JP6981610B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device.

Conventionally, in a small electronic device such as a digital camera, a plurality of electronic components such as a circuit board are arranged inside a compact housing. Here, there is a problem that it is difficult to secure a sufficient space for laying out the electronic components, lead wires, and the like so as not to be in electrical contact with each other inside the compact housing.

Therefore, in Patent Document 1, two insulating sheets are arranged on a circuit board on which an electronic component is mounted, and a lead wire is wired between the two insulating sheets to form an electronic component and a lead wire. Is disclosed so as not to be electrically contacted with each other.

Japanese Unexamined Patent Publication No. 2012-164750

However, when an electronic component such as an ASIC (Application Specific Integrated Circuit) that generates heat during operation is covered with an insulating sheet as in a conventional electronic device, the heat generated by the electronic component is insulated. The sheet makes it difficult to dissipate heat, and heat is trapped between the insulating sheet and the circuit board, which may adversely affect the operation of electronic components.

The present invention has been made in view of this point, and an object of the present invention is to prevent heat generated in an electronic component from being easily dissipated due to the influence of an insulating sheet arranged so as to cover the electronic component. ..

The present invention is intended for an electronic device including a circuit board, an electronic component mounted on the circuit board and generating heat during operation, and an insulating sheet superposed on a surface of the circuit board on which the electronic component is mounted. , The following solutions have been taken.

That is, the first invention includes a heat radiating member which is arranged at a position corresponding to the electronic component in the insulating sheet and dissipates heat generated by the electronic component through the insulating sheet.
The heat radiating member is arranged at a position that does not overlap with the electronic component when viewed from the insulating sheet side, and is integrally formed with the adhesive portion and adhered to the insulating sheet and is not adhered to the insulating sheet. It is characterized by having a heat radiating portion that is brought into close contact with the electronic component via the insulating sheet and dissipates heat of the electronic component in a state.

In the first invention, the electronic component is covered with the insulating sheet, and the heat radiating member is arranged at the position corresponding to the electronic component on the insulating sheet. As a result, the heat generated by the electronic component can be dissipated by the heat radiating member via the insulating sheet, and it is possible to suppress the heat from being trapped inside due to the influence of the insulating sheet.

In addition, the heat-dissipating part is bonded to a position on the insulating sheet that does not overlap with the electronic parts by using an adhesive sheet or the like, while the heat-dissipating part is configured so that the adhesive sheet or the like does not intervene between the heat-dissipating part and the electronic parts. Can be brought into close contact with electronic components to improve heat transfer efficiency.

The second invention is the first invention.
The insulating sheet is characterized in that it is made of a transparent material.

In the second invention, since the position of the electronic component can be visually recognized through the transparent insulating sheet, it is possible to prevent problems such as fixing the heat radiating member to a position deviated from the electronic component.

The third invention is the first or second invention.
The heat radiating member is characterized in that it is made of a sheet-shaped member.

In the third invention, the heat dissipation property can be improved by bringing the sheet-shaped heat dissipation member into close contact with the electronic component while deforming it so as to follow the surface shape of the electronic component. Here, as the sheet-shaped heat radiating member, for example, a copper foil, an aluminum foil, a carbon sheet, or the like can be used.

The fourth invention is based on any one of the first to third inventions.
Opposing members arranged to face the surface on which the electronic component is mounted on the circuit board, and
It is characterized by having an elastic member that is elastically deformable and sandwiched between the heat radiating member and the facing member.

In the fourth invention, the elastic member is sandwiched between the heat radiating member and the facing member. As a result, the heat dissipation member can be pressed against the electronic component by the elastic force of the elastic member to bring the heat dissipation member into close contact with the electronic component, thereby improving the heat dissipation property of the electronic component. Further, since heat is transferred from the heat radiating member to the facing member, heat is also radiated from the facing member, and heat is easily diffused. Here, the facing member is, for example, a holding frame for holding a display panel of a digital camera.

