably 12 N or less, still more preferably 10 N or less, which is shown by a strain value of 30% in a tensile test performed under the second condition for a substrate test piece having a width of 10 mm. Is.

The pressure-sensitive adhesive layer 12 of the dicing tape 10 contains a pressure-sensitive adhesive. The adhesive may be an adhesive (adhesive-reducing adhesive) that can intentionally reduce the adhesive force by an external action such as irradiation or heating, or may be adhesive depending on the external action. It may be a pressure-sensitive adhesive (adhesive strength non-reducing type pressure-sensitive adhesive) in which the force is hardly reduced or not reduced at all. Whether to use the adhesive strength reducing type adhesive or the adhesive strength non-reducing type adhesive as the adhesive in the adhesive layer 12 is individualized by using the dicing tape integrated adhesive adhesive sheet X. It can be appropriately selected according to the usage mode of the dicing tape-integrated adhesive sheet X, such as the method and conditions for individualizing the semiconductor chip.

When a pressure-reducing pressure-sensitive adhesive is used as the pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12, it is relative to the state in which the pressure-sensitive adhesive layer 12 exhibits a relatively high pressure-sensitive adhesive force in the process of using the adhesive tape-integrated adhesive-adhesive sheet X. It is possible to properly use the state showing a low adhesive strength. For example, when the dicing tape-integrated adhesive sheet X is used in the expanding step described later, the adhesive layer 12 is used to suppress or prevent the adhesive sheet 20 from floating or peeling from the adhesive layer 12. In the pickup process described later for picking up the semiconductor chip with the adhesive sheet from the dicing tape 10 of the dicing tape integrated adhesive sheet X, while utilizing the high adhesive strength state of the above. It is possible to utilize the low adhesive strength state of the pressure-sensitive adhesive layer 12 in order to facilitate picking up of the semiconductor chip with the adhesive-adhesive sheet from the agent layer 12.

Examples of such a pressure-reducing pressure-sensitive adhesive include a radiation-curable pressure-sensitive adhesive (radiation-curable pressure-sensitive adhesive) and a heat-foaming type pressure-sensitive adhesive. In the pressure-sensitive adhesive layer 12 of the present embodiment, one type of pressure-reducing pressure-sensitive adhesive may be used, or two or more types of pressure-reducing pressure-sensitive adhesive may be used. Further, the entire pressure-sensitive adhesive layer 12 may be formed of a pressure-reducing pressure-sensitive adhesive, or a part of the pressure-sensitive adhesive layer 12 may be formed of a pressure-reducing pressure-sensitive adhesive. For example, when the pressure-sensitive adhesive layer 12 has a single-layer structure, the entire pressure-sensitive adhesive layer 12 may be formed of a pressure-reducing pressure-sensitive adhesive, or a predetermined portion of the pressure-sensitive adhesive layer 12 may be a pressure-reducing pressure-sensitive adhesive. And other sites may be formed from a non-adhesive non-reducing pressure-sensitive adhesive. When the pressure-sensitive adhesive layer 12 has a laminated structure, all the layers forming the laminated structure may be formed of the pressure-reducing pressure-sensitive adhesive, and some layers in the laminated structure may be the pressure-reducing pressure-sensitive adhesive. It may be formed from.

As the radiation-curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12, for example, a type of pressure-sensitive adhesive that is cured by irradiation with electron beam, ultraviolet rays, α-rays, β-rays, γ-rays, or X-rays can be used. A curable type pressure-sensitive adhesive (ultraviolet curable pressure-sensitive adhesive) can be particularly preferably used.

Examples of the radiation-curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 include a base polymer such as an acrylic pressure-sensitive adhesive and a radiation-polymerizable monomer having a functional group such as a radiation-polymerizable carbon-carbon double bond. Examples thereof include additive-type radiation-curable pressure-sensitive adhesives containing components and oligomer components.

The acrylic polymer described above preferably contains a monomer unit derived from an acrylic acid ester and / or a methacrylic acid ester as the monomer unit having the largest mass ratio. "(Meta) acrylic" shall mean "acrylic" and / or "methacrylic".

Examples of the (meth) acrylic acid ester for forming the monomer unit of the acrylic polymer include hydrocarbon groups such as (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, and (meth) acrylic acid aryl ester. Included (meth) acrylic acid esters. Examples of the (meth) acrylic acid alkyl ester include methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester and iso of (meth) acrylic acid. Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, Examples include octadecyl ester and ecosil ester. Examples of the (meth) acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth) acrylic acid. Examples of the (meth) acrylic acid aryl ester include (meth) acrylic acid phenyl and (meth) acrylic acid benzyl. As the monomer component for forming the monomer unit of the acrylic polymer, one kind of (meth) acrylic acid ester may be used, or two or more kinds of (meth) acrylic acid esters may be used. As the (meth) acrylic acid ester for forming the monomer unit of the acrylic polymer, a (meth) acrylic acid alkyl ester having an alkyl group having 10 or more carbon atoms is preferable, and dodecyl acrylate is more preferable. Further, in order to appropriately develop the basic properties such as the adhesiveness due to the (meth) acrylic acid ester in the pressure-sensitive adhesive layer 12, the ratio of the (meth) acrylic acid ester in all the monomer components for forming the acrylic polymer. Is preferably 40% by mass or more, more preferably 60% by mass or more.

The acrylic polymer contains a monomer unit derived from one or more other monomers copolymerizable with the (meth) acrylic acid ester in order to modify its cohesive force, heat resistance, etc. May be good. Such other monomers include functionalities such as, for example, carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, acrylamide, and acrylonitrile. Group-containing monomers can be mentioned. Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of the acid anhydride monomer include maleic anhydride and itaconic anhydride. Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, and (. Examples include 8-hydroxyoctyl acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxydodecyl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate. Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate and methyl glycidyl (meth) acrylate. Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methyl propane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, and (meth). ) Acryloyloxynaphthalene sulfonic acid can be mentioned. Examples of the phosphoric acid group-containing monomer include 2-hydroxyethylacryloyl phosphate.

The acrylic polymer may contain a monomer unit derived from a polyfunctional monomer copolymerizable with a monomer such as (meth) acrylic acid ester in order to form a crosslinked structure in the polymer skeleton. Such polyfunctional monomers include, for example, hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate (ie polyglycidyl (meth) acrylate), polyester Examples thereof include (meth) acrylate and urethane (meth) acrylate. As the monomer for the acrylic polymer, one kind of polyfunctional monomer may be used, or two or more kinds of polyfunctional monomers may be used. The ratio of the polyfunctional monomer in all the monomer components for forming the acrylic polymer is preferable in order to appropriately express the basic properties such as the tackiness due to the (meth) acrylic acid ester in the pressure-sensitive adhesive layer 12. It is 40% by mass or less, preferably 30% by mass or less.

The acrylic polymer can be obtained by polymerizing a raw material monomer for forming the acrylic polymer. Polymerization methods include, for example, solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization. From the viewpoint of high cleanliness in the method for manufacturing a semiconductor device in which the dicing tape 10 or the dicing tape integrated adhesive sheet X is used, the adhesive layer in the dicing tape 10 or the dicing tape integrated adhesive sheet X. The number of low molecular weight components in 12 is preferably small, and the number average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000.

The pressure-sensitive adhesive layer 12 or the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 may contain, for example, an external cross-linking agent in order to increase the number average molecular weight of the base polymer such as an acrylic polymer. Examples of the external cross-linking agent for reacting with a base polymer such as an acrylic polymer to form a cross-linked structure include polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenol-based compounds and the like), aziridine compounds, and melamine-based cross-linking agents. .. The content of the external cross-linking agent in the pressure-sensitive adhesive layer 12 or the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is preferably 6 parts by mass or less, and more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the base polymer.

Examples of the above-mentioned radiopolymerizable monomer component for forming a radiation-curable pressure-sensitive adhesive include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol mono. Hydroxypenta (meth) acrylates, dipentaerythritol hexa (meth) acrylates, and 1,4-butanediol di (meth) acrylates can be mentioned. Examples of the above-mentioned radiopolymerizable oligomer component for forming a radiation-curable pressure-sensitive adhesive include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based, and have a molecular weight of about 100 to 30,000. The one is suitable. The total content of the radiopolymerizable monomer component and oligomer component in the radiation-curable pressure-sensitive adhesive is determined within a range in which the adhesive strength of the formed pressure-sensitive adhesive layer 12 can be appropriately reduced by irradiation, and acrylic polymers and the like are used. For example, it is 5 to 500 parts by mass, preferably 40 to 150 parts by mass with respect to 100 parts by mass of the base polymer. Further, as the additive-type radiation-curable pressure-sensitive adhesive, for example, those disclosed in Japanese Patent Application Laid-Open No. 60-196956 may be used.

The radiation-curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 contains, for example, a polymer side chain having a functional group such as a radiation-polymerizable carbon-carbon double bond, or a base polymer having a functional group at the end of the polymer main chain in the polymer main chain. Also included is an intrinsically curable pressure-sensitive adhesive. Such an intrinsically curable pressure-sensitive adhesive is suitable for suppressing an unintended change in adhesive properties over time due to the movement of low molecular weight components in the formed pressure-sensitive adhesive layer 12.

As the base polymer contained in the intrinsic radiation curable pressure-sensitive adhesive, a polymer having an acrylic polymer as a basic skeleton is preferable. As the acrylic polymer forming such a basic skeleton, the above-mentioned acrylic polymer in the additive-type radiation-curable pressure-sensitive adhesive can be adopted. As a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer, for example, a raw material monomer containing a monomer having a predetermined functional group (first functional group) is copolymerized to obtain an acrylic polymer. After obtaining the compound, a compound having a predetermined functional group (second functional group) capable of reacting with the first functional group and having a radiopolymerizable carbon-carbon double bond can be obtained as carbon-carbon. Examples thereof include a method of subjecting an acrylic polymer to a condensation reaction or an addition reaction while maintaining the radiation polymerizable property of the double bond.

Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, and an isocyanate group. And hydroxy groups. Of these combinations, a combination of a hydroxy group and an isocyanate group or a combination of an isocyanate group and a hydroxy group is preferable from the viewpoint of easiness of reaction tracking. Further, since it is technically difficult to produce a polymer having a highly reactive isocyanate group, the above-mentioned first functionality on the acrylic polymer side is that the acrylic polymer can be easily produced or obtained. It is more preferable that the group is a hydroxy group and the second functional group is an isocyanate group. In this case, the isocyanate compound having both a radiopolymerizable carbon-carbon double bond and an isocyanate group as a second functional group, that is, a radiopolymerizable unsaturated functional group-containing isocyanate compound is, for example, methacryloyl isocyanate, 2 -Methacryloyloxyethyl isocyanate (MOI), and m-isopropenyl-α, α-dimethylbenzylisocyanate.

