JP6954802B2 - LED chain light and its manufacturing method - Google Patents

LED chain light and its manufacturing method Download PDF

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JP6954802B2
JP6954802B2 JP2017205757A JP2017205757A JP6954802B2 JP 6954802 B2 JP6954802 B2 JP 6954802B2 JP 2017205757 A JP2017205757 A JP 2017205757A JP 2017205757 A JP2017205757 A JP 2017205757A JP 6954802 B2 JP6954802 B2 JP 6954802B2
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power cord
layer
light emitting
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emitting unit
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JP2019053969A (en
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福哲 王
福哲 王
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Description

本発明はLEDイルミネーションに関し、LEDチェーンライト、その生産方法及び生産工具に関する。 The present invention relates to LED illumination, and relates to LED chain lights, production methods thereof, and production tools.

LEDチェーンライトはイベントのお祝いの装飾ライトとして広範に使われる。特にクリスマスやお正月などの時期に街路樹や物体に取り付けて使い、お祝いの雰囲気を高める。LED商品は湿気が高いところに露出すると漏電が生じ、発光ダイオードに損害を与え、商品不良になりやすいため、LED商品に対する絶縁と防水性能の要求が高まっている。 LED chain lights are widely used as decorative lights for event celebrations. Especially during Christmas and New Year, it can be attached to roadside trees and objects to enhance the festive atmosphere. When LED products are exposed to high humidity, electric leakage occurs, which damages the light emitting diode and tends to cause product defects. Therefore, the demand for insulation and waterproof performance of LED products is increasing.

もっとも古くからよく使われる、現存のLEDチェーンライトの構造は、多くの2本足LEDを電力コードで直列と並列の工法ではんだ付けした物である。2本足LEDの間に電力コードで直列式はんだ付けをし、熱溶融可能な隔離材(主な成分はEVA)をはんだ付けされたLEDの2本足と電力コードの内側の間に挟ませ、その外側にはPVC熱収縮チューブを被せ、熱を加え収縮処理をした物である。 The oldest and most commonly used structure of existing LED chain lights is that many two-legged LEDs are soldered in series and in parallel with a power cord. Solder in series with a power cord between the two-legged LEDs, and sandwich a heat-meltable isolation material (main component is EVA) between the two legs of the soldered LED and the inside of the power cord. , The outside is covered with a PVC heat-shrinkable tube, and heat is applied to shrink the product.

以上は隔離材により柱状に形成されているが、形状と挟む際の工法上の制限から、LEDの2本足と電力コードの内側しか挟むことができず、導電部位が半露出の状態になっている。またその外側に熱収縮後のPVCチューブを設けたとしても、PVCチューブと隔離材を密閉するという本質的な性能と形の問題及び、はんだ部位の不規則な接面等の問題から、防水基準を満たすことができない。 The above is formed in a columnar shape by the isolation material, but due to the shape and restrictions on the construction method when sandwiching, only the two legs of the LED and the inside of the power cord can be sandwiched, and the conductive part is in a semi-exposed state. ing. Even if a heat-shrinked PVC tube is provided on the outside, the waterproof standard is due to the essential performance and shape problems of sealing the PVC tube and the separating material, and the irregular contact surface of the solder part. Cannot meet.

この他に本分野では、糊を用いた防止式LEDチェーンライトの生産工法がある。円筒状プラスチックの容器を用意し、その中に糊を注ぎ、はんだ付けされた2本足と電力コードを手作業で1球ずつ容器の中に挿入し固体化させた工法で得られた物である。しかし、この工法は電力コードの柔軟性と不規則の問題、さらに糊が有する浮力の問題で、はんだ部位が外へ露出し易いため、常時目視検査が必要となる。はんだ部位が外へ露出しないという前提では防滴性能が優れていても、自動化生産が難しいため、大量生産ができず、生産コストが高い。 In addition to this, in this field, there is a production method of a preventive LED chain light using glue. A cylindrical plastic container is prepared, glue is poured into it, and two soldered legs and a power cord are manually inserted into the container one by one and solidified. be. However, this method has a problem of flexibility and irregularity of the power cord, and a problem of buoyancy of the glue. Since the solder part is easily exposed to the outside, a visual inspection is always required. Even if the drip-proof performance is excellent on the premise that the solder part is not exposed to the outside, it is difficult to perform automated production, so mass production is not possible and the production cost is high.

上述問題を解決するために、本発明はLEDチェーンライトを提供する。3つ以上のLED発光ユニットを備え、前記各発光ユニットは一層面と二層面を持つ両面プリント基板を備える。前記一層面には一層面陽極電力コード用はんだ点、一層面陰極電力コード用はんだ点、一層面直列電力コード用はんだ点、一層面SMD式抵抗はんだ点及び一層面SMD式LEDはんだ点が設けられる。前記二層面には二層面陽極電力コード用はんだ点、二層面陰極電力コード用はんだ点、二層面直列電力コード用はんだ点及び二層面SMD式LED用はんだ点が設けられる。 To solve the above problems, the present invention provides an LED chain light. It comprises three or more LED light emitting units, and each light emitting unit includes a double-sided printed circuit board having a one-layer surface and a two-layer surface. The one-layer surface is provided with a one-layer anode power cord soldering point, a one-layer cathode power cord soldering point, a one-layer series power cord soldering point, a one-layer SMD resistance soldering point, and a one-layer SMD LED soldering point. .. The two-layer surface is provided with a two-layer surface anode power cord solder point, a two-layer surface cathode power cord solder point, a two-layer surface series power cord solder point, and a two-layer surface SMD type LED solder point.

前記一層面陽極電力コード用はんだ点と二層面陽極電力コード用はんだ点は直接電気的に繋がる。前記一層面隠極電力コード用はんだ点と二層面隠極電力コード用はんだ点は直接電気的に繋がる。前記二層面の各はんだ点は次の発光ユニットの一層面各はんだ点と電気的に接続される。3つ以上の発光ユニットの中、一番目の発光ユニットの一層面の陽極電力コード用はんだ点より引き入れ、引き続き一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点と二層面直列電力コード用はんだ点を経由して次の発光ユニットへ電気が流れる。前記発光ユニットの外周には円筒状の絶縁体が囲まれており、LED光源に近づく上部の形は円錐形凹型となる。前記発光ユニットの非LED光源部位外周の円筒状絶縁体及び発光ユニットの近傍の電力コードの部位にはPVC材で囲まれてある。 The solder points for the one-layer anode power cord and the solder points for the two-layer anode power cord are directly electrically connected. The solder point for the one-layer concealed power cord and the solder point for the two-layer concealed power cord are directly electrically connected. Each solder point on the two-layer surface is electrically connected to each solder point on the one-layer surface of the next light emitting unit. Of the three or more light emitting units, draw in from the solder point for the anode power cord on the first surface of the first light emitting unit, and then continue with the solder point for the one-layer SMD type resistor, the solder point for the one-layer SMD type LED, and the two-layer surface SMD type. Electricity flows to the next light emitting unit via the solder point for the LED and the solder point for the two-layer surface series power cord. A cylindrical insulator is surrounded on the outer circumference of the light emitting unit, and the shape of the upper part approaching the LED light source is a conical concave shape. The cylindrical insulator around the non-LED light source portion of the light emitting unit and the portion of the power cord near the light emitting unit are surrounded by a PVC material.

上述技術問題を解決するために、本発明の一形態は一つのLEDチェーンライト用のプリント基板を提供する。プリント基板は横方向支持体、3つ以上の縦方向支持体及び発光ユニットを含む。発光ユニットと縦方向支持体には分離用ラインが付いてある。各発光ユニットは一層面と二層面の基板を備え、前記一層面には一層面陽極電力コードはんだ点、一層面陰極電力コードはんだ点、一層面直列電力コード用はんだ点、一層面SMD式抵抗用はんだ点及び一層面SMD式LEDはんだ点が設けられてある。前記二層面には前記二層面には二層面陽極電力コード用はんだ点、二層面陰極電力コード用はんだ点、二層面直列電力コード用はんだ点及び二層面SMD式LED用はんだ点が設けてある。 In order to solve the above technical problems, one embodiment of the present invention provides a printed circuit board for one LED chain light. The printed circuit board includes a horizontal support, three or more vertical supports, and a light emitting unit. The light emitting unit and the vertical support have a separation line. Each light emitting unit is provided with a single-layer and two-layer substrate, and the single-layer anode power cord soldering point, single-layer cathode power cord soldering point, single-layer series power cord soldering point, and single-layer SMD type resistor are provided on the single-layer surface. Solder points and one-layer SMD type LED solder points are provided. The two-layer surface is provided with a two-layer surface anode power cord solder point, a two-layer surface cathode power cord solder point, a two-layer surface series power cord solder point, and a two-layer surface SMD type LED solder point.

