JP6976205B2 - Chip position measuring device - Google Patents

Description

The present invention relates to a chip position measuring device that measures the positions of a plurality of chip components spaced apart from each other on a substrate such as a wafer.

In the manufacturing process of semiconductor devices and electronic devices, chip parts are placed on substrates such as semiconductor wafers, glass, and resin (for example, patterning and mounting), and diced chip parts are picked up from expanded wafers. There is a process to do it. Then, a process of inspecting whether or not these chip parts are arranged with a predetermined accuracy, measuring the position of the chip parts held at a predetermined position, and mounting / laminating these chip parts with other parts, wiring, etc. (For example, Patent Documents 1 to 3).

Japanese Unexamined Patent Publication No. 10-189672 Japanese Unexamined Patent Publication No. 2006-135237 Japanese Patent No. 4767831

If there is a reference mark for the positioning reference in the divided image field, the position of each chip component can be measured by measuring the relative position (XY coordinates, etc.) with the reference mark. Therefore, the positioning accuracy required for the stage mechanism is not excessively required.

However, if there is no reference mark for the positioning reference in the divided field of view, the chip component of each chip component is based on the stationary position information of the place where the image is taken in the divided field of view and the position information of the chip component in the divided field of view. It is necessary to measure the position. Therefore, a high-precision imaging position accuracy is required rather than a chip measurement position accuracy, and it is necessary to use a high-precision stage using a laser length measuring device or the like.

Therefore, the present invention has been made in view of the above problems, and even if there is no reference mark for the positioning reference in the field of view of the divided image, it is not necessary to use a highly accurate positioning mechanism, and the chip is highly accurate. It is an object of the present invention to provide a device capable of measuring the position of a component.

In order to solve the above problems, one aspect of the present invention is
A chip position measuring device that measures the position of each of a plurality of chip components that are spaced apart from each other on a substrate.
The board holding part that holds the board and
An imaging unit that divides a predetermined area set on the substrate into a plurality of divided imaging areas and images the image.
A chip position calculation unit that calculates the position of each chip component included in the divided imaging area based on the image captured by the image pickup unit.
A relative moving part that moves the substrate holding part and the imaging part relative to each other,
It is equipped with a control unit that drives and controls the relative moving unit and outputs an imaging trigger to the imaging unit while changing the location of the divided imaging area set on the board.
The divided imaging area includes at least two or more chip components, and at least one of the chip components is set as a duplicate imaging chip component included in both of the adjacent divided imaging areas. ,
The chip position calculation unit is
The position of each of the overlapping imaging chip components is calculated from the positional relationship with the other chip components included in the previously imaged divided imaging area.
The position of each of the other chip components excluding the duplicated imaging chip component included in the divided imaging chip component imaged later is calculated from the positional relationship with the duplicated imaging chip component .
A master board whose mutual positions of multiple reference marks are known is held by the board holder, and the board is held.
It is characterized by having a scaling correction unit that corrects the position of each chip component calculated by the chip position calculation unit based on the mutual position of the reference marks arranged on the master board.

According to the above invention, the position of the chip component can be measured with higher accuracy than the positioning accuracy of the positioning mechanism.

It is a schematic diagram which shows the whole structure of the example of the form which embodies the present invention. It is a conceptual diagram which shows the state of the image pickup in the example of the form which embodies the present invention. It is a top view which shows the positional relationship of each chip component in an example of the form which embodies the present invention. It is a top view which shows the positional relationship of each chip component in an example of another form which embodies the present invention. It is a top view which shows the positional relationship between a master substrate and a divided image pickup area in an example of another embodiment which embodies the present invention. It is a top view which shows the positional relationship of each of a divided image pickup area and a chip component in an example of another embodiment which embodies the present invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following description, the three axes of the Cartesian coordinate system are expressed as X, Y, and Z, the horizontal direction is expressed as the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the gravity direction) is expressed as the Z direction. do. Further, in the Z direction, the direction against gravity is expressed as the upper direction, and the direction in which gravity acts is expressed as the lower direction. Further, the direction of rotation with the Z direction as the central axis is defined as the θ direction.