The radiation curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include α-ketor compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, and camphor. Examples include quinone, halogenated ketones, acylphosphinoxides, and acylphosphonates. Examples of the α-ketol compound include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, and 2-methyl-2-hydroxypro. Examples include piophenone and 1-hydroxycyclohexylphenylketone. Examples of the acetophenone compound include methoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,2-diethoxyacetophenone, and 2-methyl-1- [4- (methylthio)-. Phenyl] -2-morpholinopropane-1 can be mentioned. Examples of the benzoin ether compound include benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether. Examples of the ketal-based compound include benzyldimethyl ketal. Examples of the aromatic sulfonyl chloride compound include 2-naphthalene sulfonyl chloride. Examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime. Examples of benzophenone compounds include benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of the thioxanthone compound include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropyl. Thioxanthone is mentioned. The content of the photopolymerization initiator in the radiation-curable pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of a base polymer such as an acrylic polymer.

The heat-foaming type pressure-sensitive adhesive that can be used for the pressure-sensitive adhesive layer 12 contains, for example, a pressure-sensitive adhesive and a component that foams or expands by heating. The heat-foaming type pressure-sensitive adhesive layer expands when the effervescent component and the expanding component contained therein are sufficiently heated, and an uneven shape is formed on the surface (adhesive surface) thereof. When the heated foamed pressure-sensitive adhesive layer receives such heating while the pressure-sensitive adhesive surface is attached to a predetermined adherend, the pressure-sensitive adhesive layer expands to form an uneven shape on the pressure-sensitive adhesive surface. The total area of adhesion to the adherend is reduced, and the adhesive strength to the adherend is reduced.

Examples of the pressure-sensitive adhesive for the heat-foaming type pressure-sensitive adhesive include an acrylic polymer as an acrylic-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive.

The acrylic polymer as the acrylic pressure-sensitive adhesive preferably contains a monomer unit derived from an acrylic acid ester and / or a methacrylic acid ester as the monomer unit having the largest mass ratio. Examples of such an acrylic polymer include the acrylic polymers described above with respect to the radiation curable pressure-sensitive adhesive.

Examples of the component that foams or expands by heating for the heat-foaming type pressure-sensitive adhesive include a foaming agent and a heat-expandable microsphere.

Examples of the foaming agent for the heat foaming pressure-sensitive adhesive include various inorganic foaming agents and organic foaming agents. Examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium boron hydride, and azides. Examples of the organic foaming agent include alkane hydrochloride, such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarboxylicamide, and barium azodicarboxylate, and paratoluenesulfonyl. Hydrazine compounds such as hydrazide and diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonylhydrazide), allylbis (sulfonylhydrazide), ρ-toluylenesulfonyl semicarbazide and 4,4'-oxybis Semi-carbazide compounds such as (benzenesulfonyl semicarbazide), triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole, as well as N, N'-dinitrosopentamethylenetetramine and N, N'-dimethyl. Examples thereof include N-nitroso compounds such as -N, N'-dinitrosoterephthalamide.

Examples of the heat-expandable microspheres for the heat-foaming pressure-sensitive adhesive include microspheres having a structure in which a substance that easily gasifies and expands by heating is enclosed in a shell. Substances that are easily gasified and expanded by heating include, for example, isobutane, propane, and pentane. A heat-expandable microsphere can be produced by encapsulating a substance that easily gasifies and expands by heating in a shell-forming substance by a core selvation method, an interfacial polymerization method, or the like. As the shell-forming substance, a substance exhibiting thermal meltability or a substance that can explode due to the action of thermal expansion of the encapsulating substance can be used. Examples of such substances include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethylmethacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.

Examples of the non-reducing adhesive strength type pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12 include pressure-sensitive pressure-sensitive adhesives. As the pressure-sensitive pressure-sensitive adhesive, for example, an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive using an acrylic polymer as a base polymer can be used. When the pressure-sensitive adhesive layer 12 contains an acrylic pressure-sensitive adhesive, the acrylic polymer as the base polymer of the acrylic pressure-sensitive adhesive preferably contains a monomer unit derived from a (meth) acrylic acid ester in a mass ratio. Included as the most abundant monomer unit in. Examples of such an acrylic polymer include the acrylic polymers described above with respect to the radiation curable pressure-sensitive adhesive.

As the pressure-sensitive pressure-sensitive adhesive in the pressure-sensitive adhesive layer 12, a pressure-sensitive adhesive in the form of the above-mentioned radiation-curable pressure-sensitive adhesive cured by irradiation may be used. Such a cured radiation-curable type adhesive may exhibit adhesiveness due to the polymer component depending on the content of the polymer component even if the adhesive force is reduced by irradiation, and is used for a predetermined period of time. In the embodiment, it is possible to exert the adhesive force that can be used to adhesively hold the adherend.

In the pressure-sensitive adhesive layer 12 of the present embodiment, one kind of non-reducing adhesive strength type adhesive may be used, or two or more kinds of non-reducing pressure-sensitive adhesive strength may be used. Further, the entire pressure-sensitive adhesive layer 12 may be formed of a non-reducing adhesive strength type adhesive, or a part of the pressure-sensitive adhesive layer 12 may be formed of a non-reducing pressure-sensitive adhesive. For example, when the pressure-sensitive adhesive layer 12 has a single-layer structure, the entire pressure-sensitive adhesive layer 12 may be formed of a non-reduced pressure-sensitive adhesive, or a predetermined portion of the pressure-sensitive adhesive layer 12 may be a non-reduced pressure-sensitive adhesive. It may be formed from a pressure-sensitive adhesive, and other portions may be formed from a pressure-reducing pressure-sensitive adhesive. When the pressure-sensitive adhesive layer 12 has a laminated structure, all the layers forming the laminated structure may be formed of a non-reduced adhesive strength type adhesive, and some layers in the laminated structure may be a non-reduced adhesive strength type. It may be formed from an adhesive.

In addition to the above-mentioned components, the pressure-sensitive adhesive layer 12 or the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 may contain a cross-linking accelerator, a pressure-sensitive adhesive, an antiaging agent, a coloring agent, and the like. Colorants include pigments and dyes. Further, the colorant may be a compound that is colored by being irradiated with radiation. Examples of such compounds include leuco dyes.

The thickness of the pressure-sensitive adhesive layer 12 is, for example, 1 to 50 μm, preferably 2 to 30 μm, and more preferably 5 to 25 μm.

The adhesive sheet 20 of the dicing tape integrated adhesive sheet X functions as an adhesive exhibiting thermosetting property, and holds a work such as a semiconductor wafer and a frame member such as a ring frame described later. It also has an adhesive function. In the present embodiment, the adhesive for forming the adhesive sheet 20 may have a composition containing a thermosetting resin and, for example, a thermoplastic resin as a binder component, and may react with the curing agent. It may have a composition containing a thermoplastic resin with a thermosetting functional group capable of forming a bond. When the adhesive for forming the adhesive sheet 20 has a composition containing a thermoplastic resin with a thermosetting functional group, the adhesive may further use a thermosetting resin (epoxy resin or the like). It does not need to be included. Such an adhesive sheet 20 may have a single-layer structure or a multi-layer structure.

When the adhesive sheet 20 contains a thermosetting resin together with a thermoplastic resin, the thermosetting resin may be, for example, an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, or a silicone resin. And thermosetting polyimide resin. As the thermosetting resin in the adhesive sheet 20, one kind of resin may be used, or two or more kinds of resins may be used. Epoxy resin is preferable as the thermosetting resin contained in the adhesive sheet 20 because the content of ionic impurities and the like that can cause corrosion of workpieces such as semiconductor chips tends to be small. Further, as the curing agent for the epoxy resin, a phenol resin is preferable.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type and orthocresol. Examples thereof include novolak type, trishydroxyphenylmethane type, tetraphenylol ethane type, hydantin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resins. Novolac type epoxy resin, biphenyl type epoxy resin, trishydroxyphenylmethane type epoxy resin, and tetraphenylol ethane type epoxy resin are highly reactive with phenol resin as a curing agent and have excellent heat resistance, so they are adherent. It is preferable as the epoxy resin contained in the adhesive sheet 20.

Examples of the phenol resin that can act as a curing agent for the epoxy resin include novolak type phenol resin, resol type phenol resin, and polyoxystyrene such as polyparaoxystyrene. Examples of the novolak type phenol resin include phenol novolac resin, phenol aralkyl resin, cresol novolak resin, tert-butylphenol novolak resin, and nonylphenol novolak resin. As the phenol resin that can act as a curing agent for the epoxy resin, one kind of phenol resin may be used, or two or more kinds of phenol resins may be used. Phenol novolac resin and phenol aralkyl resin are included in the adhesive sheet 20 because they tend to improve the connection reliability of the epoxy resin when used as a curing agent for an epoxy resin as an adhesive for die bonding. It is preferable as a curing agent for the epoxy resin.

From the viewpoint of sufficiently advancing the curing reaction between the epoxy resin and the phenol resin in the adhesive sheet 20, the phenol resin preferably has a hydroxyl group in the phenol resin per equivalent amount of epoxy groups in the epoxy resin component. It is contained in the adhesive sheet 20 in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.

The content ratio of the thermosetting resin in the adhesive sheet 20 is preferably 5 to 60% by mass, more preferably from the viewpoint of appropriately exhibiting the function as a thermosetting adhesive in the adhesive sheet 20. Is 10 to 50% by mass.

Examples of the thermoplastic resin contained in the adhesive sheet 20 include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, and ethylene-acrylic acid ester. Polymers, polybutadiene resins, polycarbonate resins, thermoplastic polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluororesins. Can be mentioned. As the thermoplastic resin in the adhesive sheet 20, one kind of resin may be used, or two or more kinds of resins may be used. As the thermoplastic resin contained in the adhesive sheet 20, an acrylic resin is preferable because it has few ionic impurities and high heat resistance, so that it is easy to secure the joining reliability of the adhesive sheet 20. Further, from the viewpoint of achieving both adhesiveness of the adhesive sheet 20 to a frame member such as a ring frame described later and prevention of residue at the time of peeling at room temperature or a temperature close to the room temperature, the adhesive sheet 20 is used. As the main component of the thermoplastic resin, it is preferable to contain a polymer having a glass transition temperature of −10 to 10 ° C. The main component of the thermoplastic resin is a resin component that occupies the largest mass ratio among the thermoplastic resin components.

