TWI670763B - 一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法 - Google Patents

一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法 Download PDF

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Publication number
TWI670763B
TWI670763B TW104105791A TW104105791A TWI670763B TW I670763 B TWI670763 B TW I670763B TW 104105791 A TW104105791 A TW 104105791A TW 104105791 A TW104105791 A TW 104105791A TW I670763 B TWI670763 B TW I670763B
Authority
TW
Taiwan
Prior art keywords
brush
nodule
nodules
ratio
chemical mechanical
Prior art date
Application number
TW104105791A
Other languages
English (en)
Chinese (zh)
Other versions
TW201539567A (zh
Inventor
青天 帕特歐
Original Assignee
美商恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商恩特葛瑞斯股份有限公司 filed Critical 美商恩特葛瑞斯股份有限公司
Publication of TW201539567A publication Critical patent/TW201539567A/zh
Application granted granted Critical
Publication of TWI670763B publication Critical patent/TWI670763B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Brushes (AREA)
TW104105791A 2014-02-20 2015-02-24 一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法 TWI670763B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461942231P 2014-02-20 2014-02-20
US61/942,231 2014-02-20

Publications (2)

Publication Number Publication Date
TW201539567A TW201539567A (zh) 2015-10-16
TWI670763B true TWI670763B (zh) 2019-09-01

Family

ID=53879067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104105791A TWI670763B (zh) 2014-02-20 2015-02-24 一種用於在一化學機械研磨製程之後清潔晶圓之刷具與方法

Country Status (4)

Country Link
US (1) US10790167B2 (enExample)
JP (2) JP6843621B2 (enExample)
TW (1) TWI670763B (enExample)
WO (1) WO2015127301A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227526A (zh) * 2022-02-28 2022-03-25 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2552512A (en) * 2016-07-26 2018-01-31 Matchstick Monkey Ltd An improved teething device
US11766703B2 (en) 2018-08-15 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for wafer cleaning
US20200203192A1 (en) * 2018-12-14 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Backside brush for cleaning wafer and cleaning apparatus having the same
US11109667B2 (en) * 2019-10-16 2021-09-07 Tung An Development Ltd. Device of bi-spiral cleaning brush
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200513350A (en) * 2003-08-08 2005-04-16 Mykrolis Corp Method and materials for making a monolithic porous pad cast onto a rotatable base
WO2010132329A1 (en) * 2009-05-15 2010-11-18 Illinois Tool Works Inc. Brush core and brush driving method
WO2011103538A2 (en) * 2010-02-22 2011-08-25 Entegris,Inc. Post-cmp cleaning brush
WO2013049207A2 (en) * 2011-09-26 2013-04-04 Entegris, Inc. Post-cmp cleaning apparatus and method
TW201347862A (zh) * 2012-04-03 2013-12-01 Illinois Tool Works 凹型結核海綿刷

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US937509A (en) * 1908-03-09 1909-10-19 Donald A Carpenter Lavatory-fixture.
US4098728A (en) 1976-01-02 1978-07-04 Solomon Rosenblatt Medical surgical sponge and method of making same
JPS596974A (ja) 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
JPH03155551A (ja) 1989-11-14 1991-07-03 Seiko Epson Corp 洗浄用治具
US6080092A (en) * 1994-10-06 2000-06-27 Xomed Surgical Products, Inc. Industrial cleaning sponge
JP3680185B2 (ja) 1996-07-19 2005-08-10 アイオン株式会社 洗浄用ローラ
JP3378015B2 (ja) * 1996-11-08 2003-02-17 アイオン株式会社 洗浄用スポンジローラ
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2001358110A (ja) 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2004298767A (ja) 2003-03-31 2004-10-28 Aion Kk 洗浄用多孔質ロール体
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR101324870B1 (ko) 2005-12-06 2013-11-01 엔테그리스, 아이엔씨. 다공성 패드를 위한 성형된 회전가능 기부
JP2009066527A (ja) 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
JP2009117765A (ja) 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
JP5470746B2 (ja) 2008-05-22 2014-04-16 富士通セミコンダクター株式会社 半導体装置の製造方法
WO2010001761A1 (ja) * 2008-06-30 2010-01-07 アイオン株式会社 洗浄用スポンジローラ
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200513350A (en) * 2003-08-08 2005-04-16 Mykrolis Corp Method and materials for making a monolithic porous pad cast onto a rotatable base
WO2010132329A1 (en) * 2009-05-15 2010-11-18 Illinois Tool Works Inc. Brush core and brush driving method
WO2011103538A2 (en) * 2010-02-22 2011-08-25 Entegris,Inc. Post-cmp cleaning brush
WO2013049207A2 (en) * 2011-09-26 2013-04-04 Entegris, Inc. Post-cmp cleaning apparatus and method
TW201347862A (zh) * 2012-04-03 2013-12-01 Illinois Tool Works 凹型結核海綿刷

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114227526A (zh) * 2022-02-28 2022-03-25 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片
CN114227526B (zh) * 2022-02-28 2022-06-07 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片
TWI816544B (zh) * 2022-02-28 2023-09-21 大陸商西安奕斯偉材料科技股份有限公司 一種研磨載台、研磨裝置、研磨方法及矽片

Also Published As

Publication number Publication date
TW201539567A (zh) 2015-10-16
JP6843621B2 (ja) 2021-03-17
JP7097415B2 (ja) 2022-07-07
JP2021013028A (ja) 2021-02-04
US20170018422A1 (en) 2017-01-19
JP2017513210A (ja) 2017-05-25
WO2015127301A1 (en) 2015-08-27
US10790167B2 (en) 2020-09-29

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