JP6953819B2 - 窒化ガリウム粒子およびその製造方法 - Google Patents
窒化ガリウム粒子およびその製造方法 Download PDFInfo
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- JP6953819B2 JP6953819B2 JP2017117465A JP2017117465A JP6953819B2 JP 6953819 B2 JP6953819 B2 JP 6953819B2 JP 2017117465 A JP2017117465 A JP 2017117465A JP 2017117465 A JP2017117465 A JP 2017117465A JP 6953819 B2 JP6953819 B2 JP 6953819B2
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- gallium nitride
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- 239000002245 particle Substances 0.000 title claims description 117
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 79
- 229910002601 GaN Inorganic materials 0.000 title claims description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 52
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 33
- 239000001301 oxygen Substances 0.000 claims description 33
- 229910052760 oxygen Inorganic materials 0.000 claims description 33
- 238000005121 nitriding Methods 0.000 claims description 26
- 229910021529 ammonia Inorganic materials 0.000 claims description 25
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 24
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 23
- 229910052733 gallium Inorganic materials 0.000 claims description 23
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 15
- 239000011164 primary particle Substances 0.000 claims description 8
- 239000011163 secondary particle Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 238000005477 sputtering target Methods 0.000 claims description 5
- 239000011812 mixed powder Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 4
- 238000010301 surface-oxidation reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Description
Ga2O3+2H2 → Ga2O(g)+2H2O (2)
Ga2O(g)+2NH3→ 2GaN+H2O+2H2 (3)
その際、生成した窒化ガリウムの粒子が酸化ガリウム粉末の表面に付着することによって窒化反応が進行するため、粒子の内部には未反応の酸化ガリウムが残り、粒子の外側に窒化ガリウムが存在することとなる。結果として酸素が粒子の内側に多く存在することになる。また、1200℃より高い高温域においてはGa2O(g)の窒化反応が進む前に揮発してしまうため、極めて低い収量しか得ることができなかった。
対象物を熱分解させ、酸素・窒素・水素分析装置(Leco社製)を用いて酸素含有量を熱伝導度法により測定した。算出されるのはwt%であるため、
酸素量(atm%)=(酸素量(wt%)/酸素原子量)/((窒素量(wt%)/窒素原子量)+(ガリウム量(wt%)/ガリウム原子量)+(酸素量(wt%)/酸素原子量))
窒素量(wt%)は酸素・窒素・水素分析装置(Leco社製)を用いて測定し、ガリウム量(wt%)は酸素、窒素の残部がガリウムとして計算した。
窒化ガリウム粒子の軽装かさ密度はJISZ2504に準拠して測定した。
粉末および粒子の形状はSEM(走査型電子顕微鏡)を用いて観察を行い、その形状を確認した。
