JP6954802B2 - LED chain light and its manufacturing method - Google Patents

Description

The present invention relates to LED illumination, and relates to LED chain lights, production methods thereof, and production tools.

LED chain lights are widely used as decorative lights for event celebrations. Especially during Christmas and New Year, it can be attached to roadside trees and objects to enhance the festive atmosphere. When LED products are exposed to high humidity, electric leakage occurs, which damages the light emitting diode and tends to cause product defects. Therefore, the demand for insulation and waterproof performance of LED products is increasing.

The oldest and most commonly used structure of existing LED chain lights is that many two-legged LEDs are soldered in series and in parallel with a power cord. Solder in series with a power cord between the two-legged LEDs, and sandwich a heat-meltable isolation material (main component is EVA) between the two legs of the soldered LED and the inside of the power cord. , The outside is covered with a PVC heat-shrinkable tube, and heat is applied to shrink the product.

The above is formed in a columnar shape by the isolation material, but due to the shape and restrictions on the construction method when sandwiching, only the two legs of the LED and the inside of the power cord can be sandwiched, and the conductive part is in a semi-exposed state. ing. Even if a heat-shrinked PVC tube is provided on the outside, the waterproof standard is due to the essential performance and shape problems of sealing the PVC tube and the separating material, and the irregular contact surface of the solder part. Cannot meet.

In addition to this, in this field, there is a production method of a preventive LED chain light using glue. A cylindrical plastic container is prepared, glue is poured into it, and two soldered legs and a power cord are manually inserted into the container one by one and solidified. be. However, this method has a problem of flexibility and irregularity of the power cord, and a problem of buoyancy of the glue. Since the solder part is easily exposed to the outside, a visual inspection is always required. Even if the drip-proof performance is excellent on the premise that the solder part is not exposed to the outside, it is difficult to perform automated production, so mass production is not possible and the production cost is high.

To solve the above problems, the present invention provides an LED chain light. It comprises three or more LED light emitting units, and each light emitting unit includes a double-sided printed circuit board having a one-layer surface and a two-layer surface. The one-layer surface is provided with a one-layer anode power cord soldering point, a one-layer cathode power cord soldering point, a one-layer series power cord soldering point, a one-layer SMD resistance soldering point, and a one-layer SMD LED soldering point. .. The two-layer surface is provided with a two-layer surface anode power cord solder point, a two-layer surface cathode power cord solder point, a two-layer surface series power cord solder point, and a two-layer surface SMD type LED solder point.

The solder points for the one-layer anode power cord and the solder points for the two-layer anode power cord are directly electrically connected. The solder point for the one-layer concealed power cord and the solder point for the two-layer concealed power cord are directly electrically connected. Each solder point on the two-layer surface is electrically connected to each solder point on the one-layer surface of the next light emitting unit. Of the three or more light emitting units, draw in from the solder point for the anode power cord on the first surface of the first light emitting unit, and then continue with the solder point for the one-layer SMD type resistor, the solder point for the one-layer SMD type LED, and the two-layer surface SMD type. Electricity flows to the next light emitting unit via the solder point for the LED and the solder point for the two-layer surface series power cord. A cylindrical insulator is surrounded on the outer circumference of the light emitting unit, and the shape of the upper part approaching the LED light source is a conical concave shape. The cylindrical insulator around the non-LED light source portion of the light emitting unit and the portion of the power cord near the light emitting unit are surrounded by a PVC material.

In order to solve the above technical problems, one embodiment of the present invention provides a printed circuit board for one LED chain light. The printed circuit board includes a horizontal support, three or more vertical supports, and a light emitting unit. The light emitting unit and the vertical support have a separation line. Each light emitting unit is provided with a single-layer and two-layer substrate, and the single-layer anode power cord soldering point, single-layer cathode power cord soldering point, single-layer series power cord soldering point, and single-layer SMD type resistor are provided on the single-layer surface. Solder points and one-layer SMD type LED solder points are provided. The two-layer surface is provided with a two-layer surface anode power cord solder point, a two-layer surface cathode power cord solder point, a two-layer surface series power cord solder point, and a two-layer surface SMD type LED solder point.

