JP6850229B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP6850229B2 JP6850229B2 JP2017177737A JP2017177737A JP6850229B2 JP 6850229 B2 JP6850229 B2 JP 6850229B2 JP 2017177737 A JP2017177737 A JP 2017177737A JP 2017177737 A JP2017177737 A JP 2017177737A JP 6850229 B2 JP6850229 B2 JP 6850229B2
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- 239000011347 resin Substances 0.000 claims description 64
- 229920005989 resin Polymers 0.000 claims description 64
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 description 34
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 238000001746 injection moulding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10393—Clamping a component by an element or a set of elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
本実施形態に係る電子装置についてその製造工程を追いながら説明する。
第1実施形態では、図7に示したように、第1の配線基板21の一つの辺に設ける第1の樹脂部32を一個とした。第1の樹脂部32の個数はこれに限定されない。
図16は、本実施形態に係る電子装置の平面図である。
図19は、本実施形態に係る電子装置の断面図である。
第1〜第4実施形態では、図8に示したように、第1の樹脂部32により複数の第1の導電性コンタクト31を連結した。
本実施形態では、以下のようにして各配線基板21、33の間の電子部品28を封止する。
本実施形態では、以下のようにして電子装置の小型化を図る。
本実施形態では、各導電性コンタクト31、34、37の好適な形状について説明する。
本実施形態では、第3の導電性コンタクト37の好適な形状について説明する。
第1〜第9実施形態では、第1の導電性コンタクト31と第2の導電性コンタクト34の各々を断面視でコの字型にしたが、各導電性コンタクト31、34の断面形状はこれに限定されない。
Claims (10)
- 第1の主面を備えた第1の配線基板と、
前記第1の主面の周縁部に立設され、前記第1の配線基板の側方に向かって開口したコの字型の形状を有すると共に、前記第1の配線基板の側方に向かって延びる第1の接点部を備えた複数の第1の導電性コンタクトと、
前記第1の主面に対向する第2の主面を備えた第2の配線基板と、
前記第2の主面の周縁部に立設され、前記第2の配線基板の側方に向かって延びた第2の接点部を有すると共に、前記第2の配線基板の側方に向かって開口したコの字型の形状を有し、かつ前記第2の接点部が前記第1の接点部に接した複数の第2の導電性コンタクトと、
前記第1の導電性コンタクトと前記第2の導電性コンタクトの各々に向かって開口したコの字型の形状を有すると共に、前記第1の配線基板と前記第2の配線基板の各々の側方から前記第1の接点部と前記第2の接点部を挟持して前記第1の配線基板と前記第2の配線基板とを固定する複数の第3の導電性コンタクトと、
前記第1の配線基板と前記第2の配線基板の各々に搭載された複数の電子部品と、
を有する電子装置。 - 複数の前記第1の導電性コンタクトの各々を連結する第1の樹脂部と、
複数の前記第2の導電性コンタクトの各々を連結する第2の樹脂部とを更に有することを特徴とする請求項1に記載の電子装置。 - 複数の前記第3の導電性コンタクトの各々を連結する第3の樹脂部を更に有することを特徴とする請求項1又は請求項2に記載の電子装置。
- 前記第1の配線基板と前記第2の配線基板の各々は平面視で複数の辺を備え、
複数の前記辺ごとに一つの前記第3の樹脂部が設けられたことを特徴とする請求項3に記載の電子装置。 - 前記複数の電子部品の一部は、前記第1の主面と前記第2の主面の少なくとも一方に搭載され、
前記第1の主面と前記第2の主面との間の空間が前記第3の樹脂部により封じられたことを特徴とする請求項3に記載の電子装置。 - 前記一部の電子部品は、前記第1の配線基板と前記第2の配線基板の各々の外周側面から後退した部位に設けられ、
前記第3の樹脂部が前記第1の主面と前記第2の主面の各々に密着することにより前記空間が封じられたことを特徴とする請求項5に記載の電子装置。 - 前記第3の樹脂部が前記第1の配線基板と前記第2の配線基板の各々の外周側面に密着することにより前記空間が封じられたことを特徴とする請求項5に記載の電子装置。
- 前記第3の導電性コンタクトは、前記第1の接点部と前記第2の接点部とを挟持する一対の第3の接点部を備え、
各々の前記第3の接点部に、前記第1の接点部と前記第2の接点部の各々に摺接する突起が設けられたことを特徴とする請求項1に記載の電子装置。 - 前記第1の接点部は、断面視で前記第1の配線基板の側方に向かって厚くなるテーパ状であり、
前記第2の接点部は、断面視で前記第2の配線基板の側方に向かって厚くなるテーパ状であり、
