JP6921453B2 - パウダープロテクティング3ウェイバルブ - Google Patents
パウダープロテクティング3ウェイバルブ Download PDFInfo
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- JP6921453B2 JP6921453B2 JP2020545021A JP2020545021A JP6921453B2 JP 6921453 B2 JP6921453 B2 JP 6921453B2 JP 2020545021 A JP2020545021 A JP 2020545021A JP 2020545021 A JP2020545021 A JP 2020545021A JP 6921453 B2 JP6921453 B2 JP 6921453B2
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- Prior art keywords
- nitrogen gas
- supply member
- valve casing
- gas supply
- way valve
- Prior art date
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- 239000000843 powder Substances 0.000 title claims description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 92
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 88
- 239000007789 gas Substances 0.000 claims description 44
- 238000010438 heat treatment Methods 0.000 claims description 36
- 239000006227 byproduct Substances 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 29
- 238000004891 communication Methods 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 6
- 239000012466 permeate Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 19
- 239000010409 thin film Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
- F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
- F16K11/08—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks
- F16K11/087—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks with spherical plug
- F16K11/0873—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks with spherical plug the plug being only rotatable around one spindle
- F16K11/0876—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks with spherical plug the plug being only rotatable around one spindle one connecting conduit having the same axis as the spindle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
- F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
- F16K11/08—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks
- F16K11/087—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only taps or cocks with spherical plug
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K25/00—Details relating to contact between valve members and seats
- F16K25/02—Arrangements using fluid issuing from valve members or seats
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/06—Construction of housing; Use of materials therefor of taps or cocks
- F16K27/067—Construction of housing; Use of materials therefor of taps or cocks with spherical plugs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Valves (AREA)
- Taps Or Cocks (AREA)
- Multiple-Way Valves (AREA)
Description
120 回転ボール
130 アクチュエータ
140 窒素ガス供給部材
150 発熱体
160 ガイドディスク
Claims (8)
- 半導体または平板ディスプレー製造装置のラインに設置され、パウダーが混合された反応副産物ガスの流れを制御する3ウェイバルブにおいて、
反応副産物ガスが流入する流入口と流入した反応副産物ガスを互いに異なる方向に流出させる複数の流出口を備えたバルブケーシングと、
前記バルブケーシングの内部に回転できるように設置され、反応副産物ガスの流れ方向を制御する回転ボールと、
外部から窒素ガスの供給を受けてガイド流路によって流れを案内しつつ、前記バルブケーシングの内部に窒素ガスを供給し、前記バルブケーシングの内部で反応副産物ガスに含まれたパウダーが累積することを防止する窒素ガス供給部材と、
前記窒素ガス供給部材の内部に設置され、前記窒素ガス供給部材の内部を経由する窒素ガスを加熱する発熱体と、を含み、
前記窒素ガス供給部材は、前記バルブケーシングの一側面に密着する平たい平板型のボディーからなり、前記バルブケーシングに対して一体に結合されるパウダープロテクティング3ウェイバルブ。 - 前記窒素ガス供給部材のガイド流路は、漸進的に半径を狭めていく螺旋状に形成され、前記発熱体によって加熱される時間を増加させる請求項1に記載のパウダープロテクティング3ウェイバルブ。
- 前記発熱体は、前記窒素ガス供給部材の内部で前記ガイド流路と隔壁を間に置いて設置されるが、前記ガイド流路が形成された領域を含む幅を有するものとして備えられ、窒素ガスが前記ガイド流路に沿って流れる間に、持続的に加熱が行われるようにする請求項2に記載のパウダープロテクティング3ウェイバルブ。
