JP2015072960A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus including a heat dissipation structure of excellent assemblability, without increasing the number of components.SOLUTION: In a heat dissipation member that is inserted between an electronic component, e.g., an image sensor and a substrate, a space part is formed by the insulation member of a heat conduction sheet, which is then deflected while inserting the heat dissipation member into a gap between the electronic component and the substrate, thus pressing the heat conduction sheet toward the rear side of the image sensor. Since the heat conduction sheet is pressed and brought into tight contact with the image sensor, an elastic member is not required, and thereby increase in the number of components can be prevented.

Description

  The present invention relates to a heat dissipation structure for an electronic apparatus such as an imaging apparatus.

  2. Description of the Related Art In recent years, electronic devices such as imaging devices have a tendency to increase the temperature of an imaging device as the number of pixels of an imaging device such as a CCD or CMOS mounted increases. When the temperature of the image sensor rises, noise is generated with respect to the image and there is a possibility that the image quality is deteriorated. Therefore, it is required to have a structure that dissipates heat generated in the image sensor.

  As an imaging device that takes into consideration the heat dissipation as described above, a heat dissipation member composed of a reinforcing plate, a heat conductive sheet, and an elastic member is inserted into a gap formed between the image pickup element and the substrate, thereby releasing the heat dissipation of the image sensor. Has been proposed (see Patent Document 1).

  11 to 13 are views for explaining a conventional heat dissipation structure as proposed in Patent Document 1. FIG. FIG. 11A is a front view of an image sensor and a substrate on which the image sensor is mounted, FIG. 11B is a side view of the same, and FIG. 11C is a rear view of the same. 12A is a rear view of the heat radiating member, FIG. 12B is a side view thereof, and FIG. 12C is a front view thereof. In FIG. 11, 20 is an image sensor, and 21 is a substrate having a circuit or the like for processing an electrical signal output from the image sensor.

  The imaging element 20 is provided with terminals 20 a and 20 b on two opposite sides, and is mounted such that a certain gap 22 is provided with respect to the substrate 21.

  In FIG. 12, reference numeral 50 denotes a heat radiating member, and the heat radiating member 50 is composed of a metal foil such as a rectangular graphite sheet or a copper foil that is long in the insertion direction into the gap 22 between the image sensor 20 and the substrate 21. Reinforcement plate 52 made of polycarbonate resin or the like attached to the leading end side in the insertion direction of the sheet 51 or the heat conduction sheet 51, and affixed to the opposite side of the reinforcement plate 52 from the heat conduction sheet 51 with an adhesive or the like. It is constituted by an elastic member 53 such as rubber. Further, the total thickness of the heat radiating member 50, that is, the total thickness of the heat conductive sheet 51, the reinforcing plate 52, and the elastic member 53 is configured to be larger than the gap 22 between the imaging element 20 and the substrate 21.

  FIG. 13A is a rear view showing a state in which the heat dissipation member 50 is inserted into the gap 22 between the image sensor 20 and the substrate 21, and FIG. 13B is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 13, in the state where the heat dissipation member 50 is inserted into the gap 22 between the image sensor 20 and the substrate 21, the total thickness of the heat dissipation member 50 is larger than the gap 22 between the image sensor 20 and the substrate 21. Compressed. Thereby, the heat conductive sheet 51 is pressed and adhered to the back surface of the image sensor 20. Further, the heat radiating member 50 is fixed to the gap 22 between the imaging element 20 and the substrate 21 by this pressing force. With such a configuration, it is possible to radiate the heat generated in the imaging element 20 through the heat conductive sheet 51 of the heat radiating member 50.

JP 2011-211542 JP

  However, in the above conventional example, there is a problem that the number of parts is increased and the cost is increased because the elastic member 53 is required to press the heat conductive sheet 51 against the image pickup device 20 to be in close contact therewith. In addition, when the heat radiating member 50 is inserted into the gap 22 between the imaging element 20 and the substrate 21, there is a problem that it is difficult to assemble the heat radiating member 50.

  14A is a view of the state of the process of inserting the heat radiating member 50 into the gap 22 between the image sensor 20 and the substrate 21 as viewed from the back side, and FIG. 14B is a cross-sectional view taken along the line BB in FIG. FIG. As shown in FIG. 14, since the total thickness of the heat radiating member 50 is larger than the gap 22 between the imaging element 20 and the substrate 21, the side surface of the elastic member 53 contacts the substrate 21, so that the elastic member 53 needs to be inserted while being compressed. The problem that it is difficult to assemble arises. In addition, since the elastic member 53 formed of rubber or the like has a high coefficient of friction, it is difficult to slip when inserted into the gap, and thus it is difficult to assemble. Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an imaging device having a heat dissipating structure with good assembling properties without increasing the number of parts.