The fifth invention is the fourth invention.
The heat radiating member is formed of a sheet-shaped member and is folded back so that a part thereof overlaps with each other.
The elastic member is characterized in that it is sandwiched between the folded portions of the heat radiating member.

In the fifth invention, the elastic member is sandwiched between the folded portions of the sheet-shaped heat radiating member. As a result, the heat radiating member is pressed against the electronic component by the elastic force of the elastic member to bring it into close contact with the electronic component, and the heat transferred from the electronic component to the contact surface of the heat radiating member is transmitted through the folded portion to the opposite surface sandwiching the elastic member. Since the heat is dissipated by the entire heat radiating member, the heat radiating property can be improved.

The sixth invention is based on any one of the first to fifth inventions.
The heat radiating portion has a non-contact position where only one end is fixed to the adhesive portion and separated from the electronic component, and a contact position where the heat radiating portion is brought into close contact with the electronic component via the insulating sheet to dissipate heat of the electronic component. It is characterized in that it can rotate between and.

In the sixth invention, the heat radiating member has an adhesive portion and a heat radiating portion. The bonded portion is bonded to a position on the insulating sheet that does not overlap with the electronic component. Only one end of the heat radiating portion is fixed to the adhesive portion.

In this way, the adhesive portion is adhered to the position of the insulating sheet that does not overlap with the electronic component with an adhesive sheet or the like, while the adhesive sheet or the like is not interposed between the heat radiating portion and the electronic component. The heat dissipation part can be brought into close contact with the electronic component to improve the heat transfer efficiency.

In addition, by fixing only one end of the heat dissipation part to the adhesive part, that is, by forming a hinge shape, when the heat dissipation part is pressed against the electronic component, the boundary position between the heat dissipation part and the adhesive part is used as a starting point. The heat radiating portion will be deformed in the direction of spreading to the non-fixed side. As a result, the external force applied in the thickness direction of the electronic component via the heat radiating portion can be released and dispersed in the direction orthogonal to the thickness direction.

According to the present invention, since the electronic component is covered with the insulating sheet and the heat radiating member is arranged at the position corresponding to the electronic component in the insulating sheet, the heat generated by the electronic component can be dissipated by the heat radiating member and is insulated. It is possible to prevent heat from being trapped inside due to the influence of the sheet.

It is a rear view which shows the structure of the electronic device which concerns on this embodiment. It is an exploded perspective view which shows the internal structure of an electronic device. It is a side sectional view which shows the internal structure of an electronic device by disassembling. It is a side sectional view which shows the internal structure of an electronic device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that the following description of the preferred embodiment is essentially merely an example and is not intended to limit the present invention, its application or its use.

As shown in FIG. 1, the electronic device 10 is configured as a digital camera. The electronic device 10 includes a housing 11 made of a resin material, a display panel 20 provided on the back side of the housing 11, a plurality of operation buttons 15 arranged side by side on the display panel 20, and a lens (not shown). Has an optical lens barrel unit 40 arranged inside the housing 11 so as to be exposed on the front side of the housing 11.

In the present embodiment, the thickness direction of the electronic device 10 is the front-back direction. Further, when viewed from the back side, the side on which the display panel 20 is arranged is the left side, and the side on which the operation buttons 15 are arranged is the right side.

The housing 11 is configured by combining a back cover 12 on the back side provided with a display panel 20 and an operation button 15 and a front cover 13 on the front side provided with a lens, and the back cover 12 and the front cover 13 are provided. By fastening the four corners with the fastening screw 18, a rectangular parallelepiped shape long in the left-right direction is formed.

The display panel 20 is, for example, a liquid crystal panel, and is for displaying a subject image taken by a lens at the time of shooting and for displaying image data recorded on a recording medium such as an SD card after shooting. The surface of the display panel 20 is covered with a protective glass 16 arranged on the back side of the display panel 20.

