JP6982132B2 - 電子機器および撮像装置 - Google Patents
電子機器および撮像装置 Download PDFInfo
- Publication number
- JP6982132B2 JP6982132B2 JP2020098167A JP2020098167A JP6982132B2 JP 6982132 B2 JP6982132 B2 JP 6982132B2 JP 2020098167 A JP2020098167 A JP 2020098167A JP 2020098167 A JP2020098167 A JP 2020098167A JP 6982132 B2 JP6982132 B2 JP 6982132B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- transistor
- wiring
- layer
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003384 imaging method Methods 0.000 title claims description 17
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 594
- 239000004065 semiconductor Substances 0.000 description 310
- 238000006243 chemical reaction Methods 0.000 description 85
- 239000010408 film Substances 0.000 description 71
- 230000006870 function Effects 0.000 description 68
- 239000011701 zinc Substances 0.000 description 64
- 238000000034 method Methods 0.000 description 57
- 229910052751 metal Inorganic materials 0.000 description 49
- 239000002184 metal Substances 0.000 description 47
- 239000000463 material Substances 0.000 description 40
- 239000000758 substrate Substances 0.000 description 39
- 239000004020 conductor Substances 0.000 description 33
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 29
- 229910052760 oxygen Inorganic materials 0.000 description 29
- 239000001301 oxygen Substances 0.000 description 29
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 25
- 229910052711 selenium Inorganic materials 0.000 description 25
- 239000011669 selenium Substances 0.000 description 25
- 239000001257 hydrogen Substances 0.000 description 23
- 229910052739 hydrogen Inorganic materials 0.000 description 23
- 239000012535 impurity Substances 0.000 description 22
- 229910052738 indium Inorganic materials 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 238000009413 insulation Methods 0.000 description 19
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 18
- 229910052725 zinc Inorganic materials 0.000 description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 17
- 125000004429 atom Chemical group 0.000 description 15
- 239000013078 crystal Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 206010021143 Hypoxia Diseases 0.000 description 14
- 229910052581 Si3N4 Inorganic materials 0.000 description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 239000012212 insulator Substances 0.000 description 13
- 229910052721 tungsten Inorganic materials 0.000 description 13
- 230000000903 blocking effect Effects 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 12
- 230000007547 defect Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 8
- -1 silicon nitride nitride Chemical class 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 8
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 7
- 229910001195 gallium oxide Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910000449 hafnium oxide Inorganic materials 0.000 description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 6
- 150000002431 hydrogen Chemical class 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 150000001340 alkali metals Chemical class 0.000 description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 5