- 前記窒素ガス供給部材は、その内部で前記ガイド流路と隔壁を間に置いて形成されるが、前記ガイド流路が形成された領域を含む幅に形成され、前記供給部材の本体の周面のうち、一側の周面に開放された引込口を有するカートリッジスリットを備え、
前記発熱体は、前記カートリッジスリットの開放された引込口を介して前記カートリッジスリットに挿入されて装着される薄板型の着脱式面状発熱体である請求項2に記載のパウダープロテクティング3ウェイバルブ。 - 前記発熱体は、前記スリットに挿入される四角板状型の形態に形成され、周りの端部から開放されて中央部まで延長された干渉回避溝を備え、前記窒素ガス供給部材のカートリッジスリットに装着されるときに、前記ガイド流路の中央部に形成された窒素ガス噴射部との干渉を避けるようにする請求項4に記載のパウダープロテクティング3ウェイバルブ。
- 前記回転ボールは、前記バルブケーシングの流入口に対応して常時連通している流入孔と、前記バルブケーシングの複数の流出口に対応して回転方向によって複数の流出口のうち、いずれか1つに選択的に連通する複数の流出孔を備え、前記バルブケーシングの内部で反応副産物ガスの流れを制御するが、複数の流出孔のうち、前記バルブケーシングの流出口と非連通状態の流出孔が前記バルブケーシングの一側面に向かうように形成され、
前記窒素ガス供給部材は、前記回転ボールの複数の流出孔のうち、前記バルブケーシングの一側面に向かう非連通状態の流出孔を通過するように窒素ガスの流れを案内することにより、非連通状態の流出孔を通過する窒素ガスが非連通状態の流出孔の周部の付近に位置する前記バルブケーシングのボールシートと前記回転ボールとの間のすきまに反応副産物ガスに含まれたパウダーが浸透することを遮断するエアカーテンの役割をする請求項1に記載のパウダープロテクティング3ウェイバルブ。 - 前記バルブケーシングの一側壁には、前記回転ボールの非連通状態の流出孔と対応する円形の開口部が形成され、前記円形の開口部には、ガイドディスクが設置されるが、前記円形の開口部の内周面との間にすきまを形成するように設置され、前記窒素ガス供給部材から噴射される窒素ガスが前記ガイドディスクの前側面に接触した後に分散し、前記ガイドディスクの周部に沿って円管型のエアカーテンの形で流れながら、前記回転ボールの非連通状態の流出孔を通過できるようにする請求項6に記載のパウダープロテクティング3ウェイバルブ。
- 前記ガイドディスクは、前側面の中央には円錐型に突出して前記窒素ガス供給部材から噴射される窒素ガスに接触し、周辺に均一に分散させるガス均一分散部がさらに形成される請求項7に記載のパウダープロテクティング3ウェイバルブ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020170156637A KR101828427B1 (ko) | 2017-11-22 | 2017-11-22 | 파우더 프로텍팅 3웨이 밸브 |
KR10-2017-0156637 | 2017-11-22 | ||
PCT/KR2018/011041 WO2019103298A1 (ko) | 2017-11-22 | 2018-09-19 | 파우더 프로텍팅 3웨이 밸브 |
Publications (2)
Publication Number | Publication Date |
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JP2021503586A JP2021503586A (ja) | 2021-02-12 |
JP6921453B2 true JP6921453B2 (ja) | 2021-08-18 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020545021A Active JP6921453B2 (ja) | 2017-11-22 | 2018-09-19 | パウダープロテクティング3ウェイバルブ |
Country Status (6)
Country | Link |
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US (1) | US11322369B2 (ja) |
JP (1) | JP6921453B2 (ja) |
KR (1) | KR101828427B1 (ja) |
CN (1) | CN111357093B (ja) |
TW (1) | TWI687613B (ja) |
WO (1) | WO2019103298A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102161842B1 (ko) | 2019-05-29 | 2020-10-05 | 주식회사 다원물산 | 배기 디파우더 모듈의 삼방향 밸브 가열장치 |
KR20220002414U (ko) | 2021-04-01 | 2022-10-11 | (주)지에스티산업 | 밸브 |
JP7384886B2 (ja) | 2021-12-09 | 2023-11-21 | 大陽日酸株式会社 | 三方弁、排ガス処理装置及び排ガス処理システム並びに排ガス処理方法 |
KR102601158B1 (ko) * | 2023-03-09 | 2023-11-13 | 주식회사 에이오테크 | 원통형 발열체를 구비한 파우더 프로텍팅 3웨이 밸브 |
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2017
- 2017-11-22 KR KR1020170156637A patent/KR101828427B1/ko active IP Right Grant
-
2018
- 2018-09-19 WO PCT/KR2018/011041 patent/WO2019103298A1/ko active Application Filing
- 2018-09-19 JP JP2020545021A patent/JP6921453B2/ja active Active
- 2018-09-19 US US16/765,073 patent/US11322369B2/en active Active
- 2018-09-19 CN CN201880074380.XA patent/CN111357093B/zh active Active
- 2018-10-31 TW TW107138688A patent/TWI687613B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20210366733A1 (en) | 2021-11-25 |
KR101828427B1 (ko) | 2018-03-29 |
CN111357093B (zh) | 2023-04-07 |
JP2021503586A (ja) | 2021-02-12 |
TW201925661A (zh) | 2019-07-01 |
CN111357093A (zh) | 2020-06-30 |
TWI687613B (zh) | 2020-03-11 |
US11322369B2 (en) | 2022-05-03 |
WO2019103298A1 (ko) | 2019-05-31 |
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