上述技術問題を解決するために、本発明の一形態は前記LEDチェーンライトの一つの製造工法を提供する。
(A)プリント基板を製造する、前記プリント基板は横方向支持体、3つ以上の縦方向支持体及び発光ユニットを含む。発光ユニットと縦方向支持体には分離用ラインが付いてある。各発光ユニットは一層面と二層面の基板を備え、前記一層面には一層面陽極電力コードはんだ点、一層面陰極電力コードはんだ点、一層面直列電力コード用はんだ点、一層面SMD式抵抗用はんだ点及び一層面SMD式LEDはんだ点が設けられてある、前記二層面には二層面陽極電力コード用はんだ点、二層面陰極電力コード用はんだ点、二層面直列電力コード用はんだ点及び二層面SMD式LED用はんだ点が設けてある。
(B)前記一層面基板にSMD式抵抗とSMD式LEDを実装し、前記二層面基板にSMD式LEDを実装する。
(C)プリント基板と電力コードをはんだ用治具に固定し、スポットはんだ設備を利用して電力コードを基板の発光ユニットにはんだ付けをする。
(D)プリント基板を脱離式形体治具に固定すること。前記脱離式形体治具の円筒状容器に固体化可能な糊を注ぎ、プリント基板の発光ユニットを脱離式形体治具の円筒体容器に挿し入れ、発光ユニットのLED、抵抗と電力コードの露出された導電部位を、円筒体容器の中の固体化可能な糊の中に沈める。
(E)脱離式形体治具を電気炉に入れて固体化する。
(F)プリント基板を脱離することにより、プリント基板の発光ユニットに一層の固体状の糊により、円筒状絶縁体を形成する。
(G)プリント基板の分離ラインで分割することにより、発光ユニットをプリント基板より独立させる。
(H) 発光ユニットの非LED光源部位外周の円筒状絶縁体及び発光ユニットの近傍の電力コードの部位をPVC材で囲む。
In order to solve the above-mentioned technical problem, one embodiment of the present invention provides one manufacturing method of the LED chain light.
(A) The printed circuit board for producing a printed circuit board includes a horizontal support, three or more vertical supports, and a light emitting unit. The light emitting unit and the vertical support have a separation line. Each light emitting unit is provided with a single-layer and two-layer substrate, and the single-layer anode power cord soldering point, single-layer cathode power cord soldering point, single-layer series power cord soldering point, and single-layer SMD type resistor are provided on the single-layer surface. Solder points and one-layer SMD type LED solder points are provided. The two-layer surface has two-layer surface anode power cord solder points, two-layer surface cathode power cord solder points, two-layer surface series power cord solder points, and two-layer surface. Solder points for SMD type LEDs are provided.
(B) The SMD type resistor and the SMD type LED are mounted on the one-layer surface board, and the SMD type LED is mounted on the two-layer surface board.
(C) Fix the printed circuit board and the power cord to the soldering jig, and solder the power cord to the light emitting unit of the board using the spot soldering equipment.
(D) Fix the printed circuit board to the removable jig. Pour solidifyable glue into the cylindrical container of the detachable form jig, insert the light emitting unit of the printed circuit board into the cylindrical container of the removable form jig, and connect the LED, resistance and power cord of the light emitting unit. The exposed conductive part is submerged in a solidizable glue in a cylindrical container.
(E) Put the removable type jig in an electric furnace to solidify it.
(F) By detaching the printed circuit board, a cylindrical insulator is formed on the light emitting unit of the printed circuit board with a single layer of solid glue.
(G) The light emitting unit is made independent from the printed circuit board by dividing it by the separation line of the printed circuit board.
(H) Surround the cylindrical insulator around the non-LED light source part of the light emitting unit and the part of the power cord near the light emitting unit with PVC material.

前記(C)の中、電力コードをはんだ付けして、二層面陽極電力コード用はんだ点と次の発光ユニットの一層面陽極電力コード用はんだ点を電気的につなぐ。電力コードで二層面陰極電力コード用はんだ点と次の発光ユニットの一層面陰極電力コード用はんだ点を電気的につなぐ。一番目の発光ユニットの回路は一層面陽極電力コード用はんだ点より始まり、続いて、一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式はんだ点と二層面直列電力コード用はんだ点に繋がり、電力コードを使い、次の発光ユニットへ電気的に接続する。多くの中間の発光ユニットには一層面直列電力コード用はんだ点より入り、続いて、一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式はんだ点と二層面直列電力コード用はんだ点に接続され、電力コードを使い、次の発光ユニットへ電気的につなぐ。最後の発光ユニットには一層面直列電力コード用はんだ点より入り、続いて、一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式はんだ点と二層面陰極電力コード用はんだ点に接続されるものである。 In (C) above, the power cord is soldered to electrically connect the solder points for the two-layer anode power cord and the solder points for the one-layer anode power cord of the next light emitting unit. The power cord electrically connects the solder point for the two-layer cathode power cord and the solder point for the one-layer cathode power cord of the next light emitting unit. The circuit of the first light emitting unit starts with the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistor, the soldering point for the single surface SMD type LED, and the soldering point for the double surface SMD type soldering point and the two layer surface series. Connect to the solder point for the power cord, use the power cord, and electrically connect to the next light emitting unit. Many intermediate light emitting units enter from the soldering point for single surface series power cord, followed by the soldering point for single surface SMD type resistor, the soldering point for single surface SMD type LED, the soldering point for double surface SMD type soldering point and the two layer surface series. It is connected to the solder point for the power cord, and the power cord is used to electrically connect to the next light emitting unit. The last light emitting unit enters from the solder point for single surface series power cord, followed by the solder point for single surface SMD type resistor, the solder point for single surface SMD type LED, the solder point for double surface SMD type solder point and the solder point for double surface cathode power cord. It is connected to the soldering point.

上述技術問題を解決するために、本発明はLEDチェーンライトを製造するための一つの工具を提供する、はんだ用治具である。前記はんだ用治具には横方向支持体の固定用溝、3つ以上の縦方向支持体固定用溝及び電力コード固定用のモールが付いている。前記電力コード用のモールは斜めの角度の特徴を有し、前記電力コード用モールは治具の裏面に置かれる次の発光ユニットの電力コード用はんだ点へ繋がれる。 In order to solve the above technical problems, the present invention is a soldering jig that provides a tool for manufacturing an LED chain light. The soldering jig is provided with a groove for fixing the horizontal support, three or more grooves for fixing the vertical support, and a molding for fixing the power cord. The power cord molding has the characteristic of an oblique angle, and the power cord molding is connected to a power cord solder point of the next light emitting unit placed on the back surface of the jig.

上述技術問題を解決するために、本発明の一形態によれば、LEDチェーンライトを製造するための一つの工具を提供する脱離式形体治具である。前記脱離式形体治具にプリント基板の横方向支持体固定用の柱が設けられ、固定用の柱には固定用溝が設けられる。前記脱離式形体治具の下に3つ以上の円筒状容器が設けられ、前記円筒状容器の中に固体化可能な絶縁糊が入っており、前記円筒状容器の底部位は円錐形凹型となる。 In order to solve the above-mentioned technical problem, according to one embodiment of the present invention, it is a removable type jig that provides one tool for manufacturing an LED chain light. The detachable body jig is provided with a pillar for fixing the lateral support of the printed circuit board, and the fixing pillar is provided with a fixing groove. Three or more cylindrical containers are provided under the removable shape jig, and the insulating glue that can be solidified is contained in the cylindrical container, and the bottom portion of the cylindrical container is conical concave. It becomes.

前記脱離式形体治具のサイズはプリント基板に当てはめたものである、プリント基板の発光ユニットのサイズは6.5*9mmの際、脱離式形体治具の円筒体容器のサイズは7.5*21mmであり、発光ユニットの頂部より円錐形凹型の尖端までの距離は1.5mmであり、円錐形凹型の高さは2mmであり、発光ユニットの頂部より横方向支持体までの距離は23.75mmであり、円筒状絶縁体頂部より横方向支持体固定用柱の固定用溝までの距離は27.25mmである。 The size of the removable type jig is applied to the printed circuit board. When the size of the light emitting unit of the printed circuit board is 6.5 * 9 mm, the size of the cylindrical container of the removable type jig is 7.5 * 21 mm. The distance from the top of the light emitting unit to the tip of the conical concave is 1.5 mm, the height of the conical concave is 2 mm, and the distance from the top of the light emitting unit to the lateral support is 23.75 mm. The distance from the top of the cylindrical insulator to the fixing groove of the lateral support fixing column is 27.25 mm.

本発明の一形態によれば、発光ユニットはプリント基板を使い、電力コードの同一はんだ方法と規則を実現し、プリント基板の発光ユニットの全ての露出された導電部位に絶縁体の形成を果たし、全ての発光ユニットの防水性能を実現するものである。また、プリント基板、はんだ用治具と脱離式形体治具を使った生産仕組みとして、生産工法の規則性と標準化を果たし、自動化作業に適合させたものである、絶縁工法としては、大部分、熟練された2本足LED防止工法と同じような工法を使うことで、LEDチェーンライトの品質を高めることと共に、人件コストを下げることができる。本発明の付加的長点は下述で部分的に示し、その部分は以下の内容で明らかになる、或いは本発明の実践で了解を得られる。 According to one embodiment of the present invention, the light emitting unit uses a printed circuit board, realizes the same soldering method and rules for power cords, and forms an insulator on all exposed conductive parts of the light emitting unit of the printed circuit board. It realizes the waterproof performance of all light emitting units. In addition, as a production mechanism using a printed circuit board, a soldering jig, and a detachable body jig, the regularity and standardization of the production method has been achieved, and it is suitable for automation work. By using a construction method similar to the skilled two-legged LED prevention construction method, it is possible to improve the quality of LED chain lights and reduce labor costs. The additional advantages of the present invention are partially shown below, which will be clarified in the following contents, or will be understood in practice of the present invention.