- 150000001342 alkaline earth metals Chemical class 0.000 description 5
- 239000000969 carrier Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 230000000717 retained effect Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- 229910052727 yttrium Inorganic materials 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 4
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 4
- 229910017566 Cu-Mn Inorganic materials 0.000 description 3
- 229910017871 Cu—Mn Inorganic materials 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 3
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 229910020156 CeF Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Inorganic materials [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 1
- 229910052800 carbon group element Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Inorganic materials [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- YPMOSINXXHVZIL-UHFFFAOYSA-N sulfanylideneantimony Chemical compound [Sb]=S YPMOSINXXHVZIL-UHFFFAOYSA-N 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/709—Circuitry for control of the power supply
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/18—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength
- G08B13/189—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems
- G08B13/194—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using image scanning and comparing systems
- G08B13/196—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using image scanning and comparing systems using television cameras
- G08B13/19602—Image analysis to detect motion of the intruder, e.g. by frame subtraction
- G08B13/19604—Image analysis to detect motion of the intruder, e.g. by frame subtraction involving reference image or background adaptation with time to compensate for changing conditions, e.g. reference image update on detection of light level change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1207—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
- H01L27/14616—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/53—Constructional details of electronic viewfinders, e.g. rotatable or detachable
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/65—Control of camera operation in relation to power supply
- H04N23/651—Control of camera operation in relation to power supply for reducing power consumption by affecting camera operations, e.g. sleep mode, hibernation mode or power off of selective parts of the camera
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/667—Camera operation mode switching, e.g. between still and video, sport and normal or high- and low-resolution modes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/681—Motion detection
- H04N23/6811—Motion detection based on the image signal
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/42—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/707—Pixels for event detection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/74—Circuitry for scanning or addressing the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/767—Horizontal readout lines, multiplexers or registers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/32—Transforming X-rays