FIG. 1 is a schematic view showing an overall configuration of an example of a form embodying the present invention. FIG. 1 schematically shows each part constituting the chip position measuring device 1 according to the present invention.

The chip position measuring device 1 measures the positions of each of a plurality of chip components C spaced apart from each other on the substrate W. Specifically, the chip position measuring device 1 includes a substrate holding unit 2, an imaging unit 3, a relative moving unit 4, a chip position calculating unit 5, a control unit CN, and the like.

The substrate holding portion 2 holds the substrate W.
Specifically, the substrate holding portion 2 supports the substrate W from the lower surface side while maintaining a horizontal state. More specifically, the substrate holding portion 2 includes a substrate mounting table 20 having a horizontal upper surface.
The board mounting table 20 is provided with a groove or a hole in a portion in contact with the board W, and the groove or the hole is connected to a negative pressure generating means such as a vacuum pump via a switching valve or the like. Then, the substrate holding portion 2 can hold and release the substrate W by switching these grooves and holes to a negative pressure state or an atmospheric release state.

The image pickup unit 3 divides a predetermined area set on the substrate W into a plurality of divided image pickup areas and takes an image. The predetermined region set on the substrate W referred to here is an region (in other words, a large region) including all the chip components arranged on the substrate W to be the position measurement target. Then, the image pickup unit 3 divides this predetermined area into a plurality of divided image pickup areas (in other words, a small area, also referred to as a local area) and takes an image.
Specifically, the size and position of the divided imaging area differ depending on the type of chip component arrangement (number, pitch, etc.) and required measurement accuracy, and are linked to each type and registered in the control unit CN, etc. There is.
More specifically, the image pickup unit 3 includes a lens barrel 30, an illumination unit 31, a half mirror 32, objective lenses 33a and 33b, a revolver mechanism 34, an image pickup camera 35, and the like.

The lens barrel 30 fixes the illumination unit 31, the half mirror 32, the objective lenses 33a and 33b, the revolver mechanism 34, the image pickup camera 35, and the like in a predetermined posture, and guides the illumination light and the observation light. The lens barrel 30 is attached to the device frame 1f via a connecting metal fitting or the like (not shown).
The illumination unit 31 emits the illumination light L1 necessary for imaging. Specifically, the lighting unit 31 may be exemplified by a laser diode, a metal halide lamp, a xenon lamp, LED lighting, or the like.
The half mirror 32 reflects the illumination light L1 emitted from the illumination unit 31 and irradiates the substrate W side, and allows the light (reflected light, scattered light) L2 incident from the substrate W side to pass through the image pickup camera 35 side. Is.
The objective lenses 33a and 33b form an image of the image pickup area on the work W on the image pickup camera 35 at different predetermined observation magnifications.
The revolver mechanism 34 switches which of the objective lenses 33a and 33b is used. Specifically, the revolver mechanism 34 rotates and stands still by a predetermined angle based on manual or external signal control.
The image pickup camera 35 captures an image pickup area F on the work W and acquires an image. The acquired image is output as a video signal or video data to the outside (in the present invention, a chip position calculation unit whose details will be described later).

The relative moving unit 4 relatively moves the substrate holding unit 2 and the imaging unit 3.
Specifically, the relative moving portion 4 includes an X-axis slider 41, a Y-axis slider 42, and a rotation mechanism 43.

The X-axis slider 41 is mounted on the device frame 1f, and the Y-axis slider 42 is moved in the X direction at an arbitrary speed and stopped at an arbitrary position. Specifically, the X-axis slider is composed of a pair of rails extending in the X direction, a slider unit that moves on the rails, and a slider drive unit that moves and stops the slider unit. The slider drive unit can be configured by a servomotor that rotates and stands still by signal control from the control unit CN, a combination of a pulse motor and a ball screw mechanism, a linear motor mechanism, and the like. Further, the X-axis slider 41 is provided with an encoder for detecting the current position and the amount of movement of the slider portion. Examples of this encoder include a linear scale called a linear scale in which fine irregularities are carved at a predetermined pitch, a rotary encoder that detects the rotation angle of a motor that rotates a ball screw, and the like.