A plurality of operation buttons 15 are arranged at positions on the right side of the back cover 12. The operation button 15 is used to switch between a strobe light emitting mode, an AF mode, a still image mode, a moving image mode, and the like at the time of shooting. Further, at the time of image reproduction, it is used for switching image data to be displayed on the display panel 20, deleting image data, operating a menu screen, and the like.

The optical lens barrel unit 40 includes a lens, a shutter having an aperture function, an image pickup sensor that converts a captured optical image into an electric signal, and the like (not shown). The optical lens barrel unit 40 is float-supported in the front-rear direction inside the housing 11 by an elastic support member (not shown), so that the impact when the electronic device 10 is dropped can be mitigated.

As shown in FIGS. 2 and 3, a circuit board 30 is arranged inside the housing 11. Mounting holes 30a are formed at the four corners of the circuit board 30. The circuit board 30 is fixed to the front cover 13 by inserting a fastening screw (not shown) into the mounting hole 30a from the back surface side and fastening the circuit board 30 to the front cover 13 of the housing 11.

A plurality of electronic components 31 are mounted on the circuit board 30. Of the plurality of electronic components 31, the electronic component 31 mounted at a substantially central position of the circuit board 30 is an ASIC (Application Specific Integrated Circuit) that controls the operation of the electronic device 10.

An insulating sheet 32 having an insulating property is superposed on the surface of the circuit board 30 on the side on which the electronic component 31 is mounted. By covering the electronic component 31, the insulating sheet 32 prevents the flexible printed wiring board 21 and other conductive members (not shown) arranged from the right end of the display panel 20 from electrically contacting the electronic component 31. I have to. The insulating sheet 32 is made of a transparent material so that the position of the electronic component 31 can be visually recognized.

By the way, the ASIC as the electronic component 31 generates heat during operation, and if the electronic component 31 is covered with the insulating sheet 32, it becomes difficult for the heat generated by the electronic component 31 to be dissipated, and the insulating sheet 32 and the circuit There is a risk that heat will be trapped between the substrate 30 and the substrate 30.

Therefore, in the present embodiment, the heat radiating member 35 that dissipates the heat generated by the electronic component 31 through the insulating sheet 32 is arranged at the position corresponding to the electronic component 31 in the insulating sheet 32.

Specifically, the heat radiating member 35 is integrally formed in a hinge shape by fixing only one end to the adhesive portion 36 bonded to the insulating sheet 32 and the adhesive portion 36, and thermally contacts the electronic component 31. It has a heat radiating unit 37.

The adhesive portion 36 and the heat radiating portion 37 of the heat radiating member 35 are formed of one sheet-shaped member, for example, copper foil. The heat radiating member 35 may be made of, for example, an aluminum foil or a carbon sheet, as long as it is a member having a high thermal conductivity. An adhesive layer 38 is provided on the entire one side of the heat radiating member 35, that is, on one side of the adhesive portion 36 and the heat radiating portion 37.

The adhesive portion 36 is arranged at a position where it does not overlap with the electronic component 31 when viewed from the insulating sheet 32 side. The adhesive portion 36 is adhered to the insulating sheet 32 by the adhesive layer 38.

The heat radiating portion 37 has a shape that extends from the adhesive portion 36 toward the electronic component 31 side and is folded so that a part thereof overlaps. An elastic member 39 that can be elastically deformed is sandwiched in the folded portion of the heat radiating portion 37. The elastic member 39 is formed of, for example, a plate-shaped sponge material, and an adhesive layer 38 of a heat radiating portion 37 is attached along the surface of the elastic member 39. The elastic member 39 may be made of a rubber material.

Further, since the heat radiating portion 37 is integrally formed with the adhesive portion 36 in a hinge shape, the heat radiating portion 37 is lifted together with the elastic member 39 to be separated from the electronic component 31 at a non-contact position (virtual line in FIG. 3). (Described in) and the contact position (indicated by a solid line in FIG. 3) in contact with the electronic component 31 can be rotated.