- H04N5/3205—Transforming X-rays using subtraction imaging techniques
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Thin Film Transistor (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Studio Devices (AREA)
Description
本実施の形態では、本発明の一態様である撮像装置について、図面を参照して説明する。
本実施の形態では、実施の形態1で説明した撮像装置が有する画素20に適用可能な画素回路およびその駆動方法の一例について説明する。
本実施の形態では、本発明の一態様に用いることのできるOSトランジスタについて図面を用いて説明する。なお、本実施の形態における図面では、明瞭化のために一部の要素を拡大、縮小、または省略して図示している。
本実施の形態では、実施の形態2に示したトランジスタの構成要素について詳細を説明する。
本実施の形態では、本発明の一態様に用いることのできる酸化物半導体の材料について説明する。
本実施の形態では、イメージセンサチップを収めたパッケージおよびカメラモジュールの一例について説明する。当該イメージセンサチップには、本発明の一態様の撮像装置の構成を用いることができる。
本発明の一態様に係る撮像装置を用いることができる電子機器として、表示機器、パーソナルコンピュータ、記録媒体を備えた画像記憶装置または画像再生装置、携帯電話、携帯型を含むゲーム機、携帯データ端末、電子書籍端末、ビデオカメラ、デジタルスチルカメラ等のカメラ、ゴーグル型ディスプレイ(ヘッドマウントディスプレイ)、ナビゲーションシステム、音響再生装置(カーオーディオ、デジタルオーディオプレイヤー等)、複写機、ファクシミリ、プリンタ、プリンタ複合機、現金自動預け入れ払い機(ATM)、自動販売機などが挙げられる。これら電子機器の具体例を図38に示す。
20a 画素
20b 画素
20c 画素
21 画素アレイ
22 回路
23 回路
24 回路
25 回路
26 回路
27 回路
28 回路
29 回路
31 コンパレータ回路
32 コンパレータ回路
33 NAND回路
34 NAND回路
35 NOR回路
36 インバータ回路
37 レベルシフタ回路
41 トランジスタ
42 トランジスタ
43 トランジスタ
44 トランジスタ
45 トランジスタ
46 トランジスタ
47 トランジスタ
51 トランジスタ
52 トランジスタ
53 トランジスタ
54 トランジスタ
55 トランジスタ
56 トランジスタ
57 トランジスタ
58 トランジスタ
59 トランジスタ
60 トランジスタ
61 配線
62 配線
63 配線
65 配線
66 配線
69 配線
71 配線
71a 導電層
71b 導電層
72 配線
73 配線
74 配線
75 配線
79 配線
80 絶縁層
80a 絶縁層
80b 絶縁層
81 絶縁層
81a 絶縁層
81b 絶縁層
81e 絶縁層
81h 絶縁層
81i 絶縁層
81j 絶縁層
81k 絶縁層
82 導電体
82a 導電体
82b 導電体
83 絶縁層
84 導電層
85 導電層
88 配線
90 配線
91 配線
92 配線
93 配線
94 配線
101 トランジスタ
102 トランジスタ
103 トランジスタ
104 トランジスタ
105 トランジスタ
106 トランジスタ
107 トランジスタ
115 基板
120 絶縁層
130 酸化物半導体層
130a 酸化物半導体層
130b 酸化物半導体層
130c 酸化物半導体層
130d 酸化物半導体層
140 導電層
141 導電層
145 絶縁層
150 導電層
151 導電層
155 絶縁層
160 絶縁層
170 導電層
171 導電層
172 導電層
173 導電層
180 絶縁層
200 導電体
201 導電体
210 絶縁層
231 領域
232 領域
402 接続部
402a 金属層
402b 金属層
403 接続部
403a 金属層
403b 金属層
405 金属層
443 トランジスタ
546 トランジスタ
547 トランジスタ
561 光電変換層
562 透光性導電層
563 半導体層
564 半導体層
565 半導体層
566 電極
566a 導電層
566b 導電層
567 隔壁
568 正孔注入阻止層
569 電子注入阻止層
588 配線
600 単結晶シリコン基板
620 p+領域
630 p−領域
640 n型領域
650 p+領域
660 活性層
710 配線
711 配線
712 配線
713 配線
810 パッケージ基板
811 パッケージ基板
820 カバーガラス
821 レンズカバー
830 接着剤
835 レンズ
840 バンプ
841 ランド
850 イメージセンサチップ
851 イメージセンサチップ
860 電極パッド
861 電極パッド
870 ワイヤ
871 ワイヤ
880 スルーホール
885 ランド
890 ICチップ
901 筐体
902 筐体
903 表示部
904 表示部
905 マイク
906 スピーカー
907 操作キー
908 スタイラス
909 カメラ
911 筐体
912 表示部
919 カメラ
931 筐体
932 表示部
933 リストバンド
935 ボタン
936 竜頭
939 カメラ
951 筐体
952 レンズ
953 支持部
961 筐体
962 シャッターボタン
963 マイク
965 レンズ
967 発光部
971 筐体
972 筐体
973 表示部
974 操作キー
975 レンズ
976 接続部
1100 層
1200 層
1300 層
1400 層
1530 遮光層
1540 マイクロレンズアレイ
1550a 光学変換層
1550b 光学変換層
1550c 光学変換層
Claims (8)
- カメラモジュールを有する電子機器であって、
前記カメラモジュールは、
撮像装置と、
前記撮像装置と重なるレンズと、を有し、
前記撮像装置は、
第1の画素回路と、
前記第1の画素回路と等価の第2の画素回路と、
配線と、
前記第1の画素回路と前記配線を介して電気的に接続された第1の回路と、を有し、
前記第1の回路は、前記第2の画素回路と前記配線を介して電気的に接続され、
前記第1の画素回路は、二つの画像データの差分に基づく信号を前記配線に出力し、
前記第1の回路は、前記信号が第1の値以上の場合または第2の値以下の場合にハイレベル電位又はローレベル電位の一方を出力し、
前記第1の回路は、前記信号が前記第2の値より大きく、前記第1の値より小さい場合に前記ハイレベル電位又は前記ローレベル電位の他方を出力する電子機器。 - カメラモジュールを有する電子機器であって、
