JP6836980B2 - 基板洗浄方法 - Google Patents

基板洗浄方法 Download PDF

Info

Publication number
JP6836980B2
JP6836980B2 JP2017197641A JP2017197641A JP6836980B2 JP 6836980 B2 JP6836980 B2 JP 6836980B2 JP 2017197641 A JP2017197641 A JP 2017197641A JP 2017197641 A JP2017197641 A JP 2017197641A JP 6836980 B2 JP6836980 B2 JP 6836980B2
Authority
JP
Japan
Prior art keywords
cleaning
substrate
tank
liquid
substrate holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017197641A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019071382A (ja
JP2019071382A5 (https=
Inventor
久保田　誠
誠 久保田
大輝 石塚
大輝 石塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2017197641A priority Critical patent/JP6836980B2/ja
Priority to KR1020180105323A priority patent/KR102565317B1/ko
Priority to TW107134111A priority patent/TWI746890B/zh
Priority to US16/152,428 priority patent/US20190105689A1/en
Publication of JP2019071382A publication Critical patent/JP2019071382A/ja
Publication of JP2019071382A5 publication Critical patent/JP2019071382A5/ja
Application granted granted Critical
Publication of JP6836980B2 publication Critical patent/JP6836980B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/108—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by lowering and raising the level of the cleaning liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemically Coating (AREA)
JP2017197641A 2017-10-11 2017-10-11 基板洗浄方法 Active JP6836980B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017197641A JP6836980B2 (ja) 2017-10-11 2017-10-11 基板洗浄方法
KR1020180105323A KR102565317B1 (ko) 2017-10-11 2018-09-04 기판 세정 방법
TW107134111A TWI746890B (zh) 2017-10-11 2018-09-27 基板洗淨方法
US16/152,428 US20190105689A1 (en) 2017-10-11 2018-10-05 Substrate cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017197641A JP6836980B2 (ja) 2017-10-11 2017-10-11 基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2019071382A JP2019071382A (ja) 2019-05-09
JP2019071382A5 JP2019071382A5 (https=) 2020-05-14
JP6836980B2 true JP6836980B2 (ja) 2021-03-03

Family

ID=65992947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017197641A Active JP6836980B2 (ja) 2017-10-11 2017-10-11 基板洗浄方法

Country Status (4)

Country Link
US (1) US20190105689A1 (https=)
JP (1) JP6836980B2 (https=)
KR (1) KR102565317B1 (https=)
TW (1) TWI746890B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738855B (zh) * 2016-09-08 2021-09-11 日商荏原製作所股份有限公司 基板固持器、鍍覆裝置、基板固持器之製造方法、以及基板保持方法
US11658059B2 (en) * 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
KR102335472B1 (ko) * 2019-09-04 2021-12-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7097523B1 (ja) * 2021-02-26 2022-07-07 株式会社荏原製作所 基板ホルダの保管方法、めっき装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4361163A (en) * 1981-01-02 1982-11-30 Seiichiro Aigo Apparatus for washing semiconductor materials
DE19654903C2 (de) * 1996-04-24 1998-09-24 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
US5922138A (en) * 1996-08-12 1999-07-13 Tokyo Electron Limited Liquid treatment method and apparatus
US6799583B2 (en) * 1999-05-13 2004-10-05 Suraj Puri Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
JP6092653B2 (ja) 2012-02-27 2017-03-08 株式会社荏原製作所 基板洗浄装置及び洗浄方法
JP6748524B2 (ja) * 2015-09-30 2020-09-02 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
US20190105689A1 (en) 2019-04-11
KR20190040893A (ko) 2019-04-19
JP2019071382A (ja) 2019-05-09
TW201914702A (zh) 2019-04-16
KR102565317B1 (ko) 2023-08-09
TWI746890B (zh) 2021-11-21

Similar Documents

Publication Publication Date Title
KR101930965B1 (ko) 도금 장치 및 기판 홀더 세정 방법
JP7067863B2 (ja) 基板を処理するための方法および装置
JP4664320B2 (ja) めっき方法
JP4229954B2 (ja) めっき処理ユニット
CN103286089B (zh) 基板清洗装置以及清洗方法
TWI609417B (zh) 基板鍍覆裝置及基板鍍覆方法
JP6836980B2 (ja) 基板洗浄方法
US10240247B2 (en) Anode holder and plating apparatus
TW201514347A (zh) 鍍覆裝置以及使用於該鍍覆裝置之清潔裝置
JP2003277995A (ja) 基板ホルダ及びめっき装置
TWI634234B (zh) 鍍覆裝置及鍍覆方法
JP2002363794A (ja) 基板ホルダ及びめっき装置
JP5996224B2 (ja) 基板乾燥装置及び乾燥方法
US20050283993A1 (en) Method and apparatus for fluid processing and drying a workpiece
JP2003247098A (ja) めっき装置
JP2002363793A (ja) 基板ホルダ及びめっき装置
JP2002363797A (ja) 電気接点及びその製造方法、並びにめっき装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200331

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200331

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210208

R150 Certificate of patent or registration of utility model

Ref document number: 6836980

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250