図1は現存のLEDチェーンライトのLED光源構造図Figure 1 shows the LED light source structure of an existing LED chain light. 図2は本発明の実施された一層面構造図FIG. 2 is a one-layer structural view in which the present invention was carried out. 図3は本発明の実施された二層面の構造図FIG. 3 is a structural diagram of the two-layer surface in which the present invention was carried out. 図4は本発明の電気原理図FIG. 4 is an electrical principle diagram of the present invention. 図5は本発明のはんだ用治具とプリント基板、電力コードの取付け図FIG. 5 is an installation diagram of the soldering jig, the printed circuit board, and the power cord of the present invention. 図6は本発明の脱離式形体治具図FIG. 6 is a removable type jig diagram of the present invention. 図7は本発明のプリント基板と脱離式形体治具図の結合図FIG. 7 is a connection diagram of the printed circuit board of the present invention and the detachable form jig diagram. 図8は本発明のLED発光ユニットの製品図FIG. 8 is a product diagram of the LED light emitting unit of the present invention.

以下に本分野の技術者が本発明の実施可能性を更によく理解できるように図とともに本実施の形態を詳しく説明するが、本発明の権利範囲を限定することを意図したものではない。 Hereinafter, embodiments of the present invention will be described in detail with figures so that engineers in the field can better understand the feasibility of the present invention, but the present invention is not intended to limit the scope of rights of the present invention.

図2〜図8に示すように、本実施形態によれば、LEDチェーンライトは多数のLED発光ユニット20を備える。本実施形態では、LED発光ユニット20の個数は少なくとも3つとするが、これ以上の個数としてもよい。図2及び図3には、少なくとも6つ以上である場合を例としているが、3〜5個でも、7個以上でもよいことは言うまでもない。 As shown in FIGS. 2 to 8, according to the present embodiment, the LED chain light includes a large number of LED light emitting units 20. In the present embodiment, the number of the LED light emitting units 20 is at least three, but the number may be more than this. In FIGS. 2 and 3, the case where the number is at least 6 or more is taken as an example, but it goes without saying that the number may be 3 to 5 or 7 or more.

各発光ユニット20には一層面基板21と二層面基板22を備える。一層面基板21には一層面陽極電力コード用はんだ点211、一層面陰極電力コード用はんだ点212、一層面直列電力コード用はんだ点213、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215が設けられ、二層面基板22には二層面陽極電力コード用はんだ点221、二層面陰極電力コード用はんだ点222、二層面直列電力コード用はんだ点223と二層面SMD式LED用はんだ点224が設けられる。 Each light emitting unit 20 includes a one-layer surface substrate 21 and a two-layer surface substrate 22. On the one-sided substrate 21, one-layer anode power cord soldering point 211, one-layer cathode power cord soldering point 212, one-layer series power cord soldering point 213, one-layer SMD type resistance soldering point 214, one-layer SMD type LED solder points 215 are provided, and the two-layer surface substrate 22 has a two-layer surface anode power cord solder point 221 and a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED. Solder points 224 are provided.

一層面SMD式抵抗用はんだ点214にはSMD式抵抗216が実装され、一層面SMD式LED用はんだ点215にSMD式LED217が実装され、二層面SMD式LED用はんだ点224にはSMD式LED225が実装されてある。多数の発光ユニット20は次々と電力コード102で電気的に接続される。またさらに図8で示すように、発光ユニット20の外周に円筒状絶縁体23が囲まれ、円筒状絶縁体23のLED光源に近い上端部は円錐形凹型704になっている。発光ユニット20の円筒状絶縁体23の非LED部と円筒状絶縁体23に近い電力コード102外周にPVC材が囲まれる。 SMD resistance 216 is mounted on the single-layer SMD resistance solder point 214, SMD LED 217 is mounted on the single-layer SMD LED solder point 215, and SMD LED 225 is mounted on the double-layer SMD LED solder point 224. Is implemented. A large number of light emitting units 20 are electrically connected one after another by the power cord 102. Further, as shown in FIG. 8, a cylindrical insulator 23 is surrounded by the outer circumference of the light emitting unit 20, and the upper end portion of the cylindrical insulator 23 near the LED light source is a conical concave 704. A PVC material is surrounded by the non-LED portion of the cylindrical insulator 23 of the light emitting unit 20 and the outer circumference of the power cord 102 close to the cylindrical insulator 23.

図2及び図3に戻り、一つの実施例として、SMD式LED217,225は、側面発光LEDであり、発光面は上端部の図6に示す円錐形凹型704に向かって照らし、光の拡散が実現され、伝統的なLEDチェーンライトの固有の発光効果を得る。発光面積は2本足LEDより大きく、輝度を高める。 Returning to FIGS. 2 and 3, as one embodiment, the SMD type LEDs 217 and 225 are side light emitting LEDs, and the light emitting surface illuminates toward the conical concave 704 shown in FIG. 6 at the upper end, and the light is diffused. Realized and get the unique luminous effect of traditional LED chain lights. The light emitting area is larger than the two-legged LED, increasing the brightness.

また、本実施形態によれば、LEDチェーンライトの生産用プリント基板を公開した。引き続き図2及び図3を参照すると分かるように、プリント基板は横方向支持体30、多数の縦方向支持体40及び発光ユニット20を備え、多数の発光ユニット20は縦方向支持体40を経由して横方向支持体30と連結される。発光ユニット20と縦方向支持体40の間には「V」型分離ライン41が付いてあり、各発光ユニット20は一層面と二層面がある両面基板であり、一層面基板21には一層面陽極電力コード用はんだ点211、一層面陰極電力コード用はんだ点212、一層面直列電力コード用はんだ点213、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215が設けられ、二層面基板22には二層面陽極電力コード用はんだ点221、二層面陰極電力コード用はんだ点222、二層面直列電力コード用はんだ点223と二層面SMD式LED用はんだ点224が設けられる。 Further, according to the present embodiment, a printed circuit board for production of LED chain lights has been released. As can be seen with reference to FIGS. 2 and 3, the printed circuit board includes a horizontal support 30, a large number of vertical supports 40, and a large number of light emitting units 20, and a large number of light emitting units 20 pass through the vertical support 40. Is connected to the lateral support 30. A "V" type separation line 41 is provided between the light emitting unit 20 and the vertical support 40. Each light emitting unit 20 is a double-sided substrate having a single-layer surface and a double-layer surface, and the single-layer substrate 21 has a single surface. Solder points 211 for anode power cords, solder points 212 for single surface cathode power cords, solder points 213 for single surface series power cords, solder points 214 for single surface SMD type resistors, and single surface SMD type LED solder points 215 are provided. The two-layer surface substrate 22 is provided with a two-layer surface anode power cord solder point 221, a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED solder point 224.

さらに本実施形態によれば、プリント基板は硬質両面プリント基板であり、一層面と二層面の基板に回路が付いてあり、外観上、多数の発光ユニット20、多数の縦方向支持体40、発光ユニット20と横方向支持体30の間には縦方向支持体40で連結され、横方向支持体30は生産工法上、固定の役割を果たす。発光ユニット20と縦方向支持体40の間は「V」型分離ライン41が設けられ、これにより分割することができ、発光ユニット20の分離独立に用いられる。 Further, according to the present embodiment, the printed circuit board is a hard double-sided printed circuit board, and circuits are attached to the single-layer and two-layer substrates, and in appearance, a large number of light emitting units 20, a large number of vertical supports 40, and light emitting are emitted. The unit 20 and the lateral support 30 are connected by a vertical support 40, and the lateral support 30 plays a fixed role in the production method. A "V" type separation line 41 is provided between the light emitting unit 20 and the vertical support 40, which can be divided and used independently for the light emitting unit 20.

発光ユニット20について説明すると、一層面基板21には、一層面陽極電力コード用はんだ点211、一層面陰極電力コード用はんだ点212、一層面直列電力コード用はんだ点213、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215が設けられる。二層面基板22には、二層面陽極電力コード用はんだ点221、二層面陰極電力コード用はんだ点222、二層面直列電力コード用はんだ点223と二層面SMD式LED用はんだ点224が設けられる。 The light emitting unit 20 will be described. On the one-layer substrate 21, one-layer anode power cord solder point 211, one-layer cathode power cord solder point 212, one-layer series power cord solder point 213, and one-layer SMD type resistor A solder point 214 and a single-layer SMD type LED solder point 215 are provided. The two-layer surface substrate 22 is provided with a two-layer surface anode power cord solder point 221 and a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED solder point 224.

図4に示す通り、本実施形態によれば、RはSMD式抵抗216、LEDはSMD式LED光源217,225であり、それぞれ電気的に接続される6つの電力コード用はんだ点がある。それぞれ、一層面陽極電力コード用はんだ点211、一層面陰極電力コード用はんだ点212、一層面直列電力コード用はんだ点213、二層面基板22には二層面陽極電力コード用はんだ点221、二層面陰極電力コード用はんだ点222と二層面直列電力コード用はんだ点223である。 As shown in FIG. 4, according to the present embodiment, R is an SMD type resistor 216 and LED is an SMD type LED light source 217 and 225, and each of them has six electrically connected solder points for power cords. Solder points 211 for single-layer anode power cords, solder points 212 for single-layer cathode power cords, solder points 213 for single-layer series power cords, and solder points 221 for double-layer anode power cords and double-layer surfaces on the double-layer substrate 22, respectively. The cathode power cord solder point 222 and the two-layer surface series power cord solder point 223.

その中、一層面陽極電力コードはんだ点211は二層面陽極電力コードはんだ点221と回路が直接繋がり、電力コードを使い、二層面陽極電力コード用はんだ点221より次の一層面陽極電力コード用はんだ点211に繋がる。一層面隠極電力コードはんだ点は二層面陰極電力コードはんだ点222と回路が直接繋がり、電力コードを使い、二層面陰極電力コード用はんだ点222より次の一層面陰極電力コード用はんだ点213に繋がる。 Among them, the one-layer anode power cord solder point 211 is directly connected to the two-layer anode power cord solder point 221 and the circuit is used, and the power cord is used to solder the one-layer anode power cord solder point 221 next to the two-layer anode power cord solder point 221. It leads to point 211. The one-layer hidden electrode power cord solder point is directly connected to the two-layer cathode power cord solder point 222, and the power cord is used to connect the two-layer cathode power cord solder point 222 to the next one-layer cathode power cord solder point 213. Connect.