The Y-axis slider 42 moves the rotation mechanism 43 in the Y direction at an arbitrary speed based on the control signal output from the control unit CN, and makes it stand still at an arbitrary position. Specifically, the Y-axis slider is composed of a pair of rails extending in the Y direction, a slider unit that moves on the rails, and a slider drive unit that moves and stops the slider unit. The slider drive unit can be configured by a servomotor that rotates and stands still by signal control from the control unit CN, a combination of a pulse motor and a ball screw mechanism, a linear motor mechanism, and the like. Further, the Y-axis slider 42 is provided with an encoder for detecting the current position and the amount of movement of the slider portion. Examples of this encoder include a linear scale called a linear scale in which fine irregularities are carved at a predetermined pitch, a rotary encoder that detects the rotation angle of a motor that rotates a ball screw, and the like.

The rotation mechanism 43 rotates the substrate mounting table 20 in the θ direction at an arbitrary speed and makes it stand still at an arbitrary angle. Specifically, the rotation mechanism 43 can be exemplified as a rotation / stationary mechanism such as a direct drive motor that is rotated / stationary at an arbitrary angle by signal control from an external device. The board mounting table 20 of the board holding portion 2 is mounted on the member on the rotating side of the rotating mechanism 43.

Since the relative moving unit 4 has such a configuration, the substrate W is made independent of the imaging unit 3 in the XYθ direction while holding the substrate W to be inspected, or in combination with each other, a predetermined value is provided. It can be moved relative to each other at a speed or angle, or can be stationary at any position or angle.

The control unit CN has, for example, the following functions and roles.
・ Holding / releasing control of the substrate W with respect to the substrate holding unit 2 ・ Switching the objective lens by controlling the revolver mechanism 34 ・ Outputting an image pickup trigger to the image pickup camera 35 ・ Drive control of the relative moving unit 4: Function to output drive signals while monitoring the current positions of the X-axis slider 41, Y-axis slider 22, and rotation mechanism 23 ・ Registration of imaging position ・ Switching of board type

That is, the control unit CN can drive and control the relative moving unit 4 and output an imaging trigger to the imaging unit 3 while changing the location of the divided imaging area set on the substrate W. Further, it is possible to output an imaging trigger while switching the imaging magnification and the field of view size according to the inspection type and changing the imaging interval, and it is possible to acquire a desired divided image.

The output of the image pickup trigger can be exemplified by the following method.
-A method in which the illumination light L1 is emitted for a very short time (so-called strobe emission) every time the illumination light is moved by a predetermined distance while scanning and moving in the X direction.
-Alternatively, a method of moving to a predetermined position and making it stationary and irradiating the illumination light L1 to take an image (so-called step & repeat).

Further, the image pickup trigger means an image capture instruction to the image pickup camera 35 and an image processing device (not shown), a light emission instruction of the illumination light L1 and the like. Specifically, as an image pickup trigger, the illumination light L1 is made to emit strobe light or (case 2) the illumination light L1 is irradiated during the time during which the image pickup camera 35 can take an image (so-called exposure time). During the time you are in the picture, you can take an image. Alternatively, the image pickup trigger is not limited to the instruction to the image pickup camera 35, but may be an image capture instruction to the image processing device that acquires the image (Case 3). By doing so, it is possible to cope with a form in which a video signal or video data is sequentially output from the image pickup camera 35.

More specifically, the control unit CN is composed of a computer, a programmable logic controller, etc. (that is, hardware) and an execution program thereof (that is, software). Further, the control unit CN includes a chip position calculation unit 5, a scaling correction unit 6, and the like according to the present invention as a part of a functional block composed of hardware and software.

FIG. 2 is a conceptual diagram showing a state of imaging in an example of a form embodying the present invention.
In FIG. 2, a plurality of chip components C (1,1) to which the image pickup camera 45 of the image pickup unit 3 is spaced apart from the substrate W while moving relative to the substrate W in the direction indicated by the arrow Vs. A state of imaging C (9, 2) is shown.