As the glass transition temperature of the polymer, the glass transition temperature (theoretical value) obtained based on the following Fox formula can be used. The Fox formula is a relational expression between the glass transition temperature Tg of the polymer and the glass transition temperature Tgi of the homopolymer for each constituent monomer in the polymer. In the Fox formula below, Tg represents the glass transition temperature (° C.) of the polymer, Wi represents the weight fraction of the monomer i constituting the polymer, and Tgi represents the glass transition temperature (° C.) of the homopolymer of the monomer i. ) Is shown. Literature values can be used for the glass transition temperature of the homopolymer. For example, "New Polymer Bunko 7 Introduction to Synthetic Resins for Paints" (Kyozo Kitaoka, Polymer Publishing Association, 1995) and "Acrylic Ester Catalog (1997 Edition)" (Mitsubishi Rayon Co., Ltd.) have various single weights. The glass transition temperature of the coalescence is mentioned. On the other hand, the glass transition temperature of the homopolymer of the monomer can also be obtained by the method specifically described in JP-A-2007-51271.

Fox formula 1 / (273 + Tg) = Σ [Wi / (273 + Tgi)]

The acrylic resin contained in the adhesive sheet 20 as a thermoplastic resin preferably contains a monomer unit derived from (meth) acrylic acid ester as the main monomer unit having the largest mass ratio. As such a (meth) acrylic acid ester, for example, the same (meth) acrylic acid ester as described above for the acrylic polymer which is one component of the radiation-curable pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 can be used. can.

The acrylic resin contained as the thermoplastic resin in the adhesive sheet 20 may contain a monomer unit derived from one or more other monomers copolymerizable with the (meth) acrylic acid ester. .. Such other monomer components include, for example, functionalities such as a carboxy group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, and acrylonitrile. Group-containing monomers and various polyfunctional monomers can be mentioned. Specifically, acrylic polymers that are one component of a radiation-curable pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 can be copolymerized with (meth) acrylic acid esters. Other monomers similar to those described above can be used. From the viewpoint of achieving high cohesive force in the adhesive sheet 20, the acrylic resin contained in the adhesive sheet 20 is preferably a (meth) acrylic acid ester, a carboxy group-containing monomer, and nitrogen. It is a copolymer of an atom-containing monomer and a polyfunctional monomer. As the (meth) acrylic acid ester, a (meth) acrylic acid alkyl ester having an alkyl group having 4 or less carbon atoms is preferable. As the polyfunctional monomer, a polyglycidyl-based polyfunctional monomer is preferable. The acrylic resin contained in the adhesive sheet 20 is more preferably a copolymer of ethyl acrylate, butyl acrylate, acrylonitrile, and polyglycidyl (meth) acrylate.

When the adhesive sheet 20 contains a thermoplastic resin with a thermosetting functional group, for example, a thermosetting functional group-containing acrylic resin can be used as the thermoplastic resin. The acrylic resin for forming this thermosetting functional group-containing acrylic resin preferably contains a monomer unit derived from a (meth) acrylic acid ester as the main monomer unit having the largest mass ratio. As such a (meth) acrylic acid ester, for example, the same (meth) acrylic acid ester as described above for the acrylic polymer which is one component of the radiation-curable pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12 can be used. can. On the other hand, examples of the thermosetting functional group for forming a thermosetting functional group-containing acrylic resin include a glycidyl group, a carboxy group, a hydroxy group, and an isocyanate group. Of these, a glycidyl group and a carboxy group can be preferably used. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin or a carboxy group-containing acrylic resin can be preferably used. Further, as the curing agent for the thermosetting functional group-containing acrylic resin, for example, the above-mentioned external cross-linking agent may be used as a component of the radiation-curable pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12. can. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, a polyphenol-based compound can be preferably used as the curing agent, and for example, the above-mentioned various phenol resins can be used.

In order to achieve a certain degree of cross-linking of the adhesive sheet 20 before it is cured, for example, it reacts with the functional group at the end of the molecular chain of the above-mentioned resin contained in the adhesive sheet 20. It is preferable to add a polyfunctional compound that can be bonded to the resin composition for forming a viscous adhesive sheet as a cross-linking agent. Such a configuration is suitable for improving the adhesive properties of the adhesive sheet 20 at high temperatures and for improving the heat resistance. Examples of such a cross-linking agent include polyisocyanate compounds. Examples of the polyisocyanate compound include tolylene diisocyanate, diphenylmethane diisocyanate, p-phenylenediocyanate, 1,5-naphthalenediocyanate, and adducts of polyhydric alcohol and diisocyanate. The content of the cross-linking agent in the resin composition for forming the adhesive sheet is determined in the adhesive sheet 20 formed with respect to 100 parts by mass of the resin having the above-mentioned functional group that can react and bond with the cross-linking agent. From the viewpoint of achieving high cohesive force, it is preferably 0.05 parts by mass or more, and from the viewpoint of realizing high adhesive force in the formed adhesive adhesive sheet 20, it is preferably 7 parts by mass or less. Further, as the cross-linking agent in the adhesive sheet 20, another polyfunctional compound such as an epoxy resin may be used in combination with the polyisocyanate compound.

The content ratio of the above high molecular weight component in the adhesive sheet 20 is preferably 50 to 100% by mass, and more preferably 50 to 80% by mass. The high molecular weight component is a component having a weight average molecular weight of 10,000 or more. Such a configuration is preferable in order to achieve both stickability of the adhesive sheet 20 to a frame member such as a ring frame described later at room temperature and temperatures in the vicinity thereof and prevention of residue at the time of peeling. Further, the adhesive sheet 20 may contain a liquid resin that is liquid at 23 ° C. When the adhesive sheet 20 contains such a liquid resin, the content ratio of the liquid resin in the adhesive sheet 20 is preferably 1 to 10% by mass, more preferably 1 to 5% by mass. Such a configuration is preferable in order to achieve both stickability of the adhesive sheet 20 to a frame member such as a ring frame described later at room temperature and temperatures in the vicinity thereof and prevention of residue at the time of peeling.

The adhesive sheet 20 may contain a filler. By blending the filler into the adhesive sheet 20, it is possible to adjust the elastic modulus such as the tensile storage elastic modulus of the adhesive sheet 20 and the physical properties such as conductivity and thermal conductivity. Examples of the filler include an inorganic filler and an organic filler, and an inorganic filler is particularly preferable. Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, and crystals. In addition to quality silica and amorphous silica, simple metals such as aluminum, gold, silver, copper and nickel, alloys, amorphous carbon black and graphite can be mentioned. The filler may have various shapes such as a spherical shape, a needle shape, and a flake shape. The adhesive sheet 20 may contain one type of filler or two or more types of filler. In order to ensure the adhesiveness of the adhesive sheet 20 to a frame member such as a ring frame described later, the filler content in the adhesive sheet 20 is preferably 30% by mass or less, more preferably 25% by mass or less. Is.

When the adhesive sheet 20 contains a filler, the average particle size of the filler is preferably 0.005 to 10 μm, more preferably 0.005 to 1 μm. The configuration in which the average particle size of the filler is 0.005 μm or more is suitable for realizing high wettability and adhesiveness to an adherend such as a semiconductor wafer in the adhesive sheet 20. The configuration in which the average particle size of the filler is 10 μm or less is suitable for enjoying a sufficient filler addition effect in the adhesive sheet 20 and ensuring heat resistance. The average particle size of the filler can be obtained, for example, by using a luminous intensity type particle size distribution meter (trade name "LA-910", manufactured by HORIBA, Ltd.).

The adhesive sheet 20 may contain one kind or two or more kinds of other components, if necessary. Examples of the other component include a flame retardant, a silane coupling agent, and an ion trapping agent. Flame retardants include, for example, antimony trioxide, antimony pentoxide, and brominated epoxy resins. Examples of the silane coupling agent include β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. Examples of the ion trapping agent include hydrotalcites, bismuth hydroxide, hydroxide-containing antimony (for example, "IXE-300" manufactured by Toa Synthetic Co., Ltd.), and zirconium phosphate having a specific structure (for example, "IXE-300" manufactured by Toa Synthetic Co., Ltd.). IXE-100 "), magnesium silicate (for example," Kyoward 600 "manufactured by Kyowa Chemical Industry Co., Ltd.), and aluminum silicate (for example," Kyoward 700 "manufactured by Kyowa Chemical Industry Co., Ltd.). A compound capable of forming a complex with a metal ion can also be used as an ion trapping agent. Examples of such compounds include triazole-based compounds, tetrazole-based compounds, and bipyridyl-based compounds. Of these, a triazole-based compound is preferable from the viewpoint of the stability of the complex formed with the metal ion. Examples of such triazole compounds include 1,2,3-benzotriazole, 1- {N, N-bis (2-ethylhexyl) aminomethyl} benzotriazole, carboxybenzotriazole, 2- (2-hydroxy-). 5-Methylphenyl) Benzotriazole 2- (2-Hydroxy-3,5-di-t-butylphenyl) -5-Chlorobenzotriazole 2- (2-Hydroxy-3-t-butyl-5-methylphenyl) )-5-Chlorobenzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-5-t-octylphenyl) benzotriazole, 6- (2) -Benzotriazolyl) -4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebisphenol, 1- (2,3-dihydroxypropyl) benzotriazole, 1- (1) , 2-Dicarboxydiethyl) benzotriazole, 1- (2-ethylhexylaminomethyl) benzotriazole, 2,4-di-t-pentyl-6-{(H-benzotriazole-1-yl) methyl} phenol, 2 -(2-Hydroxy-5-t-butylphenyl) -2H-benzotriazole, octyl-3- [3-t-butyl-4-hydroxy-5- (5-chloro-2-H-benzotriazole-2-yl)) Phenyl] propionate, 2-ethylhexyl-3- [3-t-butyl-4-hydroxy-5- (5-chloro-2H-benzotriazole-2-yl) phenyl] propionate, 2- (2H-benzotriazole-2) -Il) -6- (1-Methyl-1-phenylethyl) -4- (1,1,3,3-tetramethylbutyl) phenol, 2- (2H-benzotriazole-2-yl) -4-t -Butylphenol, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2-hydroxy-5-t-octylphenyl) -benzotriazole, 2- (3-t-butyl-2-hydroxy-5) -Methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-t-butylphenyl) -5-Chloro-benzotriazole, 2- [2-hydroxy-3,5-di (1,1-dimethylbenzyl) phenyl] -2H-benzotriazole, 2,2'-methylenebis [6- (2) H-Benzotriazole-2-yl] -4- (1,1,3,3-tetramethylbutyl) phenol] 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] Examples thereof include -2H-benzotriazole and methyl-3- [3- (2-H-benzotriazole-2-yl) -5-t-butyl-4-hydroxyphenyl] propionate. Further, a predetermined hydroxyl group-containing compound such as a quinol compound, a hydroxyanthraquinone compound, and a polyphenol compound can also be used as an ion trapping agent. Examples of such hydroxyl group-containing compounds include 1,2-benzenediol, alizarin, anthralphin, tannin, gallate, methyl gallate, and pyrogallol.