回路的に、一番目発光ユニット20は、一層面陽極電力コード用はんだ点211から引きいれ、引き続き、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面直列電力コード用はんだ点223に直列され、次の発光ユニット20へ引き出す。中間の多数の発光ユニット20の回路は、一層面直列電力コード用はんだ点213から引きいれ、引き続き、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面直列電力コード用はんだ点223に直列され、次の発光ユニット20へ引き出す。 In terms of circuit, the first light emitting unit 20 is drawn from the solder point 211 for the one-layer anode power cord, and subsequently passes through the one-layer SMD type resistor 216, the one-layer SMD type LED 217, and the two-layer surface SMD type LED 225, and the two-layer surface. It is connected in series with the solder point 223 for the series power cord and pulled out to the next light emitting unit 20. The circuits of the large number of light emitting units 20 in the middle are drawn from the solder points 213 for the single-layer series power cord, and subsequently via the single-layer SMD type resistor 216, the single-layer SMD type LED 217, and the double-layer surface SMD type LED 225, and the two-layer surface. It is connected in series with the solder point 223 for the series power cord and pulled out to the next light emitting unit 20.

最後の発光ユニット20の回路は、一層面直列電力コード用はんだ点213から引きいれ、引き続き、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面陰極電力コード用はんだ点222に直列され、次のプリント基板の一番目の発光ユニット20へ引き出し並列させる。 The circuit of the final light emitting unit 20 is drawn from the solder point 213 for the single surface series power cord, and subsequently via the single surface SMD type resistor 216, the single surface SMD type LED 217, and the double surface surface SMD type LED 225, and the two layer surface cathode power. It is connected in series with the solder point 222 for the cord, and is drawn out to the first light emitting unit 20 of the next printed circuit board in parallel.

詳細には、電気原理上、全ての発光ユニット20の一層面と二層面の陽極電力コード用はんだ点211,221は直導電連結され、一層面と二層面の陰極電力コード用はんだ点212,222は直導電連結されているが、直列電力コード用はんだ点213,223同士は導電連結されていない。一番目の発光ユニット20の回路は一層面陽極電力コードはんだ点211より始まり、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面直列電力コード用はんだ点223に直列されている。 Specifically, in terms of electrical principle, the solder points 211 and 221 for the anode power cords on the one-layer surface and the two-layer surface of all the light emitting units 20 are directly conductively connected, and the solder points 212 and 222 for the cathode power cords on the one-layer surface and the two-layer surface. Are directly conductively connected, but the solder points 213 and 223 for series power cords are not conductively connected to each other. The circuit of the first light emitting unit 20 starts from the single surface anode power cord soldering point 211, passes through the single surface SMD type resistor 216, the single surface SMD type LED 217, and the double surface surface SMD type LED 225, and is a soldering point for the double surface series power cord. It is serialized in 223.

中間の発光ユニット20の回路は一層面直列電力コードはんだ点213より始まり、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面直列電力コード用はんだ点223に直列されている。最後の発光ユニット20の回路は一層面直列電力コードはんだ点より始まり、一層面SMD式抵抗216、一層面SMD式LED217、二層面SMD式LED225を経由して二層面陰極電力コード用はんだ点222に直列される。 The circuit of the intermediate light emitting unit 20 starts from the one-layer surface series power cord soldering point 213, passes through the one-layer surface SMD type resistor 216, the one-layer surface SMD type LED 217, and the two-layer surface SMD type LED 225, and the solder point 223 for the two-layer surface series power cord. Is serialized in. The circuit of the final light emitting unit 20 starts from the one-layer surface series power cord soldering point, passes through the one-layer SMD type resistor 216, the one-layer surface SMD type LED 217, and the two-layer surface SMD type LED 225, and reaches the soldering point 222 for the two-layer surface cathode power cord. Be serialized.

以上の回路の特徴により、直列と並列の電力コードのはんだ付け作業の同一性と規則性を得て、自動化作業が便利になる。図4で示す通り、発光ユニット20の間には電力コードではんだ付けされ、LEDユニットがチェーン状になる。 Due to the above circuit features, the sameness and regularity of the soldering work of the series and parallel power cords can be obtained, and the automation work becomes convenient. As shown in FIG. 4, the light emitting units 20 are soldered with a power cord to form a chain of LED units.

本実施形態によれば、発光ユニット20の個数は、世界的に幅広く用いられる定格電圧の最大値である240Vを考慮して、40個を超えないような設計になっている。プリント基板に何個の発光ユニット20があったとしても、一番目の発光ユニット20、多数の中間の発光ユニット20と最後の発光ユニット20の回路は上述された回路の内容と全く同じものとなる。生産実践の中、常に使われる、12V専用の発光ユニット1個、24V専用の発光ユニット3個、100〜120V専用の発光ユニット15個、220V専用の30個の発光ユニット20のプリント基板を手配して配置する。 According to this embodiment, the number of light emitting units 20 is designed not to exceed 40 in consideration of 240V, which is the maximum value of the rated voltage widely used in the world. No matter how many light emitting units 20 are on the printed circuit board, the circuits of the first light emitting unit 20, a large number of intermediate light emitting units 20, and the last light emitting unit 20 are exactly the same as those described above. .. In production practice, we arranged printed circuit boards for 12V dedicated light emitting unit, 24V dedicated light emitting unit 3, 100 to 120V dedicated light emitting unit 15 and 220V dedicated 30 light emitting unit 20 which are always used. And place it.

12V専用の発光ユニット1個を1組として、15組を一つのプリント基板に設け、24V専用の発光ユニット3個を1組として、5組を一つのプリント基板に設け、100〜120V専用の発光ユニット15個を1組として、1組を一つのプリント基板に設ける。220V専用の発光ユニット30個を1組として、1組を二つのプリント基板に分けて設ける。ただし、12V専用の製品は、発光ユニット1個が1組になるため、直列電力コードを不要とする。 One set of 12V dedicated light emitting units is provided on one printed circuit board, 15 sets are provided on one printed circuit board, three 24V dedicated light emitting units are provided as one set, and five sets are provided on one printed circuit board. One set is provided on one printed circuit board, with 15 units as one set. 30 light emitting units dedicated to 220V are set as one set, and one set is divided into two printed circuit boards. However, the 12V dedicated product does not require a series power cord because one light emitting unit is a set.

説明をし易くするため、24V専用の発光ユニットを例として挙げる。15個の発光ユニットのプリント基板に、SMT工法で二つの335型SMD式LEDと定格容量1/4WのSMD式抵抗を実装する。LEDのチップの使用電圧は二つに分かれていて、それは3〜3.3Vの青色系チップと1.8〜2.2Vの赤、黄、オレンジ色系のチップである、青系チップを使う場合は定格容量1/4W、抵抗値120Ωの抵抗を使い、赤、黄、オレンジ系チップを使う場合は定格容量1/4W、抵抗値270Ωの抵抗を使う。 For ease of explanation, a light emitting unit dedicated to 24V is taken as an example. Two 335 type SMD type LEDs and SMD type resistors with a rated capacity of 1 / 4W are mounted on the printed circuit board of 15 light emitting units by the SMT method. The working voltage of the LED chip is divided into two, it is a blue chip of 3 to 3.3V and a red, yellow, orange chip of 1.8 to 2.2V. When using a blue chip, the rated capacity Use a resistor with 1 / 4W and a resistance value of 120Ω, and when using a red, yellow, or orange chip, use a resistor with a rated capacity of 1 / 4W and a resistance value of 270Ω.

本実施形態によれば、LEDチェーンライトの製造方法は以下の通りである。
(A)プリント基板を製作する。プリント基板には横方向支持体30、多数の縦方向支持体40及び多数の発光ユニット20が設けられ、発光ユニット20は縦方向支持体40を経由して横方向支持体30に連結され、発光ユニット20と縦方向支持体40の間には「V」型分離ライン41が設けられる。発光ユニット20は一層面と二層面がある両面基板であり、一層面基板21には一層面陽極電力コード用はんだ点211、一層面陰極電力コード用はんだ点212、一層面直列電力コード用はんだ点213、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215が設けられ、二層面基板22には二層面陽極電力コード用はんだ点221、二層面陰極電力コード用はんだ点222、二層面直列電力コード用はんだ点223と二層面SMD式LED用はんだ点224が設けられている。
According to this embodiment, the manufacturing method of the LED chain light is as follows.
(A) Manufacture a printed circuit board. The printed circuit board is provided with a horizontal support 30, a large number of vertical supports 40, and a large number of light emitting units 20, and the light emitting unit 20 is connected to the horizontal support 30 via the vertical support 40 to emit light. A "V" type separation line 41 is provided between the unit 20 and the vertical support 40. The light emitting unit 20 is a double-sided substrate having a single-layer surface and a double-layer surface, and the single-surface substrate 21 has a single-surface anode power cord solder point 211, a single-layer cathode power cord solder point 212, and a single-surface series power cord solder point. 213, one-layer SMD type resistor solder points 214, one-layer SMD type LED solder points 215 are provided, and the two-layer surface substrate 22 has two-layer surface anode power cord solder points 221 and two-layer surface cathode power cord solder points 222. A solder point 223 for a two-layer surface series power cord and a solder point 224 for a two-layer surface SMD type LED are provided.