Specifically, imaging is performed in the order of the divided imaging areas F (1), F (2), F (3), and F (4), and the chip component C (1,1) in the divided imaging area F (1). ) To C (3,2) are imaged, the chip components C (3,1) to C (5,2) are imaged in the divided image pickup area F (2), and the chip component C is imaged in the divided image pickup area F (3). (5,1) to C (7,2) are imaged, and the chip components C (7,1) to C (9,2) are imaged in the divided image pickup area F (4).

The divided image pickup area F (1) and the divided image pickup area F (2) are set so that not only they are adjacent to each other but also a part of the regions are overlapped with each other. The adjacent and overlapping imaging regions are referred to as overlapping imaging regions M (1). Similarly, the overlapping imaging region of the divided imaging area F (2) and the divided imaging area F (3) is M (2), and the overlapping imaging region of the divided imaging area F (3) and the divided imaging area F (4) is M (). Called 3).
The divided imaging area includes at least two or more chip components, and at least one of the chip components is set as a duplicate imaging chip component included in both of the adjacent divided imaging areas. ing.

Specifically, the overlapping imaging region M (1) includes chip components C (3, 1) and C (3, 2), and the overlapping imaging region M (2) includes chip components C (5, 2). The divided imaging area F (1) includes 1) and C (5, 2), and the overlapping imaging region M (3) includes the chip components C (7, 1) and C (7, 2). The imaging position of ~ F (4) is set.

The chip position calculation unit 5 calculates the position of each chip component included in the divided image pickup area based on the image captured by the image pickup unit 3. Further, the chip position calculation unit 5 calculates the position of each of the overlapping imaging chip components from the positional relationship with the other chip components included in the previously imaged divided imaging area, and the divided imaging area imaged later. The position of each of the other chip components excluding the duplicate image pickup chip component included in the above is calculated from the positional relationship with the duplicate image pickup chip component.

FIG. 3 is a plan view showing the positional relationship of each chip component in an example of the embodiment of the present invention. FIG. 3 illustrates the positional relationship between the divided imaging areas F (1) and F (2) and the chip components C (1,1) to C (5,2).

Specifically, the chip position calculation unit 5 calculates the mutual positions of the chip components C (1,1) to C (3,2) included in the imaged divided imaging area F (1). For example, the following is calculated based on the position of the lower left corner of each chip component.
The amount of deviation of the chip component C (2,1) with respect to the chip component C (1,1) in the X direction dx1 and the amount of deviation in the Y direction dy1.
The amount of deviation of the chip component C (3,1) with respect to the chip component C (2,1) in the X direction dx2 and the amount of deviation in the Y direction dy2.
The amount of deviation of the chip component C (1,2) with respect to the chip component C (1,1) in the X direction dx20 and the amount of deviation in the Y direction dy20.
The amount of deviation of the chip component C (2, 2) with respect to the chip component C (1, 2) in the X direction dx21 and the amount of deviation in the Y direction dy21.
The amount of deviation of the chip component C (3,2) with respect to the chip component C (2,2) in the X direction dx22 and the amount of deviation in the Y direction dy22.

More specifically, assuming that the position of the chip component C (1,1) is (X11, Y11), the chip position calculation unit 5 calculates the position of each chip component based on the following formula.
-Position (X21, Y21) of chip component C (2,1) = (X11 + dx1, Y11 + dy1)
-Position (X31, Y31) of chip component C (3,1) = (X11 + dx1 + dx2, Y11 + dy1 + dy2)
-Position (X12, Y12) of chip component C (1,2) = (X11 + dx20, Y11 + dy20)
-Position (X22, Y22) of chip component C (2,2) = (X11 + dx20 + dx21, Y11 + dy20 + dy21)
-Position (X32, Y32) of chip component C (3,2) = (X11 + dx20 + dx21 + dx22, Y11 + dy20 + dy21 + dy22)

Subsequently, the mutual positions of the chip components C (3, 1) to C (5, 2) included in the imaged divided imaging area F (2) are calculated. Similar to the above, the following is calculated with reference to the position of the lower left corner of each chip component.
The amount of deviation of the chip component C (4,1) with respect to the chip component C (3,1) in the X direction dx3 and the amount of deviation in the Y direction dy3.
The amount of deviation of the chip component C (5, 1) with respect to the chip component C (4, 1) in the X direction dx4 and the amount of deviation in the Y direction dy4.
The amount of deviation of the chip component C (4, 2) with respect to the chip component C (3, 2) in the X direction dx23 and the amount of deviation in the Y direction dy23.
The amount of deviation of the chip component C (5, 2) with respect to the chip component C (4, 2) in the X direction dx24 and the amount of deviation in the Y direction dy24.