In order to solve the above-mentioned technical problem, one embodiment of the present invention provides one manufacturing method of the LED chain light.
(A) The printed circuit board for producing a printed circuit board includes a horizontal support, three or more vertical supports, and a light emitting unit. The light emitting unit and the vertical support have a separation line. Each light emitting unit is provided with a single-layer and two-layer substrate, and the single-layer anode power cord soldering point, single-layer cathode power cord soldering point, single-layer series power cord soldering point, and single-layer SMD type resistor are provided on the single-layer surface. Solder points and one-layer SMD type LED solder points are provided. The two-layer surface has two-layer surface anode power cord solder points, two-layer surface cathode power cord solder points, two-layer surface series power cord solder points, and two-layer surface. Solder points for SMD type LEDs are provided.
(B) The SMD type resistor and the SMD type LED are mounted on the one-layer surface board, and the SMD type LED is mounted on the two-layer surface board.
(C) Fix the printed circuit board and the power cord to the soldering jig, and solder the power cord to the light emitting unit of the board using the spot soldering equipment.
(D) Fix the printed circuit board to the removable jig. Pour solidifyable glue into the cylindrical container of the detachable form jig, insert the light emitting unit of the printed circuit board into the cylindrical container of the removable form jig, and connect the LED, resistance and power cord of the light emitting unit. The exposed conductive part is submerged in a solidizable glue in a cylindrical container.
(E) Put the removable type jig in an electric furnace to solidify it.
(F) By detaching the printed circuit board, a cylindrical insulator is formed on the light emitting unit of the printed circuit board with a single layer of solid glue.
(G) The light emitting unit is made independent from the printed circuit board by dividing it by the separation line of the printed circuit board.
(H) Surround the cylindrical insulator around the non-LED light source part of the light emitting unit and the part of the power cord near the light emitting unit with PVC material.

In (C) above, the power cord is soldered to electrically connect the solder points for the two-layer anode power cord and the solder points for the one-layer anode power cord of the next light emitting unit. The power cord electrically connects the solder point for the two-layer cathode power cord and the solder point for the one-layer cathode power cord of the next light emitting unit. The circuit of the first light emitting unit starts with the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistor, the soldering point for the single surface SMD type LED, and the soldering point for the double surface SMD type soldering point and the two layer surface series. Connect to the solder point for the power cord, use the power cord, and electrically connect to the next light emitting unit. Many intermediate light emitting units enter from the soldering point for single surface series power cord, followed by the soldering point for single surface SMD type resistor, the soldering point for single surface SMD type LED, the soldering point for double surface SMD type soldering point and the two layer surface series. It is connected to the solder point for the power cord, and the power cord is used to electrically connect to the next light emitting unit. The last light emitting unit enters from the solder point for single surface series power cord, followed by the solder point for single surface SMD type resistor, the solder point for single surface SMD type LED, the solder point for double surface SMD type solder point and the solder point for double surface cathode power cord. It is connected to the soldering point.

In order to solve the above technical problems, the present invention is a soldering jig that provides a tool for manufacturing an LED chain light. The soldering jig is provided with a groove for fixing the horizontal support, three or more grooves for fixing the vertical support, and a molding for fixing the power cord. The power cord molding has the characteristic of an oblique angle, and the power cord molding is connected to a power cord solder point of the next light emitting unit placed on the back surface of the jig.

In order to solve the above-mentioned technical problem, according to one embodiment of the present invention, it is a removable type jig that provides one tool for manufacturing an LED chain light. The detachable body jig is provided with a pillar for fixing the lateral support of the printed circuit board, and the fixing pillar is provided with a fixing groove. Three or more cylindrical containers are provided under the removable shape jig, and the insulating glue that can be solidified is contained in the cylindrical container, and the bottom portion of the cylindrical container is conical concave. It becomes.

The size of the removable type jig is applied to the printed circuit board. When the size of the light emitting unit of the printed circuit board is 6.5 * 9 mm, the size of the cylindrical container of the removable type jig is 7.5 * 21 mm. The distance from the top of the light emitting unit to the tip of the conical concave is 1.5 mm, the height of the conical concave is 2 mm, and the distance from the top of the light emitting unit to the lateral support is 23.75 mm. The distance from the top of the cylindrical insulator to the fixing groove of the lateral support fixing column is 27.25 mm.

According to one embodiment of the present invention, the light emitting unit uses a printed circuit board, realizes the same soldering method and rules for power cords, and forms an insulator on all exposed conductive parts of the light emitting unit of the printed circuit board. It realizes the waterproof performance of all light emitting units. In addition, as a production mechanism using a printed circuit board, a soldering jig, and a detachable body jig, the regularity and standardization of the production method has been achieved, and it is suitable for automation work. By using a construction method similar to the skilled two-legged LED prevention construction method, it is possible to improve the quality of LED chain lights and reduce labor costs. The additional advantages of the present invention are partially shown below, which will be clarified in the following contents, or will be understood in practice of the present invention.

Figure 1 shows the LED light source structure of an existing LED chain light. FIG. 2 is a one-layer structural view in which the present invention was carried out. FIG. 3 is a structural diagram of the two-layer surface in which the present invention was carried out. FIG. 4 is an electrical principle diagram of the present invention. FIG. 5 is an installation diagram of the soldering jig, the printed circuit board, and the power cord of the present invention. FIG. 6 is a removable type jig diagram of the present invention. FIG. 7 is a connection diagram of the printed circuit board of the present invention and the detachable form jig diagram. FIG. 8 is a product diagram of the LED light emitting unit of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with figures so that engineers in the field can better understand the feasibility of the present invention, but the present invention is not intended to limit the scope of rights of the present invention.