The thickness of the adhesive sheet 20 is, for example, in the range of 1 to 200 μm. The upper limit of the thickness is preferably 100 μm, more preferably 80 μm. The lower limit of the thickness is preferably 3 μm, more preferably 5 μm.

The separator S is an element for covering and protecting the surface of the adhesive sheet 20 of the dicing tape integrated adhesive sheet X, and is relevant when using the dicing tape integrated adhesive sheet X. It is peeled off from the film. Examples of the separator S include polyethylene terephthalate (PET) films, polyethylene films, polypropylene films, plastic films and papers surface-coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent. Be done.

The thickness of such a separator S is, for example, 5 to 200 μm. Further, the separator S may have a long shape. In that case, for example, a plurality of laminates each containing the dicing tape 10 and the adhesive sheet 20 are arranged on the long separator S at equal intervals, and the separator S is wound and rolled. It is said to be in the form of.

In the present embodiment, in the in-plane direction D of the dicing tape integrated adhesive sheet X, the adhesive sheet 20 is formed from the outer peripheral end 11e of the base material 11 and the outer peripheral end 12e of the pressure-sensitive adhesive layer 12 in the dicing tape 10. The outer peripheral end 20e of the above is within a distance of 1000 μm or less, preferably 700 μm or less, more preferably 500 μm or less, and more preferably 300 μm or less. That is, the outer peripheral edge 20e of the adhesive sheet 20 covers the entire circumference from 1000 μm inside to 1000 μm outside with respect to the outer peripheral edges 11e and 12e of the base material 11 and the pressure-sensitive adhesive layer 12 in the in-plane direction D of the film. It is preferably between 700 μm inside and 700 μm outside, more preferably between 500 μm inside and 500 μm outside, and more preferably between 300 μm inside and 300 μm outside. In the configuration in which the dicing tape 10 or the pressure-sensitive adhesive layer 12 thereof and the adhesive sheet 20 on the dicing tape 10 have substantially the same dimensions in the in-plane direction D, the adhesive sheet 20 is as described above. In addition to the work attachment / attachment area, the frame member attachment / attachment area is included on the surface 20a side.

The dicing tape integrated adhesive sheet X having the above structure can be manufactured, for example, as follows.

First, as shown in FIG. 2A, the adhesive composition layer C1 is formed on the elongated separator S. The adhesive composition layer C1 can be formed by applying the adhesive composition prepared for forming the adhesive sheet 20 onto the separator S. Examples of the coating method of the adhesive composition include roll coating, screen coating, and gravure coating.

Next, as shown in FIG. 2B, the pressure-sensitive adhesive composition layer C2 is formed on the pressure-sensitive adhesive composition layer C1. The pressure-sensitive adhesive composition layer C2 can be formed by applying a pressure-sensitive adhesive composition prepared for forming the pressure-sensitive adhesive layer 12 onto the pressure-sensitive adhesive composition C1. Examples of the coating method of the pressure-sensitive adhesive composition include roll coating, screen coating, and gravure coating.

Next, by undergoing a batch heat treatment of the adhesive composition layer C1 and the adhesive composition layer C2 on the separator S, as shown in FIG. 2 (c), the adhesive sheet 20' And the pressure-sensitive adhesive layer 12'is formed. In this heat treatment, both layers are dried as needed, and a cross-linking reaction is caused in both layers as needed. The heating temperature is, for example, 60 to 175 ° C., and the heating time is, for example, 0.5 to 5 minutes. The adhesive sheet 20'is to be processed and formed into the above-mentioned adhesive sheet 20. The pressure-sensitive adhesive layer 12'is to be processed and formed into the above-mentioned pressure-sensitive adhesive layer 12.

Next, as shown in FIG. 2D, the base material 11'is pressure-bonded onto the pressure-sensitive adhesive layer 12'and bonded. The base material 11'is processed and formed into the above-mentioned base material 11. The resin base material 11'is produced by a film forming method such as a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T die extrusion method, a coextrusion method, or a dry laminating method. can do. The film or the base material 11'after the film formation is subjected to a predetermined surface treatment as needed. In this step, the bonding temperature is, for example, 30 to 50 ° C, preferably 35 to 45 ° C. The bonding pressure (linear pressure) is, for example, 0.1 to 20 kgf / cm, preferably 1 to 10 kgf / cm. By this step, a long laminated sheet body having a laminated structure of a separator S, an adhesive sheet 20', an adhesive layer 12', and a base material 11'is obtained.

Next, as shown in FIG. 3A, the laminated sheet body is subjected to processing in which a processing blade is inserted from the side of the base material 11'to the separator S (cutting portion in FIG. 3A). Is schematically represented by a thick line). For example, while flowing a laminated sheet body in one direction F at a constant speed, a rotary roll with a processing blade is rotatably arranged around an axis orthogonal to that direction F and a processing blade for punching is attached to the roll surface (illustrated). The surface with the machined blade of (omitted) is brought into contact with the base material 11'side of the laminated sheet body with a predetermined pressing force. As a result, the dicing tape 10 (base material 11, adhesive layer 12) and the adhesive sheet 20 are collectively processed and formed. After a plurality of laminates each containing the dicing tape and the adhesive sheet 20 are processed and formed on the separator S in this way, as shown in FIG. 3 (b), each laminate (dicing tape). 10. The material laminated portion around the adhesive sheet 20) is removed from the separator S. When the pressure-sensitive adhesive layer 12 is a radiation-curable pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer 12 is irradiated with radiation such as ultraviolet rays as a measure for reducing the adhesive strength from the side of the base material 11 before or after this removal step. May be good. When the irradiation is ultraviolet irradiation, the irradiation amount is, for example, 50 to 500 mJ / cm ² , preferably 100 to 300 mJ / cm ² . In the dicing tape-integrated adhesive sheet X, the region where radiation irradiation is performed as a measure for reducing the adhesive strength of the adhesive layer 12 (shown as the irradiation region R in FIG. 1) is, for example, adhesive adhesion in the adhesive layer 12. It is an area excluding the peripheral portion in the sex sheet bonding area.

As described above, the dicing tape integrated adhesive sheet X can be manufactured.

As described above, the base material 11 of the dicing tape-integrated adhesive sheet X contains EVA as a main component. The configuration in which the base material 11 contains EVA as a main component is suitable for realizing the base material 11 having high uniformity and easy to stretch, and thus the dicing tape 10, and is a group having high uniformity and easy to stretch even in a low temperature region of room temperature or lower, for example. It is suitable for realizing the material 11 and thus the dicing tape. The dicing tape 10 of the dicing tape-integrated adhesive sheet X or its base material 11 has high uniformity and is easy to stretch when the dicing tape-integrated adhesive sheet X is used to perform the expansion step for cutting. In the dicing tape 10, the adhesive sheet 20 on the dicing tape 10 and the semiconductor wafer are suitable for applying a splitting force with high uniformity over the entire area to be split, and therefore, good splitting property in the expanding process for splitting is realized. Suitable for doing.

In addition, the base material 11 of the dicing tape integrated adhesive sheet X contains 3 to 45% by mass of ionomer resin as described above. The ionomer resin is a polymer material in which the main chains of the polymer are crosslinked by metal ions to form aggregates, and tends to have excellent wear resistance. The configuration in which the base material 11 contains such an ionomer resin in addition to EVA as the main component is to ensure appropriate hardness in the base material 11 which is highly uniform and easily stretchable because EVA is contained as the main component. Suitable. Therefore, in this configuration, when blade dicing is performed using the dicing tape-integrated adhesive sheet X, fibrous waste derived from the base material 11 due to the pulling action accompanied by frictional heat by the dicing blade rotating at high speed. Suitable for suppressing the occurrence of. When the cutting depth of the dicing blade reaches the base material 11 during blade dicing for the semiconductor wafer on the dicing tape integrated adhesive sheet X, the base material 11 is said to contain ionomer resin in addition to EVA as the main component. The composition is suitable for suppressing the generation of fibrous debris derived from the base material. The configuration in which the ionomer resin content of the base material 11 is 3% by mass or more is suitable for exhibiting such a fibrous waste suppressing effect to a significant extent in the dicing tape integrated adhesive sheet X. The configuration in which the ionomer resin content of the base material 11 is 45% by mass or less causes the base material 11 to exhibit a fibrous waste suppressing effect during blade dicing in the dicing tape-integrated adhesive sheet X. It is suitable for fully enjoying the above-mentioned effect (good splitting property in the expanding step for splitting) by containing EVA as the main component.

As described above, the dicing tape-integrated adhesive sheet X is suitable for suppressing the generation of fibrous debris during blade dicing, and is also suitable for achieving good breakability in the expansion step for cutting. Such a dicing tape-integrated adhesive sheet X can be used both when blade dicing is performed and when expansion for cutting is performed as a method for obtaining a semiconductor chip with an adhesive sheet. can.

The base material 11 in the dicing tape-integrated adhesive sheet X is performed under the conditions (first condition) of a base material test piece having a width of 10 mm, an initial chuck distance of 10 mm, a −15 ° C., and a tensile speed of 100 mm / min. The tensile elastic modulus shown in the tensile test is preferably 9 MPa or more, more preferably 10 MPa or more, more preferably 11 MPa or more, and even more preferably 12 MPa or more. Such a configuration is the dicing tape 10 or its base material 11 to be expanded in the expansion step for cutting performed by using the dicing tape integrated adhesive sheet X in order to obtain the semiconductor chip with the adhesive sheet. Therefore, it is preferable to exert a sufficient breaking force on the adhesive sheet 20 and the semiconductor wafer on the dicing tape 10, and therefore, it is preferable to realize good breaking property.

The substrate 11 has a tensile elastic modulus of preferably 30 MPa or less, more preferably 20 MPa or less, still more preferably 15 MPa or less, which is shown in the tensile test performed under the first condition for a substrate test piece having a width of 10 mm. Such a configuration is such that the dicing tape 10 is stretched with high uniformity in the expansion step for cutting performed by using the dicing tape integrated adhesive sheet X in order to obtain a semiconductor chip with the adhesive sheet. It is preferable for applying a highly uniform and breaking force to the entire area of the adhesive sheet 20 and the semiconductor wafer to be cut on the dicing tape 10, and therefore, for achieving good breakability in the expanding step for cutting. Is preferable.

