JP6939679B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6939679B2
JP6939679B2 JP2018064209A JP2018064209A JP6939679B2 JP 6939679 B2 JP6939679 B2 JP 6939679B2 JP 2018064209 A JP2018064209 A JP 2018064209A JP 2018064209 A JP2018064209 A JP 2018064209A JP 6939679 B2 JP6939679 B2 JP 6939679B2
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Japan
Prior art keywords
heat radiating
heat sink
heat
sealing resin
radiating portion
Prior art date
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Active
Application number
JP2018064209A
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English (en)
Japanese (ja)
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JP2019176058A5 (https=
JP2019176058A (ja
Inventor
領二 上瀧
領二 上瀧
大輔 福岡
大輔 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2018064209A priority Critical patent/JP6939679B2/ja
Priority to PCT/JP2019/003057 priority patent/WO2019187608A1/ja
Publication of JP2019176058A publication Critical patent/JP2019176058A/ja
Publication of JP2019176058A5 publication Critical patent/JP2019176058A5/ja
Application granted granted Critical
Publication of JP6939679B2 publication Critical patent/JP6939679B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018064209A 2018-03-29 2018-03-29 半導体装置 Active JP6939679B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置
PCT/JP2019/003057 WO2019187608A1 (ja) 2018-03-29 2019-01-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2019176058A JP2019176058A (ja) 2019-10-10
JP2019176058A5 JP2019176058A5 (https=) 2020-03-05
JP6939679B2 true JP6939679B2 (ja) 2021-09-22

Family

ID=68058784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018064209A Active JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Country Status (2)

Country Link
JP (1) JP6939679B2 (https=)
WO (1) WO2019187608A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7467854B2 (ja) 2019-09-26 2024-04-16 船井電機株式会社 照明装置および表示装置
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP7452233B2 (ja) 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置
JP7517143B2 (ja) 2020-12-28 2024-07-17 トヨタ自動車株式会社 リアクトルユニット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
JP2015018860A (ja) * 2013-07-09 2015-01-29 株式会社デンソー 半導体パッケージの製造方法
JP6578900B2 (ja) * 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
JP6485397B2 (ja) * 2016-04-04 2019-03-20 株式会社デンソー 電子装置及びその製造方法

Also Published As

Publication number Publication date
WO2019187608A1 (ja) 2019-10-03
JP2019176058A (ja) 2019-10-10

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