In this way, when the heat radiating member 35 is adhered to the insulating sheet 32, the adhesive portion 36 is adhered by the adhesive sheet 38 at a position where it does not overlap with the electronic component 31, while the heat radiating portion 37 and the electronic component 31 are bonded to each other. , The adhesive sheet 38 is prevented from intervening. As a result, the heat radiating portion 37 can be brought into close contact with the electronic component 31 to improve the heat transfer efficiency.

As shown in FIG. 4, a holding frame 25 (opposing member) for fitting and holding the display panel 20 is arranged so as to face the surface of the circuit board 30 on which the electronic component 31 is mounted.

The holding frame 25 is formed by bending one metal plate, and has a bottom plate 26 that receives and holds the display panel 20, and the display panel 20 that stands upright from the outer peripheral edge of the bottom plate 26 to the display panel 20 side. It has a plurality of outer peripheral walls 27 that regulate movement in the vertical and horizontal directions.

The bottom plate 26 is integrally formed with protrusions 28 that project outward from the left and right ends of the display panel 20. A mounting hole 28a is formed in the protruding portion 28. The holding frame 25 is fixed to the back cover 12 by inserting a fastening screw (not shown) into the mounting hole 28a from the front side and fastening the holding frame 25 to the back cover 12 of the housing 11.

The bottom plate 26 is formed with a substantially rectangular wiring hole 26a extending in the vertical direction at a boundary position between the protrusion 28 on the right side and the bottom plate 26. A flexible printed wiring board 21 routed from the right end of the display panel 20 is inserted into the wiring hole 26a. The flexible printed wiring board 21 is connected to a connector (not shown) of the circuit board 30.

A plurality of outer peripheral walls 27 are erected along the outer peripheral edge of the display panel 20 at intervals, and by abutting on the outer peripheral portion of the display panel 20, movement in the vertical and horizontal directions is restricted. Here, the lower outer peripheral wall 27 is provided with an urging plate 29 formed by bending a part thereof toward the display panel 20 side.

The urging plate 29 is formed so as to be elastically deformable in the thickness direction, and is pressed downward by the display panel 20 when the display panel 20 is fitted into the holding frame 25. As a result, the urging plate 29 generates an urging force that urges the display panel 20 upward, and the display panel 20 is sandwiched between the outer peripheral wall 27 on the upper side of the holding frame 25 and the urging plate 29. It becomes.

A heat transfer sheet 33 formed of copper foil and attached to the holding frame 25 is sandwiched between the holding frame 25 and the heat radiating member 35. The heat radiating member 35 is in a state of being pressed toward the electronic component 31 by the holding frame 25. Here, since the elastic member 39 is sandwiched between the heat radiating portions 37 of the heat radiating member 35, the heat radiating member 35 can be pressed against the electronic component 31 by the elastic force of the elastic member 39 to be brought into close contact with the electronic component 31. As a result, the heat generated in the electronic component 31 is easily dissipated through the heat radiating portion 37 of the heat radiating member 35, the heat transfer sheet 33, and the holding frame 25 via the insulating sheet 32.

Further, the heat transferred from the electronic component 31 to the close contact surface of the heat radiating member 35 is transmitted to the opposite surface sandwiching the elastic member 39 through the folded portion of the heat radiating portion 37, and is radiated by the entire heat radiating member 35. Become. Further, since heat is transferred from the heat radiating member 35 to the holding frame 25 via the heat transfer sheet 33, heat is also radiated from the heat transfer sheet 33 and the holding frame 25. As a result, the heat generated in the electronic component 31 can be suppressed from being trapped between the insulating sheet 32 and the circuit board 30, and the heat dissipation can be improved.