一次粒子径は、SEMを用いて、初めに50倍にて観察を行い、100μm超の粒子の有無、並びにその直径、面積を測定し、次に200倍にて10〜100μmの粒子の有無、並びにその直径、面積を測定し、次に1000倍にて5〜10μmの粒子の有無、並びにその直径、面積を測定し、最後に5000倍にて5μm未満の粒子の有無、並びにその直径、面積を測定し、これらを少なくとも3枚づつ測定し、組み合わせることにより全体の粒度分布とした。ここでの粒子は粒界が観察されない粒子とし、凝集していても粒界が存在する場合は別の粒子として算出した。
二次粒子径は以下の篩を多段に積み上げ、上部から粒子を約5g投入し、10分間振動を与え、各段に粒子が定常的に存在していることを確かめた上で各篩上の粒子量を測定し、粒度分布とした。
各篩に残った粒子の粒子径は下記の通りとした。
355μm篩・・・678μm、250μm篩・・・303μm、150μm篩・・・200μm、106μm篩・・・128μm、90μm篩・・・98μm、75μm篩・・・83μm、53μm篩・・・64μm、32μm篩・・・43μm、25μm篩・・・29μm、篩受け・・・13μm
(アンモニア/ガリウムのモル比)
投入した酸化ガリウムもしくは窒化ガリウム中のガリウムモル数と流量並びに流通時間から算出したアンモニアモル数の比から算出した。
時間当たりのアンモニア反応量は(アンモニア/ガリウムのモル比)/反応保持時間により算出した。
収率は、投入した酸化ガリウム、窒化ガリウム量から計算上想定される窒化ガリウム量に対し、どれだけの量が得られたかにより算出した。
表1の物性を有する酸化ガリウム粉末(4N:針状)28gを計り取り、アルミナ製容器に投入し、その際の充填深さを測定後、雰囲気制御炉へ投入し、窒化処理を行った。炉内を真空置換後、アンモニアを充填し、アンモニア1000mL/min、温度は10℃/minにて昇温し、最終的に1050℃まで昇温させ、6.5時間保持した(アンモニア/ガリウムのモル比=53.1)。一度200℃未満まで降温後、更に粒成長処理としてアンモニア1000mL/min、温度は10℃/minにて昇温し、最終的に1125℃まで昇温させ、6時間または12時間にて保持した(アンモニア/投入時のガリウムのモル比:6時間処理:49、 12時間処理:98)。粒子を回収し、収率並びに各物性を確認した。得られた窒化ガリウムの物性値と収率を表3に示す。
表1の物性を有する酸化ガリウム粉末14gの上に、表1の物性を有する窒化ガリウム粉末14gを順次充填し、その際の充填深さを測定後、実施例2と同様の方法で窒化処理、並びに粒成長処理を行った。粒子を回収し、収率並びに各物性を確認した。得られた窒化ガリウムの物性値と収率を表3に示す。
実施例2と同様の方法で、表1の通りの窒化処理を行った。その後、得られた窒化ガリウムから14gを秤量し充填後、更に表2に挙げた物性の窒化ガリウムを積層するように14g充填し、粒成長処理としてアンモニア1000mL/min、温度は10℃/minにて昇温し、最終的に1125℃まで昇温させ、12時間保持した。粒子を回収し、収率並びに各物性を確認した。得られた窒化ガリウムの物性値と収率を表3に示す。
酸化ガリウム粉末に代えて球状酸化ガリウム粉末(4N)を用いた以外は実施例2と同様の方法で窒化処理並びに粒成長処理を行った。得られた窒化ガリウムの物性値と収率を表3に示す。
粒成長処理時の温度を1100℃とした以外は実施例4と同様の方法で処理を行った。
粒成長処理を実施しないこと以外は実施例1と同様の方法で酸化ガリウムの処理を行った。この場合、所望するようなものは得られなかった。得られた窒化ガリウムの物性値と収率を表3に示す。
酸化ガリウム粉末に代えて軽装かさ密度2.2g/ccの酸化ガリウム(4N:球状)を用いた以外は実施例2と同様の方法で窒化処理並びに粒成長処理を実施した。得られた窒化ガリウムの物性値と収率は表3に示したものとなり、所望するような物性の窒化ガリウム粒子は得られなかった。
Claims (8)
- 酸素含有量が1atm%以下であり、一次粒子の平均粒子径が5μm以上であり、粒度分布の最小粒子から10面積%の範囲の粒子径(10%粒子径)が3μm以下であることを特徴とする窒化ガリウム粒子。
- 略球状を有する窒化ガリウム粒子が全体の25面積%以上であることを特徴とする請求項1に記載の窒化ガリウム粒子。
- 二次粒子の粒度分布において、ピークが複数存在し、最も小粒子径側のピーク(第1ピーク)の頂点が90μm以下であり、その含有率が全体の10wt%以上であることを特徴とする請求項1または2に記載の窒化ガリウム粒子。
- 酸化ガリウムと窒化ガリウムの混合粉末を1000〜1100℃の温度で、時間当たりのアンモニア反応量が投入したガリウム量に対し1倍モル以上の割合になるように3時間以上反応させる窒化工程を行うことを特徴とする請求項1〜3のいずれかに記載の窒化ガリウム粒子の製造方法。
- 1050〜1200℃の温度で、時間当たりのアンモニア反応量が投入したガリウム量に対し2倍モル以上の割合になるように3時間以上反応させ、最終的にアンモニア/ガリウムのモル比が50以上1000未満となる粒成長工程を窒化工程後に、窒化工程の温度よりも高い温度で行うことを特徴とする請求項4に記載の窒化ガリウム粒子の製造方法。
- 請求項1〜3のいずれかに記載の窒化ガリウム粒子を焼結することを特徴とする、焼結体の製造方法。
- 請求項1〜3のいずれかに記載の窒化ガリウム粒子を使用することを特徴とする、スパッタリングターゲットの製造方法。
- 請求項1〜3のいずれかに記載の窒化ガリウム粒子を使用することを特徴とする、窒化ガリウム薄膜の製造方法。
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