The substrate 11 has a tensile stress of preferably 25 N or less, more preferably 20 N or less, still more preferably 12 N or less, which is shown by a strain value of 10% in the tensile test performed under the first condition for a substrate test piece having a width of 10 mm. Is. Further, the base material 11 has a tensile stress of preferably 25 N or less, more preferably 20 N or less, still more preferably 18 N, which is shown by a strain value of 30% in the tensile test performed under the first condition for a base material test piece having a width of 10 mm. It is as follows. These configurations are made into small pieces on the dicing tape 10 in the expansion step for cutting performed by using the dicing tape integrated adhesive sheet X in order to obtain the semiconductor chip with the adhesive sheet. It is preferable to prevent the end portion of the sheet 20 from being partially or wholly peeled off from the dicing tape 10.

The substrate 11 has a tensile elastic modulus of preferably 15 MPa, which is shown in a tensile test conducted on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, 25 ° C. and a tensile speed of 100 mm / min (second condition). Below, it is more preferably 10 MPa or less, and more preferably 7.5 MPa or less. The substrate 11 has a tensile stress of preferably 15 N or less, more preferably 10 N or less, still more preferably 6 N or less, which is shown by a strain value of 10% in the tensile test performed under the second condition for a substrate test piece having a width of 10 mm. Is. Further, the base material 11 has a tensile stress of preferably 15 N or less, more preferably 12 N or less, more preferably more preferably 12 N or less, which is shown by a strain value of 30% in the tensile test performed under the second condition for the base material test piece having a width of 10 mm. It is 10 N or less. These configurations are for increasing the separation distance of the semiconductor chips with a plurality of adhesive sheets after the expansion step for splitting performed with the dicing tape integrated adhesive sheet X holding the semiconductor wafer. In the step of re-expanding the dicing tape 10, it is preferable to prevent the end portion of the small piece of the adhesive sheet 20 on the dicing tape 10 from partially or wholly peeling from the dicing tape 10. ..

4 and 5 show a semiconductor device manufacturing method performed by using the dicing tape integrated adhesive sheet X. The method includes blade dicing for obtaining a semiconductor chip with an adhesive sheet.

In this method, first, as shown in FIG. 4A, the semiconductor wafer 30 is bonded onto the adhesive sheet 20 of the dicing tape integrated adhesive sheet X from which the separator S has been peeled off. Various semiconductor elements (not shown) are already built on one side of the semiconductor wafer 30, and wiring structures and the like (not shown) required for the semiconductor elements are already formed on the one side. In this step, the semiconductor wafer 30 is pressed against the dicing tape integrated adhesive sheet X by a crimping roll or the like, and the element or the like forming surface side of the semiconductor wafer 30 is adhesively bonded to the dicing tape integrated adhesive sheet X. It is attached to the sex sheet 20.

Next, as shown in FIG. 4B, dicing is performed on the semiconductor wafer 30 (dicing step). Specifically, the semiconductor wafer 30 is diced using a dicing blade such as a dicing device while the semiconductor wafer 30 is held on the adhesive sheet X integrated with the dicing tape, and the semiconductor wafer 30 is individualized into units of semiconductor chips. (In the figure, the cutting point is schematically represented by a thick line). As a result, the semiconductor chip 31 with the chip-sized adhesive sheet 20 is formed.

When the pressure-sensitive adhesive layer 12 in the dicing tape-integrated adhesive sheet X is a radiation-curable pressure-sensitive adhesive layer, dicing is performed instead of the above-mentioned irradiation in the manufacturing process of the dicing tape-integrated adhesive sheet X. Before or after the step, the pressure-sensitive adhesive layer 12 may be irradiated with radiation such as ultraviolet irradiation as a measure for reducing the adhesive strength from the side of the base material 11. When the irradiation is ultraviolet irradiation, the irradiation amount is, for example, 50 to 500 mJ / cm ² , preferably 100 to 300 mJ / cm ² . In the dicing tape-integrated adhesive sheet X, the region where radiation irradiation is performed as a measure for reducing the adhesive strength of the adhesive layer 12 (shown as the irradiation region R in FIG. 1) is, for example, adhesive adhesion in the adhesive layer 12. It is an area excluding the peripheral portion in the sex sheet bonding area.

Then, after undergoing a cleaning step as necessary to clean the semiconductor chip 31 side of the dicing tape 10 with the semiconductor chip 31 with the adhesive sheet using a cleaning liquid such as water, the semiconductor chip with the adhesive sheet is used. 31 is picked up from the dicing tape 10 (pickup process). For example, with respect to the semiconductor chip 31 with an adhesive sheet to be picked up, the pin member (not shown) of the pickup mechanism is raised on the lower side in the drawing of the dicing tape 10, pushed up through the dicing tape 10, and then adsorbed. Adsorb and hold with a tool (not shown).

Next, as shown in FIG. 5A, the picked up semiconductor chip 31 with the adhesive sheet is temporarily fixed to the predetermined adherend 51 via the adhesive sheet 21. Examples of the adherend 51 include a lead frame, a TAB (Tape Automated Bonding) film, a wiring board, and a separately manufactured semiconductor chip.

Next, as shown in FIG. 5B, the electrode pad (not shown) of the semiconductor chip 31 and the terminal portion (not shown) of the adherend 51 are electrically connected via the bonding wire 52 (not shown). Wire bonding process). The connection between the electrode pad of the semiconductor chip 31 or the terminal portion of the adherend 51 and the bonding wire 52 is realized by ultrasonic welding accompanied by heating, and is performed so as not to thermally cure the adhesive sheet 21. As the bonding wire 52, for example, a gold wire, an aluminum wire, or a copper wire can be used. The wire heating temperature in wire bonding is, for example, 80 to 250 ° C, preferably 80 to 220 ° C. The heating time is from several seconds to several minutes.

Next, as shown in FIG. 5C, the semiconductor chip 31 is sealed with a sealing resin 53 for protecting the semiconductor chip 31 on the adherend 51 and the bonding wire 52 (sealing step). In this step, the thermosetting sheet 21 is thermally cured. In this step, for example, the sealing resin 53 is formed by a transfer molding technique performed using a mold. As the constituent material of the sealing resin 53, for example, an epoxy resin can be used. In this step, the heating temperature for forming the sealing resin 53 is, for example, 165 to 185 ° C., and the heating time is, for example, 60 seconds to several minutes. If the sealing resin 53 is not sufficiently cured in this step (sealing step), a post-curing step for completely curing the sealing resin 53 is performed after this step. Even if the adhesive sheet 21 is not completely heat-cured in the sealing step, the post-curing step enables complete heat curing of the adhesive sheet 21 together with the sealing resin 53. In the post-curing step, the heating temperature is, for example, 165 to 185 ° C., and the heating time is, for example, 0.5 to 8 hours.

As described above, the semiconductor device can be manufactured.

6 to 10 show a part of the steps in the semiconductor device manufacturing method performed by using the dicing tape integrated adhesive sheet X. This method includes an expanding step for splitting to obtain a semiconductor chip with a viscous adhesive sheet.

In this method, first, as shown in FIGS. 6A and 6B, a dividing groove 30a is formed in the semiconductor wafer W (divided groove forming step). The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) have already been built on the side of the first surface Wa of the semiconductor wafer W, and the wiring structure and the like (not shown) required for the semiconductor element have already been formed on the first surface Wa. Has been done. In this step, after the wafer processing tape T1 having the adhesive surface T1a is bonded to the second surface Wb side of the semiconductor wafer W, the semiconductor wafer W is held in a state where the semiconductor wafer W is held by the wafer processing tape T1. A dividing groove 30a having a predetermined depth is formed on the Wa side of the first surface by using a rotating blade such as a dicing device. The dividing groove 30a is a gap for separating the semiconductor wafer W into semiconductor chip units (the dividing groove 30a is schematically represented by a thick line in FIGS. 6 to 8).

Next, as shown in FIG. 6C, the wafer processing tape T2 having the adhesive surface T2a is bonded to the first surface Wa side of the semiconductor wafer W, and the wafer processing tape T1 from the semiconductor wafer W is attached. Is peeled off.

Next, as shown in FIG. 6D, with the semiconductor wafer W held by the wafer processing tape T2, the semiconductor wafer W is thinned by grinding from the second surface Wb until it reaches a predetermined thickness. (Wafer thinning process). The grinding process can be performed using a grinding device equipped with a grinding wheel. By this wafer thinning step, in the present embodiment, a semiconductor wafer 30A that can be fragmented is formed on a plurality of semiconductor chips 31. Specifically, the semiconductor wafer 30A has a portion (connecting portion) for connecting a portion of the wafer to be fragmented into a plurality of semiconductor chips 31 on the second surface Wb side. The thickness of the connecting portion in the semiconductor wafer 30A, that is, the distance between the second surface Wb of the semiconductor wafer 30A and the tip of the dividing groove 30a on the second surface Wb side is, for example, 1 to 30 μm, preferably 3 to 20 μm. Is.

Next, as shown in FIG. 7A, the semiconductor wafer 30A held on the wafer processing tape T2 is the adhesive sheet 20 of the dicing tape integrated adhesive sheet X from which the separator S has been peeled off. It is pasted against. After that, as shown in FIG. 7B, the wafer processing tape T2 is peeled off from the semiconductor wafer 30A. When the pressure-sensitive adhesive layer 12 in the dicing tape-integrated adhesive sheet X is a radiation-curable pressure-sensitive adhesive layer, instead of the above-mentioned irradiation in the manufacturing process of the dicing tape-integrated adhesive sheet X, etc. Then, before or after the semiconductor wafer 30A is bonded to the adhesive sheet 20, the adhesive layer 12 may be irradiated with radiation such as ultraviolet irradiation as a measure for reducing the adhesive force from the side of the base material 11. .. When the irradiation is ultraviolet irradiation, the irradiation amount is, for example, 50 to 500 mJ / cm ² , preferably 100 to 300 mJ / cm ² . In the dicing tape-integrated adhesive sheet X, the region where radiation irradiation is performed as a measure for reducing the adhesive strength of the adhesive layer 12 (shown as the irradiation region R in FIG. 1) is, for example, adhesive adhesion in the adhesive layer 12. It is an area excluding the peripheral portion in the sex sheet bonding area.

Next, after the ring frame 41 is attached on the adhesive sheet 20 in the dicing tape integrated adhesive sheet X, the dicing tape with the semiconductor wafer 30A is attached as shown in FIG. 8A. The integrated adhesive sheet X is fixed to the holder 42 of the expanding device.