More specifically, the chip position calculation unit 5 calculates each position based on the following calculation formula.
-Since the positions of the chip component C (3,1) and the chip component C (3,2) are as described above, the position of the chip component C (4,1) is (X11 + dx1 + dx2 + dx3, Y11 + dy1 + dy2 + dy3).
The position of the chip component C (5, 1) is (X11 + dx1 + dx2 + dx3 + dx4, Y11 + dy1 + dy2 + dy3 + dy4).
The position of the chip component C (4, 2) is (X11 + dx20 + dx21 + dx22 + dx23, Y11 + dy20 + dy21 + dy22 + dy23).
The position of the chip component C (5, 2) is (X11 + dx20 + dx21 + dx22 + dx23 + dx24, Y11 + dy20 + dy21 + dy22 + dy23 + dy24).
The positions of the other chip components C (6, 1) and the like are calculated in the same manner as described above.

Due to such a configuration, the chip position measuring device 1 according to the invention can calculate the position of each of the other chip parts with reference to the position of one chip component included in the first imaging area. can.

[Another form]
In the above description, in order to calculate the position of each chip component, the procedure of measuring the distance between adjacent chip components in the X direction and the amount of deviation in the Y direction and calculating them cumulatively is shown.
In this case, the position of each chip component in the split imaging area that was imaged last is
It is the addition of the distance between the above chip parts and the amount of deviation. Therefore, an error equal to or less than the measurement resolution is accumulated in each interval and deviation amount, and an error is accumulated in the calculated position of the chip component located far away from the first reference chip component. This raises concerns that all chip components cannot be measured with the desired accuracy. In order to eliminate such a concern (that is, to prevent the occurrence of cumulative error), it is preferable to calculate the position by the procedure shown in either or both of the following (1) and (2).

(1) The position of each chip component in one divided imaging area is calculated from the interval and the amount of deviation with respect to one reference chip component.

FIG. 4 is a plan view showing the positional relationship of each chip component in another example of the embodiment embodying the present invention. FIG. 4 illustrates the positional relationship between the divided imaging areas F (1) and F (2) and the chip components C (1,1) to C (5,2).

Specifically, the chip position calculation unit 5 has the chip components C (1,1), C (2,1), C (5) included in the imaged divided imaging area F (1) as follows. , 1), C (6, 1), etc. can be calculated.
The positions (X21, Y21) of the chip component C (2,1) are from the deviation amount dx1 in the X direction and the deviation amount dy1 in the Y direction of the chip component C (2,1) with respect to the chip component C (1,1). , (X21, Y21) = (X11 + dx1, Y11 + dy1)
The positions (X51, Y51) of the chip component C (5, 1) are from the deviation amount dx4 in the X direction and the deviation amount dy4 in the Y direction of the chip component C (5, 1) with respect to the chip component C (1, 1). , (X51, Y51) = (X11 + dx4, Y11 + dy4)
The positions (X61, Y61) of the chip component C (6, 1) are from the deviation amount dx5 in the X direction and the deviation amount dy5 in the Y direction of the chip component C (6, 1) with respect to the chip component C (1, 1). , (X51, Y51) = (X11 + dx5, Y11 + dy5)

Further, the chip position calculation unit 5 performs the chip components C (6, 1), C (7, 1), C (11, 1) included in the imaged divided imaging area F (2) as follows. Etc. can be calculated.
The position (X71, Y71) of the chip component C (7, 1) is based on the deviation amount dx6 in the X direction and the deviation amount dy6 in the Y direction of the chip component C (7, 1) with respect to the chip component C (6, 1). , (X71, Y71) = (X61 + dx6, Y61 + dy6)
The position (X111, Y111) of the chip component C (11, 1) is based on the deviation amount dx10 in the X direction and the deviation amount dy10 in the Y direction of the chip component C (11, 1) with respect to the chip component C (6, 1). , (X111, Y111) = (X61 + dx10, Y61 + dy10)

Although the procedure for calculating the position by focusing on the chip parts C (1,1) to C (6,1) has been described here, the other chips C (2,1) to C (11,3) have been described. Also, the respective positions can be calculated in the same manner (that is, with reference to the chip parts C (1,1) and C (6,1)).