  In order to achieve the above object, the invention described in claim 1 includes a substrate, an electronic component mounted with a gap from the substrate, and a heat radiating member that radiates heat generated by the electronic component. In the electronic device, the heat dissipation member includes a heat conductive sheet having flexibility, the heat conductive sheet has a space portion, and the substrate and the electronic component are bent in the space portion of the heat conductive sheet. The heat conductive sheet is pressed against the back surface of the electronic component.

  According to a second aspect of the present invention, in the electronic device according to the first aspect, the thermal conductive sheet is a PET that laminates a thermal conductive member composed of a metal foil such as a graphite sheet or a copper foil, and a thermal conductive member. It is characterized by comprising an insulating member such as a sheet.

  According to a third aspect of the present invention, in the electronic device according to the second aspect, the heat dissipating member further includes a reinforcing plate, and the thermal conductive sheet is in the insertion direction of the reinforcing plate with respect to the reinforcing plate. The end of the reinforcing plate is bonded so that only the insulating member of the heat conductive sheet protrudes so as to be larger than the dimension, and the portion protruding from the reinforcing plate is sandwiched between the reinforcing plates. The space portion is formed by bonding the portion and the end portion of the insulating member by alignment.

  According to a fourth aspect of the present invention, in the electronic device according to any one of the first to third aspects, the thermal conductive sheet has a plurality of spaces.

  According to a fifth aspect of the present invention, in the electronic device according to any one of the first to fourth aspects, an ear portion is formed at a central portion of the space portion of the heat conductive sheet, and the space portion is bent. It is characterized in that it is bent inside the space portion so that the ear portion protrudes in the state.

  According to the present invention, in the heat dissipating member to be inserted into the gap between the electronic component such as the image sensor and the substrate, the space is formed by the insulating member of the heat conductive sheet, and the heat dissipating member is inserted into the gap between the image sensor and the substrate. Thus, by bending the space portion, the heat conductive sheet is pressed toward the back surface of the image sensor.

  Therefore, it is not necessary to provide an elastic member for pressing the heat conducting sheet against the image pickup device, and it is possible to prevent an increase in the number of parts.

It is the external appearance perspective view seen from the front direction of the digital camera in the embodiment of the present invention. It is the external appearance perspective view seen from the back direction of the digital camera in the embodiment of the present invention. It is a figure which shows the expansion | deployment state of the heat radiating member in embodiment of this invention. It is a figure which shows the state which adhere | attached the edge part of the reinforcement board and the edge part of the insulation member by position alignment so that the part which protrudes from the reinforcement board of the insulation member may be inserted | pinched from the state of FIG. It is a figure which shows the state of the process in which the thermal radiation member in embodiment of this invention is inserted in the clearance gap between an image pick-up element and a board | substrate. It is a figure which shows the state which inserted the thermal radiation member in embodiment of this invention in the clearance gap between an image pick-up element and a board | substrate. It is a perspective view which shows the state which made the heat dissipation member in embodiment of this invention contact the metal chassis which consists of a magnesium alloy etc. inside a main body. In the heat radiating member in embodiment of this invention, it is a figure at the time of setting it as the structure which provided two space parts between the reinforcement boards with the insulating member of the heat conductive sheet. In the heat radiating member in embodiment of this invention, it is a figure which shows the expansion | deployment state which formed the ear | edge part in the insulating member of the heat conductive sheet. From the state of FIG. 9, when bonding the end of the reinforcing plate and the end of the insulating member so as to sandwich the reinforcing plate between the portions protruding from the reinforcing plate of the insulating member, It is a figure which shows the state bent inside. It is a figure which shows the board | substrate with which the conventional image pick-up element and the image pick-up element were mounted. It is a figure which shows the conventional heat radiating member. It is a figure which shows the state which inserted the heat radiating member in the clearance gap between the conventional image pick-up element and a board | substrate. It is a figure which shows the state in the process of inserting the heat radiating member in the clearance gap between the conventional image pick-up element and a board | substrate.

  Hereinafter, a case where the imaging apparatus according to the embodiment of the present invention is applied to a digital camera with interchangeable lenses will be described with reference to the drawings.

  FIG. 1 is an external perspective view of a digital camera capable of exchanging lenses according to an embodiment of the present invention as viewed from the front, and FIG. 2 is an external perspective view of the digital camera as viewed from the back.

  1 and 2, the digital camera body 1 includes a camera mount 2, a lens lock pin 3, a lens lock release button 4, a mode dial 5, a release button 6, a power button 7, a display unit 8, an operation button 9, and a set button. 10, an electronic dial 11, and a moving image shooting button 12.

