JP6872291B2 - パワーモジュール及びパワーモジュールを製造する方法 - Google Patents

パワーモジュール及びパワーモジュールを製造する方法 Download PDF

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Publication number
JP6872291B2
JP6872291B2 JP2019539312A JP2019539312A JP6872291B2 JP 6872291 B2 JP6872291 B2 JP 6872291B2 JP 2019539312 A JP2019539312 A JP 2019539312A JP 2019539312 A JP2019539312 A JP 2019539312A JP 6872291 B2 JP6872291 B2 JP 6872291B2
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JP
Japan
Prior art keywords
conductor layer
power module
pipe
plating
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2019539312A
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English (en)
Japanese (ja)
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JP2020505771A5 (https=
JP2020505771A (ja
Inventor
ムラド、ロバート
モロヴ、ステファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric R&D Centre Europe BV Netherlands
Original Assignee
Mitsubishi Electric R&D Centre Europe BV Netherlands
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2019539312A 2017-05-29 2018-05-01 パワーモジュール及びパワーモジュールを製造する方法 Expired - Fee Related JP6872291B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17173262.1 2017-05-29
EP17173262.1A EP3410478A1 (en) 2017-05-29 2017-05-29 Power module and method for manufacturing the power module
PCT/JP2018/018023 WO2018221149A1 (en) 2017-05-29 2018-05-01 Power module and method for manufacturing the power module

Publications (3)

Publication Number Publication Date
JP2020505771A JP2020505771A (ja) 2020-02-20
JP2020505771A5 JP2020505771A5 (https=) 2020-04-02
JP6872291B2 true JP6872291B2 (ja) 2021-05-19

Family

ID=58800718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019539312A Expired - Fee Related JP6872291B2 (ja) 2017-05-29 2018-05-01 パワーモジュール及びパワーモジュールを製造する方法

Country Status (5)

Country Link
US (1) US11121059B2 (https=)
EP (1) EP3410478A1 (https=)
JP (1) JP6872291B2 (https=)
CN (1) CN110663112A (https=)
WO (1) WO2018221149A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
CA3232380A1 (en) 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
JP2024080085A (ja) * 2022-12-01 2024-06-13 ナブテスコ株式会社 部品内蔵型回路基板および部品内蔵型回路基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235492A (ja) * 1992-02-26 1993-09-10 Hitachi Ltd 配線基板
JP4140100B2 (ja) * 1998-10-29 2008-08-27 ソニー株式会社 ヒートパイプ内蔵プリント配線基板
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement
SE522799C2 (sv) * 2000-02-23 2004-03-09 Teracom Ab Anordning för borttransport av värme från uppvärmda element samt ett förfarande för tillverkning av anordningen
US6292366B1 (en) * 2000-06-26 2001-09-18 Intel Corporation Printed circuit board with embedded integrated circuit
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process
JP4350606B2 (ja) * 2004-07-23 2009-10-21 シャープ株式会社 プリント配線板の製造方法
KR20050117482A (ko) * 2005-06-29 2005-12-14 주식회사 써모랩 냉각장치가 내장된 인쇄회로기판 및 그의 제작방법
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
JP2009290021A (ja) * 2008-05-29 2009-12-10 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
DE102008040906A1 (de) * 2008-07-31 2010-02-04 Robert Bosch Gmbh Leiterplatine mit elektronischem Bauelement
CN103635012A (zh) * 2012-08-21 2014-03-12 三星电机株式会社 印刷电路板以及用于制造该印刷电路板的方法
CN105593626A (zh) * 2013-12-24 2016-05-18 古河电气工业株式会社 受热部结构和散热器
JP6398405B2 (ja) * 2014-07-15 2018-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
US9567204B2 (en) * 2014-08-29 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
WO2016071324A1 (en) * 2014-11-03 2016-05-12 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Hermetically sealed heat pipe structure synthesized with support structure and method for producing it
KR102546379B1 (ko) * 2015-10-22 2023-06-21 에이지씨 가부시키가이샤 배선 기판의 제조 방법

Also Published As

Publication number Publication date
CN110663112A (zh) 2020-01-07
EP3410478A1 (en) 2018-12-05
JP2020505771A (ja) 2020-02-20
US11121059B2 (en) 2021-09-14
WO2018221149A1 (en) 2018-12-06
US20200161212A1 (en) 2020-05-21

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