(2) The measurement position of the divided imaging area is calculated using the master substrate, and scaling correction is performed for each position of the chip component.

Specifically, in addition to the configuration of the chip position measuring device 1 described above, the configuration is provided with a scaling correction unit. Then, the master substrate whose mutual positions of the plurality of reference marks are known is held by the substrate holding unit, and the chip calculated by the chip position calculation unit based on the mutual positions of the reference marks arranged on the master substrate. Make corrections for the position of each part.

FIG. 5 is a plan view showing the positional relationship between the master substrate and the divided imaging area in another example of the embodiment embodying the present invention. FIG. 5 illustrates a plan view of a master substrate MW in which the mutual positions of a plurality of reference marks FMa, FMk, FMq, and FMz are known.

When the master substrate MW is held by the substrate holding portion 2 of the chip position measuring device 1 and relatively moved, the reference marks FMa and FMk are observed in the visual fields of the divided imaging areas F (a) and F (k). It is arranged properly. The reference marks FMa and FMk are each circular, and the centers of these circles are arranged in the X direction at intervals of Rxm. The interval dxm is set to an accurate position (also referred to as relative distance or relative coordinates) by a highly accurate length measuring device (for example, a combination of a moving mechanism using a laser interferometer and a mark position detecting device). Is known. Specifically, it will be described below assuming that the interval Rxm is 100.00 mm.

First, the mutual position between the chip component C (a, 1) observed in the divided imaging area F (a) and the C (k, 1) observed in the divided imaging area F (k) is the chip position calculation unit 5. In the above procedure, for example, it is assumed that the distance dxk in the X direction from each other is 100.10 mm.

Then, the amount of deviation of the chip component C (a, 1) with respect to the reference mark FMa in the X direction is δxa, and the amount of deviation of the chip component C (k, 1) with respect to the reference mark FMk in the X direction is δxx. As a result of calculation by the chip position calculation unit 5, for example, it is assumed that δxa is 0.01 mm and δxx is 0.01 mm. Then, in the chip position calculation unit 5, the interval dxm of the reference marks FMa and FMk is calculated as 100.12 mm. However, since it should be calculated as 100.00 mm originally, the ratio Rxm / dxm (= 100.00 / 100.12 = 0.9988) of these values is registered as a scaling correction coefficient, and this coefficient is registered. The position of each chip component in the X direction is calculated in consideration of this. That is, in the case of the above example, if the dxk before correction is calculated at 100.10 mm, the value of the corrected dxk is output as 100.10 × 0.9988 = 99.98 mm by adding the scaling correction coefficient. do.

Although the scaling correction for the chip component C (k, 1) has been illustrated above, the scaling correction coefficient calculated in this way can also be applied to the case of calculating the position of another chip component. Further, although the procedure for performing scaling correction in the X direction has been described above, the scaling correction coefficient is similarly calculated in the Y direction (in the case of the Y direction, based on the interval Ryq of the reference marks FMa and FMq). , The position of each chip component in the Y direction can be calculated in consideration of this scaling correction coefficient.

With such a configuration, it is possible to reduce or eliminate the cumulative error of the measurement position of the chip component at a distant place.

[Another form]
In the above description, the detailed description has been made on the premise that the degree of orthogonality between the X-axis slider 41 and the Y-axis slider 42 of the relative moving portion 4 is assembled with a desired accuracy. However, for the convenience of equipment assembly, if the degree of orthogonality between the X-axis slider 41 and the Y-axis slider 42 is slightly different, or if improvement of the deviation cannot be expected, or if more accurate measurement is required, the following procedure may be used. It is preferable to correct the position of each chip component in the configuration and calculate.