(B)一層面基板21にSMD式抵抗とSMD式LEDを実装し、二層面にSMD式LEDを実装する。詳しくは、SMT(Surface Mount Technology)工法を使い、自動実装機とリフローはんだ機で、プリント基板にSMD式抵抗とSMD式LEDを実装する。
(C)プリント基板と電力コード60をはんだ用治具50に取り付け、スポットはんだ設備ではんだ付けをする。詳しくは、プリント基板と電力コード60をはんだ用治具50に取り付け、三軸ダブルごてはんだ付けロボットで、二つのはんだ用治具50を同時にはんだ付けし、正面のはんだ付けが終わり、ひっくり返して固定して、裏面のはんだ付けをする。
(B) The SMD type resistor and the SMD type LED are mounted on the one-layer surface board 21, and the SMD type LED is mounted on the two-layer surface. Specifically, using the SMT (Surface Mount Technology) method, SMD resistance and SMD LED are mounted on the printed circuit board using an automatic mounting machine and a reflow soldering machine.
(C) The printed circuit board and the power cord 60 are attached to the soldering jig 50 and soldered with a spot soldering facility. Specifically, the printed board and the power cord 60 are attached to the soldering jig 50, and the two soldering jigs 50 are soldered at the same time with a triaxial double iron soldering robot. And fix it, and solder the back side.

(D)プリント基板を脱離式形体治具70に固定する。脱離式形体治具70の円筒状容器に固体化可能な絶縁性の糊を入れて、プリント基板の発光ユニット20を円筒状容器に挿しいれ、発光ユニット20のSMD式抵抗、SMD式LEDとはんだされた電力コード60の導電部位を円筒状容器の中の固体化可能な糊に沈める。さらに詳しくは、自動輸送及び糊注入機で固体化可能な糊を円筒状容器に注ぎ、その中にSMD式抵抗、SMD式LEDと電力コード60がはんだされてあるプリント基板の発光ユニット20を、自動輸送及び糊注入機で挿しいれる。その際、SMD式抵抗、SMD式LEDと電力コード60の導電部位が円筒状容器の糊の中に沈める。また、固体化可能な糊は高硬質シリコンであり、A成分とB成分に分かれてあって、A成分とB成分を1:1の比率で混じって使う物であり、高硬質なので、固体化後、物体にあたっても変形を防ぐことができる。 (D) The printed circuit board is fixed to the removable form jig 70. Put solidifying insulating glue into the cylindrical container of the removable form jig 70, insert the light emitting unit 20 of the printed circuit board into the cylindrical container, and use the SMD resistance and SMD LED of the light emitting unit 20. The conductive portion of the soldered power cord 60 is submerged in a solidizable glue in a cylindrical container. More specifically, the light emitting unit 20 of the printed circuit board in which the glue that can be solidified by the automatic transport and the glue injection machine is poured into the cylindrical container and the SMD type resistor, the SMD type LED and the power cord 60 are soldered therein. Inserted by automatic transport and glue injection machine. At that time, the conductive parts of the SMD type resistor, SMD type LED and the power cord 60 are submerged in the glue of the cylindrical container. In addition, the glue that can be solidified is highly hard silicon, which is divided into A component and B component, and is used by mixing A component and B component at a ratio of 1: 1. Since it is highly hard, it solidifies. Later, it is possible to prevent deformation even when it hits an object.

(E)脱離式形体治具70を電気炉に入れ、固体化させる。さらに詳しくは、脱離式形体治具70を手作業で電気炉に持ち運び入れ込む。気候を勘案し、80〜90℃の間に温度設定をする。時間設定は3時間である。
(F)プリント基板を脱離させ、プリント基板の発光ユニット20に一層の固体シリコンの絶縁体を得る。さらに詳しくは、手作業でプリント基板を脱離式形体治具70より脱離させ、硬質のシリコン絶縁体が得られる。硬質なので、物体にぶつかっても変形しない。
(G)プリント基板の分離ライン41を分割して、発光ユニット20を独立させる。さらに詳しくは、手作業でプリント基板の分離ライン41にメタルの物差しを合わせ分割し、発光ユニット20の独立を果たす。
(E) The removable type jig 70 is placed in an electric furnace and solidified. More specifically, the removable form jig 70 is manually carried into the electric furnace. Consider the climate and set the temperature between 80 and 90 ° C. The time setting is 3 hours.
(F) The printed circuit board is detached to obtain a layer of solid silicon insulator in the light emitting unit 20 of the printed circuit board. More specifically, the printed circuit board is manually detached from the detachable body jig 70 to obtain a hard silicon insulator. Since it is hard, it does not deform even if it hits an object.
(G) The separation line 41 of the printed circuit board is divided to make the light emitting unit 20 independent. More specifically, the metal ruler is manually aligned with the separation line 41 of the printed circuit board and divided to achieve the independence of the light emitting unit 20.

(H)発光ユニット20の絶縁体の非光源部分外周と絶縁体に近い電力コード60の部分を、PVC(Polyvinyl chloride、ポリビニルクロライド:ポリ塩化ビニル)材24で囲む。PVC材24はシリコン絶縁体の物理性亀裂を防ぐ役割をする。さらに詳しくは、プラスチック成型機で、成型条件として、高圧140MPa、低圧10MPa、持圧20MPa、射圧40MPaに設定し、硬度30PのPVC原料を使用する。15個の絶縁体付きの発光ユニット20の発光部分を金型の固定穴に入れ込み、電力コード60は電力コード固定用モール503に固定し、プラスチック成型を行うが、固定用溝702に入ってある発光部分にはPVC材24が付いていない。図8で示す通り、PVC材24を備えた発光ユニット20を得ることができ、シリコン絶縁体の物理性亀裂を防ぐことと共に、絶縁防水性能をさらに高めることができる。それと同時に、プリント基板の分離ライン41まで付いている縦方向支持体40を部分的に隠すことができる。 (H) The outer periphery of the non-light source portion of the insulator of the light emitting unit 20 and the portion of the power cord 60 close to the insulator are surrounded by a PVC (Polyvinyl chloride) material 24. The PVC material 24 serves to prevent physical cracks in the silicon insulator. More specifically, in a plastic molding machine, the molding conditions are set to high pressure 140 MPa, low pressure 10 MPa, holding pressure 20 MPa, and firing pressure 40 MPa, and a PVC raw material having a hardness of 30P is used. The light emitting part of the light emitting unit 20 with 15 insulators is inserted into the fixing hole of the mold, the power cord 60 is fixed to the power cord fixing molding 503, and plastic molding is performed, but it is contained in the fixing groove 702. The PVC material 24 is not attached to the light emitting portion. As shown in FIG. 8, it is possible to obtain the light emitting unit 20 provided with the PVC material 24, and it is possible to prevent physical cracks in the silicon insulator and further enhance the insulating and waterproof performance. At the same time, the vertical support 40 attached to the separation line 41 of the printed circuit board can be partially hidden.

詳細には、ステップ(C)で、電力コード60をはんだ付けして、二層面陽極電力コード用はんだ点221と次の発光ユニット20の一層面陽極電力コード用はんだ点211を電気的に接続する。電力コードで二層面陰極電力コード用はんだ点222と次の発光ユニット20の一層面陰極電力コード用はんだ点212を電気的に接続する。 Specifically, in step (C), the power cord 60 is soldered, and the solder point 221 for the double-layer anode power cord and the solder point 211 for the single-layer anode power cord of the next light emitting unit 20 are electrically connected. .. The power cord electrically connects the solder point 222 for the two-layer cathode power cord and the solder point 212 for the one-layer cathode power cord of the next light emitting unit 20.

一番目の発光ユニット20の回路は一層面陽極電力コード用はんだ点211より始まり、続いて、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215、二層面SMD式はんだ点と二層面直列電力コード用はんだ点223に繋がり、電力コードを使い、次の発光ユニット20へ電気的に接続する。中間の多数の発光ユニット20には一層面直列電力コード用はんだ点213より入り、続いて、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215、二層面SMD式はんだ点と二層面直列電力コード用はんだ点223に繋がり、電力コードを使い、次の発光ユニット20へ電気的に接続する。最後の発光ユニット20には一層面直列電力コード用はんだ点213より入り、続いて、一層面SMD式抵抗用はんだ点214、一層面SMD式LEDはんだ点215、二層面SMD式はんだ点と二層面陰極電力コード用はんだ点222に繋がるものである。 The circuit of the first light emitting unit 20 starts with the solder point 211 for the single surface anode power cord, followed by the solder point 214 for the single surface SMD type resistor, the single surface SMD type LED solder point 215, and the double surface SMD type solder point. It is connected to the solder point 223 for the two-layer surface series power cord, and is electrically connected to the next light emitting unit 20 using the power cord. A large number of light emitting units 20 in the middle are filled with solder points 213 for single-layer surface series power cords, followed by solder points 214 for single-layer SMD resistance, single-layer SMD LED solder points 215, and double-layer SMD solder points. It is connected to the solder point 223 for the two-layer surface series power cord, and is electrically connected to the next light emitting unit 20 using the power cord. The final light emitting unit 20 is entered from the solder point 213 for the one-layer series power cord, followed by the solder point 214 for the one-layer SMD type resistor, the one-layer SMD type LED solder point 215, the two-layer surface SMD type solder point and the two-layer surface. It is connected to the solder point 222 for the cathode power cord.