前記カメラモジュールは、
撮像装置と、
前記撮像装置と重なるレンズと、を有し、
前記撮像装置は、
第1の画素回路と、
前記第1の画素回路と等価の第2の画素回路と、
配線と、
前記第1の画素回路と前記配線を介して電気的に接続された第1の回路と、
第2の回路と、
第3の回路と、を有し、
前記第1の回路は、前記第2の画素回路と前記配線を介して電気的に接続され、
前記第1の画素回路は、二つの画像データの差分に基づく信号を前記配線に出力し、
前記第1の回路は、前記信号が第1の値以上の場合または第2の値以下の場合にハイレベル電位又はローレベル電位の一方を出力し、
前記第1の回路は、前記信号が前記第2の値より大きく、前記第1の値より小さい場合に前記ハイレベル電位又は前記ローレベル電位の他方を出力し、
前記第2の回路は、前記第2の回路にハイレベル電位およびローレベル電位の一方が入力されたときに、前記第3の回路に電力を供給し、
前記第2の回路は、ハイレベル電位およびローレベル電位の他方が前記第2の回路に入力されたとき、前記第3の回路に電力を供給しない電子機器。 - 請求項1または請求項2において、
画素アレイを有し、
前記画素アレイは、マトリクス状に配置された複数の前記第1の画素回路を有する電子機器。 - 請求項1乃至請求項3のいずれか一において、
前記第1の画素回路は、二つの異なるフレームにおける前記二つの画像データ間の差を取得する電子機器。 - 第1の画素回路と、
前記第1の画素回路と等価の第2の画素回路と、
配線と、
前記第1の画素回路と前記配線を介して電気的に接続された第1の回路と、を有し、
前記第1の回路は、前記第2の画素回路と前記配線を介して電気的に接続され、
前記第1の画素回路は、二つの画像データの差分に基づく信号を前記配線に出力し、
前記第1の回路は、前記信号が第1の値以上の場合または第2の値以下の場合にハイレベル電位又はローレベル電位の一方を出力し、
前記第1の回路は、前記信号が前記第2の値より大きく、前記第1の値より小さい場合に前記ハイレベル電位又は前記ローレベル電位の他方を出力する撮像装置。 - 第1の画素回路と、
前記第1の画素回路と等価の第2の画素回路と、
配線と、
前記第1の画素回路と前記配線を介して電気的に接続された第1の回路と、
第2の回路と、
第3の回路と、を有し、
前記第1の回路は、前記第2の画素回路と前記配線を介して電気的に接続され、
前記第1の画素回路は、二つの画像データの差分に基づく信号を前記配線に出力し、
前記第1の回路は、前記信号が第1の値以上の場合または第2の値以下の場合にハイレベル電位又はローレベル電位の一方を出力し、
前記第1の回路は、前記信号が前記第2の値より大きく、前記第1の値より小さい場合に前記ハイレベル電位又は前記ローレベル電位の他方を出力し、
前記第2の回路は、前記第2の回路にハイレベル電位およびローレベル電位の一方が入力されたときに、前記第3の回路に電力を供給し、
前記第2の回路は、ハイレベル電位およびローレベル電位の他方が前記第2の回路に入力されたとき、前記第3の回路に電力を供給しない撮像装置。 - 請求項5または請求項6において、
画素アレイを有し、
前記画素アレイは、マトリクス状に配置された複数の前記第1の画素回路を有する撮像装置。 - 請求項5乃至請求項7のいずれか一において、
前記第1の画素回路は、二つの異なるフレームにおける前記二つの画像データ間の差を取得する撮像装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016055039 | 2016-03-18 | ||
JP2016055039 | 2016-03-18 | ||
JP2018505548A JP7007257B2 (ja) | 2016-03-18 | 2017-03-09 | 撮像装置、モジュール、および電子機器 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018505548A Division JP7007257B2 (ja) | 2016-03-18 | 2017-03-09 | 撮像装置、モジュール、および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020171023A JP2020171023A (ja) | 2020-10-15 |
JP6982132B2 true JP6982132B2 (ja) | 2021-12-17 |
Family
ID=59850212
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018505548A Active JP7007257B2 (ja) | 2016-03-18 | 2017-03-09 | 撮像装置、モジュール、および電子機器 |
JP2020098167A Active JP6982132B2 (ja) | 2016-03-18 | 2020-06-05 | 電子機器および撮像装置 |
JP2022000921A Withdrawn JP2022033323A (ja) | 2016-03-18 | 2022-01-06 | 撮像装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018505548A Active JP7007257B2 (ja) | 2016-03-18 | 2017-03-09 | 撮像装置、モジュール、および電子機器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022000921A Withdrawn JP2022033323A (ja) | 2016-03-18 | 2022-01-06 | 撮像装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US10536657B2 (ja) |
JP (3) | JP7007257B2 (ja) |
KR (2) | KR20180123547A (ja) |
WO (1) | WO2017158478A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10140827B2 (en) | 2014-07-07 | 2018-11-27 | Google Llc | Method and system for processing motion event notifications |
US9082018B1 (en) * | 2014-09-30 | 2015-07-14 | Google Inc. | Method and system for retroactively changing a display characteristic of event indicators on an event timeline |
JP7007257B2 (ja) * | 2016-03-18 | 2022-01-24 | 株式会社半導体エネルギー研究所 | 撮像装置、モジュール、および電子機器 |