As shown in FIGS. 2 to 8, according to the present embodiment, the LED chain light includes a large number of LED light emitting units 20. In the present embodiment, the number of the LED light emitting units 20 is at least three, but the number may be more than this. In FIGS. 2 and 3, the case where the number is at least 6 or more is taken as an example, but it goes without saying that the number may be 3 to 5 or 7 or more.

Each light emitting unit 20 includes a one-layer surface substrate 21 and a two-layer surface substrate 22. On the one-sided substrate 21, one-layer anode power cord soldering point 211, one-layer cathode power cord soldering point 212, one-layer series power cord soldering point 213, one-layer SMD type resistance soldering point 214, one-layer SMD type LED solder points 215 are provided, and the two-layer surface substrate 22 has a two-layer surface anode power cord solder point 221 and a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED. Solder points 224 are provided.

SMD resistance 216 is mounted on the single-layer SMD resistance solder point 214, SMD LED 217 is mounted on the single-layer SMD LED solder point 215, and SMD LED 225 is mounted on the double-layer SMD LED solder point 224. Is implemented. A large number of light emitting units 20 are electrically connected one after another by the power cord 102. Further, as shown in FIG. 8, a cylindrical insulator 23 is surrounded by the outer circumference of the light emitting unit 20, and the upper end portion of the cylindrical insulator 23 near the LED light source is a conical concave 704. A PVC material is surrounded by the non-LED portion of the cylindrical insulator 23 of the light emitting unit 20 and the outer circumference of the power cord 102 close to the cylindrical insulator 23.

Returning to FIGS. 2 and 3, as one embodiment, the SMD type LEDs 217 and 225 are side light emitting LEDs, and the light emitting surface illuminates toward the conical concave 704 shown in FIG. 6 at the upper end, and the light is diffused. Realized and get the unique luminous effect of traditional LED chain lights. The light emitting area is larger than the two-legged LED, increasing the brightness.

Further, according to the present embodiment, a printed circuit board for production of LED chain lights has been released. As can be seen with reference to FIGS. 2 and 3, the printed circuit board includes a horizontal support 30, a large number of vertical supports 40, and a large number of light emitting units 20, and a large number of light emitting units 20 pass through the vertical support 40. Is connected to the lateral support 30. A "V" type separation line 41 is provided between the light emitting unit 20 and the vertical support 40. Each light emitting unit 20 is a double-sided substrate having a single-layer surface and a double-layer surface, and the single-layer substrate 21 has a single surface. Solder points 211 for anode power cords, solder points 212 for single surface cathode power cords, solder points 213 for single surface series power cords, solder points 214 for single surface SMD type resistors, and single surface SMD type LED solder points 215 are provided. The two-layer surface substrate 22 is provided with a two-layer surface anode power cord solder point 221, a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED solder point 224.

Further, according to the present embodiment, the printed circuit board is a hard double-sided printed circuit board, and circuits are attached to the single-layer and two-layer substrates, and in appearance, a large number of light emitting units 20, a large number of vertical supports 40, and light emitting are emitted. The unit 20 and the lateral support 30 are connected by a vertical support 40, and the lateral support 30 plays a fixed role in the production method. A "V" type separation line 41 is provided between the light emitting unit 20 and the vertical support 40, which can be divided and used independently for the light emitting unit 20.

The light emitting unit 20 will be described. On the one-layer substrate 21, one-layer anode power cord solder point 211, one-layer cathode power cord solder point 212, one-layer series power cord solder point 213, and one-layer SMD type resistor A solder point 214 and a single-layer SMD type LED solder point 215 are provided. The two-layer surface substrate 22 is provided with a two-layer surface anode power cord solder point 221 and a two-layer surface cathode power cord solder point 222, a two-layer surface series power cord solder point 223, and a two-layer surface SMD type LED solder point 224.

As shown in FIG. 4, according to the present embodiment, R is an SMD type resistor 216 and LED is an SMD type LED light source 217 and 225, and each of them has six electrically connected solder points for power cords. Solder points 211 for single-layer anode power cords, solder points 212 for single-layer cathode power cords, solder points 213 for single-layer series power cords, and solder points 221 for double-layer anode power cords and double-layer surfaces on the double-layer substrate 22, respectively. The cathode power cord solder point 222 and the two-layer surface series power cord solder point 223.

Among them, the one-layer anode power cord solder point 211 is directly connected to the two-layer anode power cord solder point 221 and the circuit is used, and the power cord is used to solder the one-layer anode power cord solder point 221 next to the two-layer anode power cord solder point 221. It leads to point 211. The one-layer hidden electrode power cord solder point is directly connected to the two-layer cathode power cord solder point 222, and the power cord is used to connect the two-layer cathode power cord solder point 222 to the next one-layer cathode power cord solder point 213. Connect.