Next, the first expanding step (cool expanding step for cutting) under relatively low temperature conditions is performed as shown in FIG. 8 (b), and the semiconductor wafer 30A is formed into a plurality of semiconductor chips 31. At the same time as being separated, the adhesive sheet 20 of the dicing tape integrated adhesive sheet X is cut into small pieces of the adhesive sheet 21 to obtain a semiconductor chip 31 with an adhesive sheet. In this step, the hollow cylindrical push-up member 43 provided in the expanding device is raised in contact with the dicing tape 10 on the lower side in the drawing of the dicing tape integrated adhesive sheet X, and the semiconductor wafer 30A is bonded to the dicing tape 30A. The dicing tape 10 of the dicing tape-integrated adhesive sheet X is expanded so as to be stretched in two dimensions including the radial direction and the circumferential direction of the semiconductor wafer 30A. This expansion is performed under the condition that a tensile stress in the range of 15 to 32 MPa, preferably 20 to 32 MPa is generated in the dicing tape 10. The temperature condition in the cool expanding step is, for example, 0 ° C. or lower, preferably −20 to −5 ° C., more preferably −15 to −5 ° C., and more preferably −15 ° C. The expanding speed (speed at which the push-up member 43 rises) in the cool expanding step is preferably 0.1 to 100 mm / sec. The amount of expansion in the cool expanding step is preferably 3 to 16 mm.

In this step, the thin-walled and fragile portion of the semiconductor wafer 30A is split, resulting in individualization into the semiconductor chip 31. At the same time, in this step, in the adhesive sheet 20 in close contact with the pressure-sensitive adhesive layer 12 of the expanded dicing tape 10, deformation is suppressed in each region in which each semiconductor chip 31 is in close contact, while deformation is suppressed. The tensile stress generated in the dicing tape 10 acts on the portion facing the dividing groove between the semiconductor chips 31 in a state where such deformation suppressing action does not occur. As a result, the portion of the adhesive sheet 20 facing the dividing groove between the semiconductor chips 31 is cut. After this step, as shown in FIG. 8C, the push-up member 43 is lowered to release the expanded state of the dicing tape 10.

Next, the second expanding step under relatively high temperature conditions is performed as shown in FIG. 9A, and the distance (separation distance) between the semiconductor chips 31 with the adhesive sheet is widened. In this step, the hollow cylindrical push-up member 43 provided in the expanding device is raised again, and the dicing tape 10 of the dicing tape integrated adhesive sheet X is expanded. The temperature condition in the second expanding step is, for example, 10 ° C. or higher, preferably 15 to 30 ° C. The expanding speed (speed at which the push-up member 43 rises) in the second expanding step is, for example, 0.1 to 10 mm / sec, preferably 0.3 to 1 mm / sec. The amount of expansion in the second expanding step is, for example, 3 to 16 mm. In this step, the separation distance of the semiconductor chip 31 with the adhesive sheet is widened to the extent that the semiconductor chip 31 with the adhesive sheet can be appropriately picked up from the dicing tape 10 in the pickup step described later. After this step, as shown in FIG. 9B, the push-up member 43 is lowered to release the expanded state of the dicing tape 10. In order to prevent the separation distance of the semiconductor chip 31 with the adhesive sheet on the dicing tape 10 from being narrowed after the expanded state is released, the outside of the semiconductor chip 31 holding region of the dicing tape 10 is before the expanded state is released. It is preferable to heat and shrink the portion of.

Next, after undergoing a cleaning step as necessary to clean the semiconductor chip 31 side of the dicing tape 10 with the semiconductor chip 31 with the adhesive sheet using a cleaning liquid such as water, as shown in FIG. The semiconductor chip 31 with the adhesive sheet is picked up from the dicing tape 10 (pickup process). For example, with respect to the semiconductor chip 31 with an adhesive sheet to be picked up, the pin member 44 of the pickup mechanism is raised on the lower side in the drawing of the dicing tape 10 and pushed up through the dicing tape 10, and then the suction jig 45 is used. Adsorb and hold.

In the semiconductor device manufacturing method, after the above-mentioned process is performed with reference to FIG. 6 (c), the wafer thinning step shown in FIG. 11 is replaced with the above-mentioned wafer thinning step with reference to FIG. 6 (d). The process may be performed. In the wafer thinning step shown in FIG. 11, while the semiconductor wafer W is held on the wafer processing tape T2, the wafer is thinned by grinding from the second surface Wb until it reaches a predetermined thickness. A semiconductor wafer divider 30B including a plurality of semiconductor chips 31 and held on the wafer processing tape T2 is formed. In this step, a method of grinding the wafer until the dividing groove 30a itself is exposed on the second surface Wb side (first method) may be adopted, or from the second surface Wb side to the dividing groove 30a. A method of grinding the wafer to the front and then forming a semiconductor wafer split body 30B by causing a crack between the split groove 30a and the second surface Wb by the action of a pressing force from the rotary grindstone to the wafer (second). Method) may be adopted. Depending on the method adopted, the depth of the split groove 30a formed as described above with reference to FIGS. 6 (a) and 6 (b) from the first surface Wa is appropriately determined. .. In FIG. 11, the dividing groove 30a that has undergone the first method, the dividing groove 30a that has undergone the second method, and the cracks connected thereto are schematically represented by thick lines. In the present embodiment, the semiconductor wafer divided body 30B thus produced is bonded to the dicing tape-integrated adhesive sheet X from which the separator S has been peeled off, instead of the semiconductor wafer 30A described above. , Each step described above may be performed with reference to FIGS. 7 to 9.

12 (a) and 12 (b) show a first expanding step (cool expanding step) performed after the semiconductor wafer divided body 30B is bonded to the dicing tape integrated adhesive sheet X from which the separator S has been peeled off. ). In this step, the hollow columnar push-up member 43 provided in the expanding device is raised in contact with the dicing tape 10 at the lower side in the drawing of the dicing tape integrated adhesive sheet X, and the semiconductor wafer divided body 30B is attached. The dicing tape 10 of the combined dicing tape integrated adhesive sheet X is expanded so as to be stretched in a two-dimensional direction including the radial direction and the circumferential direction of the semiconductor wafer divided body 30B. This expansion is performed on the dicing tape 10 under the condition that a tensile stress is generated in the range of, for example, 1 to 100 MPa, preferably 5 to 40 MPa. The temperature condition in this step is, for example, 0 ° C. or lower, preferably −20 to −5 ° C., more preferably −15 to −5 ° C., and more preferably −15 ° C. The expanding speed (speed at which the push-up member 43 rises) in this step is preferably 1 to 500 mm / sec. The amount of expansion in this step is preferably 50 to 200 mm. By such a cool expanding step, the adhesive sheet 20 of the dicing tape integrated adhesive sheet X is cut into small pieces of the adhesive sheet 21 to obtain a semiconductor chip 31 with an adhesive sheet. .. Specifically, in this step, in the adhesive sheet 20 in close contact with the pressure-sensitive adhesive layer 12 of the expanded dicing tape 10, in each region in which each semiconductor chip 31 of the semiconductor wafer divider 30B is in close contact. While the deformation is suppressed, the tensile stress generated in the dicing tape 10 acts on the portion facing the dividing groove 30a between the semiconductor chips 31 without such a deformation suppressing action. As a result, the portion of the adhesive sheet 20 facing the dividing groove 30a between the semiconductor chips 31 is cut.

In the method for manufacturing a semiconductor device, the dicing tape-integrated adhesive sheet X from which the separator S has been peeled off is manufactured as follows in place of the above-mentioned semiconductor wafer 30A or semiconductor wafer divided body 30B. The semiconductor wafer 30C may be bonded.

As shown in FIGS. 13 (a) and 13 (b), first, the modified region 30b is formed on the semiconductor wafer W. The semiconductor wafer W has a first surface Wa and a second surface Wb. Various semiconductor elements (not shown) have already been built on the side of the first surface Wa of the semiconductor wafer W, and the wiring structure and the like (not shown) required for the semiconductor element have already been formed on the first surface Wa. Has been done. In this step, after the wafer processing tape T3 having the adhesive surface T3a is bonded to the first surface Wa side of the semiconductor wafer W, the semiconductor wafer W is held inside the wafer while being held by the wafer processing tape T3. Laser light with the same light spot is applied to the semiconductor wafer W from the side opposite to the wafer processing tape T3 along the planned division line, and into the semiconductor wafer W due to ablation due to multiphoton absorption. The modified region 30b is formed. The modified region 30b is a fragile region for separating the semiconductor wafer W into semiconductor chip units. A method of forming a modified region 30b on a planned division line by irradiating a semiconductor wafer with a laser beam is described in detail in, for example, Japanese Patent Application Laid-Open No. 2002-192370. In the method, the laser light irradiation conditions in the present embodiment are appropriately adjusted within the range of, for example, the following conditions.

Laser light irradiation conditions (A) Laser light Laser light source Semiconductor laser excitation Nd: YAG laser wavelength 1064 nm
Laser light spot cross-sectional area 3.14 × 10 ^-8 cm ²
Oscillation form Q-switched pulse repetition frequency 100 kHz or less Pulse width 1 μs or less Output 1 mJ or less (per pulse)
Laser light quality TEM00
Polarization characteristics Linear polarization (B) Condensing lens Magnification 100x or less NA 0.55
Transmittance with respect to laser light wavelength 100% or less (C) Movement speed of the mounting table on which the semiconductor substrate is placed 280 mm / sec or less

Next, with the semiconductor wafer W held by the wafer processing tape T3, the semiconductor wafer W is thinned by grinding from the second surface Wb until it reaches a predetermined thickness, and is shown in FIG. 13 (c). As shown, a semiconductor wafer 30C that can be fragmented is formed on a plurality of semiconductor chips 31 (wafer thinning step). In the present embodiment, the semiconductor wafer 30C produced as described above is attached to the dicing tape-integrated adhesive sheet X from which the separator S has been peeled off, instead of the semiconductor wafer 30A, and then the figure is shown. Each of the above-mentioned steps may be performed with reference to FIGS. 7 to 9.

14 (a) and 14 (b) show a first expanding step (cool expanding step) performed after the semiconductor wafer 30C is bonded to the dicing tape integrated adhesive sheet X from which the separator S has been peeled off. ). In this step, the hollow cylindrical push-up member 43 provided in the expanding device is raised in contact with the dicing tape 10 at the lower side in the drawing of the dicing tape integrated adhesive sheet X, and the semiconductor wafer 30C is bonded to the dicing tape 30C. The dicing tape 10 of the dicing tape-integrated adhesive sheet X is expanded so as to be stretched in two dimensions including the radial direction and the circumferential direction of the semiconductor wafer 30C. This expansion is performed on the dicing tape 10 under the condition that a tensile stress is generated in the range of, for example, 1 to 100 MPa, preferably 5 to 40 MPa. The temperature condition in this step is, for example, 0 ° C. or lower, preferably −20 to −5 ° C., more preferably −15 to −5 ° C., and more preferably −15 ° C. The expanding speed (speed at which the push-up member 43 rises) in this step is preferably 1 to 500 mm / sec. The amount of expansion in this step is preferably 50 to 200 mm. By such a cool expanding step, the adhesive sheet 20 of the dicing tape integrated adhesive sheet X is cut into small pieces of the adhesive sheet 21 to obtain a semiconductor chip 31 with an adhesive sheet. .. Specifically, in this step, cracks are formed in the fragile modified region 30b of the semiconductor wafer 30C, and individualization into the semiconductor chip 31 occurs. At the same time, in this step, in the adhesive sheet 20 in close contact with the pressure-sensitive adhesive layer 12 of the expanded dicing tape 10, deformation is suppressed in each region of the semiconductor wafer 30C in which each semiconductor chip 31 is in close contact. On the other hand, the tensile stress generated in the dicing tape 10 acts on the portion of the wafer facing the crack forming portion without such a deformation suppressing action. As a result, the portion of the adhesive sheet 20 facing the crack-forming portion between the semiconductor chips 31 is cut off.

