JP6848385B2 - 三次元形状計測装置 - Google Patents

三次元形状計測装置 Download PDF

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Publication number
JP6848385B2
JP6848385B2 JP2016225090A JP2016225090A JP6848385B2 JP 6848385 B2 JP6848385 B2 JP 6848385B2 JP 2016225090 A JP2016225090 A JP 2016225090A JP 2016225090 A JP2016225090 A JP 2016225090A JP 6848385 B2 JP6848385 B2 JP 6848385B2
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substrate
dimensional shape
measuring device
pattern
measurement
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English (en)
Japanese (ja)
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JP2018081048A (ja
Inventor
幸弘 辻村
幸弘 辻村
政臣 吉田
政臣 吉田
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Omron Corp
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Omron Corp
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Priority to JP2016225090A priority Critical patent/JP6848385B2/ja
Priority to DE102017216552.9A priority patent/DE102017216552B4/de
Priority to CN201710860489.3A priority patent/CN108072335B/zh
Publication of JP2018081048A publication Critical patent/JP2018081048A/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2016225090A 2016-11-18 2016-11-18 三次元形状計測装置 Active JP6848385B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016225090A JP6848385B2 (ja) 2016-11-18 2016-11-18 三次元形状計測装置
DE102017216552.9A DE102017216552B4 (de) 2016-11-18 2017-09-19 Messvorrichtung für dreidimensionale gestalt
CN201710860489.3A CN108072335B (zh) 2016-11-18 2017-09-21 三维形状测量装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016225090A JP6848385B2 (ja) 2016-11-18 2016-11-18 三次元形状計測装置

Publications (2)

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JP2018081048A JP2018081048A (ja) 2018-05-24
JP6848385B2 true JP6848385B2 (ja) 2021-03-24

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JP2016225090A Active JP6848385B2 (ja) 2016-11-18 2016-11-18 三次元形状計測装置

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JP (1) JP6848385B2 (zh)
CN (1) CN108072335B (zh)
DE (1) DE102017216552B4 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6907277B2 (ja) * 2018-08-30 2021-07-21 コグネックス・コーポレイション 歪みが低減された物体の3次元再構成を生成するための方法及び装置
CN109341576B (zh) * 2018-10-09 2020-10-27 广东奥普特科技股份有限公司 一种快速测量物体表面三维形貌及颜色的方法
CN109900221A (zh) * 2019-04-12 2019-06-18 杭州思看科技有限公司 一种手持式三维扫描系统
JP7424074B2 (ja) * 2020-01-28 2024-01-30 オムロン株式会社 三次元形状計測装置、三次元形状計測方法及びプログラム
JP7459525B2 (ja) 2020-01-28 2024-04-02 オムロン株式会社 三次元形状計測装置、三次元形状計測方法及びプログラム
JP7404941B2 (ja) * 2020-03-10 2023-12-26 オムロン株式会社 三次元形状計測装置
JP2021143939A (ja) * 2020-03-12 2021-09-24 オムロン株式会社 三次元形状計測装置
JP2022030051A (ja) * 2020-08-06 2022-02-18 Towa株式会社 切断装置、及び、切断品の製造方法
CN112894133B (zh) * 2021-01-27 2023-08-04 浙江广合智能科技有限公司 一种激光焊接系统和焊点位置提取方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08285552A (ja) * 1995-04-13 1996-11-01 Mitsubishi Heavy Ind Ltd 曲率方向測定方法及び装置
US7379193B2 (en) * 2002-02-09 2008-05-27 Lang Liu Sensing device for measuring the three-dimension shape and its measuring method
DE10219054B4 (de) * 2002-04-24 2004-08-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bestimmung der räumlichen Koordinaten eines Gegenstandes
CN100338434C (zh) * 2003-02-06 2007-09-19 株式会社高永科技 三维图像测量装置
KR20080043047A (ko) * 2006-11-13 2008-05-16 주식회사 고영테크놀러지 새도우 모아레를 이용한 3차원형상 측정장치
JP2010071782A (ja) * 2008-09-18 2010-04-02 Omron Corp 3次元計測装置およびその方法
JP5765651B2 (ja) * 2011-02-01 2015-08-19 Jukiオートメーションシステムズ株式会社 3次元測定装置
CN102364299B (zh) * 2011-08-30 2015-01-14 西南科技大学 一种多个结构光投影三维型面测量头的标定技术
CN103376071B (zh) * 2012-04-20 2017-06-30 德律科技股份有限公司 三维测量系统与三维测量方法
US9163938B2 (en) * 2012-07-20 2015-10-20 Google Inc. Systems and methods for image acquisition
JP2014178233A (ja) * 2013-03-15 2014-09-25 Azbil Corp 形状測定装置及び形状測定方法
JP5780659B2 (ja) * 2013-06-13 2015-09-16 ヤマハ発動機株式会社 3次元形状測定装置
JP2015021763A (ja) 2013-07-16 2015-02-02 株式会社キーエンス 三次元画像処理装置、三次元画像処理方法及び三次元画像処理プログラム並びにコンピュータで読み取り可能な記録媒体
CN203893824U (zh) * 2014-03-29 2014-10-22 淮安普瑞精仪科技有限公司 一种在线锡膏厚度测量仪
JP6256249B2 (ja) * 2014-08-08 2018-01-10 オムロン株式会社 計測装置、基板検査装置、及びその制御方法
JP2016099257A (ja) * 2014-11-21 2016-05-30 キヤノン株式会社 情報処理装置及び情報処理方法

Also Published As

Publication number Publication date
CN108072335A (zh) 2018-05-25
CN108072335B (zh) 2020-09-18
DE102017216552A1 (de) 2018-05-24
JP2018081048A (ja) 2018-05-24
DE102017216552B4 (de) 2019-05-29

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