JP6946437B2 - 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 - Google Patents

接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Download PDF

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Publication number
JP6946437B2
JP6946437B2 JP2019535704A JP2019535704A JP6946437B2 JP 6946437 B2 JP6946437 B2 JP 6946437B2 JP 2019535704 A JP2019535704 A JP 2019535704A JP 2019535704 A JP2019535704 A JP 2019535704A JP 6946437 B2 JP6946437 B2 JP 6946437B2
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Japan
Prior art keywords
film
shield
wiring board
printed wiring
conductive filler
Prior art date
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Application number
JP2019535704A
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English (en)
Japanese (ja)
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JPWO2019031555A1 (ja
Inventor
裕介 春名
裕介 春名
志朗 山内
志朗 山内
晃司 高見
晃司 高見
浩輔 角
浩輔 角
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2019031555A1 publication Critical patent/JPWO2019031555A1/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2019535704A 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 Active JP6946437B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017154532 2017-08-09
JP2017154532 2017-08-09
PCT/JP2018/029803 WO2019031555A1 (ja) 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2019031555A1 JPWO2019031555A1 (ja) 2020-07-09
JP6946437B2 true JP6946437B2 (ja) 2021-10-06

Family

ID=65271099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019535704A Active JP6946437B2 (ja) 2017-08-09 2018-08-08 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板

Country Status (5)

Country Link
JP (1) JP6946437B2 (ko)
KR (1) KR102422104B1 (ko)
CN (1) CN110959316B (ko)
TW (1) TWI725334B (ko)
WO (1) WO2019031555A1 (ko)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09217047A (ja) * 1996-02-08 1997-08-19 Hitachi Chem Co Ltd 粘着剤付導通テープ
JP2000269632A (ja) 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
JP4673573B2 (ja) 2004-04-21 2011-04-20 小松精練株式会社 電磁波シールド材の製造方法
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
JP2010177472A (ja) 2009-01-29 2010-08-12 Sumitomo Electric Printed Circuit Inc シールド型フレキシブルプリント配線板、その製造方法、および電子機器
JP2011066329A (ja) * 2009-09-18 2011-03-31 Tatsuta Electric Wire & Cable Co Ltd シールドフィルム、そのシールドフィルムを有するシールド配線板、シールドフィルムにおけるグランド接続方法
CN102387656B (zh) * 2010-08-30 2013-10-09 富葵精密组件(深圳)有限公司 具有接地屏蔽结构的电路板及其制作方法
JP5308465B2 (ja) * 2011-01-28 2013-10-09 タツタ電線株式会社 シールドプリント配線板
JP2013026322A (ja) * 2011-07-19 2013-02-04 Shin Etsu Polymer Co Ltd プリント配線板
CN102573285B (zh) * 2011-12-26 2015-09-09 华为终端有限公司 可挠性印制电路板及其制备方法
JP5866266B2 (ja) * 2012-08-29 2016-02-17 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルムの製造方法、およびフレキシブルプリント配線板の製造方法
US9736924B2 (en) * 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board
KR20160005053A (ko) * 2013-05-01 2016-01-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 케이블용 에지 절연 구조체
CN103763893B (zh) * 2014-01-14 2016-04-13 广州方邦电子股份有限公司 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法
CN104332217B (zh) * 2014-10-08 2018-04-10 广州方邦电子股份有限公司 自由接地膜及其制作方法、包含自由接地膜的屏蔽线路板及接地方法
CN106937522A (zh) * 2017-04-05 2017-07-07 合肥美凯电子有限公司 一种新型电磁屏蔽膜

Also Published As

Publication number Publication date
CN110959316A (zh) 2020-04-03
JPWO2019031555A1 (ja) 2020-07-09
TW201921628A (zh) 2019-06-01
CN110959316B (zh) 2022-07-01
TWI725334B (zh) 2021-04-21
KR20200035450A (ko) 2020-04-03
KR102422104B1 (ko) 2022-07-15
WO2019031555A1 (ja) 2019-02-14

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