JP7148269B2 (ja) * | 2018-05-02 | 2022-10-05 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および撮像装置 |
JPWO2021090110A1 (ja) | 2019-11-07 | 2021-05-14 | ||
JP7506468B2 (ja) * | 2019-11-21 | 2024-06-26 | キヤノン株式会社 | 撮像装置、撮像装置の制御方法 |
WO2021258303A1 (zh) * | 2020-06-23 | 2021-12-30 | 庆鼎精密电子(淮安)有限公司 | 相机模组及其制备方法 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5705807A (en) | 1994-10-24 | 1998-01-06 | Nissan Motor Co., Ltd. | Photo detecting apparatus for detecting reflected light from an object and excluding an external light componet from the reflected light |
JPH11225289A (ja) | 1997-11-04 | 1999-08-17 | Nikon Corp | エッジ検出用固体撮像装置、並びに固体撮像装置の駆動によるエッジ検出方法 |
JPH11205683A (ja) | 1998-01-08 | 1999-07-30 | Nikon Corp | 動体検出用赤外線固体撮像装置 |
JP4265038B2 (ja) | 1999-08-02 | 2009-05-20 | ソニー株式会社 | 画像処理装置 |
EP1998373A3 (en) | 2005-09-29 | 2012-10-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
JP5078246B2 (ja) | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
JP2010154189A (ja) | 2008-12-25 | 2010-07-08 | Nec Corp | 携帯端末、及び画像選択方法 |
KR101645680B1 (ko) | 2009-11-06 | 2016-08-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
MY166309A (en) | 2009-11-20 | 2018-06-25 | Semiconductor Energy Lab | Nonvolatile latch circuit and logic circuit, and semiconductor device using the same |
KR101473684B1 (ko) | 2009-12-25 | 2014-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR101874779B1 (ko) | 2009-12-25 | 2018-07-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 메모리 장치, 반도체 장치, 및 전자 장치 |
TWI562142B (en) | 2011-01-05 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Storage element, storage device, and signal processing circuit |
TWI536502B (zh) | 2011-05-13 | 2016-06-01 | 半導體能源研究所股份有限公司 | 記憶體電路及電子裝置 |
US8836626B2 (en) | 2011-07-15 | 2014-09-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
JP5812959B2 (ja) | 2011-12-15 | 2015-11-17 | キヤノン株式会社 | 撮像装置 |
JP6151530B2 (ja) * | 2012-02-29 | 2017-06-21 | 株式会社半導体エネルギー研究所 | イメージセンサ、カメラ、及び監視システム |
JP6046514B2 (ja) | 2012-03-01 | 2016-12-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP6041707B2 (ja) | 2012-03-05 | 2016-12-14 | 株式会社半導体エネルギー研究所 | ラッチ回路および半導体装置 |
JP6227890B2 (ja) | 2012-05-02 | 2017-11-08 | 株式会社半導体エネルギー研究所 | 信号処理回路および制御回路 |
US8785928B2 (en) | 2012-05-31 | 2014-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US9343120B2 (en) | 2012-06-01 | 2016-05-17 | Semiconductor Energy Laboratory Co., Ltd. | High speed processing unit with non-volatile register |
WO2014061761A1 (en) | 2012-10-17 | 2014-04-24 | Semiconductor Energy Laboratory Co., Ltd. | Microcontroller and method for manufacturing the same |
JP5604700B2 (ja) | 2012-10-29 | 2014-10-15 | 弘一 関根 | 動き検出用撮像装置、動き検出カメラおよび動き検出システム |
JP5747238B2 (ja) | 2012-12-07 | 2015-07-08 | 関根 弘一 | 動き検出用固体撮像装置及び動き検出システム |
US9384813B2 (en) | 2014-02-07 | 2016-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device applicable to a multi-context programmable logic device |
JP6612056B2 (ja) | 2014-05-16 | 2019-11-27 | 株式会社半導体エネルギー研究所 | 撮像装置、及び監視装置 |
JP6581825B2 (ja) * | 2014-07-18 | 2019-09-25 | 株式会社半導体エネルギー研究所 | 表示システム |
JP6555956B2 (ja) * | 2014-07-31 | 2019-08-07 | 株式会社半導体エネルギー研究所 | 撮像装置、監視装置、及び電子機器 |