In terms of circuit, the first light emitting unit 20 is drawn from the solder point 211 for the one-layer anode power cord, and subsequently passes through the one-layer SMD type resistor 216, the one-layer SMD type LED 217, and the two-layer surface SMD type LED 225, and the two-layer surface. It is connected in series with the solder point 223 for the series power cord and pulled out to the next light emitting unit 20. The circuits of the large number of light emitting units 20 in the middle are drawn from the solder points 213 for the single-layer series power cord, and subsequently via the single-layer SMD type resistor 216, the single-layer SMD type LED 217, and the double-layer surface SMD type LED 225, and the two-layer surface. It is connected in series with the solder point 223 for the series power cord and pulled out to the next light emitting unit 20.

The circuit of the final light emitting unit 20 is drawn from the solder point 213 for the single surface series power cord, and subsequently via the single surface SMD type resistor 216, the single surface SMD type LED 217, and the double surface surface SMD type LED 225, and the two layer surface cathode power. It is connected in series with the solder point 222 for the cord, and is drawn out to the first light emitting unit 20 of the next printed circuit board in parallel.

Specifically, in terms of electrical principle, the solder points 211 and 221 for the anode power cords on the one-layer surface and the two-layer surface of all the light emitting units 20 are directly conductively connected, and the solder points 212 and 222 for the cathode power cords on the one-layer surface and the two-layer surface. Are directly conductively connected, but the solder points 213 and 223 for series power cords are not conductively connected to each other. The circuit of the first light emitting unit 20 starts from the single surface anode power cord soldering point 211, passes through the single surface SMD type resistor 216, the single surface SMD type LED 217, and the double surface surface SMD type LED 225, and is a soldering point for the double surface series power cord. It is serialized in 223.

The circuit of the intermediate light emitting unit 20 starts from the one-layer surface series power cord soldering point 213, passes through the one-layer surface SMD type resistor 216, the one-layer surface SMD type LED 217, and the two-layer surface SMD type LED 225, and the solder point 223 for the two-layer surface series power cord. Is serialized in. The circuit of the final light emitting unit 20 starts from the one-layer surface series power cord soldering point, passes through the one-layer SMD type resistor 216, the one-layer surface SMD type LED 217, and the two-layer surface SMD type LED 225, and reaches the soldering point 222 for the two-layer surface cathode power cord. Be serialized.

Due to the above circuit features, the sameness and regularity of the soldering work of the series and parallel power cords can be obtained, and the automation work becomes convenient. As shown in FIG. 4, the light emitting units 20 are soldered with a power cord to form a chain of LED units.

According to this embodiment, the number of light emitting units 20 is designed not to exceed 40 in consideration of 240V, which is the maximum value of the rated voltage widely used in the world. No matter how many light emitting units 20 are on the printed circuit board, the circuits of the first light emitting unit 20, a large number of intermediate light emitting units 20, and the last light emitting unit 20 are exactly the same as those described above. .. In production practice, we arranged printed circuit boards for 12V dedicated light emitting unit, 24V dedicated light emitting unit 3, 100 to 120V dedicated light emitting unit 15 and 220V dedicated 30 light emitting unit 20 which are always used. And place it.

One set of 12V dedicated light emitting units is provided on one printed circuit board, 15 sets are provided on one printed circuit board, three 24V dedicated light emitting units are provided as one set, and five sets are provided on one printed circuit board. One set is provided on one printed circuit board, with 15 units as one set. 30 light emitting units dedicated to 220V are set as one set, and one set is divided into two printed circuit boards. However, the 12V dedicated product does not require a series power cord because one light emitting unit is a set.

For ease of explanation, a light emitting unit dedicated to 24V is taken as an example. Two 335 type SMD type LEDs and SMD type resistors with a rated capacity of 1 / 4W are mounted on the printed circuit board of 15 light emitting units by the SMT method. The working voltage of the LED chip is divided into two, it is a blue chip of 3 to 3.3V and a red, yellow, orange chip of 1.8 to 2.2V. When using a blue chip, the rated capacity Use a resistor with 1 / 4W and a resistance value of 120Ω, and when using a red, yellow, or orange chip, use a resistor with a rated capacity of 1 / 4W and a resistance value of 270Ω.

According to this embodiment, the manufacturing method of the LED chain light is as follows.
(A) Manufacture a printed circuit board. The printed circuit board is provided with a horizontal support 30, a large number of vertical supports 40, and a large number of light emitting units 20, and the light emitting unit 20 is connected to the horizontal support 30 via the vertical support 40 to emit light. A "V" type separation line 41 is provided between the unit 20 and the vertical support 40. The light emitting unit 20 is a double-sided substrate having a single-layer surface and a double-layer surface, and the single-surface substrate 21 has a single-surface anode power cord solder point 211, a single-layer cathode power cord solder point 212, and a single-surface series power cord solder point. 213, one-layer SMD type resistor solder points 214, one-layer SMD type LED solder points 215 are provided, and the two-layer surface substrate 22 has two-layer surface anode power cord solder points 221 and two-layer surface cathode power cord solder points 222. A solder point 223 for a two-layer surface series power cord and a solder point 224 for a two-layer surface SMD type LED are provided.

