CN107728430B - 高纯度分配单元 - Google Patents

高纯度分配单元 Download PDF

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Publication number
CN107728430B
CN107728430B CN201710687320.2A CN201710687320A CN107728430B CN 107728430 B CN107728430 B CN 107728430B CN 201710687320 A CN201710687320 A CN 201710687320A CN 107728430 B CN107728430 B CN 107728430B
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China
Prior art keywords
bladder
chamber
elongate
fluid
process fluid
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CN201710687320.2A
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English (en)
Chinese (zh)
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CN107728430A (zh
Inventor
安东·J·德维利耶
罗德尼·L·罗宾森
罗纳德·纳斯曼
大卫·特拉维斯
詹姆斯·格罗特格德
小诺曼·A·雅各布森
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • B05B9/0409—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material the pumps being driven by a hydraulic or a pneumatic fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/047—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/08—Apparatus to be carried on or by a person, e.g. of knapsack type
    • B05B9/0805—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material
    • B05B9/0838—Apparatus to be carried on or by a person, e.g. of knapsack type comprising a pressurised or compressible container for liquid or other fluent material supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Fluid Mechanics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Flow Control (AREA)
  • Control Of Fluid Pressure (AREA)
  • Hydraulic Motors (AREA)
CN201710687320.2A 2016-08-11 2017-08-11 高纯度分配单元 Active CN107728430B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373724P 2016-08-11 2016-08-11
US62/373,724 2016-08-11

Publications (2)

Publication Number Publication Date
CN107728430A CN107728430A (zh) 2018-02-23
CN107728430B true CN107728430B (zh) 2022-10-21

Family

ID=61158829

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710687320.2A Active CN107728430B (zh) 2016-08-11 2017-08-11 高纯度分配单元

Country Status (5)

Country Link
US (1) US10712663B2 (enExample)
JP (1) JP6948875B2 (enExample)
KR (1) KR102394995B1 (enExample)
CN (1) CN107728430B (enExample)
TW (1) TWI760354B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
CN111468325A (zh) * 2020-06-05 2020-07-31 余祥红 一种能够自动增压的汽车喷漆装置
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
TWI876256B (zh) * 2022-02-14 2025-03-11 日商斯庫林集團股份有限公司 基板處理裝置以及基板處理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
US4867208A (en) * 1988-02-04 1989-09-19 Fitzgerald Robert M Apparatus for storing and dispensing fluid under pressure
JP2012071230A (ja) * 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
JP2013062330A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体

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US2467150A (en) 1943-11-12 1949-04-12 Carl H Nordell Valve
US2517820A (en) 1948-08-10 1950-08-08 American Cyanamid Co Fluid-pressure controller
BE491946A (enExample) 1949-01-04 1900-01-01
US4195810A (en) 1978-03-31 1980-04-01 Lavin Aaron M Pinch valve
US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
JPS60171582U (ja) * 1984-04-20 1985-11-13 トキコ株式会社 塗布ガン装置
FR2651552B1 (fr) 1989-09-01 1991-12-06 Cit Alcatel Vanne et dispositifs utilisant ladite vanne.
JPH09303302A (ja) * 1996-05-13 1997-11-25 Morikawa Sangyo Kk 流体の一時貯留器及びそれを用いた流体の一時貯留装置
KR100754342B1 (ko) 1999-10-18 2007-09-03 인터그레이티드 디자인즈 엘.피. 유체 분배 방법 및 장치
JP2002021715A (ja) * 2000-07-10 2002-01-23 Matsushita Electric Ind Co Ltd 流体供給装置及び流体供給方法
CN1328149C (zh) * 2000-10-23 2007-07-25 因斯蒂尔医学技术有限公司 具有外壳和柔性内部气囊的流体分配器
JP2002231668A (ja) 2001-01-31 2002-08-16 Mitsubishi Materials Silicon Corp スラリー移送装置
US6568416B2 (en) 2001-02-28 2003-05-27 Brian L. Andersen Fluid flow control system, fluid delivery and control system for a fluid delivery line, and method for controlling pressure oscillations within fluid of a fluid delivery line
CN1561313A (zh) 2001-10-01 2005-01-05 Fsi国际公司 流体分配装置
US7335003B2 (en) 2004-07-09 2008-02-26 Saint-Gobain Performance Plastics Corporation Precision dispense pump
KR100643494B1 (ko) 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
KR20060065188A (ko) 2004-12-10 2006-06-14 삼성전자주식회사 반도체 코팅설비의 포토레지스트 분사장치
US20060174656A1 (en) 2005-02-08 2006-08-10 Owens-Brockway Glass Container Inc. Glassware forming machine with bladder-operated cooling wind valve
JP2006336574A (ja) 2005-06-03 2006-12-14 Anest Iwata Corp 不活性ガス昇圧送給方法および装置
JP4942449B2 (ja) * 2006-10-18 2012-05-30 株式会社コガネイ 薬液供給装置
US20080169230A1 (en) 2007-01-12 2008-07-17 Toshiba America Electronic Components, Inc. Pumping and Dispensing System for Coating Semiconductor Wafers
EP2369210B1 (en) * 2008-12-10 2018-03-28 Sudo Premium Engineering Co., Ltd. Temperature-responsive fluid flow control apparatus
US9718082B2 (en) * 2014-01-26 2017-08-01 Tokyo Electron Limited Inline dispense capacitor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
US4867208A (en) * 1988-02-04 1989-09-19 Fitzgerald Robert M Apparatus for storing and dispensing fluid under pressure
JP2012071230A (ja) * 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
JP2013062330A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体

Also Published As

Publication number Publication date
TW201818518A (zh) 2018-05-16
KR20180018444A (ko) 2018-02-21
TWI760354B (zh) 2022-04-11
US10712663B2 (en) 2020-07-14
KR102394995B1 (ko) 2022-05-04
CN107728430A (zh) 2018-02-23
JP2018026137A (ja) 2018-02-15
US20180046082A1 (en) 2018-02-15
JP6948875B2 (ja) 2021-10-13

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