前記第3の導電性コンタクトに、前記第1の接点部と前記第2の接点部とを挟持すると共に、断面視で前記第1の接点部と前記第2の接点部に倣ったテーパ状の一対の第3の接点部が設けられたことを特徴とする請求項1に記載の電子装置。 - 前記第1の導電性コンタクト、前記第2の導電性コンタクト、及び前記第3の導電性コンタクトの各々の形と大きさは同一であることを特徴とする請求項1に記載の電子装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017177737A JP6850229B2 (ja) | 2017-09-15 | 2017-09-15 | 電子装置 |
US16/127,823 US10206283B1 (en) | 2017-09-15 | 2018-09-11 | Electronic device |
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Application Number | Priority Date | Filing Date | Title |
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JP2017177737A JP6850229B2 (ja) | 2017-09-15 | 2017-09-15 | 電子装置 |
Publications (2)
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JP2019054126A JP2019054126A (ja) | 2019-04-04 |
JP6850229B2 true JP6850229B2 (ja) | 2021-03-31 |
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JP2017177737A Active JP6850229B2 (ja) | 2017-09-15 | 2017-09-15 | 電子装置 |
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US (1) | US10206283B1 (ja) |
JP (1) | JP6850229B2 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4555151A (en) * | 1984-08-06 | 1985-11-26 | Gte Communication Systems Corporation | Contact terminal device for connecting hybrid circuit modules to a printed circuit board |
US5910885A (en) * | 1997-12-03 | 1999-06-08 | White Electronic Designs Corporation | Electronic stack module |
JP3465671B2 (ja) * | 2000-08-09 | 2003-11-10 | 株式会社村田製作所 | コンバータ装置 |
JP2003198161A (ja) * | 2001-12-26 | 2003-07-11 | Mitsubishi Electric Corp | クリップ型リード、及び、当該クリップ型リードにより半導体装置又は副基板を実装した主基板 |
US6700196B1 (en) * | 2002-09-23 | 2004-03-02 | Honeywell Federal Manufacturing & Technologies | Programmable multi-chip module |
JP2004222486A (ja) * | 2002-12-27 | 2004-08-05 | Murata Mfg Co Ltd | スイッチング電源モジュール |
JP2004311189A (ja) * | 2003-04-07 | 2004-11-04 | Tamura Seisakusho Co Ltd | 基板間接続金具 |
CN101156506B (zh) * | 2005-07-11 | 2011-07-13 | 松下电器产业株式会社 | 基板连接部件和连接结构体 |
JP2007026964A (ja) | 2005-07-19 | 2007-02-01 | Ricoh Co Ltd | 基板モジュール接続ソケット |
WO2007125849A1 (ja) * | 2006-04-27 | 2007-11-08 | Panasonic Corporation | 基板接合部材ならびにそれを用いた三次元接続構造体 |
JP2009147223A (ja) * | 2007-12-17 | 2009-07-02 | Toppan Printing Co Ltd | モジュール部品、モジュール及びモジュール部品の製造方法 |
-
2017
- 2017-09-15 JP JP2017177737A patent/JP6850229B2/ja active Active
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2018
- 2018-09-11 US US16/127,823 patent/US10206283B1/en active Active
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US10206283B1 (en) | 2019-02-12 |
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