(B) The SMD type resistor and the SMD type LED are mounted on the one-layer surface board 21, and the SMD type LED is mounted on the two-layer surface. Specifically, using the SMT (Surface Mount Technology) method, SMD resistance and SMD LED are mounted on the printed circuit board using an automatic mounting machine and a reflow soldering machine.
(C) The printed circuit board and the power cord 60 are attached to the soldering jig 50 and soldered with a spot soldering facility. Specifically, the printed board and the power cord 60 are attached to the soldering jig 50, and the two soldering jigs 50 are soldered at the same time with a triaxial double iron soldering robot. And fix it, and solder the back side.

(D) The printed circuit board is fixed to the removable form jig 70. Put solidifying insulating glue into the cylindrical container of the removable form jig 70, insert the light emitting unit 20 of the printed circuit board into the cylindrical container, and use the SMD resistance and SMD LED of the light emitting unit 20. The conductive portion of the soldered power cord 60 is submerged in a solidizable glue in a cylindrical container. More specifically, the light emitting unit 20 of the printed circuit board in which the glue that can be solidified by the automatic transport and the glue injection machine is poured into the cylindrical container and the SMD type resistor, the SMD type LED and the power cord 60 are soldered therein. Inserted by automatic transport and glue injection machine. At that time, the conductive parts of the SMD type resistor, SMD type LED and the power cord 60 are submerged in the glue of the cylindrical container. In addition, the glue that can be solidified is highly hard silicon, which is divided into A component and B component, and is used by mixing A component and B component at a ratio of 1: 1. Since it is highly hard, it solidifies. Later, it is possible to prevent deformation even when it hits an object.

(E) The removable type jig 70 is placed in an electric furnace and solidified. More specifically, the removable form jig 70 is manually carried into the electric furnace. Consider the climate and set the temperature between 80 and 90 ° C. The time setting is 3 hours.
(F) The printed circuit board is detached to obtain a layer of solid silicon insulator in the light emitting unit 20 of the printed circuit board. More specifically, the printed circuit board is manually detached from the detachable body jig 70 to obtain a hard silicon insulator. Since it is hard, it does not deform even if it hits an object.
(G) The separation line 41 of the printed circuit board is divided to make the light emitting unit 20 independent. More specifically, the metal ruler is manually aligned with the separation line 41 of the printed circuit board and divided to achieve the independence of the light emitting unit 20.

(H) The outer periphery of the non-light source portion of the insulator of the light emitting unit 20 and the portion of the power cord 60 close to the insulator are surrounded by a PVC (Polyvinyl chloride) material 24. The PVC material 24 serves to prevent physical cracks in the silicon insulator. More specifically, in a plastic molding machine, the molding conditions are set to high pressure 140 MPa, low pressure 10 MPa, holding pressure 20 MPa, and firing pressure 40 MPa, and a PVC raw material having a hardness of 30P is used. The light emitting part of the light emitting unit 20 with 15 insulators is inserted into the fixing hole of the mold, the power cord 60 is fixed to the power cord fixing molding 503, and plastic molding is performed, but it is contained in the fixing groove 702. The PVC material 24 is not attached to the light emitting portion. As shown in FIG. 8, it is possible to obtain the light emitting unit 20 provided with the PVC material 24, and it is possible to prevent physical cracks in the silicon insulator and further enhance the insulating and waterproof performance. At the same time, the vertical support 40 attached to the separation line 41 of the printed circuit board can be partially hidden.

Specifically, in step (C), the power cord 60 is soldered, and the solder point 221 for the double-layer anode power cord and the solder point 211 for the single-layer anode power cord of the next light emitting unit 20 are electrically connected. .. The power cord electrically connects the solder point 222 for the two-layer cathode power cord and the solder point 212 for the one-layer cathode power cord of the next light emitting unit 20.

The circuit of the first light emitting unit 20 starts with the solder point 211 for the single surface anode power cord, followed by the solder point 214 for the single surface SMD type resistor, the single surface SMD type LED solder point 215, and the double surface SMD type solder point. It is connected to the solder point 223 for the two-layer surface series power cord, and is electrically connected to the next light emitting unit 20 using the power cord. A large number of light emitting units 20 in the middle are filled with solder points 213 for single-layer surface series power cords, followed by solder points 214 for single-layer SMD resistance, single-layer SMD LED solder points 215, and double-layer SMD solder points. It is connected to the solder point 223 for the two-layer surface series power cord, and is electrically connected to the next light emitting unit 20 using the power cord. The final light emitting unit 20 is entered from the solder point 213 for the one-layer series power cord, followed by the solder point 214 for the one-layer SMD type resistor, the one-layer SMD type LED solder point 215, the two-layer surface SMD type solder point and the two-layer surface. It is connected to the solder point 222 for the cathode power cord.

According to this embodiment, the soldering jig 50 is disclosed as one of the above-mentioned LED chain light manufacturing methods. As can be seen with reference to FIG. 5, the soldering jig 50 has a groove 501 for fixing the horizontal support of the printed circuit board, and a large number of grooves 502 for fixing the vertical support and a groove 503 for fixing the power cord. Is provided. The power cord fixing molding 503 is connected to the vertical support fixing groove 502, and is at an oblique angle from the vertical support fixing groove 502. Furthermore, it is connected to the opposite side of the jig and is connected to the front of the solder point for the next light emitting unit power cord.

According to FIG. 5, the right side shows a state in which the printed circuit board and the power cord 60 are attached to the soldering jig 50, and the front surface and the back surface are separated at the portion of the solder point for the power cord of the printed circuit board. Since the power cord fixing molding 503 is slanted, when the power cord 60 is fixed to the back side of the soldering jig 50, it goes to the front of the solder point of the next light emitting unit 20.

Half of the power cord 60 is fixed to the front surface of the soldering jig 50, and the other half is fixed to the back surface by folding. The copper wire that has been uncoated at the import end of the power cord 60 is applied to the solder point for the double-layer power cord of the light emitting unit 20, and the copper wire that has been removed from the coating at the export end is the solder point for the single-layer power cord of the next light emitting unit. Hit to. According to the LED pitch requirement of the LED chain light, a soldering jig 50 with a usual 60 mm and 120 mm long power cord molding 503 is provided and placed, respectively. Two soldering jigs 50 are mounted on the triaxial double iron soldering robot, and the gradual distance of the soldering jigs 50 is set to 3 mm, the iron temperature is set to 230 ° C., and the soldering time is set to 1.5 s.

In this embodiment, a tool for manufacturing one of the above-mentioned LED chain lights is further disclosed. FIG. 6 shows a detachable body jig 70, and FIG. 7 shows a printed circuit board further fixed. The removable form jig 70 is provided with a large number of columns for fixing the lateral support of the printed circuit board 701, and the columns for fixing in the lateral direction are provided with fixing grooves. A large number of cylindrical containers 703 are attached under the removable shape jig 70, and solidifying insulating glue is poured into the cylindrical container 703, and the bottom 704 of the cylindrical body has a conical concave shape.

Specifically, the height of the printed circuit board fixing column 701 at both ends and the middle end of the removable body jig 70, and the height of the printed circuit board placed on the removable body jig 70 by the fixing grooves 702 provided therein. The distance between the left and right is determined, and the placement accuracy of the light emitting unit in the cylindrical container 703 is improved. Since the bottom of the cylinder 704 is concave, it can reflect and exert a light diffusing effect. The insulator obtained by this method can reduce the volume of the insulator and save the cost of the cylindrical plastic container as compared with the method of the glue prevention type LED chain light.

Further, the size of the removable shape jig 70 is determined according to the size of the printed circuit board. The size of the removable form jig 70 is applied to the printed circuit board. When the size of the light emitting unit 20 of the printed substrate is 6.5 * 9 mm, the size of the cylindrical container 703 of the removable shape jig 70 is 7.5 * 21 mm, from the top of the light emitting unit 20 to the tip of the conical concave 704. The distance is 1.5 mm, the height of the conical concave 704 is 2 mm, the distance from the top of the light emitting unit 20 to the lateral support 30 is 23.75 mm, and the lateral support is fixed from the top of the cylindrical insulator. The distance to the fixing groove of the column 701 is 27.25 mm.

First, A component silicon and B component silicon are mixed at a ratio of 1: 1 with a vacuum mixer and placed in a container of equipment. The printed circuit board and the detachable body jig 70 are arranged on the printed circuit board transport standby table and the detachable form jig 70 transport standby table of the automatic transport and glue injection machine, respectively. The removable form jig 70 is transported, ejects the release agent into the cylindrical container 703, and is carried under the injection needle of the glue. After pouring the glue, the printed circuit board is lifted by an automatic jig and attached to the removable jig 70. In the next step, in order to further improve the accuracy of the mounting arrangement of the printed circuit board, the step of pressing the lateral support 30 of the printed circuit board from top to bottom is performed.

According to this embodiment, the production tool is also a soldering jig 50 and a detachable body jig 70. Further, the soldering jig 50 and the detachable body jig 70 may be referred to at the same time.

According to this embodiment, the same soldering method and regularity of the power cord are achieved, and an insulator is formed in the conductive portion of the light emitting unit 20 of the printed circuit board by the solidification method of silicon, and all the light emitting units 20 Waterproof performance can be realized. A production method that combines a specially selected printed circuit board, a soldering jig 50, and a removable form jig 70 has improved regularity and standardization, and has made automated work possible. Most of the insulation methods are similar to the skilled two-legged LED prevention method, which can improve the quality of LED chain lights and reduce labor costs.