本実施形態によれば、一つの上述LEDチェーンライトの製造工法として、はんだ用治具50を公開した。図5を参照すれば分かるように、はんだ用治具50にプリント基板の横方向用支持体固定用溝501があり、多数の縦方向用支持体固定用溝502及び電力コード固定用の溝503が設けられてある。前記電力コード固定用モール503は、縦方向用支持体固定用溝502に連なっており、縦方向用支持体固定用溝502のところから斜めの角度となっている。さらに、冶具の反対側へ繋がり、次の発光ユニット電力コード用はんだ点の手前に繋がる。 According to this embodiment, the soldering jig 50 is disclosed as one of the above-mentioned LED chain light manufacturing methods. As can be seen with reference to FIG. 5, the soldering jig 50 has a groove 501 for fixing the horizontal support of the printed circuit board, and a large number of grooves 502 for fixing the vertical support and a groove 503 for fixing the power cord. Is provided. The power cord fixing molding 503 is connected to the vertical support fixing groove 502, and is at an oblique angle from the vertical support fixing groove 502. Furthermore, it is connected to the opposite side of the jig and is connected to the front of the solder point for the next light emitting unit power cord.

図5によれば、右側がプリント基板と電力コード60をはんだ用治具50に取付けた状態を示し、プリント基板の電力コード用のはんだ点の部位で、正面と裏が分離した状態になる。電力コード固定用モール503が斜めになっているため、電力コード60をはんだ用治具50の裏側に固定する際には次の発光ユニット20のはんだ点の手前までに行くようになる。 According to FIG. 5, the right side shows a state in which the printed circuit board and the power cord 60 are attached to the soldering jig 50, and the front surface and the back surface are separated at the portion of the solder point for the power cord of the printed circuit board. Since the power cord fixing molding 503 is slanted, when the power cord 60 is fixed to the back side of the soldering jig 50, it goes to the front of the solder point of the next light emitting unit 20.

電力コード60の半分をはんだ用治具50の正面に固定し、ほかの半分を折り畳む形で裏面に固定する。電力コード60の輸入端の被覆を抜けた銅線を発光ユニット20の二層面電力コード用はんだ点に当て、輸出端の被覆を抜けた銅線を次の発光ユニットの一層面電力コード用はんだ点に当てる。LEDチェーンライトのLEDピッチの要求に合わせ、常なる60mmと120mm長さの電力コードモール503が付いてあるはんだ用治具50をそれぞれ備えて置く。三軸ダブルごてはんだ付けロボットの上にはんだ用治具50を二つ取り付け、はんだ用治具50の漸進距離を3mm、ごて温度230℃、はんだ時間を1.5sに設定して置く。 Half of the power cord 60 is fixed to the front surface of the soldering jig 50, and the other half is fixed to the back surface by folding. The copper wire that has been uncoated at the import end of the power cord 60 is applied to the solder point for the double-layer power cord of the light emitting unit 20, and the copper wire that has been removed from the coating at the export end is the solder point for the single-layer power cord of the next light emitting unit. Hit to. According to the LED pitch requirement of the LED chain light, a soldering jig 50 with a usual 60 mm and 120 mm long power cord molding 503 is provided and placed, respectively. Two soldering jigs 50 are mounted on the triaxial double iron soldering robot, and the gradual distance of the soldering jigs 50 is set to 3 mm, the iron temperature is set to 230 ° C., and the soldering time is set to 1.5 s.

本実施形態ではさらに、一つの上述LEDチェーンライトを製造するための工具を公開する。図6は脱離式形体治具70であり、図7はさらにプリント基板を固定したものである。脱離式形体治具70に多数のプリント基板の横方向支持体固定用柱701が設けられ、横方向固定用柱には固定用溝が設けられる。脱離式形体治具70の下には多数の円筒体容器703が付いており、その中に固体化可能な絶縁糊が注いであり、円筒体の底部704は円錐形凹型になっている。 In this embodiment, a tool for manufacturing one of the above-mentioned LED chain lights is further disclosed. FIG. 6 shows a detachable body jig 70, and FIG. 7 shows a printed circuit board further fixed. The removable form jig 70 is provided with a large number of columns for fixing the lateral support of the printed circuit board 701, and the columns for fixing in the lateral direction are provided with fixing grooves. A large number of cylindrical containers 703 are attached under the removable shape jig 70, and solidifying insulating glue is poured into the cylindrical container 703, and the bottom 704 of the cylindrical body has a conical concave shape.

具体的には、脱離式形体治具70の両端と中端のプリント基板固定用柱701、それに設けられている固定溝702により、プリント基板の脱離式形体治具70に置かれる高さと左右の距離が決まり、発光ユニットの円筒体容器703の中の配置正確性を高める。円筒体底部704が凹型なので、反射ができて光拡散効果を果たす。この工法で得られた絶縁体は糊の防止式LEDチェーンライトの工法に比べ、絶縁体の体積を小さくすることと円筒状プラスチック容器のコストを節約することができる。 Specifically, the height of the printed circuit board fixing column 701 at both ends and the middle end of the removable body jig 70, and the height of the printed circuit board placed on the removable body jig 70 by the fixing grooves 702 provided therein. The distance between the left and right is determined, and the placement accuracy of the light emitting unit in the cylindrical container 703 is improved. Since the bottom of the cylinder 704 is concave, it can reflect and exert a light diffusing effect. The insulator obtained by this method can reduce the volume of the insulator and save the cost of the cylindrical plastic container as compared with the method of the glue prevention type LED chain light.

さらに、プリント基板のサイズに合わせ脱離式形体治具70のサイズを決める。脱離式形体治具70のサイズはプリント基板にあてはめたものである。プリント基板の発光ユニット20のサイズは6.5*9mmの際、脱離式形体治具70の円筒体容器703のサイズは7.5*21mmであり、発光ユニット20の頂部より円錐形凹型704の尖端までの距離は1.5mmであり、円錐形凹型704の高さは2mmであり、発光ユニット20の頂部より横方向支持体30までの距離は23.75mmであり、円筒状絶縁体頂部より横方向支持体固定用柱701の固定用溝までの距離は27.25mmである。 Further, the size of the removable shape jig 70 is determined according to the size of the printed circuit board. The size of the removable form jig 70 is applied to the printed circuit board. When the size of the light emitting unit 20 of the printed substrate is 6.5 * 9 mm, the size of the cylindrical container 703 of the removable shape jig 70 is 7.5 * 21 mm, from the top of the light emitting unit 20 to the tip of the conical concave 704. The distance is 1.5 mm, the height of the conical concave 704 is 2 mm, the distance from the top of the light emitting unit 20 to the lateral support 30 is 23.75 mm, and the lateral support is fixed from the top of the cylindrical insulator. The distance to the fixing groove of the column 701 is 27.25 mm.

先ず、A成分シリコンとB成分シリコンを1:1比率で、真空混合機で混ぜ、設備の容器に入れる。プリント基板と脱離式形体治具70を自動輸送及び糊注入機のプリント基板輸送待機台と脱離式形体治具70輸送待機台にそれぞれ配置する。脱離式形体治具70が輸送され、円筒体容器703の中に催脱剤を噴射し、糊の注射針の下へ運ばれる。糊を注いだ後、自動治具でプリント基板を持ち上げ、脱離式形体治具70に取り付ける。次のステップではプリント基板の取り付け配置の正確性をさらに高めるため、プリント基板の横方向支持体30を上から下へ押える工程を経過する。 First, A component silicon and B component silicon are mixed at a ratio of 1: 1 with a vacuum mixer and placed in a container of equipment. The printed circuit board and the detachable body jig 70 are arranged on the printed circuit board transport standby table and the detachable form jig 70 transport standby table of the automatic transport and glue injection machine, respectively. The removable form jig 70 is transported, ejects the release agent into the cylindrical container 703, and is carried under the injection needle of the glue. After pouring the glue, the printed circuit board is lifted by an automatic jig and attached to the removable jig 70. In the next step, in order to further improve the accuracy of the mounting arrangement of the printed circuit board, the step of pressing the lateral support 30 of the printed circuit board from top to bottom is performed.

本実施形態によれば、生産工具ははんだ用治具50でもあり、脱離式形体治具70でもある。さらに、はんだ用治具50と脱離式形体治具70を同時に指すこともある。 According to this embodiment, the production tool is also a soldering jig 50 and a detachable body jig 70. Further, the soldering jig 50 and the detachable body jig 70 may be referred to at the same time.

本実施形態によれば、電力コードの同じはんだ方法と規則性を果たし、シリコンの固体化工法で、プリント基板の発光ユニット20の導電された部位に絶縁体が形成させ、全ての発光ユニット20の防水性能を実現することができる。特選されたプリント基板、はんだ用治具50と脱離式形体治具70を結合した生産工法で、規則性と標準化程度を高め、自動化作業が可能になった。絶縁工法としては、大部分、熟練された2本足LED防止工法と同じような工法を使うことで、LEDチェーンライトの品質を高めることと共に、人件コストを下げることができる。 According to this embodiment, the same soldering method and regularity of the power cord are achieved, and an insulator is formed in the conductive portion of the light emitting unit 20 of the printed circuit board by the solidification method of silicon, and all the light emitting units 20 Waterproof performance can be realized. A production method that combines a specially selected printed circuit board, a soldering jig 50, and a removable form jig 70 has improved regularity and standardization, and has made automated work possible. Most of the insulation methods are similar to the skilled two-legged LED prevention method, which can improve the quality of LED chain lights and reduce labor costs.