US9986179B2 (en) * | 2014-09-30 | 2018-05-29 | Qualcomm Incorporated | Sensor architecture using frame-based and event-based hybrid scheme |
JP6777421B2 (ja) * | 2015-05-04 | 2020-10-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9912897B2 (en) | 2015-05-11 | 2018-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
KR20160144314A (ko) | 2015-06-08 | 2016-12-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 및 그 동작 방법, 및 전자 기기 |
US9860465B2 (en) | 2015-06-23 | 2018-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
JP6791667B2 (ja) | 2015-07-16 | 2020-11-25 | 株式会社半導体エネルギー研究所 | 撮像装置 |
US9876946B2 (en) | 2015-08-03 | 2018-01-23 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
JP7007257B2 (ja) * | 2016-03-18 | 2022-01-24 | 株式会社半導体エネルギー研究所 | 撮像装置、モジュール、および電子機器 |
US20170365209A1 (en) | 2016-06-17 | 2017-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device, and electronic device |
CN108307131B (zh) | 2016-12-27 | 2021-08-03 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
-
2017
- 2017-03-09 JP JP2018505548A patent/JP7007257B2/ja active Active
- 2017-03-09 KR KR1020187029908A patent/KR20180123547A/ko not_active IP Right Cessation
- 2017-03-09 US US16/081,322 patent/US10536657B2/en not_active Expired - Fee Related
- 2017-03-09 WO PCT/IB2017/051375 patent/WO2017158478A1/ja active Application Filing
- 2017-03-09 KR KR1020217024912A patent/KR102593880B1/ko active IP Right Grant
-
2019
- 2019-12-16 US US16/715,852 patent/US11330213B2/en active Active
-
2020
- 2020-06-05 JP JP2020098167A patent/JP6982132B2/ja active Active
-
2022
- 2022-01-06 JP JP2022000921A patent/JP2022033323A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP7007257B2 (ja) | 2022-01-24 |
JP2022033323A (ja) | 2022-02-28 |
KR20210100221A (ko) | 2021-08-13 |
KR102593880B1 (ko) | 2023-10-24 |
JPWO2017158478A1 (ja) | 2019-01-31 |
KR20180123547A (ko) | 2018-11-16 |
US20190096206A1 (en) | 2019-03-28 |
US20200154068A1 (en) | 2020-05-14 |
US11330213B2 (en) | 2022-05-10 |
WO2017158478A1 (ja) | 2017-09-21 |
JP2020171023A (ja) | 2020-10-15 |
US10536657B2 (en) | 2020-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7049413B2 (ja) | 電子機器 | |
JP6982132B2 (ja) | 電子機器および撮像装置 | |
JP6843195B2 (ja) | 撮像装置 | |
JP6811342B2 (ja) | 光電変換装置 | |
JP2022125107A (ja) | 撮像装置、電子機器 | |
JP6960025B2 (ja) | 撮像装置 | |
JP6737633B2 (ja) | 撮像装置および電子機器 | |
JP6961479B2 (ja) | 撮像装置および電子機器 | |
JP6798790B2 (ja) | 撮像装置および電子機器 | |
JP7114783B2 (ja) | 撮像素子 | |
JP6903413B2 (ja) | 撮像装置、モジュール、および電子機器 | |
JP6904730B2 (ja) | 撮像装置 | |
WO2019243949A1 (ja) | 撮像装置の動作方法 | |
WO2021048676A1 (ja) | 撮像装置および電子機器 | |
WO2021130590A1 (ja) | 撮像装置、および電子機器 | |
JPWO2020021398A1 (ja) | 撮像装置および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200605 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210810 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210928 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20211026 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20211118 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6982132 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |