JP6843621B2 - 目標とする高い洗浄性能を得るためのこぶの比率 - Google Patents

目標とする高い洗浄性能を得るためのこぶの比率 Download PDF

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Publication number
JP6843621B2
JP6843621B2 JP2016553552A JP2016553552A JP6843621B2 JP 6843621 B2 JP6843621 B2 JP 6843621B2 JP 2016553552 A JP2016553552 A JP 2016553552A JP 2016553552 A JP2016553552 A JP 2016553552A JP 6843621 B2 JP6843621 B2 JP 6843621B2
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Japan
Prior art keywords
hump
brush
humps
diameter
ratio
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JP2016553552A
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English (en)
Japanese (ja)
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JP2017513210A5 (enExample
JP2017513210A (ja
Inventor
チンタン・パテル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
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Entegris Inc
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Publication of JP2017513210A publication Critical patent/JP2017513210A/ja
Publication of JP2017513210A5 publication Critical patent/JP2017513210A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Brushes (AREA)
JP2016553552A 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率 Active JP6843621B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461942231P 2014-02-20 2014-02-20
US61/942,231 2014-02-20
PCT/US2015/016949 WO2015127301A1 (en) 2014-02-20 2015-02-20 Nodule ratios for targeted enhanced cleaning performance

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020165904A Division JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Publications (3)

Publication Number Publication Date
JP2017513210A JP2017513210A (ja) 2017-05-25
JP2017513210A5 JP2017513210A5 (enExample) 2018-04-05
JP6843621B2 true JP6843621B2 (ja) 2021-03-17

Family

ID=53879067

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016553552A Active JP6843621B2 (ja) 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Country Status (4)

Country Link
US (1) US10790167B2 (enExample)
JP (2) JP6843621B2 (enExample)
TW (1) TWI670763B (enExample)
WO (1) WO2015127301A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2552512A (en) * 2016-07-26 2018-01-31 Matchstick Monkey Ltd An improved teething device
US11766703B2 (en) 2018-08-15 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for wafer cleaning
US20200203192A1 (en) * 2018-12-14 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Backside brush for cleaning wafer and cleaning apparatus having the same
US11109667B2 (en) * 2019-10-16 2021-09-07 Tung An Development Ltd. Device of bi-spiral cleaning brush
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
CN114227526B (zh) * 2022-02-28 2022-06-07 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US937509A (en) * 1908-03-09 1909-10-19 Donald A Carpenter Lavatory-fixture.
US4098728A (en) 1976-01-02 1978-07-04 Solomon Rosenblatt Medical surgical sponge and method of making same
JPS596974A (ja) 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
JPH03155551A (ja) 1989-11-14 1991-07-03 Seiko Epson Corp 洗浄用治具
US6080092A (en) * 1994-10-06 2000-06-27 Xomed Surgical Products, Inc. Industrial cleaning sponge
JP3680185B2 (ja) 1996-07-19 2005-08-10 アイオン株式会社 洗浄用ローラ
JP3378015B2 (ja) * 1996-11-08 2003-02-17 アイオン株式会社 洗浄用スポンジローラ
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2001358110A (ja) 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2004298767A (ja) 2003-03-31 2004-10-28 Aion Kk 洗浄用多孔質ロール体
EP1680260B1 (en) 2003-08-08 2014-04-30 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR101324870B1 (ko) 2005-12-06 2013-11-01 엔테그리스, 아이엔씨. 다공성 패드를 위한 성형된 회전가능 기부
JP2009066527A (ja) 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
JP2009117765A (ja) 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
JP5470746B2 (ja) 2008-05-22 2014-04-16 富士通セミコンダクター株式会社 半導体装置の製造方法
WO2010001761A1 (ja) * 2008-06-30 2010-01-07 アイオン株式会社 洗浄用スポンジローラ
US9524886B2 (en) 2009-05-15 2016-12-20 Illinois Tool Works Inc. Brush core and brush driving method
SG183419A1 (en) * 2010-02-22 2012-09-27 Entegris Inc Post-cmp cleaning brush
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
KR20140069043A (ko) 2011-09-26 2014-06-09 인티그리스, 인코포레이티드 포스트-cmp 세정 장치 및 방법
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush

Also Published As

Publication number Publication date
TW201539567A (zh) 2015-10-16
TWI670763B (zh) 2019-09-01
JP7097415B2 (ja) 2022-07-07
JP2021013028A (ja) 2021-02-04
US20170018422A1 (en) 2017-01-19
JP2017513210A (ja) 2017-05-25
WO2015127301A1 (en) 2015-08-27
US10790167B2 (en) 2020-09-29

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