As described above, the dicing tape integrated adhesive sheet X can be used to obtain a semiconductor chip with an adhesive sheet. The dicing tape-integrated adhesive sheet X can also be used to obtain a semiconductor chip with an adhesive sheet when a plurality of semiconductor chips are laminated and three-dimensionally mounted. A spacer may or may not be interposed between the semiconductor chips 31 in such a three-dimensional mounting together with the adhesive sheet 21.

[Example 1]
<Making dicing tape>
In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirrer, 100 mol parts of dodecyl acrylate, 20 mol parts of 2-hydroxyethyl acrylate (2HEA), and 100 mass of these monomer components. A mixture containing 0.2 parts by mass of benzoyl peroxide as a polymerization initiator and toluene as a polymerization solvent was stirred at 60 ° C. for 10 hours in a nitrogen atmosphere (polymerization reaction). As a result, a polymer solution containing the acrylic polymer P ₁ was obtained. The weight average molecular weight (Mw) of the acrylic polymer P ₁ in the polymer solution was 460,000. Next, a mixture containing the polymer solution containing the acrylic polymer P ₁ , 2-methacryloyloxyethyl isocyanate (MOI), and dibutyltin dilaurylate as an addition reaction catalyst was mixed at room temperature for 48 hours under an air atmosphere. Stirred (addition reaction). In the reaction solution, the molar ratio of the MOI compounding amount to the total amount of the 2HEA-derived unit or its hydroxyl group in the acrylic polymer P ₁ is 0.8. Further, in the reaction solution, the blending amount of dibutyltin dilaurylate is 0.01 part by mass with respect to 100 parts by mass of the acrylic polymer P ₁ . By this addition reaction, a polymer solution containing an acrylic polymer P ₂ having a methacrylate group in the side chain was obtained. Next, 1 part by mass of the polyisocyanate compound (trade name "Coronate L", manufactured by Toso Co., Ltd.) and 5 parts by mass of the photopolymerization initiator (trade name "Coronate L", manufactured by Toso Co., Ltd.) with respect to 100 parts by mass of the acrylic polymer P ₂ were added to the polymer solution. Add and mix with the trade name "Irgacure 127" (manufactured by BASF), and add toluene to dilute the mixture so that the viscosity of the mixture at room temperature becomes 500 mPa · s to obtain an adhesive solution. rice field. Next, an adhesive solution is applied on the silicone release-treated surface of the PET separator (thickness 38 μm) having the silicone release-treated surface using an applicator to form a coating film, and this coating film is formed. Was dried by heating at 130 ° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm on the PET separator. Next, using a laminator, the base material S1 made of ionomer blend EVA was attached to the exposed surface of the pressure-sensitive adhesive layer at room temperature. The base material S1 is a film having a thickness of 80 μm formed from a resin material in which an ionomer resin is blended with an ethylene-vinyl acetate copolymer (EVA) having a vinyl acetate weight fraction of 9%, and contains the ionomer resin. The ratio is 5% by mass. This ionomer resin contains an ethylene-methacrylic acid copolymer and Zn ions cross-linking the copolymer, the weight fraction of methacrylic acid in the copolymer is 3%, and the carboxy group derived from methacrylic acid is neutralized. The degree is 50%. The dicing tape was produced as described above.

<Making a viscous adhesive sheet>
Acrylic resin (polymer of ethyl acrylate, butyl acrylate, acrylonitrile and glycidyl methacrylate, weight average molecular weight 1.2 million, glass transition temperature 0 ° C, epoxy value 0.4 eq / kg) 55 parts by mass and solid 20 parts by mass of phenol resin (trade name "MEHC-7851SS", solid at 23 ° C, manufactured by Meiwa Kasei Co., Ltd.) and liquid phenol resin (trade name "MEH-8000H", liquid at 23 ° C, manufactured by Meiwa Kasei Co., Ltd.) 2 parts by mass and 22 parts by mass of a silica filler (trade name "SO-E2", average particle size 0.5 μm, manufactured by Admatex Co., Ltd.) are added to methyl ethyl ketone and mixed, and the viscosity at room temperature is 700 mPa. The concentration was adjusted so as to be s, and an adhesive composition was obtained. Next, the adhesive composition was applied to the release-treated surface of the PET separator (thickness 38 μm) having the release-treated surface using an applicator to form a coating film, and the coating film was formed. The mixture was heat-dried at 130 ° C. for 2 minutes to form a viscous adhesive sheet as a die bond film having a thickness of 10 μm on a PET separator.

<Making a dicing tape integrated adhesive sheet>
After peeling the PET separator from the dicing tape described above, the pressure-sensitive adhesive layer exposed on the dicing tape and the adhesive sheet described above with the PET separator are bonded together at room temperature using a laminator to form a laminated sheet body. Obtained. Next, the laminated sheet body was punched by inserting a processing blade from the side of the ionomer blend EVA base material of the dicing tape to the separator. Specifically, while flowing the laminated sheet body in one direction at a speed of 10 m / min, it is rotatably arranged around an axis orthogonal to that direction, and a Thomson blade for circular punching is wound around the roll surface. The surface with the processing blade of the rotary roll with the processing blade was brought into contact with the ionomer blend EVA base material side of the laminated sheet body with a predetermined pressing force, and punching was performed. The circumferential length, that is, the peripheral length of the rotary roll used for this punching process is 378.9 mm. The Thomson blade wound around the surface of the rotary roll is made of SUS and is arranged on the roll surface so that a circle with a diameter of 370 mm can be punched. The height of the blade is 0.3 mm, and the blade made by the cutting edge. The angle is 50 °. By such punching, the dicing tape and the adhesive sheet were collectively processed and formed in a disk shape, and the dicing tape integrated adhesive sheet was formed. Next, the material laminated portion around the formed dicing tape integrated adhesive sheet was removed from the separator. Next, the pressure-sensitive adhesive layer in the dicing tape was irradiated with ultraviolet rays from the side of the base material. In the ultraviolet irradiation, a high-pressure mercury lamp was used, and the integrated irradiation light amount was set to 350 mJ / cm ² . As described above, the dicing tape-integrated adhesive sheet of Example 1 having a laminated structure including the dicing tape and the adhesive sheet as a dicing film was produced.

[Example 2]
Similar to the dicing tape integrated adhesive sheet of Example 1 except that the base material S2 made of ionomer blend EVA was used instead of the base material S1, the dicing tape integrated adhesiveness of Example 2 was used. A sheet was prepared. The base material S2 has the same configuration as the base material S1 except that the content ratio of the ionomer resin is 10% by mass instead of 5% by mass.

[Example 3]
Similar to the dicing tape integrated adhesive sheet of Example 1 except that the base material S3 made of ionomer blend EVA was used instead of the base material S1, the dicing tape integrated adhesiveness of Example 3 was used. A sheet was prepared. The base material S3 has the same configuration as the base material S1 except that the content ratio of the ionomer resin is 20% by mass instead of 5% by mass.

[Example 4]
Similar to the dicing tape integrated adhesive sheet of Example 1 except that the base material S4 made of ionomer blend EVA was used instead of the base material S1, the dicing tape integrated adhesiveness of Example 5 was used. A sheet was prepared. The base material S4 is a film having a thickness of 80 μm formed from a resin material in which an ionomer resin is blended with an ethylene-vinyl acetate copolymer (EVA) having a vinyl acetate weight fraction of 14%, and contains the ionomer resin. The ratio is 10% by mass. This ionomer resin contains an ethylene-methacrylic acid copolymer and Zn ions cross-linking the copolymer, the weight fraction of methacrylic acid in the copolymer is 3%, and the carboxy group derived from methacrylic acid is neutralized. The degree is 50%.

[Example 5]
Similar to the dicing tape integrated adhesive sheet of Example 1 except that the base material S5 made of ionomer blend EVA was used instead of the base material S1, the dicing tape integrated adhesiveness of Example 5 was used. A sheet was prepared. The base material S5 has the same configuration as the base material S1 except that the content ratio of the ionomer resin is 30% by mass instead of 5% by mass.

[Example 6]
Similar to the dicing tape integrated adhesive sheet of Example 1 except that the base material S6 made of ionomer blend EVA was used instead of the base material S1, the dicing tape integrated adhesiveness of Example 6 was used. A sheet was prepared. The base material S6 has the same configuration as the base material S1 except that the content ratio of the ionomer resin is 40% by mass instead of 5% by mass.

[Comparative Examples 1 and 2]
The dicing tape integrated adhesive sheet of Example 1 except that the base material S7 made of EVA (Comparative Example 1) or another base material S8 made of EVA (Comparative Example 2) was used instead of the base material S1. In the same manner as above, the dicing tape integrated adhesive sheet of Comparative Examples 1 and 2 was produced. The base material S7 is a film having a thickness of 124 μm formed from an ethylene-vinyl acetate copolymer having a vinyl acetate weight fraction of 9%. The base material S8 is a film having a thickness of 129 μm formed from an ethylene-vinyl acetate copolymer having a vinyl acetate weight fraction of 14%.

[Tension modulus]
The tensile elastic modulus was examined for each substrate used in the dicing tape integrated adhesive sheet of Examples 1 to 6 and Comparative Examples 1 and 2 as follows. First, from the substrate, a test piece having a length of 15 mm and a width of 10 mm extending in the MD direction (first test piece), and a test having a length of 15 mm and a width of 10 mm extending in the TD direction orthogonal to the MD direction. A piece (second test piece) was cut out. Then, each test piece was subjected to a tensile test using a tensile tester (trade name "Autograph", manufactured by Shimadzu Corporation), and the tensile elastic modulus was measured. In this tensile test, the initial chuck distance is 10 mm, the temperature condition is −15 ° C., and the tensile speed is 100 mm / min. Table 1 shows the measurement results of the tensile elastic modulus (MD direction) of the first test piece and the tensile elastic modulus (MPa) of the second test piece.