Specifically, the master substrate MW is used to correct the degree of orthogonality. On the master substrate MW, as shown in FIG. 5, the center positions of the reference marks FMa, FMk, FMq, and FMz are arranged at the vertices of a rectangular or square rectangle of vertical Ryq × horizontal Rxm. Therefore, the X-axis slider 41 and the Y-axis slider 42 of the relative moving unit 4 are moved, and these reference marks FMa, FMk, FMq, and FMz are imaged by the image pickup unit 3 to acquire the center positions of the respective reference marks FMa, FMk, FMq, and FMz. Then, when the X-axis slider 41 of the relative moving unit 4 is moved to image the reference marks FMa and FMk, the distance in the X direction and the amount of deviation in the Y direction and the deviation amount in the Y direction and the Y-axis slider 42 are moved to move the reference mark FMa and FMk. From the interval in the Y direction and the amount of deviation in the X direction when the FMq is imaged, it is calculated how much the degree of orthogonality between the X-axis slider 41 and the Y-axis slider 42 is deviated. Then, the chip position calculation unit 5 corrects and calculates the position of each chip component so that the deviation amount due to the degree of orthogonality is cancelled.

With such a configuration, the position of each chip component calculated by the chip position calculation unit 5 is the position measurement due to the deviation of the orthogonality between the X-axis slider 41 and the Y-axis slider 42 of the relative moving unit 4. Errors can be reduced or prevented.

[Another form]
In the above description, the straightness (also referred to as straightness or straightness) of the X-axis slider 41 and the Y-axis slider 42 of the relative moving portion 4 has been described in detail on the assumption that the position measurement of each chip component is not affected. .. However, due to the equipment configuration, it may meander slightly in the direction orthogonal to the moving direction, and the divided imaging area may be tilted in the θ direction. Then, since the X direction and the Y direction in the divided imaging area include an error caused by the deviation in the θ direction, there is a concern that the position measurement of each chip component may be affected.

In order to reduce or eliminate such concerns (that is, the influence of the deviation of the acquired image in the θ direction), in applying the present invention, the divided imaging area includes at least two rows or more of the chip components, and the chip components are included. It is preferable that at least one row of chip components among the chip components is set as duplicate imaging chip components included in both of the adjacent divided imaging areas. Then, when the chip position calculation unit 5 calculates the positions of the other chip components excluding the duplicated imaging chip components included in the divided imaging chip area imaged later, the positional relationship between the plurality of duplicated imaging chip components (that is, X). The deviation component in the θ direction is calculated from the position in the direction and the Y direction), and this deviation component is corrected to calculate the position of each chip component.

In such a form, even if the image of the divided imaging area acquired while moving relative to each other is slightly tilted in the θ direction, the position of each chip component is calculated with desired accuracy without the influence of the tilt. be able to.

[Another form]
In the above description, an example (FIGS. 2 and 3) in which a total of 6 chip components are arranged in one divided imaging area (vertical 2 × horizontal 3) and a total of 18 in a single divided imaging area (vertical 3 × horizontal 6). An example (FIG. 4) in which individual chip components are arranged is shown, and a detailed explanation will be given while exemplifying a mode in which one vertical row of chip components is imaged in both adjacent divided imaging areas as overlapping imaging chips. did.

However, the present invention can be applied by appropriately increasing or decreasing the number of the vertical and horizontal chip parts. For example, by increasing the number of vertical and horizontal chip parts (for example, setting the length to 30 × 40), the number of substrates that can be processed per unit time (so-called WPH) can be increased. On the other hand, if the number of vertical and horizontal chips is reduced, the size of the imaging field of view can be narrowed (also referred to as increasing the magnification of imaging), the pixel resolution can be increased, and the measurement accuracy can be improved.

That is, in applying the present invention, at least two chips may be included in one divided imaging area, and one of them may be set as a duplicate imaging chip.