By the way, when the electronic device 10 according to the present embodiment is used to shoot an underwater image, the back cover 12 of the housing 11 is pressed by the water pressure so that the substantially central portion of the back cover 12 in the left-right direction bends. It may be deformed.

Since the holding frame 25 is fastened and fixed to the back cover 12 of the housing 11, the holding frame 25 moves toward the inside of the housing 11 together with the back cover 12 when the back cover 12 bends. As a result, the holding frame 25 presses the heat radiating member 35, and an external force is applied to the electronic component 31 in the thickness direction.

Here, since the elastic member 39 integrally provided with the heat radiating member 35 is sandwiched between the holding frame 25 and the electronic component 31, the elastic member 39 elastically deforms and joins the electronic component 31. External force can be reduced.

Further, since the heat radiating member 35 has a configuration in which the heat radiating portion 37 is provided in a hinge shape with respect to the adhesive portion 36, even if the heat radiating portion 37 is pressed toward the electronic component 31 due to the bending of the back cover 12, heat is radiated. Starting from the boundary position between the portion 37 and the adhesive portion 36, the heat radiating portion 37 is deformed in the direction of spreading outward (upward in FIG. 4).

As a result, the external force applied in the thickness direction of the electronic component 31 via the heat radiating portion 37 can be released and dispersed in the direction orthogonal to the thickness direction of the electronic component 31.

<< Other Embodiments >>
The embodiment may have the following configuration.

In the present embodiment, the elastic member 39 is sandwiched between the folded portions of the heat radiating portion 37 of the heat radiating member 35, but the present invention is not limited to this embodiment. That is, the elastic member 39 may be sandwiched between the holding frame 25 and the heat radiating member 35. Therefore, for example, the heat radiating member 35 is made of a copper plate and the elastic member 39 is made of a sponge plate or a rubber plate. The elastic member 39 may be brought into close contact with the surface of the heat radiating member 35.

As described above, the present invention can be highly effective practical that heat generated by electronic components disposed the influence of the insulating sheet so as to cover the electronic components as possible out to suppress the less likely to be dissipated Therefore, it is extremely useful and has high industrial applicability.

10 Electronic equipment 25 Holding frame (opposing member)
30 Circuit board 31 Electronic components 32 Insulation sheet 35 Heat dissipation member 36 Adhesive part 37 Heat dissipation part 39 Elastic member

Claims (6)

An electronic device including a circuit board, an electronic component mounted on the circuit board and generating heat during operation, and an insulating sheet superposed on a surface of the circuit board on which the electronic component is mounted.
It is provided with a heat radiating member which is arranged at a position corresponding to the electronic component in the insulating sheet and dissipates heat generated by the electronic component through the insulating sheet.
The heat radiating member is arranged at a position that does not overlap with the electronic component when viewed from the insulating sheet side, and is integrally formed with the adhesive portion and is not adhered to the insulating sheet. An electronic device characterized by having a heat radiating portion that is brought into close contact with the electronic component via the insulating sheet and dissipates heat of the electronic component in a state. In claim 1,
The insulating sheet is an electronic device characterized in that it is made of a transparent material. In claim 1 or 2,
The heat radiating member is an electronic device characterized by being formed of a sheet-shaped member. In any one of claims 1 to 3,
Opposing members arranged to face the surface on which the electronic component is mounted on the circuit board, and
An electronic device including an elastic member that is elastically deformable and sandwiched between the heat radiating member and the facing member. In claim 4,
The heat radiating member is formed of a sheet-shaped member and is folded back so that a part thereof overlaps with each other.
The elastic member is an electronic device characterized in that it is sandwiched between folded portions of the heat radiating member. In any one of claims 1 to 5,
The heat radiating portion has a non-contact position where only one end is fixed to the adhesive portion and separated from the electronic component, and a contact position where the heat radiating portion is brought into close contact with the electronic component via the insulating sheet to dissipate heat of the electronic component. An electronic device characterized by being rotatable between and.

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