JP6948875B2 - 高純度分配ユニット - Google Patents

高純度分配ユニット Download PDF

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Publication number
JP6948875B2
JP6948875B2 JP2017156611A JP2017156611A JP6948875B2 JP 6948875 B2 JP6948875 B2 JP 6948875B2 JP 2017156611 A JP2017156611 A JP 2017156611A JP 2017156611 A JP2017156611 A JP 2017156611A JP 6948875 B2 JP6948875 B2 JP 6948875B2
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JP
Japan
Prior art keywords
bladder
chamber
elongated
fluid
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017156611A
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English (en)
Japanese (ja)
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JP2018026137A5 (enExample
JP2018026137A (ja
Inventor
ジェイ．デヴィリアーズ アントン
ジェイ．デヴィリアーズ アントン
エル．ロビンソン ロドニー
エル．ロビンソン ロドニー
ナスマン ロナルド
ナスマン ロナルド
トラヴィス デイヴィッド
トラヴィス デイヴィッド
グルーテグード ジェイムズ
グルーテグード ジェイムズ
エー．ジェイコブソン ジュニア ノーマン
エー．ジェイコブソン ジュニア ノーマン
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2018026137A publication Critical patent/JP2018026137A/ja
Publication of JP2018026137A5 publication Critical patent/JP2018026137A5/ja
Application granted granted Critical
Publication of JP6948875B2 publication Critical patent/JP6948875B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0409—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material the pumps being driven by a hydraulic or a pneumatic fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/047—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/08—Apparatus to be carried on or by a person, e.g. of knapsack type
    • B05B9/0805—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material
    • B05B9/0838—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Fluid Mechanics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Flow Control (AREA)
  • Control Of Fluid Pressure (AREA)
  • Hydraulic Motors (AREA)
JP2017156611A 2016-08-11 2017-08-14 高純度分配ユニット Active JP6948875B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373724P 2016-08-11 2016-08-11
US62/373,724 2016-08-11

Publications (3)

Publication Number Publication Date
JP2018026137A JP2018026137A (ja) 2018-02-15
JP2018026137A5 JP2018026137A5 (enExample) 2020-08-27
JP6948875B2 true JP6948875B2 (ja) 2021-10-13

Family

ID=61158829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017156611A Active JP6948875B2 (ja) 2016-08-11 2017-08-14 高純度分配ユニット

Country Status (5)

Country Link
US (1) US10712663B2 (enExample)
JP (1) JP6948875B2 (enExample)
KR (1) KR102394995B1 (enExample)
CN (1) CN107728430B (enExample)
TW (1) TWI760354B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
CN111468325A (zh) * 2020-06-05 2020-07-31 余祥红 一种能够自动增压的汽车喷漆装置
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
TWI876256B (zh) * 2022-02-14 2025-03-11 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467150A (en) 1943-11-12 1949-04-12 Carl H Nordell Valve
US2517820A (en) 1948-08-10 1950-08-08 American Cyanamid Co Fluid-pressure controller
NL66828C (enExample) 1949-01-04 1900-01-01
US4195810A (en) 1978-03-31 1980-04-01 Lavin Aaron M Pinch valve
US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
JPS60171582U (ja) * 1984-04-20 1985-11-13 トキコ株式会社 塗布ガン装置
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
US4867208A (en) * 1988-02-04 1989-09-19 Fitzgerald Robert M Apparatus for storing and dispensing fluid under pressure
FR2651552B1 (fr) 1989-09-01 1991-12-06 Cit Alcatel Vanne et dispositifs utilisant ladite vanne.
JPH09303302A (ja) * 1996-05-13 1997-11-25 Morikawa Sangyo Kk 流体の一時貯留器及びそれを用いた流体の一時貯留装置
JP3958926B2 (ja) 1999-10-18 2007-08-15 インテグレイテッド・デザインズ・リミテッド・パートナーシップ 流体を分配する装置および方法
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
AU2002239480B2 (en) * 2000-10-23 2005-06-02 Medical Instill Technologies, Inc. Fluid dispenser with bladder inside rigid vial
JP2002231668A (ja) 2001-01-31 2002-08-16 Mitsubishi Materials Silicon Corp スラリー移送装置
US6568416B2 (en) 2001-02-28 2003-05-27 Brian L. Andersen Fluid flow control system, fluid delivery and control system for a fluid delivery line, and method for controlling pressure oscillations within fluid of a fluid delivery line
EP1432639A1 (en) 2001-10-01 2004-06-30 Fsi International, Inc. Fluid dispensing apparatus
US7335003B2 (en) 2004-07-09 2008-02-26 Saint-Gobain Performance Plastics Corporation Precision dispense pump
KR100643494B1 (ko) 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
KR20060065188A (ko) 2004-12-10 2006-06-14 삼성전자주식회사 반도체 코팅설비의 포토레지스트 분사장치
US20060174656A1 (en) 2005-02-08 2006-08-10 Owens-Brockway Glass Container Inc. Glassware forming machine with bladder-operated cooling wind valve
JP2006336574A (ja) 2005-06-03 2006-12-14 Anest Iwata Corp 不活性ガス昇圧送給方法および装置
JP4942449B2 (ja) * 2006-10-18 2012-05-30 株式会社コガネイ 薬液供給装置
US20080169230A1 (en) 2007-01-12 2008-07-17 Toshiba America Electronic Components, Inc. Pumping and Dispensing System for Coating Semiconductor Wafers
CN102245949B (zh) * 2008-12-10 2013-11-06 须藤优质工程有限公司 温度感应型流体流动控制设备
JP5416672B2 (ja) * 2010-09-28 2014-02-12 株式会社コガネイ 薬液供給装置
JP5672204B2 (ja) * 2011-09-13 2015-02-18 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
US9718082B2 (en) * 2014-01-26 2017-08-01 Tokyo Electron Limited Inline dispense capacitor

Also Published As

Publication number Publication date
KR102394995B1 (ko) 2022-05-04
CN107728430B (zh) 2022-10-21
KR20180018444A (ko) 2018-02-21
CN107728430A (zh) 2018-02-23
TWI760354B (zh) 2022-04-11
US10712663B2 (en) 2020-07-14
US20180046082A1 (en) 2018-02-15
JP2018026137A (ja) 2018-02-15
TW201818518A (zh) 2018-05-16

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