[Modification example]
In the above description, the divided imaging areas F (1), F (2), F (3), and F ( In the order of 4), a specific procedure for measuring the position of each chip component included in the divided imaging area while changing the divided imaging area in the X direction is shown. However, in applying the present invention, not only the overlapping imaging region is set in the X direction and moved relative to the X direction, but also the overlapping imaging region is set in the Y direction and moved relative to the Y direction first. The position of each of the other chip components may be calculated based on the positional relationship of the overlapping imaging chips included in the captured image. Alternatively, as illustrated in FIG. 6, overlapping imaging regions M (1) to M (4) are set in both XY directions, and the chip position calculation unit 5 calculates the position of each chip component as shown below. You can also.
-Calculate the positions of the chip components C (1,1) to C6,2) in the divided imaging area F (1) with reference to the position of C (1,1).
-Calculate the positions of the chip components C (7, 1) to C11, 2) in the divided imaging area F (2) based on the positions of C (6, 1) and the like.
-Calculate the positions of the chip components C (6, 4) to C (11, 5) in the divided imaging area F (m) based on the positions of C (6, 3) and the like.
-Calculate the positions of the chip components C (1,4) to C (5,5) in the divided imaging area F (m + 1) with reference to the positions of C (6,3) and the like.

[Other variants]
In the above description, as a specific example of calculating the position of each chip component in the chip position calculation unit 5, an example based on the position of the lower left corner of each chip component is shown. However, in applying the present invention, the calculation may be performed based on the center of each chip component, the position of the center of gravity, and the position of other corners.

Further, in the above description, the coaxial tilting method is exemplified as the lighting unit 31, but transmission lighting, oblique light lighting, ring lighting, dome lighting, or the like may be used.

[Application example]
In the above description, a detailed explanation has been given focusing on the chip position measurement. However, the present invention has been incorporated (used) into an inspection device having a function of inspecting cracks, chips, scratches and stains on chip parts, a device having a processing function of laser irradiation, a dispenser, an inkjet, and the like. ) It may be configured.

1 Chip position measuring device 2 Board holding unit 3 Imaging unit 4 Relative moving unit 5 Chip position calculation unit 6 Scaling correction unit CN control unit 1f Device frame 20 Board mounting base 30 Lens barrel 31 Lighting unit 32 Half mirror 33a, 33b Objective lens 34 Revolver mechanism 35 Imaging camera 41 X-axis slider 42 Y-axis slider 43 Rotation mechanism W board C Chip parts (numbers in parentheses are arrangement positions)
F split imaging area (numbers in parentheses are the order of imaging)
M Overlapping imaging area L1 Illumination light L2 Light incident from the substrate side (reflected light, scattered light)

Claims (2)

A chip position measuring device that measures the position of each of a plurality of chip components that are spaced apart from each other on a substrate.
A substrate holding portion that holds the substrate and
An imaging unit that divides a predetermined area set on the substrate into a plurality of divided imaging areas and performs imaging.
A chip position calculation unit that calculates the position of each of the chip components included in the divided imaging area based on the image captured by the image pickup unit.
A relative moving unit that relatively moves the substrate holding unit and the imaging unit,
It is provided with a control unit that drives and controls the relative moving unit and outputs an imaging trigger to the imaging unit while changing the location of the divided imaging area set on the substrate.
The divided imaging area includes at least two or more of the chip components, and at least one of the chip components is set as a duplicate imaging chip component included in both of the adjacent divided imaging areas. Has been
The chip position calculation unit is
The position of each of the overlapping imaging chip components is calculated from the positional relationship with other chip components included in the divided imaging area previously imaged.
The positions of each of the other chip components excluding the duplicated imaging chip component included in the divided imaging chip component imaged later are calculated from the positional relationship with the duplicated imaging chip component .
A master board whose mutual positions of a plurality of reference marks are known is held by the board holding portion.
It is characterized by having a scaling correction unit that corrects the position of each of the chip components calculated by the chip position calculation unit based on the mutual position of the reference marks arranged on the master board. Chip position measuring device. The divided imaging area includes at least two rows or more of the chip components, and at least one row of the chip components is included in both of the adjacent divided imaging areas as duplicate imaging chip components. The chip position measuring device according to claim 1, wherein the chip position measuring device is set.

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