  The camera mount 2 is provided with bayonet claws for engaging an interchangeable lens (not shown). To attach the interchangeable lens to the digital camera body 1, the lens mount provided on the interchangeable lens is brought into close contact with the camera mount 2 at a predetermined lens replacement position, and the bayonet claw is engaged with the interchangeable lens while maintaining the close contact state. Rotate to a predetermined lens lock position. At the lens lock position, the lens lock pin 3 engages with the lens mount and is fixed to the digital camera body 1. To remove the interchangeable lens from the digital camera body 1, the lens lock release button 4 is pressed to unlock the interchangeable lens by the lens lock pin 3, and the interchangeable lens is rotated to the lens unlock position. It can be removed from the main body 1.

  The mode dial 5 is rotated by a photographer when the shooting mode is switched to various modes such as an auto mode, a manual mode, and a moving image mode.

  The release button 6 is pressed by a photographer when an electric signal captured by an image sensor 20 such as a CMOS or CCD, which will be described later, built in the digital camera body 1 is captured as a still image.

  The display unit 8 displays various information such as the remaining battery level, the current date and time, and the number of images that can be captured, in addition to the image being captured (so-called through image) and the menu screen.

  Various other functions such as a function for switching display / non-display of various information displayed on the display unit 8 and a menu display are assigned to the operation button 9.

  The electronic dial 11 is rotated by the photographer when the menu screen is displayed on the display unit 8 and the cursor displayed in the menu is moved in a desired direction. The movie shooting button 12 is pressed by a photographer when shooting a movie.

  Next, a heat dissipation structure for an image sensor, which is a feature of an embodiment of the present invention, will be described with reference to the drawings. Here, since the configuration of the imaging device 20 and the substrate 21 on which the imaging device 20 is mounted is the same as that of the conventional example, detailed description thereof is omitted.

  FIG. 3A is a rear view showing a developed state of the heat dissipation member in the embodiment of the present invention, FIG. 3B is a side view thereof, and FIG. 3C is a front view. In FIG. 3, reference numeral 30 denotes a heat radiating member, and the heat radiating member 30 is attached to the heat conductive sheet 31 having a rectangular shape that is long in the insertion direction into the gap between the imaging element 20 and the substrate 21 with an adhesive or the like. And a reinforcing plate 32 made of polycarbonate resin or the like.

  The heat conductive sheet 31 includes a heat conductive member 31a made of a metal foil such as a graphite sheet or a copper foil, and an insulating member 31b such as a PET sheet on which the heat conductive member 31a is laminated. 3A, the insulating member of the heat conductive sheet 31 is larger than the longitudinal X dimension of the reinforcing plate 32 with respect to the reinforcing plate 32 so that X <Y. Bonding is performed with only 31b protruding (Y dimension portion in FIG. 3 (a)).

  FIG. 4 shows the end of the reinforcing plate 32 so that the portion protruding from the reinforcing plate 32 indicated by the Y dimension portion of FIG. 3A of the insulating member 31b from the state of FIG. It is the figure which showed the state which adhere | attached the edge part of the insulating member by alignment. As shown in FIG. 4, since the projecting Y dimension of the insulating member 31b is larger than the longitudinal X dimension of the reinforcing plate 32, the heat radiation member 30 has a space 33 formed between the reinforcing plates 32 by the insulating member 31b. The

  FIG. 5A is a view of the state of the process of inserting the heat radiating member 30 in the state of FIG. 4 into the gap 22 between the imaging element 20 and the substrate 21 as viewed from the back side, and FIG. It is CC sectional drawing of 5 (a). As shown in FIG. 5 (b), when the heat radiating member 30 is inserted into the gap 22 between the image sensor 20 and the substrate 21, the curved portion 31b1 of the insulating member 31b of the heat radiating member 30 serves as a call for insertion and can be incorporated. It becomes.

  6A is a rear view showing a state in which the heat dissipation member 30 is inserted into the gap 22 between the image sensor 20 and the substrate 21, and FIG. 6B is a cross-sectional view taken along the line DD in FIG. 6A.

  As shown in FIG. 6, in a state where the heat dissipation member 30 is inserted into the gap 22 between the imaging element 20 and the substrate 21, the space portion 33 formed by the insulating member 31 b of the heat conductive sheet 31 of the heat dissipation member 30 is bent. Become. Thereby, the heat conductive sheet 30 is pressed toward the back surface of the image sensor 20 and is brought into close contact therewith. Further, the heat radiating member 30 is fixed to the gap 22 between the imaging element 20 and the substrate 21 by the bending force of the space portion 33.