Further, for each of the base materials used in the dicing tape integrated adhesive sheet of Examples 1 to 6 and Comparative Examples 1 and 2, the temperature conditions in the tensile test are changed from −15 ° C. to 25 ° C., as described above. The tensile elastic modulus (MPa) in the MD direction and the TD direction was examined in the same manner as the examination method. The results are listed in Table 1.

[Fibrous waste in blade dicing]
For each dicing tape integrated adhesive sheet of Examples 1 to 6 and Comparative Examples 1 and 2, the degree of generation of fibrous waste when used in the following process was investigated.

First, the dicing tape pressure-sensitive adhesive layer of the dicing tape-integrated adhesive sheet to be used was irradiated with ultraviolet rays from the side of the dicing tape base material. The irradiation area is an area excluding the peripheral portion corresponding to the ring frame attachment area of the adhesive sheet. The integrated irradiation light amount is 350 mJ / cm ² .

Next, after attaching a silicon wafer (diameter 8 inches, thickness 50 μm, manufactured by Tokyo Kako Co., Ltd.) to the adhesive sheet of this dicing tape integrated adhesive sheet and attaching a ring frame. , The dicing step of full-cut dicing as described above was performed with reference to FIG. 4 (b). Specifically, by blade dicing performed using a dicing device (trade name "DFD6260", manufactured by DISCO Corporation) on the adhesive sheet of the adhesive sheet integrated with dicing tape and the silicon wafer on the sheet. , A dividing groove for individualization (forming a grid of 10 mm × 10 mm in one section) was formed. In this blade dicing, first, a Z1 blade (trade name "203O-SE 27HCDD", manufactured by DISCO Corporation) is used to cut the wafer from the wafer surface to half the thickness under the conditions of a blade rotation speed of 40,000 rpm and a dicing speed of 50 mm / s sec. It was cut to a depth, and then cut to the dicing tape base material with a Z2 blade (trade name "203O-SE 27HCBB", manufactured by DISCO Corporation) under the conditions of a blade rotation speed of 45,000 rpm and a dicing speed of 50 mm / s sec (book). The total cutting depth of the process is 75 μm). During such a dicing process, running water was continuously supplied toward the rotating blade and the silicon wafer (water supply amount was 1 L / min, water temperature was 25 ° C.).

After going through the above processes using the dicing tape integrated adhesive sheets of Examples 1 to 6 and Comparative Examples 1 and 2, the degree of adhesion of fibrous debris on the silicon wafer Examined. Specifically, a value obtained by counting fibrous debris having a length of 50 μm or more at each of the predetermined five locations on the silicon wafer that has undergone the dicing step, and dividing the total number of fibrous debris at the five locations by 5. Average number) was calculated. There are four counting points: one cross line including the intersection closest to the center of the silicon wafer among the intersections of the formed dividing grooves, and four points located on the outermost side and separated from each other in the circumferential direction of the wafer at 90 degree intervals. It is a cross line related to the intersection (both lines included in each cross line have a length of 2 chips). Then, the case where the average number was 0 was evaluated as excellent, the case where the average number was 1 to 10 was evaluated as good, and the case where the average number exceeded 10 was evaluated as impossible. Table 1 shows the average number of fibrous waste and the evaluation results.

[Cutability]
The dicing tape-integrated adhesive adhesive sheets of Examples 1 to 6 and Comparative Examples 1 and 2 were examined for their splittability when used in the following processes.

First, a modified region was formed inside a silicon wafer (diameter 12 inches, thickness 780 μm, manufactured by Tokyo Kako Co., Ltd.) as a fragile region for dividing the wafer into chip units. Specifically, a laser processing device (trade name "ML300-Integration", manufactured by Tokyo Precision Co., Ltd.) is used to emit laser light with a condensing point inside the silicon wafer in a grid pattern (1) on the silicon wafer. A modified region was formed on the surface side inside the wafer by irradiating the wafer along a planned division line (in a grid pattern of 10 mm × 10 mm). The laser light irradiation conditions are as follows.

<Laser light irradiation conditions>
(A) Laser light Laser light source Semiconductor laser excitation Nd: YAG laser Wavelength 1064 nm
Laser light spot cross-sectional area 3.14 × 10 ^-8 cm ²
Oscillation form Q-switched pulse repetition frequency 100kHz
Pulse width 1ns
Output 20μJ / pulse laser light quality TEM00
Polarization characteristics Linear polarization (B) Condensing lens Magnification 50x NA 0.55
Transmittance to laser light wavelength 60%
(C) The moving speed of the mounting table on which the semiconductor substrate is mounted is 100 mm / sec.

Next, the silicon wafer having the modified region formed inside was ground from the back surface side thereof to make it thinner. Specifically, a protective tape for back grind (trade name "UB-3083D", manufactured by Nitto Denko Corporation) is attached to the surface side of the silicon wafer, and then a back grind device (trade name "DGP8760", stock) is attached. The silicon wafer was ground to a thickness of 20 μm using (manufactured by Disco Corporation).

Next, the dicing tape pressure-sensitive adhesive layer of the dicing tape-integrated adhesive sheet to be used was irradiated with ultraviolet rays from the side of the dicing tape base material. The irradiation area is an area excluding the peripheral portion corresponding to the ring frame attachment area of the adhesive sheet. The integrated irradiation light amount is 350 mJ / cm ² .

Next, after attaching the back surface side of the thinned silicon wafer to the adhesive sheet of the dicing tape integrated adhesive sheet and attaching the ring frame, refer to FIG. The cool expanding process for dicing as described above was performed. Specifically, using a dicing separate device (trade name "Die Separator DDS2300", manufactured by DISCO Corporation), the dicing tape of the dicing tape integrated adhesive sheet with a silicon wafer is used in the cool expand unit. Was expanded. In this expanding step, the temperature is −15 ° C., the expanding speed is 200 mm / sec, and the expanding amount is 12 mm.

Next, with reference to FIG. 9, the expansion step for separation as described above was performed. Specifically, using a dicing separate device (trade name "Die Separator DDS2300", manufactured by DISCO Corporation), a dicing tape integrated adhesive with a silicon wafer that has undergone the first expanding step in its heat expanding unit. The dicing tape of the adhesive sheet was expanded and heat shrinkage was caused in the peripheral region thereof. In this expanding step, the expanding amount is 10 mm, and the heat temperature is 250 ° C. and the air volume is 40 L / min for hot air blown from a position 20 mm away from the periphery of the wafer holding region in the dicing tape integrated adhesive sheet. The rotation speed is 3 ° / sec.

After going through the above processes using the dicing tape integrated adhesive sheets of Examples 1 to 6 and Comparative Examples 1 and 2, the total number of semiconductor chips contained in the semiconductor wafer is divided. Moreover, the ratio of the total number of semiconductor chips with the adhesive sheet without floating (partial or total peeling from the dicing tape) was investigated. Then, regarding the splittability, the case where the ratio is 90% or more is evaluated as excellent, the case where the ratio is 70% or more and less than 90% is evaluated as good, and the case where the ratio is less than 70%. It was evaluated as impossible. The evaluation results are listed in Table 1.

[evaluation]
The dicing tape-integrated adhesive sheet of Examples 1 to 6 is suitable for suppressing the generation of fibrous debris during blade dicing, and is also suitable for realizing good splitability in the expansion step for splitting. The dicing tape-integrated adhesive sheet of Comparative Examples 1 and 2 produces a large amount of fibrous waste during blade dicing.

X Dicing tape integrated adhesive sheet 10 Dicing tape 11 Base material 11e Outer peripheral edge 12 Adhesive layer 12e Outer peripheral edge 20,21 Adhesive sheet 20e Outer peripheral edge W, 30, 30A, 30C Semiconductor wafer 30B Semiconductor wafer division Body 30a Dividing groove 30b Dicing region 31 Semiconductor chip

Claims (8)

A substrate containing an ethylene-vinyl acetate copolymer as a main component and 3 to 45% by mass of ionomer resin, and an additive-type radiation-curable pressure-sensitive adhesive, an internal-type radiation-curable pressure-sensitive adhesive, and a heat-foaming-type pressure-sensitive adhesive as pressure-sensitive adhesives. , Or a pressure-sensitive pressure-sensitive adhesive layer, and the additive-type radiation-curable pressure-sensitive adhesive is a radiation-polymerizable adhesive having a base polymer of an acrylic pressure-sensitive adhesive and a functional group such as a radiation-polymerizable carbon-carbon double bond. A pressure-sensitive adhesive layer containing the monomer component and / or the oligomer component of the above, and the internal radiation curable pressure-sensitive adhesive, the heat-foamed pressure-sensitive adhesive, and the pressure-sensitive pressure-sensitive adhesive containing an acrylic polymer as a base polymer . Dying tape with a laminated structure including
A dicing tape-integrated adhesive sheet comprising a adhesive sheet that is detachably adhered to the adhesive layer of the dicing tape. The first aspect of the present invention, wherein the base material exhibits a tensile elastic modulus of 9 MPa or more in a tensile test conducted on a base material test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, -15 ° C., and a tensile speed of 100 mm / min. Dicing tape integrated adhesive sheet. Claim 1 or 2 shows that the substrate exhibits a tensile elastic modulus of 30 MPa or less in a tensile test performed on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, −15 ° C. and a tensile speed of 100 mm / min. The dicing tape integrated adhesive sheet described in. The substrate exhibits a tensile stress of 25 N or less at a strain value of 10% in a tensile test performed on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, −15 ° C. and a tensile speed of 100 mm / min. The dicing tape integrated adhesive sheet according to any one of claims 1 to 3. The substrate exhibits a tensile stress of 25 N or less at a strain value of 30% in a tensile test performed on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, −15 ° C. and a tensile speed of 100 mm / min. The dicing tape integrated adhesive sheet according to any one of claims 1 to 4. The substrate according to claims 1 to 5, wherein the substrate exhibits a tensile elastic modulus of 15 MPa or less in a tensile test conducted on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, 25 ° C. and a tensile speed of 100 mm / min. The dicing tape integrated adhesive sheet according to any one. The substrate exhibits a tensile stress of 15 N or less at a strain value of 10% in a tensile test performed on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, 25 ° C. and a tensile speed of 100 mm / min. Item 2. The dicing tape integrated adhesive sheet according to any one of Items 1 to 6. The substrate exhibits a tensile stress of 15 N or less at a strain value of 30% in a tensile test performed on a substrate test piece having a width of 10 mm under the conditions of an initial chuck distance of 10 mm, 25 ° C. and a tensile speed of 100 mm / min. Item 2. The dicing tape integrated adhesive sheet according to any one of Items 1 to 7.

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