According to the LED chain light obtained by the manufacturing method of the present invention, there are the following effects.
First, since the solidified silicon insulator has highly stable waterproof performance, it can be used not only indoors but also in bad environments such as snow and rainy weather and places where water tends to accumulate.
2. Using two SMD type LED light sources for one light emitting unit, the light emitting area is wider than the two-legged LED, and even with the same current, the brightness is higher than the two-legged LED chain light.
Third, even if the same LED chip is used, the manufacturing cost of SMD type LED is cheaper than that of two-legged LED. Large-scale lot production is possible, and the cost of the LED chain light of the present invention is lower than that of the two-legged LED chain light.

Although the present invention has been described above with reference to examples, the technical scope of the present invention is not limited to the scope described in the above examples. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that the form with such changes or improvements may be included in the technical scope of the present invention.

100, 2-legged LED; 101, leg; 102, power cord; 103, solder part;
104, Isolator; 105, Heat shrink tube; 20, LED light emitting unit; 21, Single-layer substrate;
211 Single-layer anode power cord solder points; 212, Single-layer cathode power cord solder points;
213, Solder point for single-layer series power cord; 214, Solder point for single-layer SMD resistor;
215, Single-layer SMD LED solder point; 216, Single-layer SMD resistor; 217, Single-layer SMD LED; 22, Double-layer board; 221, Double-layer anode power cord solder point;
222, Solder point for double-layer cathode power cord; 223, Solder point for double-layer series power cord; 224, Solder point for double-layer SMD LED; 225, Solder point for double-layer SMD LED;
23, Cylindrical insulator; 24, PVC material; 30, Horizontal support; 40, Vertical support;
41, "V" type separation line; 50, soldering jig; 501, lateral support fixing groove;
502, Vertical support fixing groove; 503, Power cord molding; 60, Power cord;
70, Detachable body jig; 701, Pillar for fixing lateral support; 702, Groove for fixing;
703, Cylindrical container; 704, Conical concave

Claims (10)