  FIG. 7 shows a state in which a heat conductive sheet 31 of the heat radiating member 30 in which the heat radiating member 30 is inserted into the gap 22 between the image pickup device 20 and the substrate 21 is brought into contact with a metal chassis 40 made of magnesium alloy or the like inside the main body with double-sided tape or the like. It is a perspective view shown. With such a configuration, it is possible to dissipate heat generated in the imaging element 20 to the metal chassis 40 via the heat conductive sheet 31 of the heat dissipation member 30.

  Moreover, in the heat radiating member 30, it is good also as a structure which provides the space part 33 between the reinforcement boards 32 with the insulating member 31b of the heat conductive sheet 31. FIG.

  FIG. 8 (a) is a rear view when two insulating spaces 31a and 33b between the reinforcing plates 32 are provided by the insulating member 31b of the heat conductive sheet 31, and FIG. A side view and FIG. 8 (c) are front views. As shown in FIG. 8, by providing a plurality of space portions, it is possible to increase the pressing force of the heat conductive sheet 31 to the back surface of the imaging device 20. Further, the heat radiating member 30 may have the following configuration.

  9A is a rear view showing a developed state in which the ear portions 31b2 and 31b3 are formed on the insulating member 31b of the heat conductive sheet 31, FIG. 9B is a side view thereof, and FIG. 9C is a front view. It is. FIG. 10 shows that the end of the insulating member 31b and the end of the insulating member are bonded to each other so that the portion protruding from the reinforcing plate 32 of the insulating member 31b from the state of FIG. In this case, it is a diagram showing a state in which the ear portions 31b2 and 31b3 are bent inside the space portion 33. As shown in FIG. 9, when the space portion 33 bends with the heat dissipation member 30 inserted into the gap 22 between the imaging element 20 and the substrate 21 by bending the ear portions 31 b 2 and 31 b 3 inside the space portion 33. When the ear portions 31b2 and 31b3 are stretched, it is possible to increase the pressing force of the heat conducting sheet 30 to the back surface of the imaging element 20.

  As described above, in the embodiment of the present invention, in the heat dissipating member inserted into the gap between the image sensor and the substrate, a space is formed by the insulating member of the heat conductive sheet, and the heat dissipating member is provided in the gap between the image sensor and the substrate. In the inserted state, the heat conductive sheet is pressed toward the back surface of the imaging element by bending the space.

Therefore, it is not necessary to provide an elastic member for pressing the heat conducting sheet against the image pickup device, and it is possible to prevent an increase in the number of parts.
Further, when inserting the heat radiating member into the gap between the image sensor and the substrate, the curved portion of the insulating member of the heat conductive sheet serves as a call for insertion, so that the assemblability is improved. Furthermore, the insulating member of the heat conductive sheet is made of a material having a low coefficient of friction such as a PET sheet, so that it is easy to slip when inserted into the gap, and the assemblability is improved.

DESCRIPTION OF SYMBOLS 1 ... Digital camera body 20 ... Imaging device 21 ... Substrate 30 ... Radiation member 31 ... Thermal conduction sheet 32 ... Reinforcement plate 40 ... Metal chassis

Claims (5)

  In an electronic apparatus having a substrate, an electronic component mounted with a gap from the substrate, and a heat radiating member that radiates heat generated by the electronic component, the heat radiating member includes a flexible heat conduction sheet. The heat conduction sheet has a space portion, and the heat conduction sheet is inserted into a gap between the substrate and the electronic component in a state where the space portion of the heat conduction sheet is bent. An electronic device characterized by pressing a sheet.   2. The electron according to claim 1, wherein the heat conductive sheet includes a heat conductive member formed of a graphite sheet or a metal foil such as a copper foil, and an insulating member of a PET sheet on which the heat conductive member is laminated. machine.   The heat dissipating member further includes a reinforcing plate, and the heat conducting sheet projects only the insulating member of the heat conducting sheet so that the heat conducting sheet is larger than the dimension in the insertion direction of the reinforcing plate. By adhering the end of the reinforcing plate and the end of the insulating member so that the portion protruding from the reinforcing plate is sandwiched between the reinforcing plate and the end of the insulating member. The electronic device according to claim 2, wherein a part is formed.   The electronic device according to any one of claims 1 to 3, wherein the heat conductive sheet has a plurality of spaces.   An ear portion is formed at a center portion of the space portion of the heat conductive sheet, and the ear portion is bent inward so that the ear portion is stretched in a state where the space portion is bent. Item 5. The electronic device according to any one of Items 4 above.