JP6944642B2 - 気密パッケージの製造方法及び気密パッケージ - Google Patents

気密パッケージの製造方法及び気密パッケージ Download PDF

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Publication number
JP6944642B2
JP6944642B2 JP2017157026A JP2017157026A JP6944642B2 JP 6944642 B2 JP6944642 B2 JP 6944642B2 JP 2017157026 A JP2017157026 A JP 2017157026A JP 2017157026 A JP2017157026 A JP 2017157026A JP 6944642 B2 JP6944642 B2 JP 6944642B2
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Japan
Prior art keywords
sealing material
material layer
package
glass
laser
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JP2017157026A
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English (en)
Japanese (ja)
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JP2019036637A (ja
Inventor
将行 廣瀬
将行 廣瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
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Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP2017157026A priority Critical patent/JP6944642B2/ja
Priority to PCT/JP2018/027956 priority patent/WO2019035328A1/ja
Priority to TW107127001A priority patent/TW201911690A/zh
Publication of JP2019036637A publication Critical patent/JP2019036637A/ja
Application granted granted Critical
Publication of JP6944642B2 publication Critical patent/JP6944642B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
JP2017157026A 2017-08-16 2017-08-16 気密パッケージの製造方法及び気密パッケージ Active JP6944642B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017157026A JP6944642B2 (ja) 2017-08-16 2017-08-16 気密パッケージの製造方法及び気密パッケージ
PCT/JP2018/027956 WO2019035328A1 (ja) 2017-08-16 2018-07-25 気密パッケージの製造方法及び気密パッケージ
TW107127001A TW201911690A (zh) 2017-08-16 2018-08-03 氣密封裝的製造方法及氣密封裝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017157026A JP6944642B2 (ja) 2017-08-16 2017-08-16 気密パッケージの製造方法及び気密パッケージ

Publications (2)

Publication Number Publication Date
JP2019036637A JP2019036637A (ja) 2019-03-07
JP6944642B2 true JP6944642B2 (ja) 2021-10-06

Family

ID=65362822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017157026A Active JP6944642B2 (ja) 2017-08-16 2017-08-16 気密パッケージの製造方法及び気密パッケージ

Country Status (3)

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JP (1) JP6944642B2 (zh)
TW (1) TW201911690A (zh)
WO (1) WO2019035328A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240178247A1 (en) * 2021-05-12 2024-05-30 Mitsubishi Electric Corporation Hermetic package device and device module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012046817A1 (ja) * 2010-10-07 2014-02-24 旭硝子株式会社 電子デバイス及びその製造方法
WO2012117978A1 (ja) * 2011-02-28 2012-09-07 旭硝子株式会社 気密部材とその製造方法
JP2013239609A (ja) * 2012-05-16 2013-11-28 Asahi Glass Co Ltd 気密部材とその製造方法
JP2014005177A (ja) * 2012-06-26 2014-01-16 Asahi Glass Co Ltd 気密部材とその製造方法
JP6237989B2 (ja) * 2013-07-24 2017-11-29 日本電気硝子株式会社 電気素子パッケージの製造方法及び電気素子パッケージ

Also Published As

Publication number Publication date
WO2019035328A1 (ja) 2019-02-21
TW201911690A (zh) 2019-03-16
JP2019036637A (ja) 2019-03-07

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