JP6849221B2 - 金属薄膜の製造方法及び導電構造 - Google Patents
金属薄膜の製造方法及び導電構造 Download PDFInfo
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- 229940117389 dichlorobenzene Drugs 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
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- -1 for example Substances 0.000 description 1
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- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
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- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
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- 239000002923 metal particle Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
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- 239000011164 primary particle Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
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- 229910052724 xenon Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Thin Film Transistor (AREA)
Description
未硬化又は半硬化の熱硬化性絶縁樹脂で形成された下地層を有する基板を準備する工程と、
前記下地層に金属ナノ粒子インクを塗布する工程と、
前記熱硬化性絶縁樹脂の硬化温度以上の温度で前記金属ナノ粒子インクに含まれた金属ナノ粒子を焼結させる工程と、
をこの順で含む、金属薄膜の製造方法を提供する。
熱硬化性絶縁樹脂で形成された下地層を有する基板と、
前記下地層に支持された金属薄膜と、
前記下地層と前記金属薄膜との間に形成された厚さ100nm以下の融着層と、
を備えた、導電構造を提供する。
まず、架橋性ポリビニルフェノール(PVP)を用いてガラス基板上に下地層を形成した。具体的には、PVP(アルドリッチ社製)を15wt%の濃度でプロピレングリコール1−モノメチルエーテル2−アセタート(PEGMEA)に溶解させ、PVP溶液を得た。一方、メラミン樹脂(アルドリッチ社製)を3wt%の濃度でPEGMEAに溶解させ、メラミン樹脂溶液を得た。PVP溶液1mLとメラミン樹脂溶液1mLとを混合して混合溶液を得た。この混合溶液を用い、ガラス基板上にスピンコート法で塗膜を形成した。ホットプレート上にガラス基板を配置し、ガラス基板を架橋性PVPの硬化温度(150℃)以下の100℃で15分間加熱することで塗膜を乾燥させた。ガラス基板上に形成された架橋性PVP層(下地層)の厚さは450nmであった。
焼成温度を120℃、140℃、160℃、180℃又は200℃に変更した点を除き、サンプル1と同じ方法でサンプル2〜6の導電構造を得た。サンプル4〜6は、架橋性PVPの硬化温度(150℃)以上の温度で銀ナノ粒子インクの塗膜を焼成することによって得られたサンプルであった。
サンプル1と同じ方法でガラス基板上に塗膜を形成した後、架橋性PVPの硬化温度以上の160℃でガラス基板を60分間加熱して塗膜を硬化させた。ガラス基板上に形成された架橋性PVP層(硬化済み)の厚さは400nmであった。次に、サンプル1と同じ方法で架橋性PVP層の上に銀ナノ粒子インクの塗膜を形成し、100℃、30分間の条件で銀ナノ粒子インクの塗膜を焼成した。これにより、サンプル11の導電構造を得た。
焼成温度を120℃、140℃、160℃、180℃又は200℃に変更した点を除き、サンプル11と同じ方法でサンプル12〜16の導電構造を得た。
サンプル1〜6及び11〜16のAg薄膜のシート抵抗を抵抗率測定機(エヌピーエス社製 Model sigma-5+)にて測定した。結果を表1に示す。
サンプル2〜6及びサンプル13〜16のAg薄膜について、超薄膜スクラッチ試験機(レスカ社製 CSR−2000)を用いて、ひっかき強度を測定し、導電構造におけるAg薄膜の密着性の評価を行った。ひっかき強度の測定は、以下の条件で行い、3回の測定値の平均値を算出した。結果を表1に示す。
スタイラス:曲率半径100μm
荷重印加:0〜200mN
測定距離:1mm
スクラッチ速度:10μm/s
Claims (7)
- 未硬化又は半硬化の熱硬化性絶縁樹脂で形成された下地層を有する基板を準備する工程と、
前記下地層に金属ナノ粒子インクを塗布する工程と、
前記熱硬化性絶縁樹脂の硬化温度以上の温度で前記金属ナノ粒子インクに含まれた金属ナノ粒子を焼結させる工程と、
をこの順で含み、
前記金属ナノ粒子インクを前記下地層に塗布する前において、前記下地層の表面の表面エネルギーが15mN/m以上であり、
前記金属ナノ粒子を焼結させる工程において、前記下地層と金属薄膜との間に厚さ10nm以上100nm以下の融着層が形成され、
前記融着層は、前記下地層を構成する前記熱硬化性絶縁樹脂と前記金属薄膜を構成する金属原子とを含む層である、金属薄膜の製造方法。 - 前記金属ナノ粒子インクを前記下地層に塗布する前において、前記熱硬化性絶縁樹脂の硬化温度未満の温度で前記基板を加熱処理する工程をさらに含む、請求項1に記載の金属薄膜の製造方法。
- 前記熱硬化性絶縁樹脂の前記硬化温度が200℃以下である、請求項1又は2に記載の金属薄膜の製造方法。
- 前記熱硬化性絶縁樹脂は、ポリイミド、エポキシ樹脂、メラミン樹脂、尿素樹脂、ポリウレタン、フェノール樹脂、シリコン樹脂、不飽和ポリエステル樹脂及びジアリルフタレート樹脂からなる群より選ばれる少なくとも1つを含む、請求項1〜3のいずれか1項に記載の金属薄膜の製造方法。
- 前記金属ナノ粒子インクを前記下地層に塗布する前において、前記下地層の表面に物理的表面処理を施す工程をさらに含む、請求項1〜4のいずれか1項に記載の金属薄膜の製造方法。
- 前記物理的表面処理は、プラズマ処理、紫外線照射処理及び紫外線オゾン処理からなる群より選ばれる少なくとも1つの処理を含む、請求項5に記載の金属薄膜の製造方法。
- 前記金属薄膜のひっかき強度が142mN以上173mN以下である、請求項1〜6のいずれか1項に記載の金属薄膜の製造方法。
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WO2009035036A1 (ja) * | 2007-09-14 | 2009-03-19 | Konica Minolta Holdings, Inc. | 電極の形成方法及び有機薄膜トランジスタ |
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