本発明の製造工法で得たLEDチェーンライトによれば、以下の効果がある。
一、シリコンの固体化した絶縁体は高安定の防水性能を持っているため、屋内は勿論、雪や雨の天気と水が貯まりやすい場所などの悪い環境でも使用できる。
二、発光ユニット一つに二つのSMD式LED光源を使い、発光面積が2本足LEDより広く、同じ電流でも、2本足LEDチェーンライトより輝度が高い。
三、同じLEDチップを使用するとして、SMD式LEDの製造コストは2本足LEDより安い、SMT工法、三軸ダブルごてはんだロボットと自動輸送及び糊注入機を使った自動化作業ができるため、大規模ロット生産が可能になり、本発明のLEDチェーンライトのコストは2本足LEDチェーンライトより安くて済む。
According to the LED chain light obtained by the manufacturing method of the present invention, there are the following effects.
First, since the solidified silicon insulator has highly stable waterproof performance, it can be used not only indoors but also in bad environments such as snow and rainy weather and places where water tends to accumulate.
2. Using two SMD type LED light sources for one light emitting unit, the light emitting area is wider than the two-legged LED, and even with the same current, the brightness is higher than the two-legged LED chain light.
Third, even if the same LED chip is used, the manufacturing cost of SMD type LED is cheaper than that of two-legged LED. Large-scale lot production is possible, and the cost of the LED chain light of the present invention is lower than that of the two-legged LED chain light.

以上,本発明について実施例を用いて説明してきたが,本発明の技術的範囲は上記実施例に記載の範囲に限定されない。上記実施例に,多様な変更又は改良を加えることが可能であることが当業者に明らかである。その様な変更又は改良を加えた形態も本発明の技術的範囲に含まれ得ることが,特許請求の範囲の記載から明らかである。 Although the present invention has been described above with reference to examples, the technical scope of the present invention is not limited to the scope described in the above examples. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

100,2本足LED; 101,足; 102,電力コード; 103,はんだ部位;
104,隔離材;105,熱収縮チューブ; 20,LED発光ユニット;21,一層面基板;
211一層面陽極電力コード用はんだ点;212,一層面陰極電力コード用はんだ点;
213,一層面直列電力コード用はんだ点; 214,一層面SMD式抵抗用はんだ点;
215,一層面SMD式LED用はんだ点;216,一層面SMD式抵抗;217,一層面SMD式LED;22,二層面基板; 221,二層面陽極電力コード用はんだ点;
222,二層面陰極電力コード用はんだ点;223,二層面直列電力コード用はんだ点;224,二層面SMD式LED用はんだ点; 225,二層面SMD式LED;
23,円筒状絶縁体; 24,PVC材;30,横方向支持体;40,縦方向支持体;
41,「V」型分離ライン;50,はんだ用治具; 501,横方向支持体固定溝;
502,縦方向支持体固定溝; 503,電力コード用モール;60,電力コード;
70,脱離式形体治具; 701,横方向支持体固定用柱; 702,固定用溝;
703,円筒体容器; 704,円錐形凹型
100, 2-legged LED; 101, leg; 102, power cord; 103, solder part;
104, Isolator; 105, Heat shrink tube; 20, LED light emitting unit; 21, Single-layer substrate;
211 Single-layer anode power cord solder points; 212, Single-layer cathode power cord solder points;
213, Solder point for single-layer series power cord; 214, Solder point for single-layer SMD resistor;
215, Single-layer SMD LED solder point; 216, Single-layer SMD resistor; 217, Single-layer SMD LED; 22, Double-layer board; 221, Double-layer anode power cord solder point;
222, Solder point for double-layer cathode power cord; 223, Solder point for double-layer series power cord; 224, Solder point for double-layer SMD LED; 225, Solder point for double-layer SMD LED;
23, Cylindrical insulator; 24, PVC material; 30, Horizontal support; 40, Vertical support;
41, "V" type separation line; 50, soldering jig; 501, lateral support fixing groove;
502, Vertical support fixing groove; 503, Power cord molding; 60, Power cord;
70, Detachable body jig; 701, Pillar for fixing lateral support; 702, Groove for fixing;
703, Cylindrical container; 704, Conical concave

Claims (10)