It has three or more LED light emitting units with printed circuit boards on both sides of one layer and two layers.
Solder points for single-layer anode power cords, single-layer cathode power cords, single-layer series power cords, SMD resistors and SMD single-layer LEDs are provided on the single-layer surface, respectively.
Solder points are provided on the two-layer surface for a two-layer surface anode power cord, a two-layer surface cathode power cord, a two-layer surface series power cord, and an SMD type two-layer surface LED.
An SMD type resistor is mounted on the solder surface for the SMD type resistor on the one-layer surface.
An LED chain light in which SMD type LEDs are mounted on the solder points for SMD type LEDs on the one-layer surface and the two-layer surface, respectively, and the three or more light emitting units are electrically connected to each other. The solder points for the one-layer anode power cord and the solder points for the two-layer anode power cord are electrically connected to each other.
The solder points for the anode power cord on the two-layer surface and the solder points for the anode power cord on the first surface of the next light emitting unit are electrically connected.
The solder points for the one-layer cathode power cord and the solder points for the two-layer cathode power cord are electrically connected to each other.
The solder points for the cathode power cord on the two-layer surface and the solder points for the cathode power cord on the first surface of the next light emitting unit are electrically connected to each other.
The light emitting unit is divided into a first light emitting unit, a second light emitting unit, and a third light emitting unit.
The circuit of the first light emitting unit is drawn from the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistance soldering point, the soldering point for the single surface SMD type LED, and the soldering point for the double surface SMD type LED. Pull out from the solder point for the two-layer surface series power cord to the second light emitting unit,
The circuits of the second three or more light emitting units are drawn from the solder points for the single surface series power cord, followed by the solder points for the single surface SMD type resistor, the single surface SMD type LED solder points, and the double surface SMD type. Pull out from the solder point for LED and the solder point for double-layer surface series power cord to the third light emitting unit.
The circuit of the third light emitting unit is drawn from the solder point for the single surface series power cord, followed by the solder point for the single surface SMD type resistor, the solder point for the single surface SMD type LED, and the solder point for the double surface SMD type LED. The LED chain light according to claim 1, which is drawn from a solder point for a two-layer surface cathode power cord. The LED chain light according to claim 2, wherein a cylindrical insulator is surrounded on the outer periphery of the light emitting unit, and the shape of the upper cylindrical portion in the vicinity of the LED light source is concave. The LED chain light according to claim 3, wherein a PVC material is surrounded by a non-LED light source portion of the cylindrical insulator of the light emitting unit and an outer periphery of a power cord in the vicinity of the cylindrical insulator. Includes lateral support and 3 or more light emitting units
Three or more light emitting units are connected to the horizontal support via the vertical support, and are connected to the horizontal support.
A dividing line is provided between the light emitting unit and the vertical support.
Each of the light emitting units is provided with a double-sided printed circuit board having a single-layer circuit and a double-layer circuit, and further has a single-layer anode power cord solder point, a single-layer cathode power cord solder point, and a single-layer series power cord solder point. , Solder point for single-layer SMD type resistor, Solder point for single-layer SMD type LED, Solder point for double-layer surface anode power cord, Solder point for double-layer surface cathode power cord, Solder for double-layer surface series power cord Printed circuit board for LED chain lights, including dots and solder points for double-layer SMD LEDs. (A) The printed circuit board includes a horizontal support and three or more light emitting units, and three or more light emitting units are connected to the horizontal support via the vertical support to form a light emitting unit. A dividing line is attached between the vertical supports, and each light emitting unit is a double-sided printed circuit board having a one-layer circuit and a two-layer circuit. Solder point for single-layer series power cord, solder point for single-layer SMD resistance, solder point for single-layer SMD LED, solder point for double-layer anode power cord, double-layer cathode power in the two-layer circuit Make a printed circuit board by including the solder points for the cord, the solder points for the two-layer side series power cord, and the solder points for the two-layer side SMD type LED.
(B) The SMD type LED and the SMD type resistor are mounted on the one-layer surface of the printed circuit board, and the SMD type LED is mounted on the two-layer surface.
(C) Install the printed circuit board and the power cord on the soldering jig, and solder the power cord to the printed circuit board with the spot soldering equipment.
(D) The detachable body jig is provided with a container for insulating glue that can be solidified so that the light emitting unit of the printed circuit board can enter the container and is mounted on both sides of the printed circuit board. The printed circuit board is fixed to the removable form jig by surrounding the exposed conductive parts of the type LED, SMD type resistor and power cord with a solidizable insulating glue.
(E) The detachable body jig is placed in an electric furnace to solidify the insulating glue, and the insulating glue is solidified.
(F) The printed circuit board is detached from the detachable body jig.
(G) The dividing line of the printed circuit board is divided, and the light emitting unit is made independent of the printed circuit board.
(H) A PVC material is surrounded around the non-LED light source portion of the cylindrical insulator of the light emitting unit and the power cord in the vicinity of the cylindrical insulator.
The LED chain light according to any one of claims 1 to 4, which is manufactured by the process of. The solder point for the one-layer surface anode power cord and the solder point for the two-layer surface anode power cord are electrically connected, and the solder point for the two-layer surface anode power cord and the solder for the one-layer surface of the next light emitting unit are soldered for the anode power cord. The points are electrically connected via a power cord and
The one-layer cathode power cord solder point and the two-layer cathode power cord solder point are electrically connected, and the two-layer cathode power cord solder point and the one-layer cathode power cord solder on the next light emitting unit are electrically connected. The points are electrically connected,
The three or more light emitting units are divided into a first light emitting unit, a second light emitting unit, and a third light emitting unit.
The circuit of the first light emitting unit is drawn from the soldering point for the single surface anode power cord, followed by the soldering point for the single surface SMD type resistance soldering point, the soldering point for the single surface SMD type LED, the soldering point for the double surface SMD type LED, and the second. Using the power cord from the solder point for the layer surface series power cord, electrically connect it to the second light emitting unit.
The circuit of the second light emitting unit is drawn from the soldering point for the one-layer series power cord, followed by the soldering point for the one-layer SMD resistance, the soldering point for the one-layer SMD LED, the soldering point for the two-layer SMD LED, and the second. Using a power cord from the solder point for the layer surface series power cord, it is electrically connected to the third light emitting unit.
The circuit of the third light emitting unit is drawn from the solder point for the single surface series power cord, followed by the solder point for the single surface SMD type resistor, the solder point for the single surface SMD type LED, the solder point for the double surface SMD type LED, and the second. LED chain light that the power cord draws from the solder point for the layer surface cathode power cord. The soldering jig has a groove for fixing a support in the horizontal direction of a printed circuit board, and three or more grooves for fixing a support in the vertical direction and a molding for fixing a power cord are attached, and the molding for fixing the power cord is attached. The LED chain light according to any one of claims 6 to 7, manufactured by a tool that is connected to the opposite side of the jig using an oblique angle and is connected to the hand of the solder point for the next light emitting unit power cord. The detachable form jig is provided with a fixing column for the lateral support of the printed substrate, and the lateral support fixing column is provided with a fixing groove. Three or more cylindrical containers are provided at the bottom, and the cylindrical container contains a solidifying insulating glue, and the bottom portion of the cylindrical container is manufactured by a tool having a conical concave shape. The LED chain light according to any one of claims 6 to 7. The size of the detachable body jig is provided so as to fit the printed circuit board.
The size of the light emitting unit of the printed substrate is 6.5 * 9 mm, the inner size of the cylindrical container of the removable form jig is 7.5 * 21 mm, and the distance from the upper part of the light emitting unit to the conical tip in the cylindrical container. The LED chain light according to any one of claims 6 to 9, wherein the distance is 1.5 mm, and the distance from the bottom of the cylindrical container to the fixing groove of the horizontal support fixing column is 27.25 mm.

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