一層と二層の両面に、プリント基板をそれぞれ備えたLEDによる3つ以上の発光ユニットを有し、
前記一層面には、一層面陽極電力コード用、一層面陰極電力コード用、一層面直列電力コード用、SMD式抵抗用とSMD式一層面LED用の、はんだ点がそれぞれ設けられ、
前記二層面には二層面陽極電力コード用、二層面陰極電力コード用、二層面直列電力コード用とSMD式二層面LED用の、はんだ点が設けられ、
前記一層面のSMD式抵抗用はんだ面には、SMD式抵抗が実装され、
前記一層面と二層面のSMD式LED用はんだ点には、それぞれSMD式LEDが実装され、前記3つ以上の発光ユニットの間が電気的に連結される、LEDチェーンライト。
It has three or more LED light emitting units with printed circuit boards on both sides of one layer and two layers.
Solder points for single-layer anode power cords, single-layer cathode power cords, single-layer series power cords, SMD resistors and SMD single-layer LEDs are provided on the single-layer surface, respectively.
Solder points are provided on the two-layer surface for a two-layer surface anode power cord, a two-layer surface cathode power cord, a two-layer surface series power cord, and an SMD type two-layer surface LED.
An SMD type resistor is mounted on the solder surface for the SMD type resistor on the one-layer surface.
An LED chain light in which SMD type LEDs are mounted on the solder points for SMD type LEDs on the one-layer surface and the two-layer surface, respectively, and the three or more light emitting units are electrically connected to each other.
前記一層面陽極電力コード用はんだ点と二層面陽極電力コード用はんだ点は、電気的に連結され、
前記二層面の陽極電力コード用はんだ点と次の発光ユニットの一層面の陽極電力コード用はんだ点は、電気的に連結され、
前記一層面陰極電力コード用はんだ点と二層面陰極電力コード用はんだ点は、電気的に連結され、
前記二層面の陰極電力コード用はんだ点と次の発光ユニットの一層面の陰極電力コード用はんだ点は、電気的に連結され、
前記発光ユニットは第1の発光ユニット、第2の発光ユニット、第3の発光ユニットに分けられ、
前記第1の発光ユニットの回路は、一層面陽極電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面直列電力コード用はんだ点より前記第2の発光ユニットへ引き出し、
前記第2の3つ以上の発光ユニットの回路は、一層面直列電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面直列電力コード用はんだ点より前記第3の発光ユニットへ引き出し、
前記第3の発光ユニットの回路は一層面直列電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面陰極電力コード用はんだ点より引きだす、請求項1に記載のLEDチェーンライト。
The solder points for the one-layer anode power cord and the solder points for the two-layer anode power cord are electrically connected to each other.
The solder points for the anode power cord on the two-layer surface and the solder points for the anode power cord on the first surface of the next light emitting unit are electrically connected.
The solder points for the one-layer cathode power cord and the solder points for the two-layer cathode power cord are electrically connected to each other.
The solder points for the cathode power cord on the two-layer surface and the solder points for the cathode power cord on the first surface of the next light emitting unit are electrically connected to each other.
The light emitting unit is divided into a first light emitting unit, a second light emitting unit, and a third light emitting unit.
The circuit of the first light emitting unit is drawn from the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistance soldering point, the soldering point for the single surface SMD type LED, and the soldering point for the double surface SMD type LED. Pull out from the solder point for the two-layer surface series power cord to the second light emitting unit,
The circuits of the second three or more light emitting units are drawn from the solder points for the single surface series power cord, followed by the solder points for the single surface SMD type resistor, the single surface SMD type LED solder points, and the double surface SMD type. Pull out from the solder point for LED and the solder point for double-layer surface series power cord to the third light emitting unit.
The circuit of the third light emitting unit is drawn from the solder point for the single surface series power cord, followed by the solder point for the single surface SMD type resistor, the solder point for the single surface SMD type LED, and the solder point for the double surface SMD type LED. The LED chain light according to claim 1, which is drawn from a solder point for a two-layer surface cathode power cord.
前記発光ユニットの外周には、円筒状絶縁体が囲まれ、LED光源近傍の円筒状上部の形は凹型である、請求項2に記載のLEDチェーンライト。 The LED chain light according to claim 2, wherein a cylindrical insulator is surrounded on the outer periphery of the light emitting unit, and the shape of the upper cylindrical portion in the vicinity of the LED light source is concave. 前記発光ユニットの円筒状絶縁体の非LED光源部位と円筒状絶縁体近傍の電力コードの外周にPVC材が囲まれる、請求項3に記載のLEDチェーンライト。 The LED chain light according to claim 3, wherein a PVC material is surrounded by a non-LED light source portion of the cylindrical insulator of the light emitting unit and an outer periphery of a power cord in the vicinity of the cylindrical insulator. 横方向用支持体及び3つ以上の発光ユニットを含み、
3つ以上の発光ユニットは縦方向用支持体を経由して横方向用支持体へ連結され、
前記発光ユニットと前記縦方向用支持体の間には分割用ラインが設けられ、
前記発光ユニットはそれぞれ、一層面の回路と二層面の回路を有する両面プリント基板を備え、さらに一層面陽極電力コード用はんだ点、一層面陰極電力コード用はんだ点、一層面直列電力コード用はんだ点、一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、前記二層面回路には二層面陽極電力コード用はんだ点、二層面陰極電力コード用はんだ点、二層面直列電力コード用はんだ点と二層面SMD式LED用のはんだ点を含む、LEDチェーンライト用のプリント基板。
Includes lateral support and 3 or more light emitting units
Three or more light emitting units are connected to the horizontal support via the vertical support, and are connected to the horizontal support.
A dividing line is provided between the light emitting unit and the vertical support.
Each of the light emitting units is provided with a double-sided printed circuit board having a single-layer circuit and a double-layer circuit, and further has a single-layer anode power cord solder point, a single-layer cathode power cord solder point, and a single-layer series power cord solder point. , Solder point for single-layer SMD type resistor, Solder point for single-layer SMD type LED, Solder point for double-layer surface anode power cord, Solder point for double-layer surface cathode power cord, Solder for double-layer surface series power cord Printed circuit board for LED chain lights, including dots and solder points for double-layer SMD LEDs.
(A)前記プリント基板は横方向用支持体及び3つ以上の発光ユニットを含み、3つ以上の発光ユニットを縦方向用支持体を経由して横方向用支持体へ連結し、発光ユニットと縦方向用支持体の間には分割用ラインを取り付け、各発光ユニットは一層面の回路と二層面の回路の有する両面プリント基板であり、一層面陽極電力コード用はんだ点、一層面陰極電力コード用はんだ点、一層面直列電力コード用はんだ点、一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、前記二層面回路には二層面陽極電力コード用はんだ点、二層面陰極電力コード用はんだ点、二層面直列電力コード用はんだ点と二層面SMD式LED用のはんだ点を含める、ことにより、プリント基板を作り、
(B)前記プリント基板の前記一層面の上にSMD式LEDとSMD式抵抗を実装し、前記二層面の上にSMD式LEDを実装し、
(C)プリント基板と電力コードをはんだ用治具に設置し、スポットはんだ設備で電力コードをプリント基板にはんだ付けし、
(D)前記脱離式形体治具には固体化可能な絶縁のり入れ用の容器が設けていて、プリント基板の発光ユニットが容器の中に入るようになり、プリント基板両面に実装したるSMD式LED、SMD式抵抗と電力コードの露出された導電部位が固体化可能な絶縁のりに囲む、ことによりプリント基板を脱離式形体治具に固定し、
(E)前記脱離式形体治具を電気炉に入れて絶縁のりを固体化し、
(F)前記プリント基板を前記脱離式形体治具より脱離し、
(G)前記プリント基板の分割用ラインを折り割り、前記発光ユニットを前記プリント基板より独立させ、
(H) 前記発光ユニットの円筒状絶縁体の非LED光源部位と前記円筒状絶縁体の近傍の電力コードの外周にPVC材を囲む、
の工程により製造される請求項1〜4のいずれかに記載のLEDチェーンライト。
(A) The printed circuit board includes a horizontal support and three or more light emitting units, and three or more light emitting units are connected to the horizontal support via the vertical support to form a light emitting unit. A dividing line is attached between the vertical supports, and each light emitting unit is a double-sided printed circuit board having a one-layer circuit and a two-layer circuit. Solder point for single-layer series power cord, solder point for single-layer SMD resistance, solder point for single-layer SMD LED, solder point for double-layer anode power cord, double-layer cathode power in the two-layer circuit Make a printed circuit board by including the solder points for the cord, the solder points for the two-layer side series power cord, and the solder points for the two-layer side SMD type LED.
(B) The SMD type LED and the SMD type resistor are mounted on the one-layer surface of the printed circuit board, and the SMD type LED is mounted on the two-layer surface.
(C) Install the printed circuit board and the power cord on the soldering jig, and solder the power cord to the printed circuit board with the spot soldering equipment.
(D) The detachable body jig is provided with a container for insulating glue that can be solidified so that the light emitting unit of the printed circuit board can enter the container and is mounted on both sides of the printed circuit board. The printed circuit board is fixed to the removable form jig by surrounding the exposed conductive parts of the type LED, SMD type resistor and power cord with a solidizable insulating glue.
(E) The detachable body jig is placed in an electric furnace to solidify the insulating glue, and the insulating glue is solidified.
(F) The printed circuit board is detached from the detachable body jig.
(G) The dividing line of the printed circuit board is divided, and the light emitting unit is made independent of the printed circuit board.
(H) A PVC material is surrounded around the non-LED light source portion of the cylindrical insulator of the light emitting unit and the power cord in the vicinity of the cylindrical insulator.
The LED chain light according to any one of claims 1 to 4, which is manufactured by the process of.
前記一層面陽極電力コード用はんだ点と二層面陽極電力コード用はんだ点は、電気的に連結され、前記二層面の陽極電力コード用はんだ点と次の発光ユニットの一層面の陽極電力コード用はんだ点は電力コードを経由し電気的に連結され、
前記一層面陰極電力コード用はんだ点と二層面陰極電力コード用はんだ点は、電気的に連結され、前記二層面の陰極電力コード用はんだ点と次の発光ユニットの一層面の陰極電力コード用はんだ点は電気的に連結され、
前記3つ以上の発光ユニットは第1の発光ユニット、第2の発光ユニット、第3の発光ユニットに分けられ、
第1の発光ユニットの回路は、一層面陽極電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面直列電力コード用はんだ点より電力コードを使い、前記第2の発光ユニットへ電気的に接続し、
第2の発光ユニットの回路は一層面直列電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面直列電力コード用はんだ点より電力コードを使い、前記第3の発光ユニットへ電気的に接続され、
第3の発光ユニットの回路は一層面直列電力コード用はんだ点より引きいれ、続いて一層面SMD式抵抗用はんだ点、一層面SMD式LED用はんだ点、二層面SMD式LED用はんだ点、二層面陰極電力コード用はんだ点より電力コードが引き出すものである、LEDチェーンライト。
The solder point for the one-layer surface anode power cord and the solder point for the two-layer surface anode power cord are electrically connected, and the solder point for the two-layer surface anode power cord and the solder for the one-layer surface of the next light emitting unit are soldered for the anode power cord. The points are electrically connected via a power cord and
The one-layer cathode power cord solder point and the two-layer cathode power cord solder point are electrically connected, and the two-layer cathode power cord solder point and the one-layer cathode power cord solder on the next light emitting unit are electrically connected. The points are electrically connected,
The three or more light emitting units are divided into a first light emitting unit, a second light emitting unit, and a third light emitting unit.
The circuit of the first light emitting unit is drawn from the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistance soldering point, the soldering point for the single surface SMD type LED, the soldering point for the double surface SMD type LED, and the second. Using the power cord from the solder point for the layer surface series power cord, electrically connect it to the second light emitting unit.
The circuit of the second light emitting unit is drawn from the soldering point for the one-layer series power cord, followed by the soldering point for the one-layer SMD resistance, the soldering point for the one-layer SMD LED, the soldering point for the two-layer SMD LED, and the second. Using a power cord from the solder point for the layer surface series power cord, it is electrically connected to the third light emitting unit.
The circuit of the third light emitting unit is drawn from the solder point for the single surface series power cord, followed by the solder point for the single surface SMD type resistor, the solder point for the single surface SMD type LED, the solder point for the double surface SMD type LED, and the second. LED chain light that the power cord draws from the solder point for the layer surface cathode power cord.
前記はんだ用治具にプリント基板の横方向用支持体固定用溝があり、3つ以上の縦方向用支持体固定用溝及び電力コード固定用のモールが取り付けられ、前記電力コード固定用モールは斜めの角度を用い、冶具の反対側へ繋がり、次の発光ユニット電力コード用はんだ点の手元に繋がれる工具によって製造される、請求項6〜7のいずれかに記載のLEDチェーンライト。 The soldering jig has a groove for fixing a support in the horizontal direction of a printed circuit board, and three or more grooves for fixing a support in the vertical direction and a molding for fixing a power cord are attached, and the molding for fixing the power cord is attached. The LED chain light according to any one of claims 6 to 7, manufactured by a tool that is connected to the opposite side of the jig using an oblique angle and is connected to the hand of the solder point for the next light emitting unit power cord. 前記脱離式形体治具にプリント基板の横方向用支持体の固定用柱が設けられ、前記横方向用支持体固定用柱には固定用溝が設けられ、前記脱離式形体治具の下のほうに3つ以上の円筒状容器が設けられ、前記円筒状容器の中に固体化可能な絶縁のりが入っており、前記円筒状容器の底部位は円錐形凹型となる工具によって製造される、請求項6〜7のいずれかに記載のLEDチェーンライト。 The detachable form jig is provided with a fixing column for the lateral support of the printed substrate, and the lateral support fixing column is provided with a fixing groove. Three or more cylindrical containers are provided at the bottom, and the cylindrical container contains a solidifying insulating glue, and the bottom portion of the cylindrical container is manufactured by a tool having a conical concave shape. The LED chain light according to any one of claims 6 to 7. 前記脱離式形体治具のサイズはプリント基板に当てはまるように設けられ、
前記プリント基板の前記発光ユニットのサイズは6.5*9mmであり、脱離式形体治具の円筒状容器の内サイズは7.5*21mmであり、発光ユニットの上部より円筒状容器内の円錐形尖端までの距離は1.5mmであり、円筒状容器の底より横方向用支持体固定用柱の固定用溝までの距離は27.25mmである、請求項6〜9のいずれかに記載のLEDチェーンライト。

The size of the detachable body jig is provided so as to fit the printed circuit board.
The size of the light emitting unit of the printed substrate is 6.5 * 9 mm, the inner size of the cylindrical container of the removable form jig is 7.5 * 21 mm, and the distance from the upper part of the light emitting unit to the conical tip in the cylindrical container. The LED chain light according to any one of claims 6 to 9, wherein the distance is 1.5 mm, and the distance from the bottom of the cylindrical container to the fixing groove of the horizontal support fixing column is 27.25 mm.

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